CN102244072B - 发光器件模块 - Google Patents

发光器件模块 Download PDF

Info

Publication number
CN102244072B
CN102244072B CN2011101237881A CN201110123788A CN102244072B CN 102244072 B CN102244072 B CN 102244072B CN 2011101237881 A CN2011101237881 A CN 2011101237881A CN 201110123788 A CN201110123788 A CN 201110123788A CN 102244072 B CN102244072 B CN 102244072B
Authority
CN
China
Prior art keywords
light emitting
emitting device
circuit board
printed circuit
pcb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2011101237881A
Other languages
English (en)
Chinese (zh)
Other versions
CN102244072A (zh
Inventor
李建教
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Liyu Semiconductor Co ltd
Original Assignee
LG Innotek Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd
Publication of CN102244072A publication Critical patent/CN102244072A/zh
Application granted granted Critical
Publication of CN102244072B publication Critical patent/CN102244072B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F21V31/005—Sealing arrangements therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0125—Shrinkable, e.g. heat-shrinkable polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Circuit Arrangement For Electric Light Sources In General (AREA)
  • Liquid Crystal (AREA)
CN2011101237881A 2010-05-12 2011-05-10 发光器件模块 Expired - Fee Related CN102244072B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2010-0044602 2010-05-12
KR1020100044602A KR101641860B1 (ko) 2010-05-12 2010-05-12 발광소자 어레이, 조명장치 및 백라이트 장치

Publications (2)

Publication Number Publication Date
CN102244072A CN102244072A (zh) 2011-11-16
CN102244072B true CN102244072B (zh) 2013-12-25

Family

ID=44509792

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011101237881A Expired - Fee Related CN102244072B (zh) 2010-05-12 2011-05-10 发光器件模块

Country Status (5)

Country Link
US (1) US9285083B2 (enExample)
EP (1) EP2386790B1 (enExample)
JP (1) JP2011238933A (enExample)
KR (1) KR101641860B1 (enExample)
CN (1) CN102244072B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130032828A1 (en) * 2011-08-02 2013-02-07 Hsu Takeho Led light strip module structure
DE102012204510A1 (de) * 2011-11-18 2013-05-23 Tridonic Jennersdorf Gmbh Rohrförmige LED-Lampe
JP6201480B2 (ja) * 2013-07-23 2017-09-27 日亜化学工業株式会社 発光装置及び照明装置
JP2015167090A (ja) * 2014-03-03 2015-09-24 パナソニックＩｐマネジメント株式会社 照明用光源及び照明装置
DE202014005059U1 (de) * 2014-06-17 2014-09-10 Petrus Pfundt Tubelight LED Lichtröhre
DE102016122127A1 (de) * 2016-08-18 2018-02-22 Ledvance Gmbh Reinraumbeleuchtung auf LED-Basis
DE202019101941U1 (de) * 2019-04-04 2019-04-10 Herrnhuter Sterne GmbH Elektrische Kerze
CA3151649C (en) 2019-11-04 2023-01-03 Northquip Inc. Portable livestock handling apparatus with foldable force tub and extendable/collapsible chassis
FI20236085A1 (en) * 2023-09-28 2025-03-29 Greenlux Lighting Solutions Oy LED-based light fixture

