CN102234769A - Sputtering device and sputtering method - Google Patents

Sputtering device and sputtering method Download PDF

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Publication number
CN102234769A
CN102234769A CN2010101611061A CN201010161106A CN102234769A CN 102234769 A CN102234769 A CN 102234769A CN 2010101611061 A CN2010101611061 A CN 2010101611061A CN 201010161106 A CN201010161106 A CN 201010161106A CN 102234769 A CN102234769 A CN 102234769A
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CN
China
Prior art keywords
cavity
material bar
plated
workpiece
bar
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Granted
Application number
CN2010101611061A
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Chinese (zh)
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CN102234769B (en
Inventor
凌维成
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Application filed by Hongfujin Precision Industry Shenzhen Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Shenzhen Co Ltd
Priority to CN201010161106.1A priority Critical patent/CN102234769B/en
Publication of CN102234769A publication Critical patent/CN102234769A/en
Application granted granted Critical
Publication of CN102234769B publication Critical patent/CN102234769B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The invention relates to a sputtering device which comprises a material rod fixing frame which is used for bearing a material rod loading workpieces to be plated, wherein a protruded rod is grown at one end of the material rod along the radial direction; the material rod fixing frame is provided with a positioning seat; the positioning seat is provided with a connecting rod mechanism and a hollow raised column which is used for containing one end, at which the protruded rod is grown, of the material rod; and the positioning seat fixes the material rod through the connecting rod mechanism and drives the material rod to rotate. Compared with the prior art, the sputtering device fixes the material rod through the connecting rod mechanism, so that the material rod can be rapidly installed or disassembled, thereby greatly improving the efficiency of sputtering processing. The invention further relates to a sputtering method.

