CN102234769B - Sputtering device and sputtering method - Google Patents
Sputtering device and sputtering method Download PDFInfo
- Publication number
- CN102234769B CN102234769B CN201010161106.1A CN201010161106A CN102234769B CN 102234769 B CN102234769 B CN 102234769B CN 201010161106 A CN201010161106 A CN 201010161106A CN 102234769 B CN102234769 B CN 102234769B
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- cavity
- material bar
- plated
- workpiece
- fixed mount
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Abstract
The invention relates to a sputtering device which comprises a material rod fixing frame which is used for bearing a material rod loading workpieces to be plated, wherein a protruded rod is grown at one end of the material rod along the radial direction; the material rod fixing frame is provided with a positioning seat; the positioning seat is provided with a connecting rod mechanism and a hollow raised column which is used for containing one end, at which the protruded rod is grown, of the material rod; and the positioning seat fixes the material rod through the connecting rod mechanism and drives the material rod to rotate. Compared with the prior art, the sputtering device fixes the material rod through the connecting rod mechanism, so that the material rod can be rapidly installed or disassembled, thereby greatly improving the efficiency of sputtering processing. The invention further relates to a sputtering method.
Description
Technical field
The present invention relates to a kind of sputtering unit and method for sputtering.
Background technology
At present, being carried out to plated film, plastics or metal shell surface generally all adopt physical vaporous deposition (PVD) to carry out film-plating process, in film-plating process, the carrier of carrying workpiece to be plated generally all can drive workpiece to be plated to be rotated, and can make like this workpiece to be plated can be by abundant sputter.Preferably, a rotating device generally also can be set on carrier, workpiece to be plated is fixed on this rotating device to make when this carrier is driving passive workpiece to revolve round the sun, this rotating device drives workpiece to be plated to carry out rotation, can carry out sputter to workpiece to be plated more completely by such structure.
Drive workpiece to be plated to carry out in the processing procedure of rotation at rotating device, general being fixed on rotating device of not only needing that workpiece to be plated can be good, and require workpiece to be plated in the time starting sputter or complete sputter, can dismantle fast to save the time of whole processing procedure, especially when needing a large amount of workpieces to be plated need to transmit between multiple carriers time, how to make workpiece to be plated can be fast from a rotating device dismounting and the good efficiency that is fixed to another rotating device shangguan and is tied to whole processing procedure.
Summary of the invention
In view of this, provide a kind of sputtering unit and the method for sputtering that can avoid above-mentioned situation to occur real in necessary.
A kind of sputtering unit, it is used for to workpiece plated film to be plated, this sputtering unit has material bar fixed mount, this material bar fixed mount is used for carrying the material bar that is mounted with workpiece to be plated, there is nose bar one end of this material bar along material bar radial growth, this material bar fixed mount is provided with positioning seat, this positioning seat comprises a hollow projection and linkage, this hollow projection is used for accommodating this material bar growth one end of nose bar, this linkage has driving lever, drive link and by lever, wherein this drive link is hingedly fixed on this hollow projection, this driving lever is positioned at the inside of this hollow projection, and this driving lever and be hinged on respectively the two ends of this drive link by lever, this driving lever application of force of this material pole pair makes this drive link drive this to be moved to make this mutually to be intersected by lever and this nose bar by lever.
Preferably, this sputtering unit further comprises the first cavity, the second cavity and transmission mechanism, this first cavity is used for workpiece to be plated to carry out preheating, this second cavity is used for workpiece to be plated to carry out sputter, this first cavity and the second cavity are interconnected by a passage, in this passage, be provided with a valve and be used for controlling the open and close of this passage, in this first cavity and the second cavity, be respectively arranged with material bar fixed mount as above, this material bar can transmit between the material bar fixed mount in this first cavity and the second cavity via this passage under the effect of this transmission mechanism.
