CN102208362A - 一种穿透硅通孔背部连接端的制备方法 - Google Patents
一种穿透硅通孔背部连接端的制备方法 Download PDFInfo
- Publication number
- CN102208362A CN102208362A CN201110113880XA CN201110113880A CN102208362A CN 102208362 A CN102208362 A CN 102208362A CN 201110113880X A CN201110113880X A CN 201110113880XA CN 201110113880 A CN201110113880 A CN 201110113880A CN 102208362 A CN102208362 A CN 102208362A
- Authority
- CN
- China
- Prior art keywords
- silicon
- semiconductor substrate
- metal layer
- back surfaces
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 33
- 230000008878 coupling Effects 0.000 title abstract 3
- 238000010168 coupling process Methods 0.000 title abstract 3
- 238000005859 coupling reaction Methods 0.000 title abstract 3
- 239000000758 substrate Substances 0.000 claims abstract description 109
- 229910052751 metal Inorganic materials 0.000 claims abstract description 101
- 239000002184 metal Substances 0.000 claims abstract description 101
- 239000004065 semiconductor Substances 0.000 claims abstract description 93
- 238000005498 polishing Methods 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000005530 etching Methods 0.000 claims abstract description 11
- 239000000126 substance Substances 0.000 claims description 17
- 238000000151 deposition Methods 0.000 claims description 16
- 230000008021 deposition Effects 0.000 claims description 16
- 238000005260 corrosion Methods 0.000 claims description 14
- 230000007797 corrosion Effects 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- 239000012530 fluid Substances 0.000 claims description 10
- 230000015572 biosynthetic process Effects 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 230000001568 sexual effect Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052721 tungsten Inorganic materials 0.000 claims description 4
- 239000010937 tungsten Substances 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 230000008020 evaporation Effects 0.000 claims description 3
- 238000001704 evaporation Methods 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 3
- 238000010849 ion bombardment Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- 239000011135 tin Substances 0.000 claims description 3
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims description 2
- 238000000678 plasma activation Methods 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 15
- 238000004377 microelectronic Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 230000010354 integration Effects 0.000 abstract description 2
- 238000003475 lamination Methods 0.000 abstract 2
- 238000012545 processing Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000001020 plasma etching Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000006850 spacer group Chemical group 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
Description
Claims (12)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110113880 CN102208362B (zh) | 2011-05-04 | 2011-05-04 | 一种穿透硅通孔背部连接端的制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110113880 CN102208362B (zh) | 2011-05-04 | 2011-05-04 | 一种穿透硅通孔背部连接端的制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102208362A true CN102208362A (zh) | 2011-10-05 |
CN102208362B CN102208362B (zh) | 2013-11-06 |
Family
ID=44697127
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201110113880 Active CN102208362B (zh) | 2011-05-04 | 2011-05-04 | 一种穿透硅通孔背部连接端的制备方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102208362B (zh) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103219282A (zh) * | 2013-05-03 | 2013-07-24 | 华进半导体封装先导技术研发中心有限公司 | 一种tsv露头工艺 |
CN103390580A (zh) * | 2013-08-20 | 2013-11-13 | 华进半导体封装先导技术研发中心有限公司 | 一种tsv背面露头方法 |
CN105590893A (zh) * | 2014-10-20 | 2016-05-18 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制备方法、电子装置 |
CN112908933A (zh) * | 2021-02-20 | 2021-06-04 | 上海华虹宏力半导体制造有限公司 | 硅通孔的制造方法 |
CN113782489A (zh) * | 2021-08-27 | 2021-12-10 | 上海华虹宏力半导体制造有限公司 | 硅通孔及其形成方法 |
CN114556594A (zh) * | 2020-09-27 | 2022-05-27 | 深圳市大疆创新科技有限公司 | 芯片及制备方法、接收芯片、测距装置、可移动平台 |
WO2023272785A1 (zh) * | 2021-07-01 | 2023-01-05 | 长鑫存储技术有限公司 | 一种半导体器件及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001185685A (ja) * | 1999-12-24 | 2001-07-06 | Toshiba Corp | 半導体装置 |
CN101179037A (zh) * | 2007-12-06 | 2008-05-14 | 清华大学 | 高深宽比三维垂直互连及三维集成电路的实现方法 |
CN101483150A (zh) * | 2009-02-13 | 2009-07-15 | 华中科技大学 | 一种加工硅通孔互连结构的工艺方法 |
