CN102254839A - Simple out-core integration method for integrated circuit and novel frame - Google Patents
Simple out-core integration method for integrated circuit and novel frame Download PDFInfo
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- CN102254839A CN102254839A CN2010101801583A CN201010180158A CN102254839A CN 102254839 A CN102254839 A CN 102254839A CN 2010101801583 A CN2010101801583 A CN 2010101801583A CN 201010180158 A CN201010180158 A CN 201010180158A CN 102254839 A CN102254839 A CN 102254839A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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Abstract
The invention relates to a simple out-core integration method for an integrated circuit and a novel frame. The simple out-core integration method mainly comprises the following step of: connecting certain end points (bonding pads) on a chip, which are required to be combined and connected but are spaced away from one another, to a certain appropriate pin or bridge approach or bottom plate with metal wires (lines) by taking a bridge approach and a bottom plate in the novel frame with a unique layout or taking a bottom plate in a standard frame as bridge transition to realize combination and connection, or performing combination and connection from a suspended cross metal wire (line) in the middle of the chip. The invention has the advantages that: an IC (Integrated Circuit) chip circuit with a large quantity of pins is easily integrated into a novel integrated circuit with a small quantity of pins, resources in the original chip circuit are recombined or optimized or expanded, high cost on the research of a small batch of simple novel integrated circuits is saved, the developing period of the novel integrated circuit is shortened, and the urgent demand of customers is met quickly.
Description
Technical field
The present invention relates to a kind of integrated circuit (IC) manufacture method, simple and easy integrated approach outside the core that particularly a kind of IC chip is implemented before encapsulation can be saved simple new integrated circuit (IC) the great number cost of paying of development small lot.
Background technology
Existing method for manufacturing integrated circuit almost generally all is earlier circuit to be integrated in the silicon chip, again the silicon wafer circuitry exit is connected (group is fixed) to frame pin the inner with wire, forms with the encapsulating material encapsulation at last.This manufacture method, though it is integrated level height, encapsulation are easily, very high to the simple new required cost of Development of IC of small lot, and have only the silicon chip factory can integrated novel circuit, encapsulation factory normally can not change once more or recombinate or expand former IC chip circuit function.
Summary of the invention
Can not be when the present invention mainly solves the integrated circuit (IC) chip encapsulation to the integrated once more technical problem of former chip circuit, a kind of simple and easy integrated method outside the core of also implementing when encapsulation is provided, the resource in the former chip circuit of recombinating, or change or expanded circuit function, reduce former integrated circuit volume, (or reduce former integrated circuit take up space) shortens the new lsi development cycle, save the simple new integrated circuit of development small lot and pay the great number cost, be badly in need of to satisfy Application Design fast.
The present invention is that to solve the problems of the technologies described above the technical scheme of being taked (method) as follows:
(1) the new nead frame of the design layout uniqueness different with standard, wherein base plate and pin, or there is access bridge to intert wherein between pin and the pin, access bridge wire (line) risen the same with base plate passed through the transfer transitional function, do not draw outside the encapsulation, as embodiment 1,2, used new frame in 3, four pins 5 are wherein arranged, 6,7,8 side by side in the straight long limit of base plate 10, there are symmetrical two access bridges 11 on other three limits of base plate 10,12 armfuls around, at access bridge 11,12 outsides have two pins 2 again, 3 whole process are held up with both hands, at two pins 2,3 outsides have two pins 1 again, 4 whole process are followed and are escorted, can be fit to paste IC chip 9 and discrete electronic device on the base plate 10 simultaneously, pin, some loose position on the access bridge, also just in time be fit to paste discrete electronic device or simple chip, pin, access bridge, backplane placement, adapt to the freely direct or leap connection of wire easily, avoid wire in the middle of chip, to cross over;
(2) utilizing the layout advantage of unique new frame, need to merge for some end points (bond pad) of circumferentially-spaced on discrete device and the chip 9 and draw, is with wire directly or cross a certain suitable pin or access bridge and merge and connect; Need to merge for two or more end points (bond pad) of circumferentially-spaced on the chip but do not draw, directly or cross over and be connected on a certain suitable access bridge or base plate with wire; For the line on chip and the discrete device, can directly connect or indirect utilization pin, access bridge, base plate transition connect;
(3) utilize the existing standard framework, connect the end points (bond pad) that merges on the IC chip 9, realize that core is outer simple and easy integrated, its concrete grammar is, for adjacent side on the chip or opposite side isolated some need merge the end points (bond pad) of connection, be connected on certain same pin from the 9 middle conveniences leaps of IC chip with wire, realize that great-leap-forward merges connection; For on the chip with isolated some end points that need merge (bond pad) on one side, with wire directly or cross over and be connected on certain same pin, realize merging and connect; For some end points that need merge (bond pad) of circumferentially-spaced on the chip, be connected on the base plate 10 with wire nearby separately earlier, be connected to a certain pin with wire from base plate 10 again, utilize base plate to make terminal, realize passing through merging and connect; For some key discrete device or companion chip in the application circuit, stick on the suitable position of base plate or pin or access bridge earlier, connect with wire again.
The beneficial effect that the present invention produced is: easily that the pin position is many external end points of IC chip circuit (bond pad), before encapsulation, merge integrated once more, become the few new integrated circuit in pin position, make in the former chip circuit resource obtain reorganization or expansion, easily make former chip become one the complicated slightly new integrated circuit of new function or function is arranged, reduce former integrated circuit volume (or reduce former integrated circuit take up space), shorten the new lsi development cycle, save the simple new integrated circuit of development small lot and pay the great number cost, be badly in need of to satisfy Application Design fast.
Description of drawings:
Fig. 1 is the concrete wiring connection layout of the embodiment of the invention 1.
Fig. 2 is the concrete wiring connection layout of the embodiment of the invention 2.
Fig. 3 is the concrete wiring connection layout of the embodiment of the invention 3.
Fig. 4 is the concrete wiring connection layout of the embodiment of the invention 4.
Fig. 5 is the concrete wiring connection layout of the embodiment of the invention 5.
Fig. 6 is the concrete wiring connection layout of the embodiment of the invention 6.
Among the figure: 1～8 is pin in the framework, 9 is integrated circuit (IC) chip, a, b, c, d, e, f, g, h, j, k, l, m, n around it are external connection end point (bond pad), 10 is the base plate of placing IC chip 9 in the framework, 11 is left access bridge in the framework, 12 is right access bridge in the framework, 13 is package material, D1, D2 are voltage stabilizing didoe, D3, D4 are diode, R, R1, R2 are resistance, and each end points (bond pad) a～n is connected lead-in wire to pin 1～8, access bridge 11,12, the base plate 10 and is conduction good metal silk on discrete device and the chip 9.
Embodiment
Below by embodiment, and in conjunction with the accompanying drawings, technical scheme of the present invention (method) is further described in detail:
Embodiment 1:
The technical scheme that present embodiment is taked (concrete integrated approach), as shown in Figure 1, E class 14 pin chips are pasted on the suitable position of base plate in the described new frame 10 with insulating cement, voltage stabilizing didoe D1 positive pole is pasted on base plate 10 upper left corners with conducting resinl, the D1 negative pole is connected to pin 1 with wire, voltage stabilizing didoe D2 negative pole is pasted on base plate 10 upper right corner with conducting resinl, voltage stabilizing didoe D2 positive pole is connected to pin 4 with wire, the two ends of resistance R 1 (or equivalence element), directly welding (or stickup) is in the suitable position of pin 2 and access bridge 11, and (or stickup) directly welded in the suitable position of pin 3 and access bridge 12 in the two ends of resistance R 2 (or equivalence element); Pin 1～8 in the framework, access bridge 11,12, base plate 10 to the scheme (method) with the wire connecting wiring between chip upper extreme point (bond pad) a～n is: pin 1 connection end point c, pin 2 connection end point b, g, pin 3 connection end point i, m, pin 4 connection end point l, pin 5 connects access bridge 12 connection end point h again, k, pin 6 connection end point n, pin 7 connection end point a, pin 8 connects access bridge 11 connection end point e again, f, base plate 10 connection end point d, j, through above-mentioned leap wiry or directly connection, some non-conterminous pad in interval on the IC chip has been realized merging connection as required, and line does not intersect not to be crossed in the middle of chip yet, has reached the purpose to the outer simple and easy integrated encapsulation of IC core.
Embodiment 2:
The technical scheme that present embodiment is taked (concrete integrated approach), as shown in Figure 2, category-A 14 pin chips are pasted on the suitable position of base plate in the described new frame 10 with insulating cement, voltage stabilizing didoe D1 positive pole is pasted on base plate 10 upper left corners with conducting resinl, voltage stabilizing didoe D1 negative pole is connected to pin 1 with wire, voltage stabilizing didoe D2 negative pole is pasted on base plate 10 upper right corner with conducting resinl, voltage stabilizing didoe D2 positive pole is connected to pin 4 with wire, the two ends of resistance R 1 (or equivalence element), directly welding (or stickup) is in the suitable position of pin 2 and access bridge 11, (or paste) directly welded in the suitable position of pin 3 and access bridge 12 in the two ends of resistance R 2 (or equivalence element), pin 1～8 in the framework, access bridge 11,12, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is: pin 1 connection end point d, pin 2 connection end point c, g, pin 3 connection end point h, l, pin 4 connection end point k, pin 5 connection end point m and access bridge 12 be connection end point j again, pin 6 connection end point n, pin 7 connection end point a, pin 8 connection end point b and access bridge 11 be connection end point e again, base plate 10 connection end point f, i, through above-mentioned leap wiry or directly connection, the end points (bond pad) at some interval (non-conterminous) on the IC chip 9 has been realized merging connection as required, and line does not intersect not to be crossed in the middle of chip 9 yet, has reached the purpose to the outer simple and easy integrated encapsulation of IC core.
Embodiment 3:
The technical scheme that present embodiment is taked (concrete integrated approach), as shown in Figure 3, category-A 14 pin chips are pasted on the suitable position of base plate in the described new frame 10 with insulating cement, voltage stabilizing didoe D1 positive pole is pasted on base plate 10 upper left corners with conducting resinl, voltage stabilizing didoe D1 negative pole is connected to pin 1 with wire, voltage stabilizing didoe D2 negative pole is pasted on base plate 10 upper right corner with conducting resinl, voltage stabilizing didoe D2 positive pole is connected to pin 4 with wire, diode D3 negative pole is pasted on access bridge 11 with conducting resinl, diode D3 positive pole is connected to pin 2 with wire, diode D4 negative pole is pasted on access bridge 12 with conducting resinl, diode D4 positive pole is connected to pin 3 with wire, the two ends of resistance R 1 (or equivalence element), directly welding (or stickup) is between pin 7 and 8, (or stickup) directly welded between pin 5 and 6 in the two ends of resistance R 2 (or equivalence element), pin 1～8 in the framework, access bridge 11,12, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is: pin 1 connection end point d, pin 2 connection end point e, g, pin 3 connection end point h, j, pin 4 connection end point k, pin 5 connects access bridge 12 connection end point i again, l, pin 6 connection end point n, pin 7 connection end point a, pin 8 connects access bridge 11 connection end point c again, f, base plate 10 connection end point b, m, through above-mentioned leap wiry or directly connection, the end points (bond pad) at some interval (non-conterminous) on the IC chip 9 has been realized merging connection as required, and line does not intersect not to be crossed in the middle of chip 9 yet, has reached the purpose to the outer simple and easy integrated encapsulation of IC core.
Embodiment 4:
The technical scheme that present embodiment is taked (concrete integrated approach), as shown in Figure 4, S class 14 pin chips are pasted on the suitable position of base plate in the existing 8 footnote collimator frames 10 with insulating cement, the two ends of resistance R (or equivalence element), directly welding (or stickup) is between pin 8 and base plate 10, pin 1～8 in the framework, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is: pin 1 is connection end point b and base plate 10 respectively, pin 2 connection end point c, pin 3 connection end point e, pin 4 connection end point g, pin 5 is connection end point h and base plate 10 respectively, pin 6 connection end point i, j, pin 7 connection end point m, pin 8 connection end point n, base plate 10 is gone back connection end point d, f, l, through leap wiry of above-mentioned usefulness or directly connection, the end points (bond pad) at some interval (non-conterminous) on the IC chip 9 has been realized merging connection as required, and line does not intersect, particularly utilize base plate 10 to pass through transfer to l in the chip 9, d, f, b, the ingenious realization of five end points of h (bond pad) merges connection, successfully reached the purpose to the outer simple and easy integrated encapsulation of IC core.
