CN102310642A - 利用柔性电路上的浮凸触点的电互连 - Google Patents
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Abstract
本发明公开了一种利用柔性电路上的浮凸触点的电互连。一种打印头具有:喷口叠层,其具有喷口阵列;换能器阵列,其布置在喷口叠层上,使得每个换能器均对应于喷口阵列中的一个喷口;和柔性电路衬底,其邻近换能器阵列布置,使得柔性电路衬底上的接触焊盘电连接至换能器阵列中的换能器中的至少一些换能器,柔性电路衬底被模压,使得接触焊盘从柔性电路衬底的平面伸出。一种制造打印头的方法包括:形成具有喷口阵列的喷口叠层;将换能器阵列布置在喷口叠层上,使得换能器阵列中的每个换能器均对应于喷口阵列中的一个喷口;模压具有接触焊盘的柔性电路衬底,使得接触焊盘从柔性电路衬底的平面伸出;和布置柔性电路衬底,使得接触焊盘电连接至换能器阵列中的换能器中的至少一些换能器。
Description
技术领域
本发明涉及打印头设计,并且尤其涉及利用柔性电路上的浮凸触点的电互连。
背景技术
打印头设计的目前的趋势涉及增加喷口封装密度和喷口计数,同时降低打印头的成本。“喷口(jet)”也被称为喷嘴(nozzle)、滴发射器(drop emitter)或喷射口(ejection port),其通常由板中的孔隙或孔组成,通过所述孔隙或孔,墨被排出到打印表面上。较高密度和较高计数的喷口产生较高的分辨率和较高质量的打印图像。
每个喷口均具有对应的致动器,即某种将电信号转化成使墨离开喷口的机械力的换能器。电信号通常从图像数据和打印控制器产生,打印控制器指令在哪些间隔期间、哪些喷口需要排出墨以形成期望的图像。换能器的示例包括压电换能器、机电换能器、热发生元件,诸如那些在墨中引起气泡来用于“气泡喷墨(bubble jet)”打印机的热发生元件等等。
有些换能器元件作用于位于“喷口叠层(一系列板)”后面的膜,通过所述一系列板,墨被传输至喷嘴或喷口板。换能器的致动使膜推向喷口叠层(jet stack)的腔室,并最终迫使墨脱离喷嘴。
增加的喷口封装密度和喷口计数提出在致动器、电气迹线和机电互连之间尺寸和间距方面明显减小的需求。在此最关心的机电互连形成在单一的喷口致动器与它们的对应的驱动电子器件之间的互连,通过互连它们接收所提及的信号。目前的方法使驱动电路与换能器/致动器之间的互连昂贵,并且可能不能够以期望的增加的密度和减小的尺寸实现可制造的并且可靠的互连。一些潜在的解决方案包括覆晶薄膜(chip on flex,COF)和带式自动焊接(tape automated bonding,TAB)技术,在这些解决方案中,驱动电路位于柔性衬底上。
发明内容
根据本发明的一个目的,提供一种打印头,所述打印头包括:
喷口叠层,其具有喷口阵列;
换能器阵列,其被布置在所述喷口叠层上,使得每个换能器对应于所述喷口阵列中的一个喷口;以及
柔性电路衬底,其被布置成邻近所述换能器阵列,使得所述柔性电路衬底上的接触焊盘电连接至所述换能器阵列中的至少一些换能器,所述柔性电路衬底被模压,使得所述接触焊盘伸出所述柔性电路衬底的平面。
优选地,如上所述的打印头,还包括在所述换能器阵列与所述柔性电路之间的各向异性导电膜。
优选地,如上所述的打印头,其中,所述各向异性膜被布置在所述柔性电路与换能器阵列之间,从而所述膜内的导电颗粒导致在所述柔性电路的单独的浮凸接触焊盘与所述换能器阵列内邻近所述浮凸接触焊盘的单独的换能器元件之间形成电路径。
优选地,如上所述的打印头,还包括覆盖膜,所述覆盖膜被布置在所述柔性电路衬底上,使得仅仅所述柔性电路衬底的被选择的区域暴露。
优选地,如上所述的打印头,还包括在所述柔性衬底与所述换能器阵列之间的隔开层,所述隔开层具有布置在每个换能器之上的开口和处于所述开口中的导电粘合剂。
优选地,如上所述的打印头,还包括在所述柔性衬底与所述换能器阵列之间的非导电粘合剂层,所述非导电粘合剂层被选择成以便能够由伸出所述柔性电路衬底的平面的所述接触焊盘穿透。
优选地,如上所述的打印头,,其中,所述换能器阵列包括压电元件、机电元件或加热器元件中的一种。
根据本发明的另一个目的,提供一种制造打印头的方法,包括:
形成具有喷口阵列的喷口叠层;
将换能器阵列布置在所述喷口叠层上,使得所述换能器阵列中的每个换能器对应于所述喷口阵列中的每个喷口;
模压具有接触焊盘的柔性电路衬底,使得所述接触焊盘伸出所述柔性电路衬底的平面;以及
布置所述柔性电路衬底,使得所述接触焊盘电连接至所述换能器阵列中的换能器的至少一些。
优选地,如上所述的方法,其中,模压所述柔性电路衬底包括:
在压力机中将所述柔性电路衬底安置在柔顺垫上;
将阵列冲头布置在所述柔性电路衬底之上,使得所述阵列冲头中的单独的冲头与所述柔性电路衬底上的所述接触焊盘对准;以及
