CN102205462B - 非金属切割中的激光焦距跟踪装置 - Google Patents
非金属切割中的激光焦距跟踪装置 Download PDFInfo
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- CN102205462B CN102205462B CN201110133001XA CN201110133001A CN102205462B CN 102205462 B CN102205462 B CN 102205462B CN 201110133001X A CN201110133001X A CN 201110133001XA CN 201110133001 A CN201110133001 A CN 201110133001A CN 102205462 B CN102205462 B CN 102205462B
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- 238000005520 cutting process Methods 0.000 title claims abstract description 68
- 229910052755 nonmetal Inorganic materials 0.000 title claims abstract description 16
- 238000005070 sampling Methods 0.000 claims description 24
- 230000015572 biosynthetic process Effects 0.000 claims description 17
- 238000003786 synthesis reaction Methods 0.000 claims description 16
- 238000001514 detection method Methods 0.000 claims description 4
- 230000008901 benefit Effects 0.000 abstract description 2
- 230000002194 synthesizing effect Effects 0.000 abstract 3
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000009467 reduction Effects 0.000 description 7
- 230000008859 change Effects 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 239000007769 metal material Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000012423 maintenance Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000011217 control strategy Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000011022 operating instruction Methods 0.000 description 1
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Abstract
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Application Number | Priority Date | Filing Date | Title |
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CN201110133001XA CN102205462B (zh) | 2011-05-21 | 2011-05-21 | 非金属切割中的激光焦距跟踪装置 |
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CN201110133001XA CN102205462B (zh) | 2011-05-21 | 2011-05-21 | 非金属切割中的激光焦距跟踪装置 |
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CN102205462A CN102205462A (zh) | 2011-10-05 |
CN102205462B true CN102205462B (zh) | 2013-12-11 |
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CN201110133001XA Expired - Fee Related CN102205462B (zh) | 2011-05-21 | 2011-05-21 | 非金属切割中的激光焦距跟踪装置 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103433621B (zh) * | 2013-07-29 | 2015-07-22 | 燕山大学 | 一种激光切割头工作状态的切换装置及方法 |
JP5941087B2 (ja) * | 2014-03-25 | 2016-06-29 | ファナック株式会社 | 電源障害時に加工ノズルを退避するレーザ加工装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0713745A1 (en) * | 1994-11-15 | 1996-05-29 | ROLLS-ROYCE plc | A method and apparatus for producing apertured components |
CN201271782Y (zh) * | 2008-07-01 | 2009-07-15 | 北京大恒激光设备有限公司 | 随动式激光切割装置及使用该装置的激光切割机 |
CN202087921U (zh) * | 2011-05-21 | 2011-12-28 | 无锡创科源软件有限公司 | 非金属切割中的激光焦距跟踪装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61135493A (ja) * | 1984-12-04 | 1986-06-23 | Mitsubishi Electric Corp | レ−ザ加工機 |
JPH0655360B2 (ja) * | 1985-09-30 | 1994-07-27 | 株式会社日平トヤマ | レ−ザ加工ヘツド調整装置 |
JPS63203291A (ja) * | 1987-02-20 | 1988-08-23 | Mitsubishi Electric Corp | レ−ザ加工装置 |
JP2597597B2 (ja) * | 1987-09-19 | 1997-04-09 | 株式会社日平トヤマ | レーザ加工機におけるセンサ出力サンプリング方法 |
JP4674992B2 (ja) * | 2001-05-11 | 2011-04-20 | パナソニック電工Sunx株式会社 | レーザマーキング装置 |
JP5072281B2 (ja) * | 2006-07-28 | 2012-11-14 | 株式会社キーエンス | レーザ加工装置、レーザ加工条件設定装置、レーザ加工方法、レーザ加工条件設定方法、レーザ加工条件設定プログラム |
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2011
- 2011-05-21 CN CN201110133001XA patent/CN102205462B/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0713745A1 (en) * | 1994-11-15 | 1996-05-29 | ROLLS-ROYCE plc | A method and apparatus for producing apertured components |
CN201271782Y (zh) * | 2008-07-01 | 2009-07-15 | 北京大恒激光设备有限公司 | 随动式激光切割装置及使用该装置的激光切割机 |
CN202087921U (zh) * | 2011-05-21 | 2011-12-28 | 无锡创科源软件有限公司 | 非金属切割中的激光焦距跟踪装置 |
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CN102205462A (zh) | 2011-10-05 |
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Address after: 214028 18 factory building, block 52, national hi tech Industrial Development Zone, Wuxi, Jiangsu Applicant after: WUXI CHUANGKEYUAN LASER EQUIPMENT Co.,Ltd. Address before: 214028 No. 17-21 Changjiang South Road, New District, Jiangsu, Wuxi Applicant before: Wuxi Chuangkeyuan Software Co.,Ltd. |
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CP01 | Change in the name or title of a patent holder |
Address after: 214028 18 factory building, block 52, national hi tech Industrial Development Zone, Wuxi, Jiangsu Patentee after: Wuxi chuangkeyuan laser equipment Co.,Ltd. Address before: 214028 18 factory building, block 52, national hi tech Industrial Development Zone, Wuxi, Jiangsu Patentee before: WUXI CHUANGKEYUAN LASER EQUIPMENT Co.,Ltd. |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Laser focusing tracking device for nonmetal cutting Effective date of registration: 20151225 Granted publication date: 20131211 Pledgee: Agricultural Bank of China Limited by Share Ltd. Wuxi science and Technology Branch Pledgor: Wuxi chuangkeyuan laser equipment Co.,Ltd. Registration number: 2015990001158 |
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Address after: 214028 18 factory building, block 52, national hi tech Industrial Development Zone, Wuxi, Jiangsu Patentee after: JIANGSU CKYLASER EQUIPMENT CO.,LTD. Address before: 214028 18 factory building, block 52, national hi tech Industrial Development Zone, Wuxi, Jiangsu Patentee before: Wuxi chuangkeyuan laser equipment Co.,Ltd. |
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