Embodiment 5:
The technical scheme that present embodiment is taked (concrete integrated approach), as shown in Figure 5, S class 14 pin chips are pasted on the suitable position of base plate in the existing 8 footnote collimator frames 10 with insulating cement, the two ends of resistance R (or equivalence element), directly welding (or stickup) is between pin 6 and 7, pin 1～8 in the framework, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is: pin 1 connection end point e, pin 2 is connection end point f and base plate 10 respectively, pin 3 connection end point g, pin 4 connection end point i, pin 5 connection end point k, pin 6 connection end point n, pin 7 is connection end point b and pin 8 respectively, pin 8 is connection end point d again, l, base plate 10 is gone back connection end point h, j, wherein, end points l crosses over opposite side through IC chip 9 centres and the last line of end points d is connected to pin 8, pin 7 is in parallel with 8 to be in order to strengthen the external circuit connection reliability, end points h, j utilizes base plate 10, and transfer carries out the transition to pin 2 and end points f and realizes merging and is connected with line, has successfully reached the purpose to the simple and easy integrated encapsulation outward of IC core.
Embodiment 6:
The technical scheme that present embodiment is taked (concrete integrated approach), as shown in Figure 6, E class 14 pin chips are pasted on the suitable position of base plate in the existing 8 footnote collimator frames 10 with insulating cement, resistance R 1 (or equivalence element) welding (or stickup) is between pin 1 and access bridge 10, resistance R 2 (or equivalence element) welding (or stickup) is between pin 4 and access bridge 10, pin 1～8, access bridge 11,12, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is: pin 1 connection end point e, f, pin 2 connects base plate 10 and end points g, pin 3 connection end point d, h, pin 4 connection end point i, j, pin 5 connection end point l, pin 6 connection end point m, pin 7 connection end point a, pin 8 connection end point c, base plate 10 connection end point b, k, n, wherein, chip 9 upper terminal d and h are distributed on the two adjacent limits, be unsettled leap wire connection end point h and pin 3 in the middle of chip 9, realization terminal d is connected merging with h, b on the chip 9, n, k, four terminals of g utilize base plate 10 to connect to merge and are wired on the pin 2 again, thereby reach the purpose of the outer simple and easy integrated encapsulation of core.
Claims (7)
1. outer simple and easy integrated approach of an ic core and new frame is characterized in that:
(1) adopted the nead frame of the newly-designed layout uniqueness different with standard, base plate and pin in the new frame, or there is access bridge to intert wherein between pin and the pin, access bridge wire (line) risen the same with base plate passed through the transfer transitional function, do not draw outside the encapsulation, as embodiment 1,2, used new frame in 3, four pins 5 are wherein arranged, 6,7,8 side by side in the straight long limit of base plate 10, there are symmetrical two access bridges 11 on other three limits of base plate 10,12 armfuls around, at access bridge 11,12 outsides have two pins 2 again, 3 whole process are held up with both hands, at two pins 2,3 outsides have two pins 1 again, 4 whole process are followed and are escorted, can be fit to paste IC chip 9 and discrete electronic device on the base plate 10 simultaneously, pin, some loose position on the access bridge, also just in time be fit to paste discrete electronic device or simple chip, pin, access bridge, backplane placement, adapt to the freely direct or leap connection of wire easily, avoid wire in the middle of chip, to cross over;
(2) utilize the layout advantage of unique new frame, two or more end points (bond pad) for circumferentially-spaced on discrete device and the chip 9 need merging to draw, be directly or cross a certain suitable pin or access bridge and merge and connect with wire, need to merge for two or more end points (bond pad) of circumferentially-spaced on the chip but do not draw, with wire directly or cross over and be connected on a certain suitable access bridge or base plate, for the line on chip and the discrete device, can directly connect or indirect utilization pin, access bridge, base plate transition connect;
(3) utilize the existing standard framework, connect the end points (bond pad) that merges on the IC chip 9, realize that core is outer simple and easy integrated, its concrete grammar is, for adjacent side on the chip or the isolated two or more end points (bond pad) that connect that need to merge of opposite side, be connected on certain same pin from the 9 middle conveniences leaps of IC chip with wire, realize that great-leap-forward merges connection, for the same isolated end points that two or more need merge (bond pad) on one side on the chip, with wire directly or cross over and be connected on certain same pin, realize merging and connect, two or more end points that need merge (bond pad) for circumferentially-spaced on the chip, be connected on the base plate 10 with wire nearby separately earlier, be connected to a certain pin with wire from base plate 10 again, utilize base plate to make terminal, realization is passed through to merge and is connected, for some key discrete device or companion chip in the application circuit, stick on the suitable position of base plate or pin or access bridge earlier, connect with wire again.