将所述阵列冲头压在所述柔性电路衬底上,直到所述接触焊盘朝所述柔顺垫的方向从所述柔性电路衬底的平面向外永久变形。
优选地,如上所述的方法,其中,模压所述柔性电路衬底包括:
将所述柔性电路衬底安置在压力机中,将具有阵列冲模和所述柔性电路衬底的所述压力机布置在所述阵列冲模上方,使得所述阵列冲模中的孔对应于所述柔性电路衬底上的所述接触焊盘;
用柔顺垫覆盖所述柔性电路;以及
将所述柔性电路挤压到所述阵列冲模中,直到所述接触焊盘朝所述阵列冲模中的孔的方向从所述柔性电路衬底的平面向外永久变形。
优选地,如上所述的方法,其中,模压所述柔性电路衬底包括:
将所述柔性电路衬底安置在压力机中,将具有阵列冲模和所述柔性电路衬底的所述压力机布置在所述阵列冲模上方,使得所述阵列冲模中的孔对应于所述柔性电路衬底上的所述接触焊盘;
将阵列冲头布置在所述柔性电路衬底之上,使得所述阵列冲头中的单独的冲头与所述柔性电路衬底上的所述接触焊盘对准;
将柔顺垫安置在所述阵列冲头与所述压力机的顶部之间;以及
用所述阵列冲头挤压所述柔性电路,直到所述柔性电路的所述接触焊盘朝所述阵列冲模中的孔的方向从所述柔性电路衬底的平面向外永久变形。
优选地,如上所述的方法,其中,布置所述柔性电路衬底包括:
将各向异性导电膜涂覆至所述换能器阵列;
将所述柔性电路衬底布置在所述各向异性导电膜上,使得导电焊盘阵列覆盖在所述换能器阵列上面;以及
向所述柔性电路衬底和所述各向异性导电膜施加温度和压力,直到围绕所述接触焊盘的所述各向异性导电膜的区域中出现局部流动,从而通过所述区域在所述换能器阵列与所述接触焊盘阵列之间形成电连接。
优选地,如上所述的方法,其中,施加温度与和压力还使所述各向异性导电膜在所述柔性电路和衬底和所述换能器阵列之间形成机械结合。
优选地,如上所述的方法,还包括在所述柔性电路衬底上形成覆盖膜,使得仅仅所述柔性电路上的被选择的区域暴露。
优选地,如上所述的方法,其中,形成覆盖膜包括在将掩膜涂覆至所述柔性电路之前对所述覆盖膜形成图案。
优选地,如上所述的方法,其中,形成覆盖膜包括将覆盖膜层涂覆至所述柔性电路,并且移除所述覆盖膜层的被选择的部分。
优选地,如上所述的方法,其中,移除所述覆盖膜层的选择的部分包括利用光刻法或激光烧蚀中的一种来移除所述被选择的部分。
优选地,如上所述的方法,其中,布置所述柔性电路衬底包括:
将隔开层涂覆至所述换能器阵列,所述隔开层具有与所述换能器的至少一部分对应的开口;
将导电粘合剂分送到所述开口中;以及
将所述柔性电路布置在所述隔开层上,使得所述接触焊盘延伸到所述开口中并通过所述导电粘合剂与所述换能器电连接。
优选地,如上所述的方法,其中,布置所述柔性电路衬底包括:
将非导电粘合剂涂覆至所述换能器阵列;
将所述柔性电路布置在所述非导电粘合层上,使得接触焊盘与所述换能器阵列对准;以及
将所述柔性电路压向所述非导电粘合层,使得所述接触焊盘穿透所述非导电粘合层并与所述换能器连接。
优选地,如上所述的方法,还包括用所述非导电粘合剂在所述换能器阵列与所述接触焊盘阵列之间形成机械结合。
附图说明
图1示出具有柔性电路的打印头的截面图。
图2示出浮凸柔性电路的实施例。
图3-5示出模压柔性电路的方法的实施例。
图6示出利用各向异性导电膜的互连的实施例。
图7示出利用隔开层与导电粘合剂的互连的实施例。
图8示出利用非导电粘合剂的互连的实施例。
具体实施方式
图1示出打印头10的一部分的截面图。在此示出的打印头部分示出喷口叠层11,其通常由一系列铜焊金属板或金属板与聚合体或粘合剂层的组合组成。如图中所取向地,喷嘴或孔隙板将位于喷口叠层11的底部。诸如12的换能器阵列位于喷口叠层的与喷嘴板相对的表面上,在该例中是喷口叠层11的顶部。换能器通过通常被分配到隔开层14(standoff layer)的孔中的导电粘合剂电连接至驱动电路18。在增加的喷口密度和更紧的间隔的情况下,驱动电路与喷口叠层11之间的连接变得更加难以维持。
一些方法已开始使用柔性电路衬底,例如,通过利用像带式自动焊接(TAB)或覆晶薄膜(COF)这样的技术将驱动芯片安装到柔性电路上。这些方法为与多层柔性电路相关的受限的间距密度(pitchdensity)和高成本提供可能的解决方案。另一解决方案或解决方案的一部分是模压(emboss)柔性电路衬底,使得在柔性电路与换能器之间连接的接触焊盘(contact pad)伸出柔性电路衬底的平面,形成更坚固的连接。
图2示出柔性电路衬底20的实施例。诸如22的接触焊盘被模压,这意味着它们已经经受了施加向它们的某一压力,该压力使得它们从柔性电路衬底的平面向外永久地变形。以此方式,接触焊盘能在柔性电路与换能器阵列之间形成更坚固的互连。
图3-5示出用于模压柔性电路衬底的过程的实施例。在这些附图中,示出一种具有顶部和底部压力机(press),柔性电路在顶部和底部之间。应当注意到,可使用任何类型的压力机,在此示出的压力机仅用作示例。在图3中,压力机具有底部30和上部32。柔顺垫(compliant pad)34被放置在底部上。然后,柔性电路36被布置在柔顺垫上。