A kind of method for sputtering, it comprises the steps: to provide a sputtering unit as above; The material bar that carries workpiece to be plated is installed on the material bar fixed mount in this first cavity, this first cavity is vacuumized; Workpiece to be plated in the first cavity is carried out to pre-hot work; The workpiece to be plated that completes pre-hot work is sent in the second cavity via the passage between this first cavity and the second cavity one by one and is fixed on the material bar fixed mount in the second cavity; Close the passage between this first cavity and the second cavity, the workpiece to be plated in the second cavity is carried out to sputter operation; Open the passage between this first cavity and the second cavity, will in the second cavity, complete in work piece delivery to the first cavity to be plated of sputter operation; Close passage between this first cavity and the second cavity to keep the vacuum state in this second cavity, take away and in the first cavity, complete the workpiece to be plated of sputter operation and put into second batch workpiece to be plated.
Compared with prior art, this sputtering unit provided by the invention is provided with a positioning seat with linkage on material bar fixed mount, this positioning seat is used for the material bar that carries workpiece to be plated to be fixed, in the time that one end is packed in this positioning seat with the material bar of nose bar, by continuous action relation, the nose bar by lever and material bar in linkage being intersected mutually, positioning seat is cross one anotherly driven material bar to carry out rotation by lever and material bar nose bar by this.
Further, in preferred version of the present invention, this sputtering unit has two cavitys and is used for respectively workpiece to be plated to carry out pre-hot work and sputter operation, in these two cavitys, be all provided with the material bar fixed mount with above-mentioned positioning seat, workpiece to be plated transmits in the material bar fixed mount in two cavitys by manipulator, owing to can installing fast and dismantle between the positioning seat in this material bar fixed mount and material bar, the sputter efficiency of this sputtering unit provided by the present invention be further enhanced.
Brief description of the drawings
Fig. 1 is the structural representation of the sputtering unit that provides of the embodiment of the present invention, and it comprises material bar and material bar fixed mount.
Fig. 2 is that the sputtering unit that provides of the embodiment of the present invention is in the view of expecting bar transport.
Fig. 3 is that the sputtering unit that the embodiment of the present invention provides is expected bar fixed mount and the rotation schematic diagram of expecting bar in preheating or sputter process.
Fig. 4 is the enlarged drawing of IV part in Fig. 3.
Fig. 5 is the enlarged drawing of V part in Fig. 3.
Fig. 6 is the cutaway view of Fig. 5.
Main element symbol description
Sputtering unit 100
The first cavity 10
The second cavity 20
The first swivel mount 30
Material bar 31
Nose bar 311
Hanger bracket 312
Material bar fixed mount 32
Upper supporting disk 321
Location notch 3211
Lower carrier 322
Positioning seat 3221
Hollow projection 3222
Linkage 3223
Driving lever 3224
Drive link 3225
By lever 3226
Storage tank 3227
Perforation 3228
Support bar 323
The second swivel mount 40
Manipulator 50
Passage 60
Valve 61
Embodiment
See also Fig. 1 to Fig. 6, this sputtering unit 100 that the embodiment of the present invention provides, it comprises the first cavity 10, the second cavity 20, the first swivel mount 30, the second swivel mount 40 and manipulator 50.
This first cavity 10 is used for workpiece to be plated to carry out preheating, and this second cavity 20 is used for the workpiece to be plated that completes preheating processing procedure in this first cavity 10 to carry out sputter.
Between this first cavity 10 and the second cavity 20, be provided with a passage 60, this first cavity 10 is interconnected by this passage 60 with this second cavity 20, and the workpiece to be plated that completes preheating in this first cavity 10 is transferred in this second cavity 20 and carries out sputter process via this passage 60.In this passage 60, be also provided with valve 61 and be used for controlling the open and close of this passage 60.
This first swivel mount 30 is arranged in this first cavity 10 and is used for carrying workpiece to be plated.This first swivel mount 30 comprises material bar 31 and material bar fixed mount 32, and wherein this material bar fixed mount 32 can be in the interior rotation of this first cavity 10 under the drive of actuating force.
