CN102339822A - Structure for packaging light-emitting diodes (LEDs) - Google Patents
Structure for packaging light-emitting diodes (LEDs) Download PDFInfo
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- CN102339822A CN102339822A CN2010102329941A CN201010232994A CN102339822A CN 102339822 A CN102339822 A CN 102339822A CN 2010102329941 A CN2010102329941 A CN 2010102329941A CN 201010232994 A CN201010232994 A CN 201010232994A CN 102339822 A CN102339822 A CN 102339822A
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Abstract
The invention discloses a structure for packaging light-emitting diodes (LEDs). The structure comprises a drive chip, at least one LED element, a shade member and a printed circuit board (PCB); the drive chip is arranged between the shade member and the PCB; the drive chip comprises grooves which are used for respectively arranging the LEDs; and the shade member is arranged on the drive chip and is provided with light-penetrable zones corresponding to the grooves so as to allow the lights of the LEDs to pass through. With the adoption of the structure for packaging the LEDs, optical passive components can be omitted so as to simplify the structure for packaging the LEDs and lower the cost for design.
Description
Technical field
The present invention relates to a kind of encapsulating structure, particularly relate to a kind of light-emitting diode (Light Emitting Diode, encapsulating structure LED).
Background technology
Light-emitting diode is a kind of semiconductor subassembly, has efficient height, life-span advantage long, that conventional light source such as cracky can't be not by comparison.It is applied to occasions such as indicator light, display panel more at present, and the application on traffic signals sign and street lighting is then general.Along with the appearance of white light emitting diode, light-emitting diode is regarded as the new type light source of 21 century.
Because the volume of light-emitting diode is little, switch speed is fast, therefore replace the light source of electronic installation gradually, for example mobile phone, LCD screen and LED printer etc.The LED printer is to utilize LED to be carried out to picture as light source, has advantages such as volume is little, print speed is fast compared to traditional laser printer.In addition; Led light source also can be applied in the photoinduction formula printer; Special optics seal gauge outfit need be set to produce the light of specific wavelength in this photoinduction formula printer; Present this optics seal gauge outfit light emitting diode matrix capable of using is used as light source, utilizes lens to transmit light and focusing then.Yet the optical facilities of present optics seal gauge outfit are too complicated, and volume causes assembly precision low excessively more greatly and easily, and is unfavorable for volume production.
In existing optics seal gauge outfit, LED and chip for driving are to adopt individual package, and then are integrated in the printed circuit board (PCB), so its volume is bigger, and manufacturing cost is also higher.In addition, the light source of LED is to adopt PASSIVE OPTICAL element such as lens to come focused ray, because the part light of LED can scatter to the zone beyond the eyeglass, so optical coupling efficient is relatively poor.For improving energy of light source, high drive current capable of using is come driving LED, but when improving drive current, will make luminous diode temperature rise the life-span that can cause extra heat dissipation problem and can reduce light-emitting diode.
Summary of the invention
The technical problem that the present invention will solve is for the LED packaging technology volume that overcomes prior art is big, manufacturing cost is high, increase driving voltage and cause the too high defective of luminous diode temperature in order to improve energy of light source, provides a kind of and can omit the PASSIVE OPTICAL element, simplifies the encapsulating structure of light-emitting diode and reduce the encapsulating structure of the light-emitting diode of design cost.
The present invention solves above-mentioned technical problem through following technical proposals:
The present invention provides a kind of encapsulating structure of light-emitting diode, and its characteristics are that it comprises a chip for driving, one first light-emitting diode and a shade spare.Chip for driving has one first groove, and first light-emitting diode is arranged in first groove.Shade spare has one first transparent area, shade spare be arranged on the chip for driving and first transparent area corresponding to first groove.
Preferably, have a gap between above-mentioned shade spare and the above-mentioned chip for driving, the width in this gap is 16-20 μ m.
Preferably, above-mentioned chip for driving also has one second groove, and this second groove is used to be provided with one second light-emitting diode, and above-mentioned shade spare also has one second transparent area, and above-mentioned second transparent area is corresponding to above-mentioned second groove.