然后,阵列冲头(arrayed punch)38被布置在柔性电路36之上。阵列冲头具有一组单独的冲头,并且被对准成每个单独的冲头均与柔性电路衬底上的接触焊盘排齐。然后向压力机施加压力,以使冲头将接触焊盘推出柔性电路衬底的平面。
在替代性方法中,使用阵列冲模(arrayed die)来代替阵列冲头。在图4的实施例中,阵列冲模40具有一组开口或孔。然后,将柔性电路衬底36布置在阵列冲模之上,使得接触焊盘在阵列冲模中的孔或开口之上对准。然后,将柔顺垫放置在柔性电路之上,并利用压力机的顶部32挤压整个组件。压力使接触焊盘在阵列冲模的孔的区域压向柔顺垫,以允许接触焊盘对着柔顺垫伸出柔性电路衬底的平面。
图5示出模压柔性电路衬底的又一替代性方法。图5实质上将图3和4的方法结合。将阵列冲模40安置在压力机的底部上。然后,将柔性电路衬底36布置在阵列冲模40上,使得阵列冲模的开口与接触焊盘对准。然后,将阵列冲头布置在柔性电路之上,使得冲头与接触焊盘对准。然后,将柔顺垫34放置在阵列冲头之上,并挤压整个组件以模压柔性电路。
在以上实施例的任一实施例中,可通过冲头和冲模元件的尺寸、高度和形状、柔顺垫的硬度以及由压力机所施加的压力来调节在接触焊盘上形成的微坑(dimple)的特性。通过调节这些参数,能使微坑的重要方面优化,以适合特定应用的需求。
冲头的高度在确定微坑高度方面,对于所研究的因素是主要因素。应当注意到,阵列元件在以上实施例中的使用可用单个冲头、单个冲模或者阵列元件替换。
一旦柔性电路被模压,对于如何形成柔性电路衬底与换能器阵列之间的互连存在若干种选择。例如,一种方法使用各向异性导电粘合剂膜(anisotropic conductive adhesive film,ACF),其也被称为z轴带(z-axis tape,ZAT)。第二种方法使用具有或者不具有隔开层的模印(stencil)的或以另外的方式形成图案的导电粘合剂。第三种方法在柔性电路衬底与换能器阵列之间采用非导电粘合层,其中由粗糙接触(asperity contact)建立电连接。
各向异性导电膜通常由装在聚合体粘合剂层中的导电颗粒组成。这种带通常是不导电的,直到热和压力的施加使颗粒在粘合剂内移动以形成导电路径。以下的讨论使用利用各向异性导电膜形成互连的两种不同的方法。在利用各向异性导电膜的第一种方法中,在柔性电路衬底上使用掩膜(mask)或覆盖膜层(coverlay layer)。覆盖膜被形成图案,以选择性地使期望互连的柔性电路衬底的部分暴露。
覆盖膜的图案形成可以不同的方式实现。例如,对覆盖膜形成图案的叠加法包括当制造掩膜时对掩膜形成图案。然后,将预先形成图案的掩膜粘合至柔性电路;或者,作为制造过程的一部分,用形成图案的掩膜制成柔性电路。在相减法中,掩膜覆盖柔性电路的整个表面。然后,利用激光烧蚀或光刻法移除覆盖膜的被选择的区域。在一个实施例中,扫描CO2激光器或准分子激光器进行移除过程。在扫描CO2的实施例中,激光束可被装上快门(shuttered)并扫描横过柔性电路衬底及其覆盖膜,以从每个焊盘移除覆盖膜材料。采用准分子激光器工艺,激光照射掩膜并被成像到焊盘上。在较高的焊盘密度的情况下,准分子激光工艺可产生较清洁的并且精确对准的焊盘开口。
得到的覆盖膜覆盖柔性电路衬底上的大部分迹线,并仅暴露期望互连的焊盘区域。然后,模压柔性电路以使接触焊盘从柔性电路衬底的平面伸出。这种延伸可能会或可能不会使接触焊盘延伸到覆盖膜之外。
在第二种方法中,柔性电路衬底不使用覆盖膜。柔性电路衬底上所有的迹线和焊盘保持暴露。在该方法中,仅模压期望连接的那些部分,并且仅那些模压的部分形成电连接。
在任一方法中,柔性电路衬底在各向异性导电膜之上被安置成浮凸侧(embossed side)向下,使得浮凸焊盘与单独的换能器元件对准。然后施加合适的压力和温度。与浮凸焊盘接触的各向异性导电膜的区域经历局部流动(localized flow),导致各向异性导电膜内的导电颗粒变得彼此接触,以及与换能器元件和浮凸焊盘接触。导电颗粒的这种链形成换能器元件与柔性焊盘之间的电互连。膜的粘合部分还形成在该点处的永久机械结合。该过程将导致形成电互连,而不管柔性电路是否具有覆盖膜。
图6示出这种类型的互连的示例。喷口叠层50在其上布置诸如52的换能器阵列。各向异性导电膜53布置成覆盖整个换能器阵列。在施加温度与压力后,在各向异性导电膜中产生的局部流动使区域57形成在柔性电路阵列58的浮凸部分与换能器之间的电连接。
浮凸柔性电路的应用不需要各向异性导电膜的使用。人们可以使用形成互连的更传统的手段。图7示出具有带有隔开层的浮凸柔性电路衬底的打印头的一部分的实施例。喷口叠层50在其上布置有换能器阵列,使得阵列中的每个换能器52对应于喷口叠层中的喷嘴板中的喷口。柔性电路衬底58具有在接触焊盘处从柔性电路衬底的平面伸出的浮凸部分。