This material bar 31 is the column body of rod, and one end of this material bar 31 is T-shape, and the other end has the nose bar 311 perpendicular with the body of rod of this material bar 31 at the position near end to outgrowth, and this material bar 31 is installed on this material bar fixed mount 32 by this structure is dismountable.On the body of rod of this material bar 31, the spaced apart hanger bracket 312 that is fixed with, this hanger bracket 312 is used for carrying workpiece to be plated.
This material bar fixed mount 32 comprises two ring-type upper supporting disks 321 that are oppositely arranged and lower carrier 322, between these two carriers, is provided with several support bars 323, and these two ring-type carriers support fixing by this support bar 323 mutually.
Be arranged at intervals with some location notchs 3211 corresponding with the T-shape end of this material bar 31 in the outer rim of this upper supporting disk 321, the T-shape end by this material bar 31 and this location notch 3211 mutual engage make this material bar 31 can vertical hanging in this upper supporting disk 321 times.Corresponding with this location notch 3211, be provided with positioning seat 3221 in this corresponding position of lower carrier 322, this positioning seat 3221 comprises hollow projection 3222 and a linkage 3223, this hollow projection 3222 is used for accommodating these material bar 31 growths one end of nose bar 311, this linkage 3223 has driving lever 3224, drive link 3225 and by lever 3226, wherein the middle part of this drive link 3225 is hingedly fixed on the sidewall of this hollow projection 3222, this driving lever 3224 is positioned at the inside of this hollow projection 3222, and this driving lever 3224 and be hingedly fixed in respectively the two ends of this drive link 3225 by lever 3226 along the axis direction of this hollow projection 3222, when 31 groups, this material bar enters after this hollow projection 3222, this driving lever 3224 drives this to be moved upward to make this mutually to be intersected by lever 3226 and the nose bar 311 that is grown in these material bar 31 ends by lever 3226 by this drive link 3225 in stressed moving downward, this positioning seat 3221 is cross one anotherly driven this material bar 31 to carry out rotation by lever 3226 and nose bar 311 by this.
In the present embodiment, driving lever 3224 at this linkage 3223 is provided with storage tank 3227, this is provided with perforation 3228 by lever 3226, one end of this drive link 3225 is contained in this storage tank 3227, the other end is located in this perforation 3228, this driving lever 3224 and being hinged by this storage tank and perforation structure and this drive link 3225 by lever 3226.
This is appreciated that this this driving lever 3224 and can also be hinged by bolt or alternate manner by lever 3226, as long as can be moved upward along the axis direction of this hollow projection 3222 under the drive of this driving lever 3224 by lever 3226.
This second swivel mount 40 is arranged in this second cavity 20, and its structure is identical with the structure of this material bar fixed mount 32, and this second swivel mount 40 is used for carrying the workpiece to be plated that has completed preheating processing procedure in the first cavity 10.
This manipulator 50 is arranged on the ring central authorities of this material bar fixed mount 32, and it is used for capturing the material bar 31 being installed on this material bar fixed mount 32, and this material bar 31 is transmitted and enters in this second cavity 20 and be installed on this second swivel mount 40.
Understandable, in the present invention, in this first cavity 10, the second cavity 20, be also provided with the equipment for workpiece to be plated is heated and be used for that this workpiece to be plated is carried out to the employing physical vaporous depositions such as target, positive and negative electrode, vacuum unit and the air supply unit of sputter and carry out the necessary sputter of plated film unit, because the present invention does not relate to the improvement to these parts, therefore do not show in diagram, but this does not represent that this sputtering unit 100 provided by the present invention does not arrange these sputter unit.
The present invention also provides a kind of method for sputtering that uses above-mentioned sputtering unit to carry out sputter, and it comprises the steps.
(1) provide sputtering unit 100 as above.
(2) workpiece to be plated is installed on this first swivel mount 30, the firing equipment starting in this first cavity 10 carries out preheating to workpiece to be plated.
