CN102254857B - 半导体工艺及结构 - Google Patents
半导体工艺及结构 Download PDFInfo
- Publication number
- CN102254857B CN102254857B CN201010183027.0A CN201010183027A CN102254857B CN 102254857 B CN102254857 B CN 102254857B CN 201010183027 A CN201010183027 A CN 201010183027A CN 102254857 B CN102254857 B CN 102254857B
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- Prior art keywords
- conductive substrates
- layer
- protective layer
- metal pattern
- pattern
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- Expired - Fee Related
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
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Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201010183027.0A CN102254857B (zh) | 2010-05-18 | 2010-05-18 | 半导体工艺及结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201010183027.0A CN102254857B (zh) | 2010-05-18 | 2010-05-18 | 半导体工艺及结构 |
Publications (2)
Publication Number | Publication Date |
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CN102254857A CN102254857A (zh) | 2011-11-23 |
CN102254857B true CN102254857B (zh) | 2015-11-25 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201010183027.0A Expired - Fee Related CN102254857B (zh) | 2010-05-18 | 2010-05-18 | 半导体工艺及结构 |
Country Status (1)
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CN (1) | CN102254857B (zh) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1348511A (zh) * | 1999-02-27 | 2002-05-08 | 晏达科技有限公司 | 用激光显影掩模层对金属基体选择性镀覆方法及设备 |
CN1505138A (zh) * | 2002-11-29 | 2004-06-16 | ������������ʽ���� | 半导体器件及其制造方法 |
CN1516272A (zh) * | 2002-12-03 | 2004-07-28 | 三洋电机株式会社 | 半导体装置、及其制作方法和薄板相互连线部件 |
CN1783542A (zh) * | 2001-12-28 | 2006-06-07 | 大日本印刷株式会社 | 高分子电解质型燃料电池及高分子电解质型燃料电池用隔板 |
CN1988140A (zh) * | 2005-12-21 | 2007-06-27 | 中华映管股份有限公司 | 焊垫以及显示面板 |
-
2010
- 2010-05-18 CN CN201010183027.0A patent/CN102254857B/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1348511A (zh) * | 1999-02-27 | 2002-05-08 | 晏达科技有限公司 | 用激光显影掩模层对金属基体选择性镀覆方法及设备 |
CN1783542A (zh) * | 2001-12-28 | 2006-06-07 | 大日本印刷株式会社 | 高分子电解质型燃料电池及高分子电解质型燃料电池用隔板 |
CN1505138A (zh) * | 2002-11-29 | 2004-06-16 | ������������ʽ���� | 半导体器件及其制造方法 |
CN1516272A (zh) * | 2002-12-03 | 2004-07-28 | 三洋电机株式会社 | 半导体装置、及其制作方法和薄板相互连线部件 |
CN1988140A (zh) * | 2005-12-21 | 2007-06-27 | 中华映管股份有限公司 | 焊垫以及显示面板 |
Also Published As
Publication number | Publication date |
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CN102254857A (zh) | 2011-11-23 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
ASS | Succession or assignment of patent right |
Owner name: VIDOLED GROUP CO., LTD. Free format text: FORMER OWNER: HONGBAO TECHNOLOGY CO., LTD. Effective date: 20120703 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20120703 Address after: Anguilla Valley Applicant after: Victoria Group Company Address before: Hsinchu City, Taiwan, China Applicant before: Hongbao Technology Co.,Ltd. |
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ASS | Succession or assignment of patent right |
Owner name: YIGFEBOS YOULE LLC Free format text: FORMER OWNER: VIDOLED GROUP CO., LTD. Effective date: 20130227 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20130227 Address after: Delaware Applicant after: Yigfebos Youle LLC Address before: Anguilla Valley Applicant before: Victoria Group Company |
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
C41 | Transfer of patent application or patent right or utility model | ||
GR01 | Patent grant | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20151104 Address after: Delaware Applicant after: Sharp KK Address before: Delaware Applicant before: Yigfebos Youle LLC |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151125 Termination date: 20190518 |