CN102278622A - LED light source module packaging structure with convex cup structure - Google Patents
LED light source module packaging structure with convex cup structure Download PDFInfo
- Publication number
- CN102278622A CN102278622A CN2011101168025A CN201110116802A CN102278622A CN 102278622 A CN102278622 A CN 102278622A CN 2011101168025 A CN2011101168025 A CN 2011101168025A CN 201110116802 A CN201110116802 A CN 201110116802A CN 102278622 A CN102278622 A CN 102278622A
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- reflector
- light source
- circuit board
- source module
- led light
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Abstract
The invention provides an LED light source module packaging structure with a convex cup structure, belonging to the processing field of illumination devices. The LED light source module packaging structure comprises a base with a plurality of reflector cups, wherein the bottoms of the reflector cups are provided with at least one LED chip which is adhered on the bottoms of the reflector cups through insulating adhesive. The LED light source module packaging structure is characterized in that each reflector cup is formed through surrounding of an annular bulge, the side wall of the reflector cup is provided with an opening, the base is also concavely provided with a circuit board groove which respectively extends to the openings of the side walls of the reflector cups, a through hole is arranged below the circuit board groove, a circuit board is embedded in the circuit board groove and extends into the reflector cups, the LED chips are connected to the circuit board through wires, and a glue water and fluorescent powder mixed layer is coated above the LED chips in the reflector cups and the circuit board extending into the openings of the reflector cups.
Description
Technical field
The present invention relates to a kind of lighting apparatus, relate in particular to a kind of high-power LED light source module.
Background technology
LED is a kind of low voltage light sources, because its power saving, life-span is long, various low-voltage lighting devices now have been widely used in, traditional led light source module encapsulation construction generally comprises a metab with reflector, reflector bottom center at base is provided with some led chips, this led chip is bonded at the bottom center of reflector equably by welding manner or insulating cement, be in series by lead between the led chip or parallel connection after draw, be connected to the wiring board of the reflector outside that is arranged on the metab, make led chip be covered mixed layer inside fully after again the upper surface of led chip being applied glue and fluorescent material mixed layer.In above-mentioned traditional led light source module encapsulation construction, because needing lead-in wire between led chip and the wiring board is connected, but led chip is arranged on reflector inside, and wiring board is arranged on outside the reflector, therefore in the process of producing, be easy to make between led chip and the wiring board lead-in wire because of the people for bumping disconnected the damage, greatly reduce production efficiency, and it is more complicated that production process also becomes, and increases production cost.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of and can simplifies production process, saves the novel protruding cup structure led light source module encapsulation construction of production cost.
The present invention is achieved in that a kind of protruding cup structure led light source module encapsulation construction, comprise that one has the base of some reflectors, the reflector bottom is provided with at least one led chip, this led chip is bonded at the bottom of reflector by insulating cement, it is characterized in that: described reflector is surrounded by an annular projection, the sidewall of this reflector also is provided with an opening, also be concaved with a circuit board slot on the described base, this circuit board slot extends to respectively in the opening of reflector sidewall, circuit board slot below also is provided with a through hole, the embedded wiring board that is provided with of described circuit board slot, this wiring board extends in the reflector, led chip is connected to wiring board by lead, and the led chip in the described reflector is coated with glue and fluorescent material mixed layer with the top that extends into the wiring board in the reflector opening.
The bottom of described circuit board slot is lower than the bottom of reflector.
The upper surface of described base is provided with a reflector layer of electroplating.
Described base and reflector are circle.
Described reflector is 6, and described circuit board slot is " king " font.
Described wiring board is pressed together by a glass flaggy and a line layer to be formed, and the line layer upper surface also is coated with the reflective white paint of one deck.
Described base adopts metal material to be stamped to form through one-shot forming technique.
The present invention has following advantage: protruding cup structure led light source module encapsulation construction of the present invention adopts above-mentioned with led chip with extend into the wiring board of opening part of reflector and the lead between them, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, lead is from the back pass-out of metab, metab then adopts one-time formed technology to be stamped to form, be convenient in the operation of led chip encapsulation, just can finish in a direct step, improved production efficiency greatly, reduce the damage of lead in the production process, saved production cost.
Description of drawings
The present invention is further illustrated in conjunction with the embodiments with reference to the accompanying drawings.
Fig. 1 is an overall structure schematic diagram of the present invention.
Fig. 2 is the structural representation of base of the present invention.。
Fig. 3 is the structural representation between base of the present invention, wiring board and the led chip.
Fig. 4 is the A-A cutaway view of Fig. 3.
The specific embodiment
The present invention will be described in detail below in conjunction with specific embodiment.