When workpiece to be plated is carrying out in the process of preheating, can start and drive this first swivel mount 30 that it is revolved round the sun, and can also start the drive unit that drives material bar 31 simultaneously, make this material bar 31 drive workpiece to be plated to carry out rotation.Certainly, the revolution direction of the rotation of this material bar 31 and this first swivel mount 30 can be the same or different.Preferably, the revolution opposite direction of the sense of rotation of this material bar 31 and this first swivel mount 30.
Preferably, before workpiece to be plated is heated, this first cavity 10 is vacuumized.
(3) start manipulator 50, the workpiece to be plated that completes preheating is transmitted one by one and entered in the second cavity 20, and be arranged on the second swivel mount 40 on this first swivel mount 30.
In transport process, this manipulator 50 captures after material bar 31, first can upwards walk vertically a segment distance so that material bar 31 is opened out from positioning seat 3221, then material bar 31 is pushed away to this first swivel mount 30 and enter in this second cavity 20 via this passage 60, now this second swivel mount 40 makes to be used for fixing on it location notch and just direction of advance to this manipulator 50 of positioning seat of material bar under the control of actuating force, manipulator 50 pushes material bar 31 in the location notch of this second swivel mount 40, and then walking downwards vertically by material bar 31 put into the second swivel mount 40 positioning seat so that this material bar 31 be fixed on this second swivel mount 40, last manipulator 50 unclamps material bar 31 and returns to the ring central authorities of the first swivel mount 30 in this first cavity 10.Now, this first swivel mount 30 and this second swivel mount 40 are under the drive of actuating force, the same angle of rotating photo simultaneously, make next one material bar on this first swivel mount 30 just to this manipulator 50, now manipulator 50 carries out identical material bar transmission action again, until the material bar on this first swivel mount 30 is all transmitted and is fixed on this second swivel mount 40.
(4) start valve 61 and close this passage 60 with by this first cavity 10 and the mutual seal isolation of the second cavity 20.
Preferably, after closing passage 60, can again vacuumize action to this second cavity 20.
(5) workpiece to be plated is carried out to sputter operation the second cavity 20 is interior.
(6) open passage 60, start manipulator 50 workpiece to be plated that completes sputter work in the second cavity is transported on the first swivel mount from this second swivel mount 40.
(7) workpiece to be plated that completes sputter operation in the first cavity 10 is taken and again put into closing passage 60, to keep the vacuum state of the second cavity 20, away second batch workpiece to be plated.
(8) repeat above-mentioned steps so that second batch workpiece to be plated is carried out to sputter operation.
In addition, those skilled in the art also can do other variation in spirit of the present invention.Therefore the variation that these do according to spirit of the present invention, within all should being included in the present invention's scope required for protection.
Claims (7)
1. a sputtering unit, it is used for to workpiece plated film to be plated, this sputtering unit has material bar fixed mount, this material bar fixed mount is used for carrying the material bar that is mounted with workpiece to be plated, this material bar fixed mount comprises the ring-type upper supporting disk and the lower carrier that are oppositely arranged, between this upper supporting disk and lower carrier, be also provided with some support bars fixing to support, this material bar is the column body of rod, the other end of this column body of rod is T-shape, on the body of rod of this material bar, be also provided with hanger bracket to be used for carrying workpiece to be plated, it is characterized in that: there is nose bar one end of this material bar along this material bar radial growth, this lower carrier is provided with positioning seat, with this positioning seat one to one, outer edge at this upper supporting disk is arranged at intervals with location notch, this location notch is used for locating the T-shape end of this material bar, the edge away from carrier center of each this location notch comprises a peristome that can enter for this material bar, this positioning seat comprises a hollow projection and linkage, this hollow projection is used for accommodating this material bar growth one end of nose bar, this linkage has driving lever, drive link and by lever, wherein this drive link is hingedly fixed on this hollow projection, this driving lever is positioned at the inside of this hollow projection, and this driving lever and be hinged on respectively the two ends of this drive link by lever, this driving lever application of force of this material pole pair makes this drive link drive this to be moved to make this mutually to be intersected by lever and this nose bar by lever.
