CN102263095A - 发光装置以及照明装置 - Google Patents
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Abstract
一种使用陶瓷基板并可实现散热性的提高的发光装置及照明装置。发光装置包括:陶瓷基板;金属导热层,形成在所述陶瓷基板上且未电性连接;发光元件,安装在所述金属导热层上;以及金属接合层,介隔在所述金属导热层与所述发光元件之间,将所述发光元件接合于所述金属导热层。
Description
技术领域
本发明的实施方式涉及一种使用发光二极管(Light Emitting Diode,LED)等的发光元件的发光装置及照明装置。
背景技术
近来,正逐渐使用LED来作为照明装置的光源。该光源是在基板上安装多个LED的裸芯片(bare chip),并利用接合线(bonding wire)来电性连接各LED芯片而构成为发光装置。
LED等的发光元件随着其温度上升,会与光输出的下降、特性的变动一同造成寿命的下降。因此,在将LED等的固态发光元件作为光源的发光装置中,必须抑制发光元件的温度上升,以改善寿命、效率等各特性。
先前,作为发光装置的基板,已知有陶瓷(ceramics)基板,该陶瓷基板具有绝缘性,热膨胀少,而且也适合于要求散热性及耐热性且供给大电流来作为驱动电流的用途。发光元件通过树脂材料的粘合剂而接合并安装于该陶瓷基板上。
然而,在上述现有的基板中,发光元件是通过树脂材料的粘合剂来接合,因此,从发光元件产生的热有可能无法有效地传导至基板,从而无法有效地进行散热。而且,当在基板上安装多个发光元件时,各发光元件的温度会变得不均匀,从而各个发光元件的光输出或发光色有可能产生偏差。
现有技术文献
专利文献
专利文献1日本专利特开2009-290244号公报
专利文献2E本专利特开2010-34487号公报
发明内容
本发明是有鉴于上述问题而完成,其目的在于提供一种使用陶瓷基板并可实现散热性的提高的发光装置及照明装置。
根据实施方式,提供一种发光装置,包括:陶瓷基板;金属导热层,形成在所述陶瓷基板上且未电性连接;发光元件,安装在所述金属导热层上;以及金属接合层,介隔在所述金属导热层与所述发光元件之间,将所述发光元件接合于所述金属导热层。
发明的效果
根据本发明,能够期待一种使用陶瓷基板并可提高从发光元件产生的热的散热性且可抑制发光元件的温度上升的发光装置、以及使用该发光装置的照明装置。
附图说明
图1是表示第1实施方式的发光装置的立体图。
图2是表示第1实施方式的发光装置的基板上的导热层、正极侧供电导体及负极侧供电导体的图案(pattern)的平面图。
图3是以局部切开的状态来表示第1实施方式的发光装置的平面图。
图4是沿着图3的X-X线的剖面图。
图5是示意性地表示用于对第1实施方式的发光装置中的导热层的面积与发光元件的温度的关系进行调查的试料的剖面图。
图6是图5的平面图。
图7是表示导热层的面积与发光元件的温度的关系的图表。
图8是表示导热层的面积与发光元件的温度的关系的图表。
图9是表示第2实施方式的发光装置的剖面图。
图10是表示第3实施方式的照明装置的立体图。
符号的说明:
1:发光装置
2:陶瓷基板
2a:切口部
3:金属导热层
4、4a:发光元件
5:金属接合层
16:铜层
21:正极侧供电导体
22:负极侧供电导体
23、24:供电端子部
25:框构件
26:密封构件
27:导线
41:接合线
100:照明装置/照明器具
104:凹面反射镜
105:镜支撑构件
105a:底部
105b:支撑部
105c:开口缘
131:散热片
132:底座
133:散热鳍
135:受热部
141:凹面镜构件
141a:缘
141b:座部
142:螺丝
145:压镜件
145a:安装片部
145b:塞片部
145c:前端缘
A:第一层
B:第二层
C:第三层
L:导热层3的长度尺寸
Ls:发光元件4的接合面积
Ms:导热层3的面积
R:发光元件4的接合面积Ls相对于导热层3的面积Ms的面积比率
t:导热层3的厚度尺寸
Tj:接面温度
具体实施方式
以下,更详细说明本发明的实施方式。
陶瓷基板可适用白色系的氧化铝或氮化铝,但并不特别限定于特定的材料。