CN101604683A (zh) * | 2008-06-11 | 2009-12-16 | 和舰科技(苏州)有限公司 | 一种用于互连的气隙结构及其制造方法 |
-
2011
- 2011-05-04 CN CN 201110113880 patent/CN102208362B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001185685A (ja) * | 1999-12-24 | 2001-07-06 | Toshiba Corp | 半導体装置 |
CN101179037A (zh) * | 2007-12-06 | 2008-05-14 | 清华大学 | 高深宽比三维垂直互连及三维集成电路的实现方法 |
CN101604683A (zh) * | 2008-06-11 | 2009-12-16 | 和舰科技(苏州)有限公司 | 一种用于互连的气隙结构及其制造方法 |
CN101483150A (zh) * | 2009-02-13 | 2009-07-15 | 华中科技大学 | 一种加工硅通孔互连结构的工艺方法 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103219282A (zh) * | 2013-05-03 | 2013-07-24 | 华进半导体封装先导技术研发中心有限公司 | 一种tsv露头工艺 |
CN103390580A (zh) * | 2013-08-20 | 2013-11-13 | 华进半导体封装先导技术研发中心有限公司 | 一种tsv背面露头方法 |
CN105590893A (zh) * | 2014-10-20 | 2016-05-18 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制备方法、电子装置 |
CN114556594A (zh) * | 2020-09-27 | 2022-05-27 | 深圳市大疆创新科技有限公司 | 芯片及制备方法、接收芯片、测距装置、可移动平台 |
CN112908933A (zh) * | 2021-02-20 | 2021-06-04 | 上海华虹宏力半导体制造有限公司 | 硅通孔的制造方法 |
WO2023272785A1 (zh) * | 2021-07-01 | 2023-01-05 | 长鑫存储技术有限公司 | 一种半导体器件及其制作方法 |
US11955383B2 (en) | 2021-07-01 | 2024-04-09 | Changxin Memory Technologies, Inc. | Semiconductor device and manufacturing method thereof |
CN113782489A (zh) * | 2021-08-27 | 2021-12-10 | 上海华虹宏力半导体制造有限公司 | 硅通孔及其形成方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102208362B (zh) | 2013-11-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102208362B (zh) | 一种穿透硅通孔背部连接端的制备方法 | |
CN103193193B (zh) | Mems器件及其形成方法 | |
CN102420210B (zh) | 具有硅通孔(tsv)的器件及其形成方法 | |
US20180374751A1 (en) | Novel 3D Integration Method Using SOI Substrates and Structures Produced Thereby | |
CN102157442B (zh) | 一种形成微电子芯片间互连的方法 | |
US20130181355A1 (en) | Support Structure for TSV in MEMS Structure | |
WO2017035321A1 (en) | Conductive barrier direct hybrid bonding | |
US10790248B2 (en) | Three-dimensional integrated circuit and method of manufacturing the same | |
US20140124900A1 (en) | Through-silicon via (tsv) die and method to control warpage | |
CN103367285A (zh) | 一种通孔结构及其制作方法 | |
US20120061794A1 (en) | Methods of forming through wafer interconnects in semiconductor structures using sacrificial material, and semiconductor structures formed by such methods | |
JP2021535608A (ja) | ウェハレベルパッケージ方法及びパッケージ構造 | |
CN104167353A (zh) | 键合衬底表面的处理方法 | |
CN111968953A (zh) | 硅通孔结构及其制备方法 | |
CN103066016A (zh) | 一种晶圆自对准硅通孔连接方法 | |
CN103219282B (zh) | 一种tsv露头工艺 | |
CN102412193A (zh) | 硅通孔填充方法 | |
CN105513943A (zh) | 一种半导体器件的制作方法 | |
CN109686657B (zh) | 晶圆间键合结构的形成方法、晶圆的键合方法 | |
SG188195A1 (en) | Methods of forming through wafer interconnects in semiconductor structures using sacrificial material, and semiconductor structures formed by such methods | |
CN103066009A (zh) | 穿透硅的通孔填充钨塞的工艺方法 | |
CN103378060A (zh) | 硅通孔及其填充方法 | |
CN104143527A (zh) | 一种导电插塞和tsv的形成方法 | |
CN105742193A (zh) | 晶圆与晶圆接合的工艺及结构 | |
CN104992910A (zh) | 一种金属突刺混合键合方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: NATIONAL CENTER FOR ADVANCED PACKAGING Free format text: FORMER OWNER: INST OF MICROELECTRONICS, C. A. S Effective date: 20140108 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 100029 CHAOYANG, BEIJING TO: 214135 WUXI, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20140108 Address after: 214135 Jiangsu province Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee after: National Center for Advanced Packaging Co.,Ltd. Address before: 100029 Beijing city Chaoyang District Beitucheng West Road No. 3 Patentee before: Institute of Microelectronics of the Chinese Academy of Sciences |
|
TR01 | Transfer of patent right |
Effective date of registration: 20170825 Address after: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee after: Shanghai State Intellectual Property Services Co.,Ltd. Address before: 214135 Jiangsu province Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee before: National Center for Advanced Packaging Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191030 Address after: 214028 Jiangsu New District of Wuxi City Linghu Road No. 200 Chinese Sensor Network International Innovation Park building D1 Patentee after: National Center for Advanced Packaging Co.,Ltd. Address before: 200331 room 155-2, ginkgo Road, Shanghai, Putuo District, China, 4 Patentee before: Shanghai State Intellectual Property Services Co.,Ltd. |
|
TR01 | Transfer of patent right |