Description

Sputtering apparatus and jet-plating method
Technical field
The present invention relates to a kind of sputtering apparatus and jet-plating method.
Background technology
At present, in that being carried out plated film, plastics or metal shell surface generally all adopt physical vaporous deposition (PVD) to carry out film-plating process, in film-plating process, the carrier of carrying workpiece to be plated generally all can drive workpiece to be plated and be rotated, like this can be so that workpiece to be plated can be by abundant sputter.Preferably, a rotating device generally also can be set on carrier, workpiece to be plated is fixed on this rotating device so that when this carrier is driving passive workpiece and revolves round the sun, this rotating device drives workpiece to be plated and carries out rotation, can carry out sputter to workpiece to be plated more completely by such structure.
Driving workpiece to be plated at rotating device carries out in the processing procedure of rotation, general being fixed on the rotating device of needing not only that workpiece to be plated can be good, and require workpiece to be plated when beginning sputter or finishing sputter, can dismantle fast to save the time of whole processing procedure, especially when needing a large amount of workpieces to be plated between a plurality of carriers, to transmit, how to make workpiece to be plated can be fast from a rotating device dismounting and good be fixed to the efficient that another rotating device shangguan is tied to whole processing procedure.
Summary of the invention
In view of this, provide a kind of sputtering apparatus and the jet-plating method that can avoid above-mentioned situation to occur real for necessary.
A kind of sputtering apparatus, it is used for to workpiece plated film to be plated, this sputtering apparatus has material bar anchor, this material bar anchor is used for carrying the material bar that is mounted with workpiece to be plated, one end of this material bar is radially grown along the material bar nose bar, this material bar anchor is provided with positioning seat, this positioning seat comprises a hollow projection and linkage assembly, this hollow projection is used for accommodating the end that this material bar growth has nose bar, this linkage assembly has driving lever, transmission rod and passive bar, wherein this transmission rod is hingedly fixed on this hollow projection, this driving lever is positioned at the inside of this hollow projection, and this driving lever and passive bar are hinged on the two ends of this transmission rod respectively, and this driving lever application of force of this material pole pair makes this transmission rod drive this passive bar motion so that this passive bar intersects mutually with this nose bar.
Preferably, this sputtering apparatus further comprises first cavity, second cavity and transmission rig, this first cavity is used for workpiece to be plated is carried out preheating, this second cavity is used for workpiece to be plated is carried out sputter, this first cavity and second cavity are interconnected by a passage, in this passage, be provided with the open and close that a valve is used for controlling this passage, be respectively arranged with aforesaid material bar anchor in this first cavity and second cavity, this material bar can transmit between the intravital material bar of this first cavity and second chamber anchor via this passage under the effect of this transmission rig.
A kind of jet-plating method, it comprises the steps: to provide an aforesaid sputtering apparatus; The material bar that carries workpiece to be plated is installed on the intravital material bar anchor of this first chamber, this first cavity is vacuumized; The intravital workpiece to be plated in first chamber is carried out pre-hot work; One by one be sent to second cavity in via the passage between this first cavity and second cavity workpiece to be plated of finishing pre-hot work and be fixed on the intravital material bar anchor of second chamber; Close the passage between this first cavity and second cavity, the intravital workpiece to be plated in second chamber is carried out the sputter operation; Open the passage between this first cavity and second cavity, the workpiece to be plated of finishing the sputter operation in second cavity is sent in first cavity; Close passage between this first cavity and second cavity to keep this intravital vacuum state in second chamber, take the workpiece to be plated of finishing the sputter operation in first cavity away and put into second batch of workpiece to be plated.
Compared with prior art, this sputtering apparatus provided by the invention is provided with a positioning seat with linkage assembly on material bar anchor, this positioning seat is used for the material bar that carries workpiece to be plated is fixed, in the time of in the material bar that an end is had nose bar is packed this positioning seat into, by continuous action relation the passive bar in the linkage assembly is intersected mutually with the nose bar of expecting bar, positioning seat drives the material bar by this cross one another passive bar with material bar nose bar and carries out rotation.