2. sputtering unit as claimed in claim 1, is characterized in that: this positioning seat can rotate under the drive of actuating force, and this positioning seat drives this material bar to be rotated by this material bar and the cross one another structure of this linkage.
3. sputtering unit as claimed in claim 1 or 2, it is characterized in that: this sputtering unit further comprises the first cavity, the second cavity and transmission mechanism, this first cavity is used for workpiece to be plated to carry out preheating, this second cavity is used for workpiece to be plated to carry out sputter, this first cavity and the second cavity are interconnected by a passage, in this passage, be provided with a valve and be used for controlling the open and close of this passage, in this first cavity and the second cavity, be respectively arranged with this material bar fixed mount, this material bar can transmit between the material bar fixed mount in this first cavity and the second cavity via this passage under the effect of this transmission mechanism.
4. sputtering unit as claimed in claim 1, it is characterized in that: this material bar fixed mount and this positioning seat are connected with respectively a drive unit, under the drive of drive unit, this material bar fixed mount revolves round the sun, this positioning seat generation rotation, the revolution direction of this material bar fixed mount is identical or contrary with the sense of rotation of this positioning seat.
5. sputtering unit as claimed in claim 3, is characterized in that: this transmission mechanism is manipulator, and this manipulator is arranged in this first cavity and is positioned at the central authorities of this material bar fixed mount.
6. a method for sputtering, it comprises the steps:
A sputtering unit as described in claim 3 to 5 any one is provided;
The material bar that carries workpiece to be plated is installed on the material bar fixed mount in this first cavity, this first cavity is vacuumized;
Workpiece to be plated in the first cavity is carried out to pre-hot work;
The workpiece to be plated that completes pre-hot work is sent in the second cavity via the passage between this first cavity and the second cavity one by one and is fixed on the material bar fixed mount in the second cavity;
Close the passage between this first cavity and the second cavity, the workpiece to be plated in the second cavity is carried out to sputter operation;
Open the passage between this first cavity and the second cavity, will in the second cavity, complete in work piece delivery to the first cavity to be plated of sputter operation;
Close passage between this first cavity and the second cavity to keep the vacuum state in this second cavity, take away and in the first cavity, complete the workpiece to be plated of sputter operation and put into second batch workpiece to be plated.
7. method for sputtering as claimed in claim 6, is characterized in that: carry out in the process of pre-hot work or sputter operation at workpiece to be plated, this material bar fixed mount and this material bar rotate, and the rotation direction of this material bar fixed mount and the direction of rotation of expecting bar.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010161106.1A CN102234769B (en) | 2010-04-30 | 2010-04-30 | Sputtering device and sputtering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010161106.1A CN102234769B (en) | 2010-04-30 | 2010-04-30 | Sputtering device and sputtering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102234769A CN102234769A (en) | 2011-11-09 |
| CN102234769B true CN102234769B (en) | 2014-11-05 |
Family
ID=44885885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010161106.1A Expired - Fee Related CN102234769B (en) | 2010-04-30 | 2010-04-30 | Sputtering device and sputtering method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102234769B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109825799A (en) * | 2018-08-23 | 2019-05-31 | 深圳市昊翀珠宝科技有限公司 | A kind of jewelry vacuum noble metal sputtering equipment and technique |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5961798A (en) * | 1996-02-13 | 1999-10-05 | Diamond Black Technologies, Inc. | System and method for vacuum coating of articles having precise and reproducible positioning of articles |
| US6471837B1 (en) * | 1997-09-29 | 2002-10-29 | Unaxis Trading Ag | Vacuum coating installation and coupling device |
-
2010
- 2010-04-30 CN CN201010161106.1A patent/CN102234769B/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5961798A (en) * | 1996-02-13 | 1999-10-05 | Diamond Black Technologies, Inc. | System and method for vacuum coating of articles having precise and reproducible positioning of articles |
| US6471837B1 (en) * | 1997-09-29 | 2002-10-29 | Unaxis Trading Ag | Vacuum coating installation and coupling device |
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| Publication number | Publication date |
|---|---|
| CN102234769A (en) | 2011-11-09 |
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