Preferably, above-mentioned first transparent area comprises a loophole or a transparent glass.
Preferably; The encapsulating structure of above-mentioned light-emitting diode also comprises a printed circuit board (PCB); In order to above-mentioned chip for driving to be set, above-mentioned chip for driving is between above-mentioned printed circuit board (PCB) and above-mentioned shade spare, and wherein above-mentioned chip for driving also has at least one through hole; Above-mentioned printed circuit board (PCB) is electrically connected to the circuit element on the above-mentioned chip for driving via above-mentioned through hole, and wherein above-mentioned through hole is to utilize straight-through silicon wafer perforation encapsulation technology to form.
Preferably, above-mentioned chip for driving has one first and one second, and above-mentioned first groove is positioned at first of above-mentioned chip for driving, and above-mentioned shade spare is towards this first, and printed circuit board (PCB) is towards second of chip for driving.
Positive progressive effect of the present invention is: the encapsulating structure of light-emitting diode of the present invention, LED directly is integrated in the groove of chip for driving, and dwindle whole encapsulation volume thus.The top of chip for driving is provided with the shade spare of local printing opacity to focus on the light that LED was sent, the encapsulating structure and reduction design cost of shade spare instead PASSIVE OPTICAL element to simplify light-emitting diode.And the encapsulating structure of light-emitting diode of the present invention utilizes the groove of chip for driving light-emitting diode to be set to simplify and to dwindle encapsulating structure, omits base plate for packaging simultaneously.In addition, the present invention utilizes the micropore of shade spare to replace the PASSIVE OPTICAL element with control light output variable.Thus, the encapsulating structure of light-emitting diode of the present invention has the advantage of simplifying encapsulating structure, dwindling structural volume and reduction design cost.
Description of drawings
Fig. 1 is the encapsulating structure sketch map of light-emitting diode according to an embodiment of the invention.
Fig. 2 is the encapsulating structure generalized section according to the hatching AA ' of Fig. 1.
Description of reference numerals
110: printed circuit board (PCB)
120: chip for driving
122: through hole
126: groove
130: shade spare
132: transparent area
142: light-emitting diode
150: the gap
170: adhesion material
AA ': hatching
H: width
Embodiment
For letting the above-mentioned feature and advantage of the present invention can be more obviously understandable, enumerate preferred embodiment below, and combine accompanying drawing, introduce technical scheme of the present invention in detail.
Fig. 1 is the encapsulating structure sketch map of light-emitting diode according to an embodiment of the invention.The encapsulating structure of light-emitting diode comprises printed circuit board (PCB) 110, chip for driving 120 and shade spare 130.Chip for driving 120 is arranged between shade spare 130 and the printed circuit board (PCB) 110, has a plurality of transparent areas 132 on the shade spare 130, is example with 6 transparent areas among Fig. 1, but is not limited thereto.Have groove on the chip for driving 120 so that light-emitting diode to be set, 132 of transparent areas on the shade spare 130 are corresponding to a groove, let light that LED sent can see through transparent area 132 and send.In the present embodiment, the transparent area number on the shade spare 130 can according to design requirement, as according to LED number decision, but is not limited thereto.
Next, please be simultaneously with reference to Fig. 2, Fig. 2 is the encapsulating structure generalized section according to the hatching AA ' of Fig. 1.Chip for driving 120 has a plurality of grooves so that light-emitting diode to be set respectively.With groove 126 is example explanation, and light-emitting diode 142 is arranged among the groove 126, the transparent area 132 on the shade spare 130 be positioned at groove 126 directly over to let the light of light-emitting diode 142 pass through.It should be noted that on the circuit element of chip for driving 120 and the same one side that groove can be formed at chip for driving 120, let chip for driving 120 can be connected directly to corresponding light-emitting diode 142 so that driving power to be provided.When chip for driving 120 was provided with the led array (for example three kinds of led array of red, green, blue) of different wave length, chip for driving 120 may command different LED arrays made it be mixed into the light source of required color.