Further, in preferred version of the present invention, this sputtering apparatus has two cavitys and is used for respectively workpiece to be plated is carried out pre-hot work and sputter operation, all be provided with material bar anchor in these two cavitys with above-mentioned positioning seat, workpiece to be plated transmits in two chamber intravital material bar anchors by mechanical manipulator, owing to can install fast and dismantle between positioning seat in this material bar anchor and the material bar, make the sputter efficient of this sputtering apparatus provided by the present invention be further enhanced.
Description of drawings
Fig. 1 is the structural representation of the sputtering apparatus that provides of the embodiment of the invention, and it comprises material bar and material bar anchor.
Fig. 2 is that the sputtering apparatus that provides of the embodiment of the invention is in the view of expecting the bar transportation.
Fig. 3 is that the sputtering apparatus that the embodiment of the invention provides is expected bar anchor and the rotation synoptic diagram of expecting bar in preheating or sputter process.
Fig. 4 is the enlarged view of IV part among Fig. 3.
Fig. 5 is the enlarged view of V part among Fig. 3.
Fig. 6 is the sectional view of Fig. 5.
The main element nomenclature
Sputtering apparatus 100
First cavity 10
Second cavity 20
First swivel mount 30
Material bar 31
Nose bar 311
Hanger bracket 312
Material bar anchor 32
Upper supporting disk 321
Locating slot 3211
Following carrier 322
Positioning seat 3221
Hollow projection 3222
Linkage assembly 3223
Driving lever 3224
Transmission rod 3225
Passive bar 3226
Storage tank 3227
Perforation 3228
Support bar 323
Second swivel mount 40
Mechanical manipulator 50
Passage 60
Valve 61
Embodiment
See also Fig. 1 to Fig. 6, this sputtering apparatus 100 that the embodiment of the invention provides, it comprises first cavity 10, second cavity 20, first swivel mount 30, second swivel mount 40 and mechanical manipulator 50.
This first cavity 10 is used for workpiece to be plated is carried out preheating, and this second cavity 20 is used for the workpiece to be plated of finishing the preheating processing procedure in this first cavity 10 is carried out sputter.
Between this first cavity 10 and second cavity 20, be provided with a passage 60, this first cavity 10 is interconnected by this passage 60 with this second cavity 20, and the workpiece to be plated of finishing preheating in this first cavity 10 is transmitted to enter in this second cavity 20 via this passage 60 and carries out sputter process.In this passage 60, also be provided with the open and close that valve 61 is used for controlling this passage 60.
This first swivel mount 30 is arranged in this first cavity 10 and is used for carrying workpiece to be plated.This first swivel mount 30 comprises material bar 31 and material bar anchor 32, wherein should can rotate in this first cavity 10 under the drive of motivating force by material bar anchor 32.
This material bar 31 is the column body of rod, and an end of this material bar 31 is T-shape, and the other end has the nose bar 311 perpendicular with the body of rod of this material bar 31 at the position near the end to outgrowth, and this material bar 31 is installed on this material bar anchor 32 by this structure is dismountable.On the body of rod of this material bar 31, the hanger bracket 312 that is fixed with spaced apart, this hanger bracket 312 is used for carrying workpiece to be plated.
This material bar anchor 32 comprises that two ring-type upper supporting disks that are oppositely arranged 321 reach carrier 322 down, is provided with several support bars 323 between these two carriers, and these two ring-type carriers are by these support bar 323 mutual support fixation.
Be arranged at intervals with some and the corresponding locating slot 3211 of T-shape end this material bar 31 in the outer rim of this upper supporting disk 321, the T-shape end by this material bar 31 and this locating slot 3211 mutual engage make this material bar 31 can vertical hanging in this upper supporting disk 321 times.Corresponding with this locating slot 3211, be provided with positioning seat 3221 in this time carrier 322 corresponding positions, this positioning seat 3221 comprises a hollow projection 3222 and a linkage assembly 3223, this hollow projection 3222 is used for accommodating the end that these material bar 31 growths have nose bar 311, this linkage assembly 3223 has driving lever 3224, transmission rod 3225 and passive bar 3226, wherein the middle part of this transmission rod 3225 is hingedly fixed on the sidewall of this hollow projection 3222, this driving lever 3224 is positioned at the inside of this hollow projection 3222, and this driving lever 3224 and passive bar 3226 are hingedly fixed in the two ends of this transmission rod 3225 respectively along the axis direction of this hollow projection 3222, after 31 groups on this material bar is gone into this hollow projection 3222, this driving lever 3224 drives by this transmission rod 3225 in stressed moving downward that this passive bar 3226 moves upward so that this passive bar 3226 intersects mutually with the nose bar 311 that is grown in these material bar 31 ends, and this positioning seat 3221 drives this material bar 31 by this cross one another passive bar 3226 and nose bar 311 and carries out rotation.
In the present embodiment, driving lever 3224 at this linkage assembly 3223 is provided with storage tank 3227, this passive bar 3226 is provided with perforation 3228, one end of this transmission rod 3225 is contained in this storage tank 3227, the other end is located in this perforation 3228, and this driving lever 3224 and passive bar 3226 are hinged by this storage tank and perforation structure and this transmission rod 3225.
