CN102275231A - Three-dimensional ultrasonic vibration machining working head - Google Patents
Three-dimensional ultrasonic vibration machining working head Download PDFInfo
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- CN102275231A CN102275231A CN2011102095765A CN201110209576A CN102275231A CN 102275231 A CN102275231 A CN 102275231A CN 2011102095765 A CN2011102095765 A CN 2011102095765A CN 201110209576 A CN201110209576 A CN 201110209576A CN 102275231 A CN102275231 A CN 102275231A
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Abstract
The invention discloses a three-dimensional ultrasonic vibration machining working head which has a simple structure and high cost performance, is easy to control in real time, and can be used for carrying out three-dimensional precise machining of crisp and hard materials. The three-dimensional ultrasonic vibration machining working head comprises a cutter clamp, a membrane platform, a working head body, a pretightening force adjusting bolt, an adjusting washer, an adjusting ring, ring piezoelectric ceramic chips, a pretightening force adjusting nut and a working head end cover, wherein the cutter clamp and the membrane platform are fabricated into an integral structure, the working head body is connected inside the membrane platform, the other end of the working head body is connected with the working head end cover, the working head body is provided with a cavity, three groups of parallelly connected ring piezoelectric ceramic chips are arranged in the cavity, the electrodes of the ring piezoelectric ceramic chips are connected with an external control part through a wiring board of the working head body.
Description
Technical field
The invention belongs to precision metallic Machining Technology for Cutting field, particularly a kind of working head that can carry out three-dimensional ultrasonic vibrocutting processing to the three-dimensional surface of hard brittle material.
Background technology
Development along with Aero-Space, semiconductor and electronic engineering, hard brittle materials such as crystalline silicon, optical glass, engineering ceramics obtain extensive use in these engineerings, but processing is very difficult because these hard brittle materials are shaped, especially the engineering ceramics part that has the 3 D complex profile does not still have effective manufacturing process so far, had a strong impact on further applying of engineering ceramic material, the high-precision three-dimensional micro-processing technology of hard brittle material becomes the manufacturing important subject in countries in the world.
Under the prior art condition, be applicable to that the means of hard brittle material processing mainly contain special processing technologies such as lithography process, spark machined, Laser Processing, Ultrasonic machining.Ultrasonic machining is compared with spark machined, Electrolyzed Processing, laser processing technology, not only do not rely on the electric conductivity of material but also do not have thermophysical effect, compare and can process the big 3D shape of high-aspect-ratio with lithography process, these features make the Ultrasonic machining technology aspect the hard brittle materia processing such as pottery, semiconductor silicon advantageous advantage arranged.
Ultrasonic machining precision height, fast, the rapidoprint wide accommodation of speed, but processed complex die cavity and profile, adding the man-hour instrument contacts with workpiece gently, cutting force is little, can not produce defectives such as burn, distortion, residual stress, be an effective processing method so adopt ultrasonic wave these difficult-to-machine materials directly to be carried out vibrocutting processing at vibration frequency 20～100kHz and amplitude under less than 25 μ m conditions.Existing supersonic vibration cutting method mainly contains one dimension UVC and two kinds of processing methods of two-dimensional ultrasound elliptical vibration cutting, in accurate or little processing, select the diamond cutter tool usually for use, yet diamond makes it be easy to generate serious tool wear to the affinity of ferrous metal, in order to solve the tool wear problem, Kumabe utilizes the supersonic vibration cutting method to carry out the little processing of diamond cutter to the ferrous metal material, though this method has reduced the wearing and tearing of diamond cutter, suface processing quality is descended to some extent; Afterwards, Moriwaki and Shamoto have proposed the ultrasonic elliptically vibrating cutting method in the 50's of 20th century, this method has improved cutting ability effectively, its principal character is: the cutter point of a knife of processing usefulness is done the ultrasonic vibration of high frequency elliptical orbit form, carry out the noncontinuity cutting, compare with other machining, the ultrasonic elliptically vibrating cutting method has many good cutting effects, as little machined surface roughness, high machining accuracy, the ultrasonic elliptically vibrating cutting method has been subjected to the attention of international academic community and engineering circle since coming out.At present, the ultrasonic elliptical vibratory cutting is in theory research and all prematurities still of application facet, especially the precision cutting processing of hard brittle material and the first-class aspect of ultra precision cutting processing work of fine mould are also needed further research, adopt the three-D ultrasonic vibration that hard brittle material is carried out accurate micro-cutting processing, because the point of a knife on the three-D ultrasonic vibration working head is in the internal vibration of the space of a three-dimensional, its anterior angle and relief angle may constantly change in an instantaneous vibration period, vibration amplitude also is constantly to change, in order to reduce cutting force and depth of cut, reduce surface roughness and obtain reasonable three-dimensional surface geometric accuracy, should adopt different vibration frequencies at different hard brittle materials, different phase differences and different ultrasonic amplitudes are had higher requirement to the cutwork head.
