CN102287776A - Ceramic-coating base for LED (Light Emitting Diode) light source module - Google Patents
Ceramic-coating base for LED (Light Emitting Diode) light source module Download PDFInfo
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- CN102287776A CN102287776A CN2011102666244A CN201110266624A CN102287776A CN 102287776 A CN102287776 A CN 102287776A CN 2011102666244 A CN2011102666244 A CN 2011102666244A CN 201110266624 A CN201110266624 A CN 201110266624A CN 102287776 A CN102287776 A CN 102287776A
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- base
- led
- source module
- reflector
- light source
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Abstract
The invention provides a ceramic-coating base for an LED (Light Emitting Diode) light source module. The base comprises a base plate and a plurality of straightly arranged light reflecting cups, the light reflecting cups are arranged on the base plate, a ceramic coating is plated on a luminescence surface of each light reflecting cup, the luminescence surface is used for mounting an LED, and the whiteness of the ceramic coating is larger than or equal to 70, preferably 85 and more preferably 88. The base plate is provided with small slots for mounting circuit boards, and the small slots extend to the sidewalls of the light reflecting cups. According to the ceramic-coating base for the LED light source module, disclosed by the invention, the manufacturing process of light reflecting layers on a traditional LED metal base can be reduced, the production technique is simplified, the production cost can be largely saved, and the industrial production in large batch is facilitated; simultaneously, the base can be directly manufactured by a prefabricating manner, the luminescence efficiency of the LED chip is largely increased after the high-whiteness ceramic coating is plated on the light reflecting cup of the base, thus the loss of the conversion from optical energy to heat can be largely reduced, the heat dissipation performance of the LED chip can be largely improved, and the LED lamp manufactured by the LED chips has good safety and largely prolonged service life, does not conduct electricity and is not easy to be broken.
Description
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of LED lamp.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span are long, various lighting devices now have been widely used in, if traditional LED bulb lamp all adopts metal material as the LED base plate for packaging, because the whiteness of metal substrate own is lower, therefore the not treated encapsulation base plate of directly making the LED lamp, its reflector efficiency is not high, particularly in great power LED was used, because its caloric value is bigger, life of product was lower; Therefore the light-emitting area on the existing metal substrate all can be handled earlier, as improving its whiteness as the reflector layer of reflector layer or pressing one deck white at its surface brush one deck white paint, but this way, at first its technology is complicated, production cost is higher, simultaneously, because after having increased one deck reflector layer, traditional its heat dispersion of led light source module encapsulation construction reduces greatly, can't solve the heat dissipation problem of high-power LED light source module more.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of and can either saves production cost, can keep the led light source module of heat dispersion plating ceramic layer base preferably again.
The technical solution used in the present invention is: a kind of led light source module is with plating the ceramic layer base, described base comprises substrate and the some reflectors arranged in a straight line that have that are arranged on the substrate, the light-emitting area that is used to install LED on the described reflector is coated with a ceramic layer, the whiteness of described ceramic layer 〉=70.
Described substrate and reflector are to adopt one-body molded making, or reflector is bonded and fixed on the substrate.
The whiteness of described ceramic layer is more preferred from 〉=and 85.
Whiteness the best of described ceramic layer is 〉=88.
The sidewall locations of described adjacent reflector is equipped with opening, forms one group of reflector of strip, and the bottom of the reflector at the two ends of this base is respectively equipped with the circuit board slot, also is provided with a through hole below the circuit board slot.
The bottom of described circuit board slot is lower than the bottom of reflector.
Described base is a strip, and reflector is circular.
Compared with prior art, the present invention has following advantage: because described substrate and reflector are to adopt that metal material is one-body molded to be made, or after being bonded and fixed at reflector on the substrate, plating high whiteness ceramic layer again handles, the reflector layer production process that can reduce traditional LED to adopt metab and need to increase had both been simplified production technology, can save production cost greatly, help large batch of suitability for industrialized production, can adopt prefabricated mode directly to produce base simultaneously; The inventor finds through long-term a large amount of experiment in addition, the whiteness of its base reflective surface is increased to 〉=70, can promote well and get optical efficiency, and the heat dispersion excellence; Its whiteness is 〉=88 best results if lifting is better for 〉=85 effects if promote; Because after being coated with high whiteness ceramic layer on the reflector of base, the getting optical efficiency and will promote greatly of led chip, therefore can significantly reduce luminous energy is converted into heat energy loss, therefore its heat dispersion also will improve greatly, good with its its security performance of LED lamp of making, non-conductive, also improve greatly non-friable service life.
