CN102346199A - 球栅阵列测试座 - Google Patents
球栅阵列测试座 Download PDFInfo
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- CN102346199A CN102346199A CN2010102452876A CN201010245287A CN102346199A CN 102346199 A CN102346199 A CN 102346199A CN 2010102452876 A CN2010102452876 A CN 2010102452876A CN 201010245287 A CN201010245287 A CN 201010245287A CN 102346199 A CN102346199 A CN 102346199A
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- 238000012360 testing method Methods 0.000 title claims abstract description 136
- 230000002285 radioactive effect Effects 0.000 claims abstract description 38
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000000295 complement effect Effects 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229910052718 tin Inorganic materials 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000005260 alpha ray Effects 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 239000011133 lead Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 230000003044 adaptive effect Effects 0.000 description 1
- LBDSXVIYZYSRII-IGMARMGPSA-N alpha-particle Chemical compound [4He+2] LBDSXVIYZYSRII-IGMARMGPSA-N 0.000 description 1
- -1 benzene compound Chemical class 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102452876A CN102346199A (zh) | 2010-07-30 | 2010-07-30 | 球栅阵列测试座 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010102452876A CN102346199A (zh) | 2010-07-30 | 2010-07-30 | 球栅阵列测试座 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN102346199A true CN102346199A (zh) | 2012-02-08 |
Family
ID=45545065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010102452876A Pending CN102346199A (zh) | 2010-07-30 | 2010-07-30 | 球栅阵列测试座 |
Country Status (1)
Country | Link |
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CN (1) | CN102346199A (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI504901B (zh) * | 2014-04-17 | 2015-10-21 | ||
CN105575836A (zh) * | 2014-10-08 | 2016-05-11 | 慧荣科技股份有限公司 | 测试装置 |
CN110045160A (zh) * | 2019-05-24 | 2019-07-23 | 杭州易正科技有限公司 | 一种bga封装用的上方取放的测试座 |
CN110749816A (zh) * | 2019-11-22 | 2020-02-04 | 中国电子科技集团公司第十一研究所 | 芯片测试系统 |
CN112485646A (zh) * | 2020-12-03 | 2021-03-12 | 上海航天科工电器研究院有限公司 | 基于毛纽扣的bga芯片垂直互连测试模块 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6064214A (en) * | 1997-12-19 | 2000-05-16 | Hewlett-Packard Company | Perimeter trace probe for plastic ball grid arrays |
US6489790B1 (en) * | 1999-03-08 | 2002-12-03 | Samsung Electronics Co., Ltd. | Socket including pressure conductive rubber and mesh for testing of ball grid array package |
CN2649444Y (zh) * | 2003-09-05 | 2004-10-20 | 罗望保 | 铁路轨道信息采集装置 |
CN2748923Y (zh) * | 2004-11-30 | 2005-12-28 | 四川微迪数字技术有限公司 | 一种用于集成电路芯片的测试工装 |
CN200972480Y (zh) * | 2006-11-30 | 2007-11-07 | 唐中卫 | 集成电路芯片测试座 |
CN101233415A (zh) * | 2005-07-12 | 2008-07-30 | 斯班逊有限公司 | 集成电路测试座 |
CN201181302Y (zh) * | 2008-03-18 | 2009-01-14 | 东莞中探探针有限公司 | 同轴隔离式大电流探针 |
CN201207076Y (zh) * | 2007-12-03 | 2009-03-11 | 唐中卫 | 可更换测试弹簧的芯片测试座 |
CN201311990Y (zh) * | 2008-10-01 | 2009-09-16 | 番禺得意精密电子工业有限公司 | 一种电连接器 |
-
2010
- 2010-07-30 CN CN2010102452876A patent/CN102346199A/zh active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6064214A (en) * | 1997-12-19 | 2000-05-16 | Hewlett-Packard Company | Perimeter trace probe for plastic ball grid arrays |
US6489790B1 (en) * | 1999-03-08 | 2002-12-03 | Samsung Electronics Co., Ltd. | Socket including pressure conductive rubber and mesh for testing of ball grid array package |
CN2649444Y (zh) * | 2003-09-05 | 2004-10-20 | 罗望保 | 铁路轨道信息采集装置 |
CN2748923Y (zh) * | 2004-11-30 | 2005-12-28 | 四川微迪数字技术有限公司 | 一种用于集成电路芯片的测试工装 |
CN101233415A (zh) * | 2005-07-12 | 2008-07-30 | 斯班逊有限公司 | 集成电路测试座 |
CN200972480Y (zh) * | 2006-11-30 | 2007-11-07 | 唐中卫 | 集成电路芯片测试座 |
CN201207076Y (zh) * | 2007-12-03 | 2009-03-11 | 唐中卫 | 可更换测试弹簧的芯片测试座 |
CN201181302Y (zh) * | 2008-03-18 | 2009-01-14 | 东莞中探探针有限公司 | 同轴隔离式大电流探针 |
CN201311990Y (zh) * | 2008-10-01 | 2009-09-16 | 番禺得意精密电子工业有限公司 | 一种电连接器 |
Non-Patent Citations (1)
Title |
---|
JEDEC SOLID STATE TECHNOLOGY ASSOCIATION: "Measurement and Reporting of Alpha Particle and Terrestrial Cosmic Ray-Induced Soft Errors in Semiconductor Devices", 《HTTP://WWW.JEDEC.ORG/SITES/DEFAULT/FILES/DOCS/JESD89A.PDF》 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI504901B (zh) * | 2014-04-17 | 2015-10-21 | ||
CN105575836A (zh) * | 2014-10-08 | 2016-05-11 | 慧荣科技股份有限公司 | 测试装置 |
CN105575836B (zh) * | 2014-10-08 | 2018-06-12 | 慧荣科技股份有限公司 | 测试装置 |
CN110045160A (zh) * | 2019-05-24 | 2019-07-23 | 杭州易正科技有限公司 | 一种bga封装用的上方取放的测试座 |
CN110749816A (zh) * | 2019-11-22 | 2020-02-04 | 中国电子科技集团公司第十一研究所 | 芯片测试系统 |
CN112485646A (zh) * | 2020-12-03 | 2021-03-12 | 上海航天科工电器研究院有限公司 | 基于毛纽扣的bga芯片垂直互连测试模块 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20121121 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20121121 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20120208 |