作为金属导热层,例如可列举铜图案作为基板上的第一层,列举镀镍层作为铜图案之上的第二层,进而列举镀银层作为第三层。金属导热层例如也可由铜图案这一层构成。金属导热层的材料并不受特别限定。而且,金属接合层的材料也不受特别限定。
发光元件可适用LED等的固态发光元件。进而,发光元件的安装个数并无特别限制。
发光装置可装入照明装置的本体内而应用。此时,照明装置包括光源、在室内或室外使用的照明器具或显示器(display)装置等。
第1实施方式
参照图1至图8来说明本实施方式的发光装置。另外,在各图中,对于相同部分标注相同符号并省略重复的说明。
如图1至图4所示,发光装置1具备:陶瓷基板2;金属导热层3,形成在该基板上;发光元件4,安装在该金属导热层上;以及金属接合层5,介隔在所述金属导热层3与发光元件4之间。
基板2具有绝缘性,由白色系的氧化铝或氮化铝等的陶瓷材料形成。基板2形成为大致四边形状,在各角部,形成有螺丝等的固定机构所卡合的切口部2a。
如图2至图4所示,在基板2的表面上,以同样的层结构而层叠着导热层3、正极侧供电导体21及负极侧供电导体22。如图2所示,导热层3在基板2的中央部形成为大致四边形状。正极侧供电导体21及负极侧供电导体22是在导热层3的相向的边上平行地,且与导热层3空开隔离距离(绝缘距离)而成对地形成。因此,导热层3成为未电性连接的非连接状态,并非作为电性导体而发挥作用。
并且,正极侧供电导体21及负极侧供电导体22是各自地整体以大致L字状而呈线对称地形成。另外,正极侧供电导体21及负极侧供电导体22的一端侧是作为供电端子部23、24而构成。
如图4所示,这些导热层3、正极侧供电导体21及负极侧供电导体22为三层结构,在基板2上,通过蚀刻(etching)而设有铜图案来作为第一层A。在该铜图案层之上,对镍(Ni)进行无电场电镀处理以作为第二层B,对银(Ag)进行无电解电镀处理以作为第三层C。导热层3、正极侧供电导体21及负极侧供电导体22的第三层C,即,表层,均为镀银(Ag)层,全光线反射率高达90%。另外,在基板2的表面上,也可适当地形成抗蚀剂(resist)层。
在基板2的导热层3上,安装着多个发光元件4。发光元件4是由LED的裸芯片构成。对于LED的裸芯片,例如使用发出蓝色光的LED裸芯片,以使发光部发出白色系的光。该LED的裸芯片使用由金属材料构成的接合剂而接合于导热层3上。因此,在导热层3与发光元件4(即,LED的裸芯片)之间,形成着具有导热性的金属接合层5。
具体而言,接合剂为Au-Sn合金焊料,通过该Au-Sn合金焊料层而形成接合层5。在该接合层5的形成时,首先,将Au-Sn合金焊料涂布于导热层3上的发光元件4的配设位置。继而,在Au-Sn合金焊料上配置发光元件4,在该状态下进行加热,并以约300℃的高温来实施回流(reflow)处理而使Au-Sn合金焊料熔解之后予以冷却。由此,形成接合层5,发光元件4被接合至导热层1上。另外,作为接合剂,也可使用无铅焊料等来作为金属材料的焊料。
所述多个发光元件4排列成矩阵(matrix)状而形成多列例如6列发光元件列(参照图3)。
LED的裸芯片例如为InGaN系的元件,在透光性的蓝宝石(sapphire)元件基板上层叠有发光层,发光层是使n型氮化物半导体层、InGaN发光层及p型氮化物半导体层依序层叠而形成为大致长方体形状。并且,用于使电流流经发光层的电极设在上表面侧,且由在p型氮化物半导体层上由p型电极焊垫(pad)形成的正(plus)侧电极以及在n型氮化物半导体层上由n型电极焊垫形成的负(minus)侧电极构成。这些电极通过接合线41而电性连接着。接合线41由金(Au)的细线构成,为了提高安装强度和降低LED裸芯片的损伤,经由以金(Au)为主成分的凸块(bump)而连接着。
具体而言,在各个发光元件列中,在该列所延伸的方向上邻接的发光元件4的异极的电极彼此,即,邻接的发光元件4中的一个发光元件4的正侧电极和邻接的发光元件4中的另一个发光元件4的负侧电极,利用接合线41而依序连接着。由此,构成各个发光元件列的多个发光元件4电性串联连接。因此,多个发光元件4在通电状态下一齐发光。