Be appreciated that this this driving lever 3224 and passive bar 3226 can also be hinged by bolt or alternate manner, as long as make this passive bar 3226 under the drive of this driving lever 3224, can move upward along the axis direction of this hollow projection 3222.
This second swivel mount 40 is arranged in this second cavity 20, and its structure is identical with the structure of this material bar anchor 32, and this second swivel mount 40 is used for carrying the workpiece to be plated of finishing the preheating processing procedure in first cavity 10.
This mechanical manipulator 50 is arranged on the ring central authorities of this material bar anchor 32, and it is used for grasping the material bar 31 that is installed on this material bar anchor 32, and should expect that bar 31 transmits and enter in this second cavity 20 and be installed on this second swivel mount 40.
Understandable, in the present invention, in this first cavity 10, second cavity 20, also be provided with and be used for equipment that workpiece to be plated is heated and being used for carries out sputter to this workpiece to be plated employing physical vaporous depositions such as target, positive and negative electrode, vacuum unit and air supply unit and carry out the necessary sputter of plated film unit, because the present invention does not relate to the improvement to these parts, so do not show in diagram, but on behalf of this sputtering apparatus 100 provided by the present invention, this these sputter unit are not set.
The present invention also provides a kind of jet-plating method that uses above-mentioned sputtering apparatus to carry out sputter, and it comprises the steps.
(1) provides aforesaid sputtering apparatus 100.
(2) workpiece to be plated is installed on this first swivel mount 30, the heating installation that starts in this first cavity 10 carries out preheating to workpiece to be plated.
Carrying out when workpiece to be plated in the process of preheating, can start this first swivel mount 30 of driving it is revolved round the sun, and can also start the drive unit that drives material bar 31 simultaneously, making this material bar 31 drive workpieces to be plated and carry out rotation.Certainly, the revolution direction of the rotation of this material bar 31 and this first swivel mount 30 can be the same or different.Preferably, the sense of rotation of this material bar 31 is opposite with the revolution direction of this first swivel mount 30.
Preferably, before workpiece to be plated is heated, this first cavity 10 is vacuumized.
(3) start mechanical manipulator 50, the workpiece to be plated of finishing preheating on this first swivel mount 30 is transmitted one by one enter in second cavity 20, and be installed on second swivel mount 40.
In transport process, after this mechanical manipulator 50 grasps material bar 31, the segment distance of at first can upwards walking vertically opens out from positioning seat 3221 will expect bar 31, to expect that then bar 31 pushes away this first swivel mount 30 and enters in this second cavity 20 via this passage 60, this second swivel mount 40 made under the control of motivating force and was used for fixing the material locating slot of bar and the positioning seat working direction over against this mechanical manipulator 50 on it this moment, mechanical manipulator 50 will expect that bar 31 pushes in the locating slot of this second swivel mount 40, and then walking downwards vertically will expect that bar 31 puts into the positioning seat of second swivel mount 40 so that this material bar 31 is fixed on this second swivel mount 40, and mechanical manipulator 50 unclamps the ring central authorities of expecting bar 31 and returning to the first interior swivel mount 30 of this first cavity 10 at last.At this moment, this first swivel mount 30 and this second swivel mount 40 are under the drive of motivating force, rotate identical angle simultaneously, make next one material bar on this first swivel mount 30 over against this mechanical manipulator 50, this moment, mechanical manipulator 50 carried out identical material bar transmission action once more, was fixed on this second swivel mount 40 until the material bar on this first swivel mount 30 is all transmitted.
(4) start valve 61 and close this passage 60 with this first cavity 10 and second cavity, 20 mutual seal isolation.
Preferably, behind closes passage 60, can vacuumize action once more to this second cavity 20.
(5) in second cavity 20, workpiece to be plated is carried out the sputter operation.
(6) open passage 60, start mechanical manipulator 50 workpiece to be plated of finishing sputter work in second cavity is transported on first swivel mount from this second swivel mount 40.
(7) workpiece to be plated of finishing the sputter operation in first cavity 10 is taken and put into once more to closes passage 60 away second batch of workpiece to be plated to keep the vacuum state of second cavity 20.
(8) repeat above-mentioned steps so that second batch of workpiece to be plated carried out the sputter operation.
In addition, those skilled in the art also can do other variation in spirit of the present invention.So the variation that these are done according to spirit of the present invention all should be included within the present invention's scope required for protection.

