CN102238808B - 胶纸粘贴方法和利用该方法粘贴形成的主板 - Google Patents

胶纸粘贴方法和利用该方法粘贴形成的主板 Download PDF

Info

Publication number
CN102238808B
CN102238808B CN201010152638.9A CN201010152638A CN102238808B CN 102238808 B CN102238808 B CN 102238808B CN 201010152638 A CN201010152638 A CN 201010152638A CN 102238808 B CN102238808 B CN 102238808B
Authority
CN
China
Prior art keywords
gummed paper
cover
mainboard
release film
screening cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201010152638.9A
Other languages
English (en)
Other versions
CN102238808A (zh
Inventor
吕华林
陈国钧
邹廷建
邹玉
王开贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201010152638.9A priority Critical patent/CN102238808B/zh
Priority to US12/843,073 priority patent/US8365390B2/en
Publication of CN102238808A publication Critical patent/CN102238808A/zh
Application granted granted Critical
Publication of CN102238808B publication Critical patent/CN102238808B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2018—Presence of a frame in a printed circuit or printed circuit assembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49007—Indicating transducer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y10T29/49135—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting and shaping, e.g., cutting or bending, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49718—Repairing
    • Y10T29/49719—Seal or element thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49833—Punching, piercing or reaming part by surface of second part
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49904—Assembling a subassembly, then assembling with a second subassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0476—Including stacking of plural workpieces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0505—With reorientation of work between cuts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0505—With reorientation of work between cuts
    • Y10T83/051—Relative to same tool
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/04—Processes
    • Y10T83/0524—Plural cutting steps
    • Y10T83/0577—Repetitive blanking

Abstract

一种胶纸粘贴方法，用于将胶纸粘贴在主板上，防止主板上的元器件与屏蔽盖直接接触，屏蔽盖包括屏蔽盖上盖和屏蔽盖下盖，该屏蔽盖下盖将该主板分割成若干个区域，该胶纸粘贴方法包括以下步骤：吸附工序：将胶纸吸附在PET离型膜上；冲裁工序：将PET离型膜和吸附在PET离型膜上的胶纸冲裁；贴装工序：将PET离型膜对准屏蔽盖上盖后将胶纸粘附于屏蔽盖上盖上；剥离工序：将PET离型膜从屏蔽盖上盖上剥离；安装工序：将屏蔽盖上盖扣住屏蔽盖下盖。本发明还提供一种利用胶纸粘贴方法粘贴形成的主板。通过该方法和主板，提高胶纸粘贴精度。

Description

胶纸粘贴方法和利用该方法粘贴形成的主板
技术领域
本发明涉及一种粘贴方法和利用该方法粘贴形成的主板，特别涉及一种胶纸粘贴方法和利用该方法粘贴胶纸而形成的主板。
背景技术
目前电路主板在制造过程中，需要加上屏蔽盖来防止高频部分的元件向外辐射能量和避免环境中的高频辐射影响电路正常工作。一般来说，屏蔽盖包括上盖与下盖，其中，下盖为一框架结构，用于将主板上的电子元件分成若干个区域，上盖与下盖卡合，并可与元器件表面接触。但是直接盖上该上盖容易损伤主板上的电子元件，则需要在电子元器件上覆盖一层胶纸防止上盖与元器件直接接触。一般是通过直接将胶纸贴在主板上，当主板被分成的区域较多时，需要一一将胶纸贴在该些区域，浪费大量的时间和人力，且贴装精度不高。
发明内容
有鉴于此，有必要提供一种粘贴方法，通过该粘贴方法可得到一具有较高的贴装精度的主板。
另外，还有必要提供一种利用该方法粘贴的主板，能增加贴装精度。
一种胶纸粘贴方法，用于将胶纸粘贴在主板上，防止主板上的元器件与屏蔽盖直接接触，屏蔽盖包括屏蔽盖上盖和屏蔽盖下盖，该屏蔽盖下盖将该主板分割成若干个区域，该胶纸粘贴方法包括以下步骤:吸附工序：将胶纸吸附在PET离型膜上，该胶纸一面有背胶，一面无背胶，其中无背胶的一面用于吸附在该PET离型膜上；冲裁工序：将PET离型膜和吸附在PET离型膜上的胶纸冲裁，该冲裁工序后，PET离型膜的外形与屏蔽盖上盖的内框相同，同时胶纸精密的分布在PET离型膜上，胶纸的形状与个数与该屏蔽盖下盖将该主板分割的若干个区域的形状和个数一一匹配；贴装工序：将PET离型膜对准屏蔽盖上盖后将胶纸有背胶的一面粘附于屏蔽盖上盖上；剥离工序：将PET离型膜从屏蔽盖上盖上剥离；安装工序：将屏蔽盖上盖扣住屏蔽盖下盖。
一种主板，该主板上覆盖有屏蔽盖，屏蔽盖包括屏蔽盖上盖和屏蔽盖下盖，该主板被屏蔽盖下盖分割成若干个区域，该若干个区域与屏蔽盖上盖之间包括胶纸和PET离型膜，该胶纸无背胶的一面吸附在该PET离型膜上，冲裁胶纸后得到与该若干个区域对应个数的胶纸，该冲裁后的胶纸有背胶的一面粘贴在屏蔽盖上盖上，剥离PET离型膜后无背胶的一面与主板上的若干个区域接触。
将胶纸吸附在PET离型膜上后，冲裁PET离型膜和胶纸，将PET离型膜贴装在屏蔽盖上盖后，将PET离型膜剥离，从而胶纸粘贴在屏蔽盖上盖，将屏蔽盖上盖扣住屏蔽盖下盖。从而胶纸较精确的贴在主板上。
附图说明
图1是本发明主板的爆炸示意图。
图2是本发明实施方式中主板在贴装过程的分解示意图。
图3是本发明胶纸贴装方法流程图。
主要元件符号说明
主板 100
主体 1
屏蔽盖 2
屏蔽盖下盖 3
屏蔽盖上盖 4
胶纸 5
PET离型膜 6
具体实施方式
请参考图1及图2。该主板100包括一主体1及一屏蔽盖2。该主体1上设置有元器件。该屏蔽盖2包括有屏蔽盖下盖3及屏蔽盖上盖4。屏蔽盖下盖3为一框架结构，该屏蔽盖下盖3将主体1上的元器件分割成若干个独立区域，在本实施方式中，该独立区域的个数为9个。屏蔽盖上盖4通过胶纸5粘贴于该屏蔽盖下盖3。
在本实施方式中，该胶纸5一面有背胶，一面无背胶，胶纸5有背胶的一面粘贴于屏蔽盖上盖4上，且胶纸5在屏蔽盖上盖4上的分布与屏蔽盖下盖3分割的若干个区域一一对应。当屏蔽盖上盖4覆盖在屏蔽盖下盖3上时，主体1被屏蔽盖下盖3分成的若干个区域与屏蔽盖上盖4之间均由粘贴于屏蔽盖上盖4上的胶纸5分隔开，从而避免主体1上的元器件与屏蔽盖上盖4直接接触而损坏。其中，该胶纸5由绝缘材料制成，该屏蔽盖上盖4和该屏蔽盖下盖3形成一个密封的空间，用于防止高频部分的元件向外辐射能量和避免环境中的高频辐射影响电路正常工作。
请同时参考图3，该粘贴方法包括以下步骤：
吸附工序：将胶纸5无背胶的一面吸附在一PET离型膜6上，其中，PET离型膜6具有良好的吸附性和贴合性，可通过静电将胶纸5吸附于PET离型膜6上(S201)；
冲裁工序：对PET离型膜6以及吸附于PET离型膜6上的胶纸5进行冲裁，使得PET离型膜6外形与屏蔽盖上盖4内框大致相同，同时胶纸5精密分布在PET离型膜6上，胶纸5的形状与个数与该屏蔽盖下盖3将该主体1分割的若干个区域的形状和个数一一匹配(S202)；
贴装工序：将PET离型膜6与屏蔽盖上盖4进行比对，在PET离型膜6与屏蔽盖上盖4完全重合时，通过胶纸5的背胶，将胶纸5粘贴在屏蔽盖上盖4的下表面，从而胶纸5在屏蔽盖上盖4上的分布与主体1被分成的区域的分布相同(S203)；
剥离工序：将PET离型膜6从屏蔽盖上盖4上剥离(S204)；
安装工序：将屏蔽盖上盖4扣住屏蔽盖下盖3(S205)。
在步骤S202中，该胶纸5以+/-0.1MM的公差精密分布在PET离型膜6上。
尽管对本发明的优选实施方式进行了说明和描述，但是本领域的技术人员将领悟到该粘贴方法可能产生的其他步骤，这些都不超出本发明的真正范围。因此期望，本发明并不局限于所公开的作为实现本发明所设想的最佳模式的具体实施方式，本发明包括的所有实施方式都有所附权利要求书的保护范围内。

Claims (6)

1.一种胶纸粘贴方法，用于将胶纸粘贴在主板上，防止主板上的元器件与屏蔽盖直接接触，屏蔽盖包括屏蔽盖上盖和屏蔽盖下盖，该屏蔽盖下盖将该主板分割成若干个区域，其特征在于，该胶纸粘贴方法包括以下步骤:
吸附工序：将胶纸吸附在PET离型膜上，该胶纸一面有背胶，一面无背胶，其中无背胶的一面用于吸附在该PET离型膜上；
冲裁工序：将PET离型膜和吸附在PET离型膜上的胶纸冲裁；
贴装工序：将PET离型膜对准屏蔽盖上盖后将胶纸有背胶的一面粘附于屏蔽盖上盖上；
剥离工序：将PET离型膜从屏蔽盖上盖上剥离；
安装工序：将屏蔽盖上盖扣住屏蔽盖下盖。
2.如权利要求1所述的胶纸粘贴方法，其特征在于：该冲裁工序后，PET离型膜的外形与屏蔽盖上盖的内框相同，同时胶纸精密的分布在PET离型膜上，胶纸的形状与个数与该屏蔽盖下盖将该主板分割的若干个区域的形状和个数一一匹配。
3.如权利要求2所述的胶纸粘贴方法，其特征在于：该胶纸在PET离型膜上的分布公差为+/-0.1MM。
4.一种主板，该主板上覆盖有屏蔽盖，屏蔽盖包括屏蔽盖上盖和屏蔽盖下盖，该主板被屏蔽盖下盖分割成若干个区域，其特征在于：
该若干个区域与屏蔽盖上盖之间包括胶纸和PET离型膜，该胶纸无背胶的一面吸附在该PET离型膜上，冲裁胶纸后得到与该若干个区域对应个数的胶纸，该冲裁后的胶纸有背胶的一面粘贴在屏蔽盖上盖上，剥离PET离型膜后无背胶的一面与主板上的若干个区域接触。
5.如权利要求4所述的主板，其特征在于：该对应个数的胶纸的形状与主板被屏蔽盖分割的若干个区域的形状一一匹配。
6.如权利要求4所述的主板，其特征在于：该胶纸由绝缘材料制成。
CN201010152638.9A 2010-04-22 2010-04-22 胶纸粘贴方法和利用该方法粘贴形成的主板 Expired - Fee Related CN102238808B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201010152638.9A CN102238808B (zh) 2010-04-22 2010-04-22 胶纸粘贴方法和利用该方法粘贴形成的主板
US12/843,073 US8365390B2 (en) 2010-04-22 2010-07-26 Method for affixing adhesive films and main board with adhesive films applied using the method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201010152638.9A CN102238808B (zh) 2010-04-22 2010-04-22 胶纸粘贴方法和利用该方法粘贴形成的主板

Publications (2)

Publication Number Publication Date
CN102238808A CN102238808A (zh) 2011-11-09
CN102238808B true CN102238808B (zh) 2016-01-20

Family

ID=44815665

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201010152638.9A Expired - Fee Related CN102238808B (zh) 2010-04-22 2010-04-22 胶纸粘贴方法和利用该方法粘贴形成的主板

Country Status (2)

Country Link
US (1) US8365390B2 (zh)
CN (1) CN102238808B (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101299259B1 (ko) * 2013-04-03 2013-08-22 주식회사 에스아이 플렉스 Ｍｏｄｅ ｋｅｙ 취부 공법
CN105682441A (zh) * 2016-03-30 2016-06-15 上海维衡精密电子股份有限公司 屏蔽罩绝缘膜贴合方法及其使用的绝缘膜结构

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2862614Y (zh) * 2005-07-29 2007-01-24 林江俊 防电磁干扰遮蔽罩结构
CN101187748A (zh) * 2007-11-01 2008-05-28 东莞市茶山三贤电子有限公司 遮光胶膜的生产方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005135962A (ja) * 2003-10-28 2005-05-26 Hitachi Kokusai Electric Inc 電子機器のシールド構造
JP2006313330A (ja) * 2005-05-04 2006-11-16 Samsung Electronics Co Ltd 偏光板アセンブリとその製造方法、及びそれを用いたパネルアセンブリの製造方法
JP4608422B2 (ja) * 2005-12-05 2011-01-12 共同技研化学株式会社 粘接着フィルム
JP2008308648A (ja) * 2007-06-18 2008-12-25 Hosiden Corp 両面テープ及びテープアセンブリー
WO2009011423A1 (ja) * 2007-07-18 2009-01-22 Murata Manufacturing Co., Ltd. 無線ｉｃデバイス
CN101389206A (zh) * 2007-09-14 2009-03-18 鸿富锦精密工业（深圳）有限公司 屏蔽装置以及应用该屏蔽装置的电子设备
US20090265931A1 (en) * 2008-04-28 2009-10-29 Yu-Jen Cheng Method for manufacturing protective cover for prevention of electromagnetism interference
CN101626676B (zh) * 2008-07-10 2013-01-09 深圳富泰宏精密工业有限公司 柔性屏蔽罩及其使用方法、应用该柔性屏蔽罩的电子装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2862614Y (zh) * 2005-07-29 2007-01-24 林江俊 防电磁干扰遮蔽罩结构
CN101187748A (zh) * 2007-11-01 2008-05-28 东莞市茶山三贤电子有限公司 遮光胶膜的生产方法

Also Published As

Publication number Publication date
CN102238808A (zh) 2011-11-09
US20110261552A1 (en) 2011-10-27
US8365390B2 (en) 2013-02-05

Similar Documents

Publication Publication Date Title
US8654537B2 (en) Printed circuit board with integral radio-frequency shields
CN103595899B (zh) 相机模组组件载具
US20090122507A1 (en) Conductive elastomeric shielding device and method of forming same
WO2008027888A3 (en) Radio frequency and electromagnetic interference shielding
US20130087266A1 (en) Method and apparatus for assembly of a satellite antenna
CN105118844A (zh) 一种柔性显示面板的制备方法及柔性显示面板
WO2007134308A3 (en) Thin film battery on an integrated circuit or circuit board and method thereof
CN104347540A (zh) 电路模块以及电路模块的制造方法
CN111051971B (zh) 电连接组件以及移动终端
TW200741907A (en) Perforated embedded plane package and method
CN101528021A (zh) 电子部件箱体的屏蔽方法和屏蔽构件
TW200640315A (en) Electrically connecting structure of circuit board and method for fabricating same
CN102238808B (zh) 胶纸粘贴方法和利用该方法粘贴形成的主板
US9755297B2 (en) Housing, electronic device using same, and method for making same
WO2009051122A1 (ja) 薄膜太陽電池モジュール
CN103633434B (zh) 整合于金属壳体的天线结构
CN109152198B (zh) 一种导电胶的保护膜、电路板及显示器件的制作方法
CN206196252U (zh) 屏蔽盖与电子装置
CN102412437B (zh) 天线的制造方法
US20160023260A1 (en) Modular tuner and method for manufacturing the same
US20090266602A1 (en) Electromagnetic interference shield
CN103633435B (zh) 整合金属壳体的天线结构
CN103779516A (zh) 固定片及电子装置
WO2007061996A3 (en) Ball grid attachment
CN207587976U (zh) 共形微带天线

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160120

Termination date: 20180422

CF01 Termination of patent right due to non-payment of annual fee