Seeing also Fig. 1 to shown in Figure 4, is a kind of protruding cup structure led light source module encapsulation construction of the present invention, comprises base 11, led chip 12, insulating cement 13, glue and fluorescent material mixed layer 14, reflector 15, wiring board 16, through hole 17, lead 19.Be provided with 6 reflectors on the described base 11 equably, base 11 and reflector 15 in the present embodiment are circle, described base 11 adopts metal material to form through one-body molded die casting, its upper surface has a reflector layer of electroplating, this reflector layer is a silver coating in the present embodiment, the bottom of reflector 15 is provided with some led chips 12, these led chips 12 are bonded at the bottom of reflector 15 by insulating cement 13, described reflector 15 is surrounded by an annular projection 151, the sidewall of this reflector 15 also is provided with an opening 152, also be concaved with a circuit board slot 111 on the described base 11, this circuit board slot 111 extends to respectively in the opening 152 of reflector 15 sidewalls, the below of circuit board slot 111 also is provided with a through hole 17, be embedded with a wiring board 16 in the described circuit board slot 111, this wiring board 16 extends in the reflector 15, led chip 12 is connected to wiring board 16 by lead 19, and led chip 12 in the described reflector 15 and the top that extends into the wiring board 16 in the opening 152 of reflector 15 are coated with glue and fluorescent material mixed layer 14.Described wiring board 16 is " king " font, and is sandwich construction, is pressed together by a glass flaggy and a line layer and forms, and the line layer upper surface also is coated with the reflective white paint of one deck.After wiring board 16 is installed, the upper surface of wiring board 16 is just equal with the bottom surface of reflector 15, when the through hole 17 on the base 11 is used for the led light source module package lead of wiring board 16 back from base 11 is passed, so just can and extend into the wiring board of opening part of reflector and the lead between them with led chip, all be encapsulated in the encapsulating structure of the reflector inside below glue and the fluorescent material mixed layer, can in the operation of led chip encapsulation, just can finish in a direct step, improved production efficiency greatly, reduce the damage of lead in the production process, saved production cost.
In the foregoing description, described base can be selected metal material such as aluminium sheet, the copper coin etc. of various high heat radiations, adopt the mould of making in advance to utilize one-shot forming technique, stamp out the solid shapes such as the reflector that is protruding cup-shaped, opening, circuit board slot and through hole that need, can enhance productivity greatly; And the shape of base also is not limited to circle, can do shapes such as squarely or strip, still can reach aforesaid goal of the invention.
Claims (7)
1. protruding cup structure led light source module encapsulation construction, comprise that one has the base of some reflectors, the reflector bottom is provided with at least one led chip, this led chip is bonded at the bottom of reflector by insulating cement, it is characterized in that: described reflector is surrounded by an annular projection, the sidewall of this reflector also is provided with an opening, also be concaved with a circuit board slot on the described base, this circuit board slot extends to respectively in the opening of reflector sidewall, circuit board slot below also is provided with a through hole, the embedded wiring board that is provided with of described circuit board slot, this wiring board extends in the reflector, led chip is connected to wiring board by lead, and the led chip in the described reflector is coated with glue and fluorescent material mixed layer with the top that extends into the wiring board in the reflector opening.
2. protruding cup structure led light source module encapsulation construction according to claim 1, it is characterized in that: the bottom of described circuit board slot is lower than the bottom of reflector.
3. protruding cup structure led light source module encapsulation construction according to claim 1 is characterized in that: the upper surface of described base is provided with a reflector layer of electroplating.
4. protruding cup structure led light source module encapsulation construction according to claim 1, it is characterized in that: described base and reflector are circle.
5. protruding cup structure led light source module encapsulation construction according to claim 1, it is characterized in that: described reflector is 6, described circuit board slot is " king " font.
6. protruding cup structure led light source module encapsulation construction according to claim 1 is characterized in that: described wiring board is pressed together by a glass flaggy and a line layer to be formed, and the line layer upper surface also is coated with the reflective white paint of one deck.
7. protruding cup structure led light source module encapsulation construction according to claim 1 is characterized in that: described base adopts metal material to be stamped to form through one-shot forming technique.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101168025A CN102278622A (en) | 2011-05-06 | 2011-05-06 | LED light source module packaging structure with convex cup structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101168025A CN102278622A (en) | 2011-05-06 | 2011-05-06 | LED light source module packaging structure with convex cup structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102278622A true CN102278622A (en) | 2011-12-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011101168025A Pending CN102278622A (en) | 2011-05-06 | 2011-05-06 | LED light source module packaging structure with convex cup structure |
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| Country | Link |
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| CN (1) | CN102278622A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958388A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light source module encapsulating structure |
| CN101958387A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light resource module packaging structure |
| CN202076268U (en) * | 2011-05-06 | 2011-12-14 | 福建省万邦光电科技有限公司 | LED light source module package structure with projecting cup structure |
-
2011
- 2011-05-06 CN CN2011101168025A patent/CN102278622A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101958388A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light source module encapsulating structure |
| CN101958387A (en) * | 2010-07-16 | 2011-01-26 | 福建中科万邦光电股份有限公司 | Novel LED light resource module packaging structure |
| CN202076268U (en) * | 2011-05-06 | 2011-12-14 | 福建省万邦光电科技有限公司 | LED light source module package structure with projecting cup structure |
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Application publication date: 20111214 |