Claims (9)

1. sputtering apparatus, it is used for to workpiece plated film to be plated, this sputtering apparatus has material bar anchor, this material bar anchor is used for carrying the material bar that is mounted with workpiece to be plated, it is characterized in that: an end of this material bar is radially grown along this material bar nose bar, this material bar anchor is provided with positioning seat, this positioning seat comprises a hollow projection and linkage assembly, this hollow projection is used for accommodating the end that this material bar growth has nose bar, this linkage assembly has driving lever, transmission rod and passive bar, wherein this transmission rod is hingedly fixed on this hollow projection, this driving lever is positioned at the inside of this hollow projection, and this driving lever and passive bar are hinged on the two ends of this transmission rod respectively, and this driving lever application of force of this material pole pair makes this transmission rod drive this passive bar motion so that this passive bar intersects mutually with this nose bar.
2. sputtering apparatus as claimed in claim 1 is characterized in that: this positioning seat can rotate under the drive of motivating force, and this positioning seat drives this material bar by this material bar and the cross one another structure of this linkage assembly and is rotated.
3. sputtering apparatus as claimed in claim 1 or 2, it is characterized in that: this sputtering apparatus further comprises first cavity, second cavity and transmission rig, this first cavity is used for workpiece to be plated is carried out preheating, this second cavity is used for workpiece to be plated is carried out sputter, this first cavity and second cavity are interconnected by a passage, in this passage, be provided with the open and close that a valve is used for controlling this passage, be respectively arranged with this material bar anchor in this first cavity and second cavity, this material bar can transmit between the intravital material bar of this first cavity and second chamber anchor via this passage under the effect of this transmission rig.
4. sputtering apparatus as claimed in claim 3 is characterized in that: this material bar is the column body of rod, and the other end of this column body of rod is T-shape, also is provided with hanger bracket to be used for carrying workpiece to be plated on the body of rod of this material bar.
5. sputtering apparatus as claimed in claim 4, it is characterized in that: this material bar anchor comprises that the ring-type upper supporting disk that is oppositely arranged reaches carrier down, it is fixing to support also to be provided with some support bars between the carrier under this upper supporting disk reaches, this positioning seat is arranged on this time carrier, with this positioning seat one to one, outer edge at this upper supporting disk is arranged at intervals with locating slot, and this locating slot is used for locating the T-shape end of this material bar.
6. sputtering apparatus as claimed in claim 5, it is characterized in that: this material bar anchor and this positioning seat are connected with a drive unit respectively, under the drive of drive unit, this material bar anchor revolves round the sun, this positioning seat generation rotation, the revolution direction of this material bar anchor is identical or opposite with the sense of rotation of this positioning seat.
7. sputtering apparatus as claimed in claim 3 is characterized in that: this transmission rig is a mechanical manipulator, and this mechanical manipulator is arranged in this first cavity and is positioned at the central authorities of this material bar anchor.
8. jet-plating method, it comprises the steps:
Provide one as each described sputtering apparatus of claim 3 to 7;
The material bar that carries workpiece to be plated is installed on the intravital material bar anchor of this first chamber, this first cavity is vacuumized;
The intravital workpiece to be plated in first chamber is carried out pre-hot work;
One by one be sent to second cavity in via the passage between this first cavity and second cavity workpiece to be plated of finishing pre-hot work and be fixed on the intravital material bar anchor of second chamber;
Close the passage between this first cavity and second cavity, the intravital workpiece to be plated in second chamber is carried out the sputter operation;
Open the passage between this first cavity and second cavity, the workpiece to be plated of finishing the sputter operation in second cavity is sent in first cavity;
Close passage between this first cavity and second cavity to keep this intravital vacuum state in second chamber, take the workpiece to be plated of finishing the sputter operation in first cavity away and put into second batch of workpiece to be plated.
9. jet-plating method as claimed in claim 8 is characterized in that: carry out in the process of pre-hot work or sputter operation at workpiece to be plated, this material bar anchor and this material bar rotate, and should expect the turning direction of bar anchor and the direction of rotation of material bar.
CN201010161106.1A 2010-04-30 2010-04-30 Sputtering device and sputtering method Expired - Fee Related CN102234769B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201010161106.1A CN102234769B (en) 2010-04-30 2010-04-30 Sputtering device and sputtering method

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Application Number Priority Date Filing Date Title
CN201010161106.1A CN102234769B (en) 2010-04-30 2010-04-30 Sputtering device and sputtering method

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CN102234769A true CN102234769A (en) 2011-11-09
CN102234769B CN102234769B (en) 2014-11-05

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109825799A (en) * 2018-08-23 2019-05-31 深圳市昊翀珠宝科技有限公司 A kind of jewelry vacuum noble metal sputtering equipment and technique

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961798A (en) * 1996-02-13 1999-10-05 Diamond Black Technologies, Inc. System and method for vacuum coating of articles having precise and reproducible positioning of articles
US6471837B1 (en) * 1997-09-29 2002-10-29 Unaxis Trading Ag Vacuum coating installation and coupling device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5961798A (en) * 1996-02-13 1999-10-05 Diamond Black Technologies, Inc. System and method for vacuum coating of articles having precise and reproducible positioning of articles
US6471837B1 (en) * 1997-09-29 2002-10-29 Unaxis Trading Ag Vacuum coating installation and coupling device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109825799A (en) * 2018-08-23 2019-05-31 深圳市昊翀珠宝科技有限公司 A kind of jewelry vacuum noble metal sputtering equipment and technique

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CN102234769B (en) 2014-11-05

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