隔开层54位于换能器层上,使得隔开层中的开口与换能器对准。导电粘合剂56位于开口中,其已经诸如通过模印或其他图案形成沉积到开口中。导电粘合剂形成柔性电路衬底的浮凸部分与换能器之间的电互连。在一个实施例中,将导电粘合剂分送到开口中,并然后可对准柔性电路衬底使得柔性电路衬底的浮凸部分延伸到开口中。
在另一实施例中,非导电粘合剂可位于浮凸柔性电路衬底与换能器阵列之间。向柔性电路阵列施加足够的压力,使得浮凸部分推挤经过非导电粘合剂并与换能器直接接触。当粘合剂固化时,其将接触区域保持在适当的位置。图8示出该方法的实施例。
在图8的实施例中,喷口叠层在其上首先布置诸如52的电换能器的阵列。然后,使非导电粘合剂60的层驻留在换能器阵列上。然后,柔性电路衬底58及其浮凸部分向下压在非导电粘合剂上,直到浮凸部分穿透非导电粘合剂,并且,在如59处所示,与换能器接触。
存在其他的变化和修改。换能器、喷口和微坑的阵列可由一维或二维阵列组成。微坑的尺寸、形状和高度可根据特定的应用、喷口密度和喷口计数的需要,通过模压工艺改变。导电粘合剂、非导电粘合剂、覆盖膜和隔开层的形式和成分可根据特定应用以及材料和它们的兼容物的混合的需要来改变。
如此,实施例公开了具有灵活的制造过程和结构的坚固的互连架构。这些互连实施例即使考虑到增加的喷口密度和较高的喷口计数也提供这种坚固性。
应意识到的是,多种以上公开的及其他的特征和功能,或它们的替代可合乎需要地被结合到许多其他不同的系统或应用中。此外,本领域的技术人员后继可以作出其中的各种目前未预见到或预料到的替代、修改、变化或改进,这些替代、修改、变化或改进也被所附权利要求涵盖。
Claims (4)
1.一种打印头,包括:
喷口叠层,其具有喷口阵列;
换能器阵列,其被布置在所述喷口叠层上,使得每个换能器对应于所述喷口阵列中的一个喷口;以及
柔性电路衬底,其被布置成邻近所述换能器阵列,使得所述柔性电路衬底上的接触焊盘电连接至所述换能器阵列中的至少一些换能器,所述柔性电路衬底被模压,使得所述接触焊盘伸出所述柔性电路衬底的平面。
2.根据权利要求1所述的打印头,还包括在所述换能器阵列与所述柔性电路之间的各向异性导电膜。
3.根据权利要求1所述的打印头,还包括在所述柔性衬底与所述换能器阵列之间的隔开层,所述隔开层具有布置在每个换能器之上的开口和处于所述开口中的导电粘合剂。
4.根据权利要求1所述的打印头,还包括在所述柔性衬底与所述换能器阵列之间的非导电粘合剂层,所述非导电粘合剂层被选择成以便能够由伸出所述柔性电路衬底的平面的所述接触焊盘穿透。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106466966A (zh) * | 2015-08-21 | 2017-03-01 | 精工爱普生株式会社 | 接合结构体及其制造方法、压电装置、液体喷射头 |
CN109130496A (zh) * | 2018-08-21 | 2019-01-04 | 嘉兴学院 | 一种制备柔性可延展多级结构互连线的方法及设备 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8826539B2 (en) * | 2012-05-16 | 2014-09-09 | Xerox Corporation | Method for flex circuit bonding without solder mask for high density electrical interconnect |
US8857021B2 (en) | 2012-06-15 | 2014-10-14 | Xerox Corporation | Laser welded bonding pads for piezoelectric print heads |
US8888254B2 (en) | 2012-09-13 | 2014-11-18 | Xerox Corporation | High density three-dimensional electrical interconnections |
US8814326B2 (en) * | 2012-10-03 | 2014-08-26 | Xerox Corporation | Reduced mechanical coupling with structured flex circuits |
US8845907B2 (en) | 2012-12-20 | 2014-09-30 | Xerox Corporation | Structure and method to fabricate tooling for bumping thin flex circuits |