进而,在各个发光元件列中,特定的发光元件,即,配置在列的端部的发光元件4a,的电极利用接合线41而连接于正极侧供电导体21及负极侧供电导体22。因此,所述各发光元件列电性并列设置,并通过正极侧供电导体21及负极侧供电导体22而受到供电。因此,即使各发光元件列中的任一列有时因接合不良等导致无法再发光,发光装置1整体的发光也不会停止。
在基板2的表面上设有框构件25。在框构件25上,例如使用分配器(dispenser)而将具有规定粘度的未硬化的硅酮(silicone)树脂在基板2上涂布成框状,随后进行加热硬化,由此粘合至基板2上。该框构件25被涂布成大致四边形状,且具有与导热层3同样的大致四边形状的内周面。在由内周面所围成的框构件25的内侧,配设着整个导热层3、正极侧供电导体21及负极侧供电导体22、各发光元件4。即,发光元件4的安装区域成为由框构件25所包围的状态。
如上所述,框构件25是由硅酮树脂所形成,因此难以产生因光或热造成的劣化,可抑制表层实施有镀银(Ag)的导热层3、正极侧供电导体21及负极侧供电导体22的变色。因此,能够减轻这些导热层3、正极侧供电导体21及负极侧供电导体22引起的反射效率的下降。
在框构件的内侧,填充着密封构件26,且密封构件26设于基板2上。密封构件26为透光性合成树脂,例如为透明硅酮树脂制,且对导热层3、正极侧供电导体21及负极侧供电导体22、各发光元件4进行密封。
而且,密封构件26含有适量的荧光体。荧光体受到发光元件4发出的光激发而放射出与发光元件4所发出的光的颜色为不同颜色的光。在发光元件4发出蓝色光的本实施方式中,为了能够放射出白色光,对荧光体使用放射出与蓝色光存在补色关系的黄色系的光的黄色荧光体。密封构件26是在未硬化的状态下向框构件25的内侧注入规定量之后进行加热硬化而设。
如图1所示,在正极侧供电导体21及负极侧供电导体22的一端侧的供电端子部23、24上,通过焊接而连接着导线(lead wire)27。在该导线27上,电性连接着未图示的点灯电路,由此,从点灯电路向发光元件4供给电力,以对发光元件4进行点灯控制。
当通过点灯电路来对上述结构的发光装置1供给电力时,由于导热层3为非电性连接的状态,因此从正极侧供电导体21向接合线41、发光元件4、负极侧供电导体22通电,由密封构件26所覆盖的各发光元件4一齐发光,发光装置1被用作出射白色光的面状光源。
在该点灯过程中,导热层3是作为使各发光元件4发出的热得以扩散的散热器(heat spreader)而发挥功能。各发光元件4发出的热从由导热性良好的金属材料,即,Au-Sn合金焊料层,形成的接合层5传导至导热层3,传导至该导热层3的热在此处得以扩散,并且,主要传导至基板2而得以散热。
而且,在发光装置1的点灯过程中,发光元件4放射出的光中的朝向基板2侧的光主要是在导热层3或正极侧供电导体21及负极侧供电导体22的表层而被反射向光的利用方向。
如上所述,根据本实施方式,可有效利用陶瓷基板2的特性,且可提高从发光元件4产生的热的散热性,从而能够抑制发光元件4的温度上升。而且,可实现各发光元件4的温度的均匀化,从而能够减轻各个发光元件的光输出或发光色的偏差。
除此以外,当在高温下进行接合层5的形成时,由于基板2具有耐热性,因此可避免基板2因热而受到损伤。
然而,以上述实施方式为前提,本发明者如图5至图8所示般对导热层3的面积与发光元件4的温度的关系进行调查。具体而言,所调查的为发光元件4的接合面积Ls相对于导热层3的面积Ms的面积比率R、与发光元件4在点灯时的接面(junction)温度Tj的关系。
如图5及图6所示,准备在基板2上安装有1个发光元件4的试料来作为试料。此时,导热层3的面积Ms相当于每1个发光元件4的面积。当所安装的发光元件4为多个时,每1个发光元件4的面积是将导热层3的总面积除以发光元件4的安装个数所得的值。发光元件4的接合面积Ls是发光元件4的每1个发光元件4与导热层3的接合面积,该接合面积近似于发光元件4的上表面侧的发光面积。另外,当接合层5的面积小于发光元件4时,严格而言,每1个发光元件4的接合面积Ls为每1个发光元件4的接合层5的面积。在此种试料中,准备各种改变了导热层3的面积Ms与厚度尺寸t的试料,对接面温度Tj进行测定。