Shade spare 130 adopts the material of silicon for example or glass to form, and the zone beyond transparent area is light tight zone, can be used to stop the scattering of light.In the present embodiment, if shade spare 130 is to adopt glass to form, then the zone beyond transparent area 132 can be coated with light tight material (for example blacking) to prevent light scatter.If shade spare 130 adopts silicon materials to form, then transparent area 132 perforate modes capable of using form.When transparent area 132 was a perforate, the medial surface of its perforate was that smooth reflecting surface is to reduce the energy loss of light.Present embodiment does not limit the structure of the material and the transparent area 132 of shade spare 130, as long as can let the light that LED sent pass transparent area 132.The structure of all the other transparent areas on the shade spare 130 is identical with transparent area 132, does not give unnecessary details at this.
Have a gap 150 between shade spare 130 and the chip for driving 120, and fixed, to reduce the generation of light diffraction phenomenon, width H can be 16-20 μ m to the width H in gap 150 according to wavelength of light, but present embodiment is not limited thereto.The size in its gap 150 is pasted and determined to adhesion material 170 capable of using between shade spare 130 and the chip for driving 120.Owing to have gap 150 between shade spare 130 and the chip for driving 120, can have suitable distance between transparent area 132 and the groove 126 to reduce the generation of diffraction phenomenon.
Printed circuit board (PCB) 110 is used for being provided with chip for driving 120, and printed circuit board (PCB) 110 is positioned at the back side of chip for driving 120.In other words, shade spare 130 is towards first of chip for driving 120, and printed circuit board (PCB) 110 is then towards second of chip for driving 120.Chip for driving 120 has a plurality of through holes, is used for electrically connecting the circuit element and the printed circuit board (PCB) 110 that are positioned at 120 first of chip for driving.With through hole 122 is example, and printed circuit board (PCB) 110 can see through through hole 122 and be electrically connected to circuit element in the chip for driving 120 to transmit signal or power supply.Through hole 122 in the chip for driving 120 can utilize straight-through silicon wafer perforation encapsulation technology, and (Through-Silicon Via Via) forms.The generation type manufacture of semiconductor capable of using of through hole 122 and groove 126 or micro electronmechanical (microelectromechanical system, MEMS) processing procedure is realized, but generation type is not limited to this.After the explanation via the foregoing description, those skilled in the art also can adopt other known approaches that is fit to, and do not give unnecessary details at this.
In the present embodiment, light-emitting diode 142 is directly to be arranged in the groove 126 of chip for driving 120, therefore can dwindle encapsulation volume.The transparent area 132 of shade spare 130 can be used to guide the light of light-emitting diode 142 so that be imaged on the required image plane, so shade spare 130 can be used to replace PASSIVE OPTICAL element of the prior art (for example lens etc.) to simplify the complexity and the design cost of optics module.Printed circuit board (PCB) 110 electrically connects with the direct formed through hole 122 of straight-through silicon wafer perforation encapsulation technology that utilizes of the circuit in the chip for driving 120.Such structure can further be dwindled the volume of overall package structure, can improve the stability of electric signal transmission simultaneously.And, because the shade spare 130 in the present embodiment, chip for driving 120 and printed circuit board (PCB) 110 can adopt the mode of storehouse to encapsulate and integrate, therefore can simplify the encapsulation flow process and reduce cost simultaneously, more help volume production and application.
The encapsulating structure of light-emitting diode of the present invention can be applicable to use as light source in the seal gauge outfit assembly of optical printer; Chip for driving 120 can be provided with the array groove with ccontaining light-emitting diode according to the required resolution of seal gauge outfit assembly, and the set-up mode of its array is not limited to Fig. 1 and structure shown in Figure 2.After the explanation via the foregoing description, those skilled in the art also can adopt other known approaches that is fit to, and do not give unnecessary details at this.
In sum, the present invention utilizes groove that light-emitting diode is set, and correspondence is provided with shade spare to replace the PASSIVE OPTICAL element, and therefore the encapsulating structure of light-emitting diode of the present invention has reduced volume, simplifies the encapsulation flow process and advantage such as reduces cost.