2. outer simple and easy integrated approach of a kind of ic core according to claim 1 and new frame, it is characterized in that: in embodiment 1, E class 14 pin chips are pasted on the suitable position of base plate in the described new frame 10 with insulating cement, voltage stabilizing didoe D1 positive pole is pasted on base plate 10 upper left corners with conducting resinl, the D1 negative pole is connected to pin 1 with wire, voltage stabilizing didoe D2 negative pole is pasted on base plate 10 upper right corner with conducting resinl, voltage stabilizing didoe D2 positive pole is connected to pin 4 with wire, the two ends of resistance R 1 (or equivalence element), directly welding (or stickup) is in the suitable position of pin 2 and access bridge 11, (or paste) directly welded in the suitable position of pin 3 and access bridge 12 in the two ends of resistance R 2 (or equivalence element), pin 1～8 in the framework, access bridge 11,12, base plate 10 to the scheme (method) with the wire connecting wiring between chip upper extreme point (bond pad) a～n is, pin 1 connection end point c, pin 2 connection end point b, g, pin 3 connection end point i, m, pin 4 connection end point l, pin 5 connects access bridge 12 connection end point h again, k, pin 6 connection end point n, pin 7 connection end point a, pin 8 connects access bridge 11 connection end point e again, f, base plate 10 connection end point d, j, through above-mentioned leap wiry or directly connection, some non-conterminous pad in interval on the IC chip 9 has been realized merging connection as required, and line does not intersect not to be crossed in the middle of chip 9 yet, has reached the purpose to the outer simple and easy integrated encapsulation of IC core.
3. outer simple and easy integrated approach of a kind of ic core according to claim 1 and new frame, it is characterized in that: in embodiment 2, category-A 14 pin chips are pasted on the suitable position of base plate in the described new frame 10 with insulating cement, voltage stabilizing didoe D1 positive pole is pasted on base plate 10 upper left corners with conducting resinl, voltage stabilizing didoe D1 negative pole is connected to pin 1 with wire, voltage stabilizing didoe D2 negative pole is pasted on base plate 10 upper right corner with conducting resinl, voltage stabilizing didoe D2 positive pole is connected to pin 4 with wire, the two ends of resistance R 1 (or equivalence element), directly welding (or stickup) is in the suitable position of pin 2 and access bridge 11, (or paste) directly welded in the suitable position of pin 3 and access bridge 12 in the two ends of resistance R 2 (or equivalence element), pin 1～8 in the framework, access bridge 11,12, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is, pin 1 connection end point d, pin 2 connection end point c, g, pin 3 connection end point h, l, pin 4 connection end point k, pin 5 connection end point m and access bridge 12 be connection end point j again, pin 6 connection end point n, pin 7 connection end point a, pin 8 connection end point b and access bridge 11 be connection end point e again, base plate 10 connection end point f, i, through above-mentioned leap wiry or directly connection, the end points (bond pad) at some interval (non-conterminous) on the IC chip 9 has been realized merging connection as required, and line does not intersect not to be crossed in the middle of chip 9 yet, has reached the purpose to the outer simple and easy integrated encapsulation of IC core.
4. outer simple and easy integrated approach of a kind of ic core according to claim 1 and new frame, it is characterized in that: in embodiment 3, category-A 14 pin chips are pasted on the suitable position of base plate in the described new frame 10 with insulating cement, voltage stabilizing didoe D1 positive pole is pasted on base plate 10 upper left corners with conducting resinl, voltage stabilizing didoe D1 negative pole is connected to pin 1 with wire, voltage stabilizing didoe D2 negative pole is pasted on base plate 10 upper right corner with conducting resinl, voltage stabilizing didoe D2 positive pole is connected to pin 4 with wire, diode D3 negative pole is pasted on access bridge 11 with conducting resinl, diode D3 positive pole is connected to pin 2 with wire, diode D4 negative pole is pasted on access bridge 12 with conducting resinl, diode D4 positive pole is connected to pin 3 with wire, the two ends of resistance R 1 (or equivalence element), directly welding (or stickup) is between pin 7 and 8, (or stickup) directly welded between pin 5 and 6 in the two ends of resistance R 2 (or equivalence element), pin 1～8 in the framework, access bridge 11,12, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is, pin 1 connection end point d, pin 2 connection end point e, g, pin 3 connection end point h, j, pin 4 connection end point k, pin 5 connects access bridge 12 connection end point i again, l, pin 6 connection end point n, pin 7 connection end point a, pin 8 connects access bridge 11 connection end point c again, f, base plate 10 connection end point b, m, through above-mentioned leap wiry or directly connection, the end points (bond pad) at some interval (non-conterminous) on the IC chip 9 has been realized merging connection as required, and line does not intersect not to be crossed in the middle of chip 9 yet, has reached the purpose to the outer simple and easy integrated encapsulation of IC core.