Family Cites Families (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4729076A (en) * 1984-11-15 1988-03-01 Tsuzawa Masami Signal light unit having heat dissipating function
FR2650153B1 (fr) * 1989-07-28 1994-04-01 Mitchell Sports Dispositif pour fixer, de maniere ajustable, un accessoire tel qu'un moulinet sur une canne a peche
JPH03120714A (ja) * 1989-10-04 1991-05-22 Toshiba Corp Ｘ線露光装置
US5276599A (en) * 1992-02-21 1994-01-04 Neeley Willard L Light sculpture device
NO176415C (no) * 1992-10-16 1995-03-29 Technor As Lyslist for nivåglass
US5412159A (en) * 1993-09-27 1995-05-02 Zenith Electronics Corporation High voltage resistive network circuit board with good potting adhesion
US5410328A (en) * 1994-03-28 1995-04-25 Trans-Lux Corporation Replaceable intelligent pixel module for large-scale LED displays
TW408497B (en) * 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
US6152590A (en) * 1998-02-13 2000-11-28 Donnelly Hohe Gmbh & Co. Kg Lighting device for motor vehicles
JP3925602B2 (ja) * 1999-06-14 2007-06-06 セイコーエプソン株式会社 接着材料の貼着方法及び半導体装置の製造方法
US7401935B2 (en) * 1999-09-17 2008-07-22 Vanderschuit Carl R Beverage accessory devices
JP2002006325A (ja) * 2000-06-20 2002-01-09 Nec Corp 液晶表示パネルの製造方法
JP3554533B2 (ja) * 2000-10-13 2004-08-18 シャープ株式会社 チップオンフィルム用テープおよび半導体装置
US6639360B2 (en) * 2001-01-31 2003-10-28 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US8376576B2 (en) * 2001-07-25 2013-02-19 The Sloan Company, Inc. Perimeter lighting
KR100788071B1 (ko) * 2001-10-03 2007-12-21 도시바 마쯔시따 디스플레이 테크놀로지 컴퍼니, 리미티드 액정 표시 패널
US7192161B1 (en) * 2001-10-18 2007-03-20 Ilight Technologies, Inc. Fluorescent illumination device
TW533750B (en) * 2001-11-11 2003-05-21 Solidlite Corp LED lamp
US20030090892A1 (en) * 2001-11-13 2003-05-15 Chin-Lai Su Drinking vessel capable of emitting light and sound
US7312400B2 (en) * 2002-02-22 2007-12-25 Fujikura Ltd. Multilayer wiring board, base for multilayer wiring board, printed wiring board and its manufacturing method
US6758993B2 (en) * 2002-04-17 2004-07-06 Delphi Technologies, Inc. System and method for minimizing cure-induced residual stress in an epoxy impregnated ignition coil
JP2004095853A (ja) * 2002-08-30 2004-03-25 Koha Co Ltd Ｌｅｄランプおよび照明装置
US7800121B2 (en) * 2002-08-30 2010-09-21 Lumination Llc Light emitting diode component
JP4252297B2 (ja) * 2002-12-12 2009-04-08 株式会社日立製作所 発光素子およびこの発光素子を用いた表示装置
JP2004207341A (ja) * 2002-12-24 2004-07-22 Sanken Electric Co Ltd 発光波長変換型半導体発光装置及びその製法
TWI352553B (en) * 2002-12-26 2011-11-11 Semiconductor Energy Lab Light emitting device and a method for manufacturi
TWI235506B (en) * 2003-12-02 2005-07-01 Yuan Lin Light reflection device and its manufacturing method
US7245279B2 (en) * 2003-12-04 2007-07-17 Xiao-Ping Wang Linear led array
US20050270774A1 (en) * 2004-06-03 2005-12-08 Frank Pan LED illuminating strip unit
JP4802533B2 (ja) * 2004-11-12 2011-10-26 日亜化学工業株式会社 半導体装置
JP4828886B2 (ja) 2005-07-29 2011-11-30 株式会社光波 面発光モジュール及びそれを用いた面発光装置
JP2007081234A (ja) * 2005-09-15 2007-03-29 Toyoda Gosei Co Ltd 照明装置
JP3120714U (ja) 2006-01-17 2006-04-20 森山産業株式会社 Ｌｅｄ照明発光体装置
DE102006031345A1 (de) * 2006-07-06 2008-01-10 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Formflexibles Beleuchtungssystem
US7887218B2 (en) * 2006-10-17 2011-02-15 Baoliang Wang LED illuminating device
US7889421B2 (en) * 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
EP1928026A1 (en) * 2006-11-30 2008-06-04 Toshiba Lighting & Technology Corporation Illumination device with semiconductor light-emitting elements
JP4893582B2 (ja) * 2007-10-25 2012-03-07 豊田合成株式会社 光源装置
CN201121811Y (zh) 2007-11-09 2008-09-24 邵树发 可任意安排造型之线条灯
US7810954B2 (en) * 2007-12-03 2010-10-12 Lumination Llc LED-based changeable color light lamp
JP5133120B2 (ja) 2008-04-24 2013-01-30 シチズン電子株式会社 発光装置
US7618157B1 (en) * 2008-06-25 2009-11-17 Osram Sylvania Inc. Tubular blue LED lamp with remote phosphor
JP2010010437A (ja) 2008-06-27 2010-01-14 Stanley Electric Co Ltd 光半導体装置
US20100078483A1 (en) * 2008-09-26 2010-04-01 Rong Liu Arrangement for and method of generating uniform distributed line pattern for imaging reader
KR100993059B1 (ko) * 2008-09-29 2010-11-08 엘지이노텍 주식회사 발광 장치
JP2010103355A (ja) 2008-10-24 2010-05-06 Alpine Electronics Inc バックライト用ｌｅｄモジュール
CN101749640B (zh) * 2008-12-05 2012-12-26 富准精密工业(深圳)有限公司 发光二极管灯具
CN101482252B (zh) * 2008-12-08 2010-10-13 上海三思电子工程有限公司 一种对流散热式led照明灯
US8556452B2 (en) * 2009-01-15 2013-10-15 Ilumisys, Inc. LED lens
TWM368029U (en) * 2009-03-30 2009-11-01 E Pin Internat Tech Co Ltd Fresnel LED lens and LED assembly thereof
US8348460B2 (en) * 2009-05-01 2013-01-08 Abl Ip Holding Llc Lighting apparatus with several light units arranged in a heatsink
CN101994933B (zh) * 2009-08-14 2013-01-09 鸿富锦精密工业（深圳）有限公司 照明装置
US8414149B2 (en) * 2009-08-25 2013-04-09 Daktronics, Inc. Light element seal module and method for same
WO2012090350A1 (ja) * 2010-12-27 2012-07-05 パナソニック株式会社 発光装置およびランプ