Description of drawings
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is the overall structure schematic diagram of led light source module of the present invention with plating ceramic layer base.
Fig. 2 is the A-A generalized section of Fig. 1.
The specific embodiment
The present invention will be described in detail below in conjunction with specific embodiment.
A kind of led light source module is with plating the ceramic layer base, described base comprises substrate 1 and the some reflectors arranged in a straight line 2 that have that are arranged on the substrate 1, the light-emitting area that is used to install led chip on the described reflector 2 is coated with a ceramic layer 23, the whiteness of described ceramic layer 〉=70; Be more preferred from 〉=85; The best is 〉=88.Described substrate 1 and reflector 2 can be to adopt that metal material is one-body molded to be made, and perhaps also can be that reflector is bonded and fixed on the substrate.
Therefore traditional general whiteness of LED metab needs light-emitting area thereon to increase the reflector layer production process in actual production all less than 70, but do like this heat dispersion of LED base is reduced greatly, and increase production process, has also increased production cost.The present invention adopts the ceramic layer that plates high whiteness on the light-emitting area of reflector, can be according to producing the prefabricated size that processes needs of needs, both met the requirement of whiteness 〉=70, improve heat dispersion, both can simplify production technology, can also save a large amount of production costs, help large batch of suitability for industrialized production, simultaneously can adopt prefabricated mode directly to produce base, production efficiency will improve greatly.
In the foregoing description, the shape of described base also is not limited to annular, can do shapes such as quadrate or rectangle, still can reach aforesaid goal of the invention.
Claims (7)
1. a led light source module is with plating the ceramic layer base, described base comprises substrate and the some reflectors arranged in a straight line that have that are arranged on the substrate, it is characterized in that: the light-emitting area that is used to install LED on the described reflector is coated with a ceramic layer, the whiteness of described ceramic layer 〉=70.
2. led light source module according to claim 1 is characterized in that with plating the ceramic layer base: described substrate and reflector are to adopt one-body molded making, or reflector is bonded and fixed on the substrate.
3. led light source module according to claim 1 is characterized in that with plating ceramic layer base: the whiteness of described ceramic layer is more preferred from 〉=and 85.
4. led light source module according to claim 1 is characterized in that with plating the ceramic layer base: the whiteness of described ceramic layer is best to be 〉=88.
5. led light source module according to claim 1 is with plating the ceramic layer base, it is characterized in that: the sidewall locations of described adjacent reflector is equipped with opening, form one group of reflector of strip, the bottom of the reflector at the two ends of this base is respectively equipped with the circuit board slot, also is provided with a through hole below the circuit board slot.
6. led light source module according to claim 5 is with plating the ceramic layer base, and it is characterized in that: the bottom of described circuit board slot is lower than the bottom of reflector.
7. led light source module according to claim 1 is with plating the ceramic layer base, and it is characterized in that: it is characterized in that: described base is a strip, and reflector is circular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102666244A CN102287776A (en) | 2011-09-09 | 2011-09-09 | Ceramic-coating base for LED (Light Emitting Diode) light source module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102666244A CN102287776A (en) | 2011-09-09 | 2011-09-09 | Ceramic-coating base for LED (Light Emitting Diode) light source module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102287776A true CN102287776A (en) | 2011-12-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102666244A Pending CN102287776A (en) | 2011-09-09 | 2011-09-09 | Ceramic-coating base for LED (Light Emitting Diode) light source module |
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| CN (1) | CN102287776A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102037578A (en) * | 2008-04-23 | 2011-04-27 | 希爱化成株式会社 | Package for light emitting diode, light emitting device, and light emitting device manufacturing method |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
-
2011
- 2011-09-09 CN CN2011102666244A patent/CN102287776A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102037578A (en) * | 2008-04-23 | 2011-04-27 | 希爱化成株式会社 | Package for light emitting diode, light emitting device, and light emitting device manufacturing method |
| CN102072422A (en) * | 2010-09-30 | 2011-05-25 | 福建省万邦光电科技有限公司 | Packaging structure of high-power LED (light emitting diode) light source module |
Non-Patent Citations (1)
| Title |
|---|
| 吴建锋 等: "高反射激光泵浦腔材料的研制", 《佛山陶瓷》 * |
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Application publication date: 20111221 |