5. the outer simple and easy integrated approach of a kind of ic core according to claim 1, it is characterized in that: in embodiment 4, S class 14 pin chips are pasted on the suitable position of base plate in the existing 8 footnote collimator frames 10 with insulating cement, the two ends of resistance R (or equivalence element), directly welding (or stickup) is between pin 8 and base plate 10, pin 1～8 in the framework, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is, pin 1 is connection end point b and base plate 10 respectively, pin 2 connection end point c, pin 3 connection end point e, pin 4 connection end point g, pin 5 is respectively at the bottom of connection end point h and the plate 10, pin 6 connection end point i, j, pin 7 connection end point m, pin 8 connection end point n, base plate 10 is gone back connection end point d, f, l, through leap wiry of above-mentioned usefulness or directly connection, the end points (bond pad) at some interval (non-conterminous) on the IC chip has been realized merging connection as required, and line does not intersect, particularly utilize base plate 10 to pass through transfer to l in the chip 9, d, f, b, the ingenious realization of five end points of h (bond pad) merges connection, successfully reached the purpose to the outer simple and easy integrated encapsulation of IC core.
6. the outer simple and easy integrated approach of a kind of ic core according to claim 1, it is characterized in that: in embodiment 5, S class 14 pin chips are pasted on the suitable position of base plate in the existing 8 footnote collimator frames 10 with insulating cement, the two ends of resistance R (or equivalence element), directly welding (or stickup) is between pin 6 and 7, pin 1～8 in the framework, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is, pin 1 connection end point e, pin 2 is connection end point f and base plate 10 respectively, pin 3 connection end point g, pin 4 connection end point i, pin 5 connection end point k, pin 6 connection end point n, pin 7 is connection end point b and pin 8 respectively, pin 8 is connection end point d again, l, base plate 10 is gone back connection end point h, j, wherein, end points l crosses over opposite side through IC chip 9 centres and the last line of end points d is connected to pin 8, pin 7 is in parallel with 8 to be in order to strengthen the external circuit connection reliability, end points h, j utilizes base plate 10, and transfer carries out the transition to pin 2 and end points f and realizes being connected merging with line, has successfully reached the purpose to the simple and easy integrated encapsulation outward of IC core.
7. the outer simple and easy integrated approach of a kind of ic core according to claim 1, it is characterized in that: in embodiment 6, E class 14 pin chips are pasted on the suitable position of base plate in the existing 8 footnote collimator frames 10 with insulating cement, resistance R 1 (or equivalence element) welding (or stickup) is between pin 1 and base plate 10, resistance R 2 (or equivalence element) welding (or stickup) is between pin 4 and base plate 10, pin 1～8, base plate 10 to the scheme (method) with the wire connecting wiring between chip 9 upper extreme points (bond pad) a～n is, pin 1 connection end point e, f, pin 2 connects base plate 10 and end points g, pin 3 connection end point d, h, pin 4 connection end point i, j, pin 5 connection end point l, pin 6 connection end point m, pin 7 connection end point a, pin 8 connection end point c, base plate 10 is gone back connection end point b, k, n, wherein, chip 9 upper terminal d and h are distributed on the two adjacent limits, be unsettled leap wire connection end point d and pin 3 in the middle of chip 9, realization terminal d is connected merging with h, b on the chip 9, n, k, four terminals of g utilize base plate 10 to connect to merge and are wired on the pin 2 again, thereby reach the purpose of the outer simple and easy integrated encapsulation of core.
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