Summary of the invention
At the defective of existing supersonic vibration cutting technology, the three-dimensional ultrasonic vibrocutting processing working head that the present invention proposes that a kind of control simple in structure, real-time is easy, cost performance is high, can carry out three-dimensional precision cutting processing to hard brittle material.
For achieving the above object, the technical solution used in the present invention is: three-dimensional ultrasonic vibrocutting processing working head, comprise cutter chuck, the diaphragm platform, the working head main body, pretightning force is regulated bolt, adjust pad, adjust ring, the ring piezoelectric ceramic wafers, pretightning force adjusting nut and working head end cap, cutter chuck and diaphragm platform are made as overall structure, the inboard working head main body that connects of diaphragm platform, the working head main body other end connects the working head end cap, be provided with cavity in the working head main body, be provided with the ring piezoelectric ceramic wafers of three groups of parallel connections in the cavity, the electrode of ring piezoelectric ceramic wafers links to each other with the control section of outside by the terminal plate of working head main body.
Three groups of parallel connections of described ring piezoelectric ceramic wafers also adopt the pretightning force of three parallel connections to regulate the bolt installation, the ring piezoelectric ceramic wafers outside is provided with to be adjusted pad and adjusts ring, adjustment pad and adjustment ring are installed in pretightning force and regulate on the bolt, and pretightning force adjusting bolt end is stretched in the working head end cap and is connected with the pretightning force adjusting nut.
Described pretightning force adjusting bolt is the equilateral triangle layout and head withstands on the diaphragm platform.
The invention has the beneficial effects as follows:
⑴ three ultrasonic vibration working heads in parallel can arbitrarily be controlled the frequency and the amplitude of vibration cutting, also can control Tool in Cutting workpiece form, promptly control the shape of smear metal;
⑵ the reciprocating motion of working head drive cutter adjusts vibration mode from an oscillation cycle to next cycle or in an oscillation cycle or phase difference can accurately be controlled the surface of the work shape, therefore can finish the processing of various complex surface shapes.
Description of drawings
Fig. 1 is the overall structure schematic diagram of the embodiment of the invention;
Fig. 2 is the A-A cutaway view of Fig. 1;
Among the figure: 1 cutter chuck, 2 diaphragm platforms, 3 working head main bodys, 4 pretightning forces are regulated bolt, and 5 adjust pad, and 6 adjust ring, 7 working head end caps, 8 pretightning force adjusting nuts, 9 ring piezoelectric ceramic wafers, 10 terminal plates.
The specific embodiment
The present invention is further described below in conjunction with drawings and Examples.
Three-dimensional ultrasonic vibrocutting processing working head, it is characterized in that: comprise cutter chuck 1, diaphragm platform 2, working head main body 3, pretightning force is regulated bolt 4, adjust pad 5, adjust ring 6, working head end cap 7, pretightning force adjusting nut 8 and ring piezoelectric ceramic wafers 9, cutter chuck 1 and diaphragm platform 2 are made as overall structure, the diaphragm platform 2 inboard working head main bodys 3 that connect, working head main body 3 other ends connect working head end cap 7, be provided with cavity in the working head main body 3, be provided with the ring piezoelectric ceramic wafers 9 of three groups of parallel connections in the cavity, the electrode of ring piezoelectric ceramic wafers 9 links to each other with the control section of outside by the terminal plate 10 of working head main body 3.