US9588552B2 (en) * | 2013-09-11 | 2017-03-07 | Sentons Inc. | Attaching electrical components using non-conductive adhesive |
US9079392B2 (en) | 2013-09-26 | 2015-07-14 | Xerox Corporation | Double sided flex for improved bump interconnect |
KR102052358B1 (ko) * | 2014-03-28 | 2019-12-05 | 코오롱인더스트리 주식회사 | 유연소자 |
US9682589B2 (en) * | 2015-01-19 | 2017-06-20 | Xerox Corporation | Part design geometry for stenciling epoxies through orifices in film adhesive |
US10585480B1 (en) | 2016-05-10 | 2020-03-10 | Apple Inc. | Electronic device with an input device having a haptic engine |
JP6915250B2 (ja) | 2016-09-28 | 2021-08-04 | ブラザー工業株式会社 | アクチュエータ装置、液体吐出装置、及び、配線部材の接続構造 |
US10355371B2 (en) | 2017-03-03 | 2019-07-16 | Microsoft Technology Licensing, Llc | Flexible conductive bonding |
JP6950216B2 (ja) * | 2017-03-22 | 2021-10-13 | ブラザー工業株式会社 | アクチュエータ装置の製造方法 |
US10768747B2 (en) | 2017-08-31 | 2020-09-08 | Apple Inc. | Haptic realignment cues for touch-input displays |
US11054932B2 (en) * | 2017-09-06 | 2021-07-06 | Apple Inc. | Electronic device having a touch sensor, force sensor, and haptic actuator in an integrated module |
US10768738B1 (en) | 2017-09-27 | 2020-09-08 | Apple Inc. | Electronic device having a haptic actuator with magnetic augmentation |
JP7303916B2 (ja) * | 2018-02-20 | 2023-07-05 | 東芝テック株式会社 | インクジェットヘッド、インクジェットプリンタ |
JP7031978B2 (ja) * | 2018-02-20 | 2022-03-08 | 東芝テック株式会社 | インクジェットヘッド、インクジェットプリンタ |
US10942571B2 (en) | 2018-06-29 | 2021-03-09 | Apple Inc. | Laptop computing device with discrete haptic regions |
US10936071B2 (en) | 2018-08-30 | 2021-03-02 | Apple Inc. | Wearable electronic device with haptic rotatable input |
US10966007B1 (en) | 2018-09-25 | 2021-03-30 | Apple Inc. | Haptic output system |
US11024135B1 (en) | 2020-06-17 | 2021-06-01 | Apple Inc. | Portable electronic device having a haptic button assembly |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6241340B1 (en) * | 1996-07-31 | 2001-06-05 | Canon Kabushiki Kaisha | Ink-jet recording head, process for producing the head and ink-jet recording apparatus employing the head |