Though more than described embodiment of the present invention, it will be understood by those of skill in the art that these only illustrate, protection scope of the present invention is limited appended claims.Those skilled in the art can make numerous variations or modification to these execution modes under the prerequisite that does not deviate from principle of the present invention and essence, but these changes and modification all fall into protection scope of the present invention.
Claims (9)
1. the encapsulating structure of a light-emitting diode is characterized in that, it comprises:
One chip for driving, this chip for driving have one first groove;
One first light-emitting diode is arranged in this first groove; And
One shade spare has one first transparent area, this shade spare be arranged on this chip for driving and this first transparent area corresponding to this first groove.
2. the encapsulating structure of light-emitting diode as claimed in claim 1 is characterized in that, has a gap between this shade spare and this chip for driving.
3. the encapsulating structure of light-emitting diode as claimed in claim 2 is characterized in that, the width in this gap is 16-20 μ m.
4. the encapsulating structure of light-emitting diode as claimed in claim 1; It is characterized in that this chip for driving also has one second groove, this second groove is in order to be provided with one second light-emitting diode; This shade spare also has one second transparent area, and this second transparent area is corresponding to this second groove.
5. the encapsulating structure of light-emitting diode as claimed in claim 1 is characterized in that, this first transparent area comprises a loophole.
6. the encapsulating structure of light-emitting diode as claimed in claim 1; It is characterized in that; This encapsulating structure also comprises a printed circuit board (PCB), and this printed circuit board (PCB) is in order to be provided with this chip for driving, and this chip for driving is between this printed circuit board (PCB) and this shade spare; Wherein this chip for driving also has at least one through hole, and this printed circuit board (PCB) is electrically connected to the circuit element on this chip for driving via said through hole.
7. the encapsulating structure of light-emitting diode as claimed in claim 6; It is characterized in that this chip for driving has one first and one second, this first groove is positioned at this first of this chip for driving; This shade spare is towards this first, and this printed circuit board (PCB) is towards this second of this chip for driving.
8. the encapsulating structure of light-emitting diode as claimed in claim 6 is characterized in that, said through hole is to utilize straight-through silicon wafer perforation encapsulation technology to form.
9. the encapsulating structure of light-emitting diode as claimed in claim 1 is characterized in that, this first transparent area is a transparent glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102329941A CN102339822A (en) | 2010-07-21 | 2010-07-21 | Structure for packaging light-emitting diodes (LEDs) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102329941A CN102339822A (en) | 2010-07-21 | 2010-07-21 | Structure for packaging light-emitting diodes (LEDs) |
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| Publication Number | Publication Date |
|---|---|
| CN102339822A true CN102339822A (en) | 2012-02-01 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102329941A Pending CN102339822A (en) | 2010-07-21 | 2010-07-21 | Structure for packaging light-emitting diodes (LEDs) |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766962A (en) * | 2018-05-25 | 2018-11-06 | 张琴 | Solid state light emitter luminescent system integrated encapsulation structure and production method |
| CN109244217A (en) * | 2018-09-23 | 2019-01-18 | 厦门天微电子有限公司 | A kind of composite packaging method shown for LED |
| CN114495735A (en) * | 2020-11-11 | 2022-05-13 | 宏碁股份有限公司 | Light emitting device |
-
2010
- 2010-07-21 CN CN2010102329941A patent/CN102339822A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108766962A (en) * | 2018-05-25 | 2018-11-06 | 张琴 | Solid state light emitter luminescent system integrated encapsulation structure and production method |
| CN108766962B (en) * | 2018-05-25 | 2020-01-07 | 张琴 | Solid-state light source light-emitting system integrated packaging structure and manufacturing method |
| CN109244217A (en) * | 2018-09-23 | 2019-01-18 | 厦门天微电子有限公司 | A kind of composite packaging method shown for LED |
| CN114495735A (en) * | 2020-11-11 | 2022-05-13 | 宏碁股份有限公司 | Light emitting device |
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Application publication date: 20120201 |