9 three groups of parallel connections of described ring piezoelectric ceramic wafers also adopt the pretightning force of three parallel connections to regulate bolt 4 installations, ring piezoelectric ceramic wafers 9 outsides are provided with to be adjusted pad 5 and adjusts ring 6, adjustment pad 5 and adjustment ring 6 are installed in pretightning force and regulate on the bolt 4, and pretightning force adjusting bolt 4 ends are stretched in the working head end cap 7 and are connected with pretightning force adjusting nut 8.
Described pretightning force adjusting bolt 4 is the equilateral triangle layout and head withstands in the groove of diaphragm platform 2.
During work, three-dimensional ultrasonic vibrocutting processing working head is installed on the knife rest of lathe, the diamond indexable insert tip, throw away tip is installed on the cutter chuck 1, the diaphragm platform 2 of the other end is connected with working head main body 3, the ring piezoelectric ceramic wafers 9 of three groups of parallel connections in working head main body 3 is installed in the pretightning force of three parallel connections respectively and regulates on the bolt 4, then by adjusting pad 5 and adjusting the lengthwise position of ring piezoelectric ceramic wafers 9 in working head main body 3 that ring 6 is adjusted three groups of parallel connections, cover make behind the working head end cap 7 three pretightning forces regulate bolts 4 be equilateral triangle respectively and head withstand in the groove of diaphragm platform 2, adjust the prestressing force of ring piezoelectric ceramic wafers 9 at last by pretightning force adjusting nut 8, studies show that prestressing force has material impact to the vibration frequency of ring piezoelectric ceramic wafers 9, the prestressing force that applies is no more than the maximum capacitance 20% of ring piezoelectric ceramic wafers manufacturer recommendation.
When hard brittle material is carried out the ultrasonic wave machining, drive under the three-dimensional ultrasonic vibrocutting processing working head course feed situation at knife rest, make the ring piezoelectric ceramic wafers 9 of three groups of parallel connections produce ultrasonic vibration by the electrode input pulse signal on ring piezoelectric ceramic wafers 9, by adjusting the frequency of pulse signal, the ring piezoelectric ceramic wafers 9 of three groups of parallel connections of amplitude and phase place official post produces different ultrasonic vibrations, thereby make cutter chuck 1 and diaphragm platform 2 produce two rotations and a moving movement vertically, the synthetic point of a knife that is installed on the cutter chuck 1 that makes of these three motions is realized three-dimensional spatial movement, thereby realizes the processing of workpiece 3 D surface shape.This UVC working head can be adjusted hyperacoustic vibration frequency continuously, studies show that this ultrasonic vibration system that is based upon on the diaphragm platform can simplified manufacturing technique, obtain very high dynamic property and can reduce the heat that ring piezoelectric ceramic wafers 9 produces.
Claims (3)
1. working head is processed in a three-dimensional ultrasonic vibrocutting, it is characterized in that: comprise cutter chuck, the diaphragm platform, the working head main body, pretightning force is regulated bolt, adjust pad, adjust ring, the ring piezoelectric ceramic wafers, pretightning force adjusting nut and working head end cap, cutter chuck and diaphragm platform are made as overall structure, the inboard working head main body that connects of diaphragm platform, the working head main body other end connects the working head end cap, be provided with cavity in the working head main body, be provided with the ring piezoelectric ceramic wafers of three groups of parallel connections in the cavity, the electrode of ring piezoelectric ceramic wafers links to each other with the control section of outside by the terminal plate of working head main body.
2. three-dimensional ultrasonic vibrocutting processing working head according to claim 1, it is characterized in that three groups of parallel connections of described ring piezoelectric ceramic wafers and adopt the pretightning force of three parallel connections to regulate the bolt installation, the ring piezoelectric ceramic wafers outside is provided with to be adjusted pad and adjusts ring, adjustment pad and adjustment ring are installed in pretightning force and regulate on the bolt, and pretightning force adjusting bolt end is stretched in the working head end cap and is connected with the pretightning force adjusting nut.
3. three-dimensional ultrasonic vibrocutting processing working head according to claim 1 is characterized in that described pretightning force adjusting bolt is the equilateral triangle layout and head withstands on the diaphragm platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110209576.5A CN102275231B (en) | 2011-07-25 | 2011-07-25 | Three-dimensional ultrasonic vibration machining working head |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110209576.5A CN102275231B (en) | 2011-07-25 | 2011-07-25 | Three-dimensional ultrasonic vibration machining working head |
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| Publication Number | Publication Date |
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| CN102275231A true CN102275231A (en) | 2011-12-14 |
| CN102275231B CN102275231B (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110209576.5A Expired - Fee Related CN102275231B (en) | 2011-07-25 | 2011-07-25 | Three-dimensional ultrasonic vibration machining working head |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873595A (en) * | 2012-10-12 | 2013-01-16 | 上海理工大学 | Three-dimensional ultrasonic auxiliary processing device used for optical aspheric-surface grinding |
| CN105171926A (en) * | 2015-07-23 | 2015-12-23 | 厦门大学 | Vibration-assisted device of single-point diamond cutting tool |
| CN107405696A (en) * | 2015-01-30 | 2017-11-28 | 毛瑟－韦尔克奥伯恩多夫机械制造有限公司 | Drill bit, have drill bit main shaft and for method for finishing manufactured |
| CN109604815A (en) * | 2018-12-10 | 2019-04-12 | 东北大学 | A kind of lens low frequency reciprocating rotation auxiliary laser processing unit (plant) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU923804A1 (en) * | 1980-07-15 | 1982-04-30 | Inst Nadezhnosti Dolgovechnost | Circular saw machine cutting unit |
| CN87204877U (en) * | 1987-03-27 | 1987-11-25 | 清华大学 | Fully sealed high temp. and radiation-resisting three-wafer ultrasonic transducer |
| JPH03117513A (en) * | 1989-09-29 | 1991-05-20 | Seikosha Co Ltd | Ultrasonic saw |
| US5144771A (en) * | 1990-02-06 | 1992-09-08 | Brother Kogyo Kabushiki Kaisha | Liquid supply system of an ultrasonic machine |
| EP0820841A1 (en) * | 1996-07-25 | 1998-01-28 | Georg Geiss Maschinenfabrik | Apparatus for three-dimensional cutting of a thin-walled moulded article |
| CN1597249A (en) * | 2004-07-15 | 2005-03-23 | 天津大学 | Trifreedom nanometer grade micro allocation working table |
| CN201040319Y (en) * | 2007-05-21 | 2008-03-26 | 江苏大学 | Three freedom degree ultrasonic vibration drilling parallel machine tool |
-
2011
- 2011-07-25 CN CN201110209576.5A patent/CN102275231B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SU923804A1 (en) * | 1980-07-15 | 1982-04-30 | Inst Nadezhnosti Dolgovechnost | Circular saw machine cutting unit |
| CN87204877U (en) * | 1987-03-27 | 1987-11-25 | 清华大学 | Fully sealed high temp. and radiation-resisting three-wafer ultrasonic transducer |
| JPH03117513A (en) * | 1989-09-29 | 1991-05-20 | Seikosha Co Ltd | Ultrasonic saw |
| US5144771A (en) * | 1990-02-06 | 1992-09-08 | Brother Kogyo Kabushiki Kaisha | Liquid supply system of an ultrasonic machine |
| EP0820841A1 (en) * | 1996-07-25 | 1998-01-28 | Georg Geiss Maschinenfabrik | Apparatus for three-dimensional cutting of a thin-walled moulded article |
| CN1597249A (en) * | 2004-07-15 | 2005-03-23 | 天津大学 | Trifreedom nanometer grade micro allocation working table |
| CN201040319Y (en) * | 2007-05-21 | 2008-03-26 | 江苏大学 | Three freedom degree ultrasonic vibration drilling parallel machine tool |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873595A (en) * | 2012-10-12 | 2013-01-16 | 上海理工大学 | Three-dimensional ultrasonic auxiliary processing device used for optical aspheric-surface grinding |
| CN107405696A (en) * | 2015-01-30 | 2017-11-28 | 毛瑟－韦尔克奥伯恩多夫机械制造有限公司 | Drill bit, have drill bit main shaft and for method for finishing manufactured |
| CN105171926A (en) * | 2015-07-23 | 2015-12-23 | 厦门大学 | Vibration-assisted device of single-point diamond cutting tool |
| CN109604815A (en) * | 2018-12-10 | 2019-04-12 | 东北大学 | A kind of lens low frequency reciprocating rotation auxiliary laser processing unit (plant) |
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| Publication number | Publication date |
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| CN102275231B (en) | 2014-07-09 |
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