CN102251228B - 清洁气体输送装置的方法、生长薄膜的方法及反应装置 - Google Patents
清洁气体输送装置的方法、生长薄膜的方法及反应装置 Download PDFInfo
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- CN102251228B CN102251228B CN201110073624.2A CN201110073624A CN102251228B CN 102251228 B CN102251228 B CN 102251228B CN 201110073624 A CN201110073624 A CN 201110073624A CN 102251228 B CN102251228 B CN 102251228B
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- CN
- China
- Prior art keywords
- reaction chamber
- bracing
- strutting arrangement
- cleaning device
- strut member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 157
- 238000004140 cleaning Methods 0.000 claims abstract description 272
- 239000007789 gas Substances 0.000 claims abstract description 175
- 238000004220 aggregation Methods 0.000 claims abstract description 134
- 230000002776 aggregation Effects 0.000 claims abstract description 134
- 238000007790 scraping Methods 0.000 claims abstract description 84
- 239000012495 reaction gas Substances 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 144
- 230000008569 process Effects 0.000 claims description 61
- 239000010408 film Substances 0.000 claims description 57
- 239000012530 fluid Substances 0.000 claims description 52
- 239000010409 thin film Substances 0.000 claims description 28
- 238000009826 distribution Methods 0.000 claims description 18
- 230000014759 maintenance of location Effects 0.000 claims description 18
- 230000009347 mechanical transmission Effects 0.000 claims description 13
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 claims description 7
- 239000000376 reactant Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 238000010586 diagram Methods 0.000 description 28
- 230000004888 barrier function Effects 0.000 description 16
- 238000001914 filtration Methods 0.000 description 13
- 239000011148 porous material Substances 0.000 description 8
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000001451 molecular beam epitaxy Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- -1 such as Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
- C23C16/4407—Cleaning of reactor or reactor parts by using wet or mechanical methods
-
- B08B1/32—
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Abstract
Description
Claims (55)
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110073624.2A CN102251228B (zh) | 2011-03-25 | 2011-03-25 | 清洁气体输送装置的方法、生长薄膜的方法及反应装置 |
TW100131736A TWI484062B (zh) | 2011-03-25 | 2011-09-02 | A method of cleaning a gas delivery device, a method of growing a film, and a reaction device |
PCT/CN2012/072873 WO2012130089A1 (zh) | 2011-03-25 | 2012-03-23 | 清洁气体输送装置的方法、生长薄膜的方法及反应装置 |
US14/003,787 US20130344244A1 (en) | 2011-03-25 | 2012-03-23 | Method for cleaning gas conveying device, and method and reaction device for film growth |
EP12763198.4A EP2690193B1 (en) | 2011-03-25 | 2012-03-23 | Method for cleaning gas conveying device and reaction device for film growth comprising said gas conveying device |
KR1020137022182A KR20130122783A (ko) | 2011-03-25 | 2012-03-23 | 가스 이송 장치의 세정 방법, 필름 성장용 반응 장치 및 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201110073624.2A CN102251228B (zh) | 2011-03-25 | 2011-03-25 | 清洁气体输送装置的方法、生长薄膜的方法及反应装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102251228A CN102251228A (zh) | 2011-11-23 |
CN102251228B true CN102251228B (zh) | 2015-12-16 |
Family
ID=44978788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201110073624.2A Active CN102251228B (zh) | 2011-03-25 | 2011-03-25 | 清洁气体输送装置的方法、生长薄膜的方法及反应装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130344244A1 (zh) |
EP (1) | EP2690193B1 (zh) |
KR (1) | KR20130122783A (zh) |
CN (1) | CN102251228B (zh) |
TW (1) | TWI484062B (zh) |
WO (1) | WO2012130089A1 (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102251228B (zh) * | 2011-03-25 | 2015-12-16 | 中微半导体设备(上海)有限公司 | 清洁气体输送装置的方法、生长薄膜的方法及反应装置 |
CN103374711B (zh) * | 2012-04-26 | 2017-08-15 | 塔工程有限公司 | 用于清洁反应室的设备 |
CN103668337A (zh) * | 2013-12-09 | 2014-03-26 | 大连维乐液压制造有限公司 | 一种拉杆下料装置 |
DE102015107315A1 (de) | 2014-07-02 | 2016-01-07 | Aixtron Se | Verfahren und Vorrichtung zum Reinigen eines Gaseinlassorgans |