Also Published As

Publication number Publication date
KR20110125064A (ko) 2011-11-18
EP2386790B1 (en) 2017-06-07
KR101641860B1 (ko) 2016-07-29
JP2011238933A (ja) 2011-11-24
EP2386790A2 (en) 2011-11-16
EP2386790A3 (en) 2013-09-25
US20110280012A1 (en) 2011-11-17
CN102244072A (zh) 2011-11-16
US9285083B2 (en) 2016-03-15

Similar Documents

Publication Publication Date Title
CN102244072B (zh) 发光器件模块
CN102484195B (zh) 发光器件以及使用该发光器件的光单元
CN102810623B (zh) 发光器件封装和照明系统
CN103682068A (zh) 发光装置
KR20120118686A (ko) 발광소자 모듈
CN102299239A (zh) 发光器件封装
CN104425690A (zh) 发光器件封装
US9041043B2 (en) Light emitting device package
CN102479911B (zh) 发光器件封装
KR101941512B1 (ko) 발광소자 패키지
KR101781043B1 (ko) 발광소자 어레이
KR20130079921A (ko) 인쇄 회로 기판
KR101849126B1 (ko) 발광소자 패키지
KR20110125067A (ko) 발광소자 패키지
KR20120128884A (ko) 발광소자 모듈
KR101911939B1 (ko) 발광소자 패키지
KR101880058B1 (ko) 발광 소자 패키지 및 조명 장치
KR102042208B1 (ko) 인쇄회로기판
KR20130070273A (ko) 발광소자 어레이
KR101766717B1 (ko) 발광소자 패키지
KR101831278B1 (ko) 발광소자 패키지
KR101722627B1 (ko) 발광소자 모듈
KR101735310B1 (ko) 발광소자 패키지
KR101843734B1 (ko) 발광소자 어레이
KR20130039171A (ko) 발광소자 어레이

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right

Effective date of registration: 20210813

Address after: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Leyu Semiconductor Co.,Ltd.

Address before: Seoul, South Kerean

Patentee before: LG INNOTEK Co.,Ltd.

TR01 Transfer of patent right
CP03 Change of name, title or address

Address after: 215499 No. 168, Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee after: Suzhou Liyu Semiconductor Co.,Ltd.

Country or region after: China

Address before: 168 Changsheng North Road, Taicang City, Suzhou City, Jiangsu Province

Patentee before: Suzhou Leyu Semiconductor Co.,Ltd.

Country or region before: China

CP03 Change of name, title or address
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131225

CF01 Termination of patent right due to non-payment of annual fee