US6270193B1 (en) * | 1996-06-05 | 2001-08-07 | Brother Kogyo Kabushiki Kaisha | Ink-jet and ink jet recording apparatus having IC chip attached to head body by resin material |
US20030112298A1 (en) * | 2001-08-22 | 2003-06-19 | Fuji Xerox Co., Ltd. | Lattice array-structured piezoelectric actuator and method for producing the same |
US20050287835A1 (en) * | 2004-06-28 | 2005-12-29 | Brother Kogyo Kabushiki Kaisha | Flat connector, ink jet head and method of manufacturing them |
CN101071150A (zh) * | 2006-05-12 | 2007-11-14 | 上海华仕德电路技术有限公司 | 柔性电路板的线路通断检测方法 |
CN101106865A (zh) * | 2006-05-15 | 2008-01-16 | 日本梅克特隆株式会社 | 两面柔性电路基板 |
CN101219598A (zh) * | 2007-01-12 | 2008-07-16 | 三星电子株式会社 | 喷墨打印头芯片及制造方法、连接到电路板的结构和方法 |
CN201252676Y (zh) * | 2008-07-18 | 2009-06-03 | 天津三星电机有限公司 | 用于扁平微型电机的柔性电路板 |
CN101572992A (zh) * | 2008-04-28 | 2009-11-04 | 王定锋 | 连续的双面柔性印刷线路板及led灯带 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5764267A (en) * | 1992-05-15 | 1998-06-09 | Fuji Xerox Co., Ltd. | Conduction recording head |
JP3637633B2 (ja) * | 1995-05-10 | 2005-04-13 | ブラザー工業株式会社 | インクジェット式印字ヘッド及びその製造方法 |
JP3613302B2 (ja) * | 1995-07-26 | 2005-01-26 | セイコーエプソン株式会社 | インクジェット式記録ヘッド |
EP0800920B1 (en) * | 1996-04-10 | 2002-02-06 | Seiko Epson Corporation | Ink jet recording head |
US6161270A (en) * | 1999-01-29 | 2000-12-19 | Eastman Kodak Company | Making printheads using tapecasting |
US6641254B1 (en) * | 2002-04-12 | 2003-11-04 | Hewlett-Packard Development Company, L.P. | Electronic devices having an inorganic film |
US7576288B2 (en) * | 2002-11-27 | 2009-08-18 | Sumitomo Bakelite Company Limited | Circuit board, multi-layer wiring boards, method of producing circuit boards and method of producing multilayer wiring boards |
US6905342B2 (en) * | 2003-04-01 | 2005-06-14 | Hewlett-Packard Development Company, L.P. | Protected electrical interconnect assemblies |
TWI263403B (en) * | 2004-01-22 | 2006-10-01 | Murata Manufacturing Co | Electronic component manufacturing method |
US7475964B2 (en) * | 2004-08-06 | 2009-01-13 | Hewlett-Packard Development Company, L.P. | Electrical contact encapsulation |
US8584331B2 (en) * | 2011-09-14 | 2013-11-19 | Xerox Corporation | In situ flexible circuit embossing to form an electrical interconnect |
-
2010
- 2010-06-07 US US12/795,605 patent/US8628173B2/en active Active
-
2011
- 2011-06-07 CN CN201110164441.1A patent/CN102310642B/zh not_active Expired - Fee Related
-
2013
- 2013-12-05 US US14/098,122 patent/US9381737B2/en active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6270193B1 (en) * | 1996-06-05 | 2001-08-07 | Brother Kogyo Kabushiki Kaisha | Ink-jet and ink jet recording apparatus having IC chip attached to head body by resin material |
US6241340B1 (en) * | 1996-07-31 | 2001-06-05 | Canon Kabushiki Kaisha | Ink-jet recording head, process for producing the head and ink-jet recording apparatus employing the head |
US20030112298A1 (en) * | 2001-08-22 | 2003-06-19 | Fuji Xerox Co., Ltd. | Lattice array-structured piezoelectric actuator and method for producing the same |
US20050287835A1 (en) * | 2004-06-28 | 2005-12-29 | Brother Kogyo Kabushiki Kaisha | Flat connector, ink jet head and method of manufacturing them |
CN101071150A (zh) * | 2006-05-12 | 2007-11-14 | 上海华仕德电路技术有限公司 | 柔性电路板的线路通断检测方法 |
CN101106865A (zh) * | 2006-05-15 | 2008-01-16 | 日本梅克特隆株式会社 | 两面柔性电路基板 |
CN101219598A (zh) * | 2007-01-12 | 2008-07-16 | 三星电子株式会社 | 喷墨打印头芯片及制造方法、连接到电路板的结构和方法 |
CN101572992A (zh) * | 2008-04-28 | 2009-11-04 | 王定锋 | 连续的双面柔性印刷线路板及led灯带 |
CN201252676Y (zh) * | 2008-07-18 | 2009-06-03 | 天津三星电机有限公司 | 用于扁平微型电机的柔性电路板 |
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CN106466966A (zh) * | 2015-08-21 | 2017-03-01 | 精工爱普生株式会社 | 接合结构体及其制造方法、压电装置、液体喷射头 |
CN109130496A (zh) * | 2018-08-21 | 2019-01-04 | 嘉兴学院 | 一种制备柔性可延展多级结构互连线的方法及设备 |
CN109130496B (zh) * | 2018-08-21 | 2023-12-01 | 嘉兴学院 | 一种制备柔性可延展多级结构互连线的方法及设备 |
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US9381737B2 (en) | 2016-07-05 |
US20140090248A1 (en) | 2014-04-03 |
US20110298871A1 (en) | 2011-12-08 |
CN102310642B (zh) | 2016-05-11 |
US8628173B2 (en) | 2014-01-14 |
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