DE102014109349A1 (de) | 2014-07-04 | 2016-01-21 | Aixtron Se | Vorrichtung zum Reinigen einer Gasaustrittsfläche eines Gaseinlassorgans eines CVD-Reaktors |
CN104328387A (zh) * | 2014-11-25 | 2015-02-04 | 聚灿光电科技(苏州)有限公司 | 一种气相沉淀设备用喷淋头清洁装置 |
CN106929824A (zh) * | 2015-12-29 | 2017-07-07 | 中国建材国际工程集团有限公司 | 清洁覆层设施中基底运输机构的方法和设备以及覆层设施 |
KR20180069403A (ko) * | 2016-12-15 | 2018-06-25 | 삼성전자주식회사 | 질화 갈륨 기판의 제조 방법 |
JP6846303B2 (ja) * | 2017-06-30 | 2021-03-24 | 昭和電工株式会社 | 研削装置および研削方法 |
JP6996952B2 (ja) * | 2017-11-27 | 2022-01-17 | 株式会社トクヤマ | Iii族窒化物単結晶積層体の製造方法及びiii族窒化物単結晶積層体 |
US20220367159A1 (en) * | 2019-11-01 | 2022-11-17 | Lam Research Corporation | Systems and methods for cleaning a showerhead |
CN112317196A (zh) * | 2020-09-30 | 2021-02-05 | 中国科学院长春光学精密机械与物理研究所 | 一种喷淋头清洁装置 |
CN114141568A (zh) * | 2021-11-28 | 2022-03-04 | 盛吉盛(宁波)半导体科技有限公司 | 一种薄膜生长设备腔体的电动开关装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0526644A1 (en) * | 1991-02-15 | 1993-02-10 | Semiconductor Process Laboratory Co., Ltd. | Semiconductor manufacturing equipment |
EP0605791A1 (en) * | 1992-11-30 | 1994-07-13 | Canon Sales Co., Inc. | Apparatus for forming a film |
US6286525B1 (en) * | 1997-05-08 | 2001-09-11 | Dainippon Screen Mfg. Co. | Substrate cleaning apparatus and method |
CN101097844A (zh) * | 2006-06-29 | 2008-01-02 | Ips有限公司 | 半导体处理装置 |
CN201296780Y (zh) * | 2008-10-29 | 2009-08-26 | 上海蓝光科技有限公司 | 一种清腔刷头 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5703493A (en) * | 1995-10-25 | 1997-12-30 | Motorola, Inc. | Wafer holder for semiconductor applications |
EP1135540B1 (de) * | 1998-10-21 | 2002-03-13 | Siemens Aktiengesellschaft | Verfahren und vorrichtung zur reinigung eines erzeugnisses |
JP2003059884A (ja) * | 2001-08-20 | 2003-02-28 | Tokyo Electron Ltd | 基板処理装置及び基板処理方法 |
US7984526B2 (en) * | 2003-08-08 | 2011-07-26 | Entegris, Inc. | Methods and materials for making a monolithic porous pad cast onto a rotatable base |
JP5031013B2 (ja) * | 2008-11-19 | 2012-09-19 | 東京エレクトロン株式会社 | 成膜装置、成膜装置のクリーニング方法、プログラム、プログラムを記憶するコンピュータ可読記憶媒体 |
TWI426579B (zh) * | 2010-02-01 | 2014-02-11 | Hermes Epitek Corp | 半導體設備及其清潔方法 |
CN102251228B (zh) * | 2011-03-25 | 2015-12-16 | 中微半导体设备(上海)有限公司 | 清洁气体输送装置的方法、生长薄膜的方法及反应装置 |
-
2011
- 2011-03-25 CN CN201110073624.2A patent/CN102251228B/zh active Active
- 2011-09-02 TW TW100131736A patent/TWI484062B/zh active
-
2012
- 2012-03-23 US US14/003,787 patent/US20130344244A1/en not_active Abandoned
- 2012-03-23 EP EP12763198.4A patent/EP2690193B1/en active Active
- 2012-03-23 KR KR1020137022182A patent/KR20130122783A/ko active Search and Examination
- 2012-03-23 WO PCT/CN2012/072873 patent/WO2012130089A1/zh active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0526644A1 (en) * | 1991-02-15 | 1993-02-10 | Semiconductor Process Laboratory Co., Ltd. | Semiconductor manufacturing equipment |
EP0605791A1 (en) * | 1992-11-30 | 1994-07-13 | Canon Sales Co., Inc. | Apparatus for forming a film |
US6286525B1 (en) * | 1997-05-08 | 2001-09-11 | Dainippon Screen Mfg. Co. | Substrate cleaning apparatus and method |
CN101097844A (zh) * | 2006-06-29 | 2008-01-02 | Ips有限公司 | 半导体处理装置 |
CN201296780Y (zh) * | 2008-10-29 | 2009-08-26 | 上海蓝光科技有限公司 | 一种清腔刷头 |
Also Published As
Publication number | Publication date |
---|---|
TWI484062B (zh) | 2015-05-11 |
EP2690193A4 (en) | 2014-08-20 |
KR20130122783A (ko) | 2013-11-08 |
EP2690193B1 (en) | 2019-05-08 |
TW201239128A (en) | 2012-10-01 |
EP2690193A1 (en) | 2014-01-29 |
CN102251228A (zh) | 2011-11-23 |
US20130344244A1 (en) | 2013-12-26 |
WO2012130089A1 (zh) | 2012-10-04 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20111123 Assignee: Nanchang Medium and Micro Semiconductor Equipment Co., Ltd. Assignor: Advanced Micro-Fabrication Equipment (Shanghai) Inc. Contract record no.: 2018990000345 Denomination of invention: Method for cleaning gas conveying device, and method and reaction device for film growth Granted publication date: 20151216 License type: Exclusive License Record date: 20181217 |
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CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |