CN102237318A - Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body - Google Patents
Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body Download PDFInfo
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- CN102237318A CN102237318A CN2010101673621A CN201010167362A CN102237318A CN 102237318 A CN102237318 A CN 102237318A CN 2010101673621 A CN2010101673621 A CN 2010101673621A CN 201010167362 A CN201010167362 A CN 201010167362A CN 102237318 A CN102237318 A CN 102237318A
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- base plate
- chip
- laminated substrate
- loam cake
- fixed head
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Abstract
The invention discloses a packaging substrate fixing device and a method for manufacturing a semiconductor chip packaging body. The packaging substrate fixing device comprises a bottom plate, a lamination substrate and an upper fixing cover plate, wherein the lamination substrate is provided with multiple chip crystal placing areas for allowing at least one chip to be jointed; and the lamination substrate is flatly fixed between the bottom plate and the upper cover fixing plate through a magnetic force or a mechanical force, wherein the upper cover fixing plate is provided with multiple opening areas corresponding to the multiple chip crystal placing areas.
Description
Technical field
The present invention relates to the manufacture method of a kind of base plate for packaging fixture and capsulation body of semiconductor ship, particularly a kind of manufacture method that is used for chip-shaped crystal-coated packing substrate plate fixture and chip-shaped flip chip packaging body.
Background technology
Traditional die type chip package technology (Flip Chip CSP, be called for short fcCSP), after the chip upset, engage with laminated substrate (laminated substrate) by metallic conductor in ventricumbent mode, being used in widely needs high-performance, high speed and high density, and on the element of small size encapsulation.
Along with the size micro of semiconductor device, the spacing that electrically connects projection is also dwindled thereupon gradually.If use traditional chip-shaped chip package technology, when the chip inversion is attached at laminated substrate,, makes bridge joint easily takes place between the adjacent projections because of laminated substrate is subjected to external force generation warpage, perhaps form the very cold solder connection of fragility (cold joint).Particularly, when chip is got the step that places on the laminated substrate, do not fix, after through the reflow step, then when carrying out the cleaning of follow-up removal scaling powder, just use fixedly laminated substrate edge of tool with fixed jig.Yet, getting when putting the step of chip on laminated substrate, cause the laminated substrate warpage easily, cause bridge joint or cold solder connection defective between projection.With regard to itself, industry is badly in need of the manufacture method of a kind of base plate for packaging fixture and capsulation body of semiconductor ship, can avoid bridge joint or cold solder connection defective between projection effectively, and avoid after the cleaning of removing scaling powder, causing scaling powder and residual easily.
Summary of the invention
According to one embodiment of the invention, a kind of base plate for packaging fixture comprises: a base plate; One laminated substrate has a plurality of chips crystal area at least one chip join; And securing cover plate on, by magnetic force or mechanical force this laminated substrate entirely is fixed between this base plate and this loam cake fixed head; Wherein this loam cake fixed head has corresponding described a plurality of chips crystal area, a plurality of open areas.
According to another embodiment of the present invention, a kind of manufacture method of capsulation body of semiconductor ship, comprise: a base plate for packaging fixture is provided, it comprises that a base plate, a laminated substrate have a plurality of chips crystal area and this laminated substrate entirely be fixed between this base plate and this loam cake fixed head by magnetic force or mechanical force for securing cover plate at least one chip join and, and wherein this loam cake fixed head has corresponding described a plurality of chips crystal area, a plurality of open areas; One chip reversing is covered on this chip crystal area that places this laminated substrate; This base plate for packaging fixture that will contain chip is carried out a reflow process; Clean this base plate for packaging fixture that this contains chip with a solution that contains deionized water and solvent, to remove residual flux.
For the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing, be described in detail below.
Description of drawings
Figure 1A shows the schematic perspective view according to the base plate for packaging fixture of one embodiment of the invention.
Figure 1B shows the generalized section of the base plate for packaging fixture of Figure 1A.
Fig. 2 A shows the schematic perspective view of base plate for packaging fixture according to another embodiment of the present invention.
The generalized section of the base plate for packaging fixture of Fig. 2 B displayed map 2A.
Fig. 3 A shows the schematic perspective view of base plate for packaging fixture according to another embodiment of the present invention.
The decomposing schematic representation of the base plate for packaging fixture of Fig. 3 B displayed map 3A.
Fig. 4 A shows the schematic perspective view of base plate for packaging fixture according to another embodiment of the present invention.
The local enlarged diagram of the neighboring area 4B of the base plate for packaging fixture of Fig. 4 B displayed map 4A.
Top view after the combination of the base plate for packaging fixture 400 of Fig. 4 C displayed map 4A.
The generalized section of the base plate for packaging fixture 400 of Fig. 4 D displayed map 4C.
Fig. 5 A shows the top view after the combination of base plate for packaging fixture 500 according to another embodiment of the present invention.
The generalized section of the base plate for packaging fixture 500 of Fig. 5 B displayed map 5A.
The local enlarged diagram of the neighboring area 5C of the base plate for packaging fixture of Fig. 5 C displayed map 5A.
Fig. 6 A shows the top view after the combination of base plate for packaging fixture 600 according to another embodiment of the present invention.
The generalized section of the base plate for packaging fixture 600 of Fig. 6 B displayed map 6A.
The local enlarged diagram of the neighboring area 6C of the base plate for packaging fixture of Fig. 6 C displayed map 6A.
And the description of reference numerals in the above-mentioned accompanying drawing is as follows:
100,200,300,400,500,600～base plate for packaging fixture;
110,210,310,410,510,610～loam cake fixed head;
115,215,315,415～fixation holes;
The stake of 416～base plate nail;
122,322,422,522,622～cancellate faciola;
125,225,325,425,525,625～open area;
126,226, the neighboring area of 426～loam cake fixed head;
130,230,430,530,630～laminated substrate;
135,235,535,635～chip crystal area;
150,250,450,550,650～base plate;
160,260,560,660～chip;
228～broadband;
232～cutting groove;
310a～first fixed component;
310b～second fixed component;
318～clasp;
455～vacuum is inhaled the hole;
458～magnetite;
428～covered conduit;
526,626～protuberance;
528,628～raceway groove;
The thickness of T～loam cake fixed head;
The height of T1～covered conduit;
The width in D～broadband;
Spacing between D '～two group pattern formula chips;
The width of d～cutting groove.
Embodiment
Below describe and be accompanied by the example of description of drawings in detail with each embodiment, as reference frame of the present invention.In accompanying drawing or specification description, similar or identical part is all used identical figure number.And in the accompanying drawings, the shape of embodiment or thickness can enlarge, and to simplify or convenient the sign.Moreover the part of each element will be it should be noted that to describe explanation respectively in the accompanying drawing, the element that does not illustrate among the figure or describe is the form known to those of ordinary skills, in addition, the ad hoc fashion that certain embodiments is only used for explanation the present invention, it is not in order to limit the present invention.
Figure 1A shows that Figure 1B shows the generalized section of the base plate for packaging fixture of Figure 1A according to the schematic perspective view of the base plate for packaging fixture of one embodiment of the invention.In Figure 1A, Figure 1B, one base plate for packaging fixture 100 comprises a base plate 150, a laminated substrate 130, have a plurality of chips crystal area 135 and engage, and a loam cake fixed head 110 has 125 corresponding described a plurality of chips crystal areas 135, a plurality of open area at least one chip 160.Will be appreciated that in the process of removing scaling powder, in order to make the solution that deionized water and solvent constituted get rid of easily, in design, the thickness T of loam cake fixed head 110 should be less than or equal to the thickness of chip 160.A plurality of fixation holes (pinhole) 115 are arranged at the neighboring area 126 of loam cake fixed head 110.The nail stake (guide pin) of described a plurality of fixation holes 115 and base plate is in order to combine and fixed cover fixed head 110, laminated substrate 130 and base plate 150 with the nail stake (guide pin) of base plate.Comprise cancellate faciola 122 in the open area of loam cake fixed head 110, separate each chip in the array.
Fig. 2 A shows the schematic perspective view of base plate for packaging fixture according to another embodiment of the present invention, the generalized section of the base plate for packaging fixture of Fig. 2 B displayed map 2A.In Fig. 2 A, Fig. 2 B, one base plate for packaging fixture 200 comprises a base plate 250, a laminated substrate 230, have a plurality of chips crystal area 235 and engage, and a loam cake fixed head 210 has 225 corresponding described a plurality of chips crystal areas 235, a plurality of open area at least one chip 260.In this embodiment, each chip crystal area 235 can be sticked for an array formula chip 260.A plurality of fixation holes 215 are arranged at the neighboring area of loam cake fixed head 210.Described a plurality of fixation holes 215 is in order to combine and fixed cover fixed head 210, laminated substrate 230 and base plate 250 with the nail stake (guide pin) of base plate.Will be appreciated that to have a broadband 228 between adjacent two open areas 225, wherein the width D in broadband 228 is greater than the width d of a cutting groove 232 of laminated substrate, but less than the space D between two groups of adjacent array formula chips '.Moreover in the process of removing scaling powder, in order to make the solution that deionized water and solvent constituted get rid of easily, the thickness T of this loam cake fixed head 110 should be less than or equal to the thickness of this chip 160 in design.
Fig. 3 A shows the schematic perspective view of base plate for packaging fixture according to another embodiment of the present invention, the decomposing schematic representation of the base plate for packaging fixture of Fig. 3 B displayed map 3A.In Fig. 3 A, Fig. 3 B, a loam cake fixed head 310 comprises the first fixed component 310a and the second fixed component 310b.This first fixed component 310a is a top cover ring, presses the edge of attached this second fixed component 310b, and wherein the periphery of this top cover ring has a plurality of clasps 318, with fixed base plate, laminated substrate, last securing cover plate and top cover ring.
The second fixed component 310b has 325 corresponding chip crystal areas, a plurality of open area similar in appearance to the loam cake fixed head 110 of Figure 1A-Figure 1B.A plurality of fixation holes 315 are arranged at the neighboring area of loam cake fixed head 310.Described a plurality of fixation holes 315 is in order to fixed cover fixed head, laminated substrate and base plate.Similarly, comprise cancellate faciola 322 in the open area of the second fixed component 310b, separate each chip in the array.
Fig. 4 A shows the schematic perspective view of base plate for packaging fixture according to another embodiment of the present invention, the local enlarged diagram of the neighboring area 4B of the base plate for packaging fixture of Fig. 4 B displayed map 4A.In Fig. 4 A, Fig. 4 B, one base plate for packaging fixture 400 comprises a base plate 450, a laminated substrate 430, have a plurality of chips crystal area at least one chip join, and a loam cake fixed head 410 have 425 corresponding described a plurality of chips crystal areas, a plurality of open area.In an embodiment, base plate 450 studs with a plurality of magnetites 458 so that laminated substrate 430 entirely is fixed between base plate 450 and the loam cake fixed head 410.Loam cake fixed head 410 has fixation holes 415, in order to combine and fixed cover fixed head 410, laminated substrate 430 and base plate 450 with the nail stake (guide pin) 416 of base plate.In another embodiment, base plate 450 has a plurality of vacuum and inhales hole 455 with absorption laminated substrate 430.
Moreover a plurality of fixation holes 415 are arranged at the neighboring area 426 of loam cake fixed head 410.The neighboring area 426 of loam cake securing cover plate 410 has many covered conduits 428, connects a little open areas 425 with extraneous.Top view after the combination of the base plate for packaging fixture 400 of Fig. 4 C displayed map 4A, the generalized section of the base plate for packaging fixture 400 of Fig. 4 D displayed map 4C.In Fig. 4 D, can entirely press laminated substrate 430 attached and be fixed on the base plate 450 by loam cake securing cover plate 410, warpages take place to avoid laminated substrate 430.Will be appreciated that, in the process of removing scaling powder, in order to make the solution that deionized water and solvent constituted get rid of to extraneous, in design by covered conduit 428 easily, the thickness T of loam cake fixed head 410 should be greater than the thickness of chip, and greater than the height T1 of covered conduit 428.
Fig. 5 A shows the top view after the combination of base plate for packaging fixture 500 according to another embodiment of the present invention, the generalized section of the base plate for packaging fixture 500 of Fig. 5 B displayed map 5A, the local enlarged diagram of the neighboring area 5C of the base plate for packaging fixture of Fig. 5 C displayed map 5A.In Fig. 5 A, Fig. 5 B, one base plate for packaging fixture 500 comprises a base plate 550, a laminated substrate 530, have a plurality of chips crystal area 535 and engage, and a loam cake fixed head 510 has the crystal area 535 of a plurality of open areas 525 corresponding chips at least one chip 560.Loam cake fixed head 510 comprises cancellate faciola 522, separates each chip position in the array.In this embodiment, the neighboring area of loam cake securing cover plate 510 has many raceway grooves 528.Will be appreciated that in the process of removing scaling powder, in order to make the solution that deionized water and solvent constituted get rid of to extraneous by raceway groove 528 easily, connection opening zone 525 is with extraneous.The neighboring area of loam cake fixed head 510 be a stairstepping near laminated substrate 530, have a protuberance 526, wherein the bottom of raceway groove 528 and laminated substrate 530 about equal altitudes.
Fig. 6 A shows the top view after the combination of base plate for packaging fixture 600 according to another embodiment of the present invention, the generalized section of the base plate for packaging fixture 600 of Fig. 6 B displayed map 6A, the local enlarged diagram of the neighboring area 6C of the base plate for packaging fixture of Fig. 6 C displayed map 6A.In Fig. 6 A-Fig. 6 C figure, a base plate for packaging fixture 600 is described the base plate for packaging fixture of stating 500 similar in appearance to Fig. 5 A-Fig. 5 C embodiment in fact, for asking simple and clear event, omits identical narration at this.Difference is, the neighboring area of loam cake fixed head 610 is a stairstepping, is pressed on the edge of laminated substrate 630, has a protuberance 626, wherein the bottom of raceway groove 628 is higher than the surface with laminated substrate 630 in fact, gets rid of to extraneous by raceway groove 628 in order to flux cleaning solution.
According to the embodiment of the invention, can utilize above-mentioned base plate for packaging fixture 100-600 to carry out the manufacturing of chip-shaped chip package.For example, above-mentioned base plate for packaging fixture is provided, and a chip reversing is covered on the crystal area of the chip that places laminated substrate, then, the base plate for packaging fixture that will contain chip is carried out a reflow process, cleaning the base plate for packaging fixture that contains chip with a solution that contains deionized water and solvent, is to carry out in a continuous process equipment to remove residual flux, wherein chip reversing to be covered and to put step, reflow process and clean removal residual flux step.Because laminated substrate is subjected to smooth the covering of loam cake fixed head, so when covering brilliant step, bridge joint or cold solder connection (cold joint) defective between the projection that can avoid causing because of substrate warp.Moreover, by neighboring area raceway groove or covered conduit are set at the loam cake fixed head, in the process of removing scaling powder, can avoid scaling powder and solution residual fully with going flux solvent to get rid of to extraneous.Moreover, because the base plate for packaging fixture of the embodiment of the invention can be with base plate, laminated substrate and loam cake fixed head overall fixed, in the manufacture process applicable to successional chip-shaped chip package, reduce because of in breaking process, the dielectric layer of ultra-low dielectric constant delamination (ELK de-lamination) that caused by external force.
Though the present invention is with various embodiment openly as above, yet it is not in order to limiting scope of the present invention, any those skilled in the art, without departing from the spirit and scope of the present invention, when doing a little change and retouching.Protection scope of the present invention is as the criterion when looking the scope that claim defined of enclosing.
Claims (13)
1. base plate for packaging fixture comprises:
One base plate;
One laminated substrate has a plurality of chips crystal area at least one chip join; And
Securing cover plate on one entirely is fixed on this laminated substrate between this base plate and this loam cake fixed head by magnetic force or mechanical force;
Wherein this loam cake fixed head has corresponding described a plurality of chips crystal area, a plurality of open areas.
2. base plate for packaging fixture as claimed in claim 1, wherein the thickness of this loam cake fixed head is less than or equal to the thickness of this chip.
3. base plate for packaging fixture as claimed in claim 2 has a broadband between wherein adjacent two open areas, and wherein the width in this broadband is greater than the width of a cutting groove of this laminated substrate, but less than the spacing between the two group pattern formula chips.
4. base plate for packaging fixture as claimed in claim 1, also comprise a top cover ring, press the attached edge that should go up securing cover plate, wherein the periphery of this top cover ring has a plurality of clasps, with fix this base plate, this laminated substrate, securing cover plate and this top cover ring are in aggregates on this.
5. base plate for packaging fixture as claimed in claim 1, the neighboring area that wherein should go up securing cover plate has many covered conduits, and every covered conduit connects described a plurality of open area with extraneous.
6. base plate for packaging fixture as claimed in claim 1, wherein the thickness of this loam cake fixed head is less than or equal to the thickness of this chip, and upward the neighboring area of securing cover plate is a stairstepping, has many raceway grooves and connects described a plurality of open area with extraneous.
7. the manufacture method of a capsulation body of semiconductor ship comprises:
One base plate for packaging fixture is provided, comprises:
One base plate;
One laminated substrate has a plurality of chips crystal area at least one chip join; And
Securing cover plate on one entirely is fixed on this laminated substrate between this base plate and this loam cake fixed head by magnetic force or mechanical force;
Wherein this loam cake fixed head has corresponding described a plurality of chips crystal area, a plurality of open areas;
One chip reversing is covered on this chip crystal area that places this laminated substrate;
This base plate for packaging fixture that will contain chip is carried out a reflow process;
Clean this base plate for packaging fixture that this contains chip with a solution that contains deionized water and solvent, to remove residual flux.
8. the manufacture method of capsulation body of semiconductor ship as claimed in claim 7 is wherein covered chip reversing and is put step, this reflow process and clean that to remove the residual flux step be to carry out in a continuous process equipment.
9. the manufacture method of capsulation body of semiconductor ship as claimed in claim 7, wherein the thickness of this loam cake fixed head is less than or equal to the thickness of this chip.
10. the manufacture method of capsulation body of semiconductor ship as claimed in claim 7 has a broadband between wherein adjacent two open areas, and wherein the width in this broadband is greater than the width of a cutting groove of this laminated substrate, but less than the spacing between the two group pattern formula chips.
11. the manufacture method of capsulation body of semiconductor ship as claimed in claim 7, also comprise a top cover ring, press the attached edge that should go up securing cover plate, wherein the periphery of this top cover ring has a plurality of clasps, with fix this base plate, this laminated substrate, securing cover plate and this top cover ring are in aggregates on this.
12. the manufacture method of capsulation body of semiconductor ship as claimed in claim 7, the neighboring area that wherein should go up securing cover plate has many covered conduits, and every covered conduit connects described a plurality of open area with extraneous.
13. the manufacture method of capsulation body of semiconductor ship as claimed in claim 7, wherein the thickness of this loam cake fixed head is less than or equal to the thickness of this chip, and the neighboring area that should go up securing cover plate is a stairstepping, has many raceway grooves and connects described a plurality of open area with extraneous.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010167362 CN102237318B (en) | 2010-04-20 | 2010-04-20 | Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010167362 CN102237318B (en) | 2010-04-20 | 2010-04-20 | Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body |
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| CN102237318A true CN102237318A (en) | 2011-11-09 |
| CN102237318B CN102237318B (en) | 2013-07-17 |
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| CN 201010167362 Active CN102237318B (en) | 2010-04-20 | 2010-04-20 | Packaging substrate fixing device and method for manufacturing semiconductor chip packaging body |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040009582A (en) * | 2002-07-24 | 2004-01-31 | 삼성테크윈 주식회사 | Semiconductor package and manufacturing method thereof |
| KR20060041356A (en) * | 2004-11-08 | 2006-05-12 | 주식회사 하이닉스반도체 | Jig for fbga package |
| JP2007035978A (en) * | 2005-07-28 | 2007-02-08 | Citizen Miyota Co Ltd | Positioning jig |
| KR100759211B1 (en) * | 2006-09-25 | 2007-09-14 | 주식회사 디엠에스 | Jig for hardening of mold |
-
2010
- 2010-04-20 CN CN 201010167362 patent/CN102237318B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040009582A (en) * | 2002-07-24 | 2004-01-31 | 삼성테크윈 주식회사 | Semiconductor package and manufacturing method thereof |
| KR20060041356A (en) * | 2004-11-08 | 2006-05-12 | 주식회사 하이닉스반도체 | Jig for fbga package |
| JP2007035978A (en) * | 2005-07-28 | 2007-02-08 | Citizen Miyota Co Ltd | Positioning jig |
| KR100759211B1 (en) * | 2006-09-25 | 2007-09-14 | 주식회사 디엠에스 | Jig for hardening of mold |
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| Publication number | Publication date |
|---|---|
| CN102237318B (en) | 2013-07-17 |
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