其结果,获得图7及图8所示的数据(data)。首先,在图7中,纵轴表示接面温度Tj(℃),横轴表示导热层3的长度尺寸L(mm)。该导热层3的长度尺寸L是与导热层3的面积Ms存在着相关,且可替代为面积Ms。因此,在图示上,6%~40%的表示是指发光元件4的接合面积Ls相对于导热层3的面积Ms的面积比率R。
对于面积比率R为6%~100%的数种试料(参照图8的(a)~(k)),在18μm~250μm之间(参照图7的(a)~(g))改变厚度尺寸t而测定接面温度Tj(℃)。其结果,如图所示,确认存在如下倾向,即:面积比率R越小则接面温度Tj(℃)越是下降,厚度尺寸t越是增加则接面温度Tj(℃)越是降低。而且,图7的线段(h)是表示(无)导热层3而未形成导热层3,且表示将发光元件4直接设于基板2上时的接面温度Tj(℃)。此时,线段(h)为110℃,因此以此为基准,110℃更上侧的区域并无因形成导热层3带来的散热效果,而110℃更下侧的区域具有因形成导热层3带来的散热效果。因而,面积比率R为5%的试料在导热层3的厚度尺寸t为18μm~250μm的整个范围内,接面温度Tj处于110℃更下侧。
确认并无因形成导热层3带来的散热效果的区域,例如,区域N1由于面积比率R大,因此无法有效地使热得以扩散,而且,导热层3作为热阻而发挥作用,从而视为会妨碍向基板2的导热。
因此,根据图7所示的数据可知的是,只要至少面积比率R为5%以上,则可对应于与厚度尺寸t的组合状态而设为与“无”导热层3的线段(h)为同等以下的接面温度Tj,从而可有效地抑制发光元件4的温度上升。
其次,图8是改变坐标轴来表示测定数据。即,纵轴表示接面温度Tj(℃),横轴表示导热层3的厚度尺寸t(μm)。
与图7同样地,已确认存在如下倾向,即:面积比率R越小,则接面温度Tj(℃)越是下降,厚度尺寸t越是增加则接面温度Tj(℃)越是降低。而且,同样地,以线段(1)为基准,110℃更上侧的区域并未因形成导热层3而带来散热效果,而110℃更下侧的区域具有因形成导热层3带来的散热效果。
但是,可知的是,被确认为并未因形成导热层3而带来散热效果的区域N2存在如下倾向,即,尽管厚度尺寸t增加,接面温度Tj(℃)仍会上升。考虑其原因在于,由于导热层3的厚度尺寸t增加,基于与面积比率R的关系,导热层3作为热阻而发挥作用的程度提高。
根据以上的图8所示的数据可知的是,只要面积比率R为40%以下,则可对应于与厚度尺寸t的组合状态而设为与“无”导热层3的线段(1)为同等以下的接面温度Tj,从而可有效地抑制发光元件4的温度上升。
如上所述,通过将发光元件4的每1个发光元件4与导热层3的接合面积Ls相对于每1个发光元件4的导热层3的面积Ms的比率设定为5%以上40%以下,能够实现散热效果的提高。
第2实施方式
参照图9,对使用DCB(Direct Copper Bonding)基板的发光装置1进行说明。DCB基板是在陶瓷基板2的背面形成有厚度约50μm的铜层16的基板,陶瓷基板2的表面侧的构造例如与图4相同。另外,在图9中,图示为导热层3由一层金属层构成。当使用DCB基板时,也有时将表面侧的导热层3的厚度设为250μm以上。
第3实施方式
发光装置1可构成为作为LED灯(lamp)的光源、在室内或室外使用的照明器具、或装入显示器装置等的装置本体内的照明装置。
参照图10,对本实施方式的照明装置进行说明。该照明装置100包括2个发光装置1、本体103、凹面反射镜104以及镜支撑构件105。发光装置1可使用第1实施方式或第2实施方式中说明的发光装置。
本体103具备呈盒体(case)的散热片(heat sink)131以及受热部135。散热片131一体地具有多个垂直地安装在大致圆板状底座(base)132的背面的散热鳍(fin)133。受热部135是具有与底座132的厚度为同程度的厚度的长方体。该受热部135与散热片131为不同体,且相对于底座132而安装在与散热鳍133为相反侧的正面。
凹面反射镜104是由以铝制作的一对凹面镜构件141构成。各凹面镜构件141的反射面形成为抛物面,并且被加工成镜面。凹面镜构件141具有位于光出射侧的半圆弧状的缘141a以及位于散热片131的底座132侧的座部141b。座部141b是沿底座132平坦地形成,且具有切口141c。凹面镜构件141是使座部141b接触至散热片131的底座132的正面,并通过以扣于切口141c的方式而安装在底座132的固定孔内的螺丝142而固定至底座132。
被固定在散热片131的正面侧的一对凹面镜构件141在受热部135的两侧面向发光装置1,以该受热部135为边界而呈面对称地配置着。成为发光装置1的发光部的加入有荧光体的密封构件是与由凹面镜构件141的抛物面构成的反射面相向。发光装置1被配置成,发光部的中心部位于凹面镜构件141的焦点处。
在半径方向上远离从照明器具100放射出的光束的中心的受热部135的端部,从正面侧利用螺钉而固定有压镜件145。压镜件145一体地具有抵接于受热部135的安装片部145a以及沿反射面弯折的塞片部145b。一对凹面镜构件141在中间插入有受热部135而相应地远离反射面。当安装片部145a螺固于受热部135时,塞片部145b以堵塞凹面镜构件141之间的间隙的方式而配置着。由此,凹面镜构件141的缘141a与塞片部145b的前端缘145c形成近似于圆形的形状。
兼作凹面反射镜104的罩(cover)的镜支撑构件105是由圆筒形的底部105a以及从该一端呈喇叭(horn)状扩大的支撑部105b构成。支撑部105b为直径比底部105a大的锥(taper)形状,从正面侧观察时呈圆形。镜支撑构件105使底部105a碰抵至底座132的正面,且使支撑部105b接触至凹面反射镜104的外周部背面,由此被保持在底座132与凹面反射镜104的周部之间。镜支撑构件105从背侧支撑凹面反射镜104。
镜支撑构件105预先配置在底座132的正面侧之后,由固定在底座132上的凹面镜构件141而予以保持着。镜支撑构件105的支撑部105b上形成的开口缘105c较凹面镜构件141的缘141a及压镜件145的前端缘145c位于更前侧,即,位于光出射侧。凹面反射镜104及压镜件145被收纳在镜支撑构件105内。电缆(cable)孔5d是为了使连接至供电端子的绝缘包覆电线穿过而设置着。
根据本实施方式的照明装置,可提供一种具有上述发光装置所起到的效果的照明装置。
另外,本发明并不限定于上述实施方式的结构,可在不脱离发明的主旨的范围内进行各种变形。上述实施方式中,对导热层由铜、镍、银的三层结构形成的情况进行说明,但并不限于此,例如也可由铜箔这一层形成。而且,构成导热层的材料并不特别限定于特定材料。进而,形成接合层的金属材料也不限定于特定材料。
Claims (3)
1.一种发光装置,其特征在于包括:
陶瓷基板;
金属导热层,形成在所述陶瓷基板上且未电性连接;
发光元件,安装在所述金属导热层上;以及
金属接合层,介隔在所述金属导热层与所述发光元件之间,将所述发光元件接合于所述金属导热层。
2.根据权利要求1所述的发光装置,其特征在于,
每1个所述发光元件的与所述金属导热层的接合面积相对于每1个所述发光元件的所述金属导热层的面积的比率为5%以上40%以下。
3.一种照明装置,其特征在于包括:
照明装置本体;以及
根据权利要求1所述的发光装置,配设在照明装置本体上。
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- 2011-05-24 EP EP11167364.6A patent/EP2390917A3/en not_active Withdrawn
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Also Published As
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US20110291151A1 (en) | 2011-12-01 |
JP2012009834A (ja) | 2012-01-12 |
EP2390917A3 (en) | 2014-01-15 |
US8368113B2 (en) | 2013-02-05 |
CN102263095B (zh) | 2015-07-29 |
JP5846408B2 (ja) | 2016-01-20 |
EP2390917A2 (en) | 2011-11-30 |
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