CN102201379A - 器件封装结构及其封装方法 - Google Patents
器件封装结构及其封装方法 Download PDFInfo
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- CN102201379A CN102201379A CN2011101249215A CN201110124921A CN102201379A CN 102201379 A CN102201379 A CN 102201379A CN 2011101249215 A CN2011101249215 A CN 2011101249215A CN 201110124921 A CN201110124921 A CN 201110124921A CN 102201379 A CN102201379 A CN 102201379A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 31
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000002184 metal Substances 0.000 claims abstract description 67
- 229910052751 metal Inorganic materials 0.000 claims abstract description 67
- 238000003466 welding Methods 0.000 claims abstract description 30
- 238000005538 encapsulation Methods 0.000 claims description 41
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 18
- 238000012856 packing Methods 0.000 claims description 16
- 238000010276 construction Methods 0.000 claims description 14
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 11
- 238000003912 environmental pollution Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 24
- 239000011521 glass Substances 0.000 description 8
- 238000012545 processing Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000006004 Quartz sand Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000008685 targeting Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110124921 CN102201379B (zh) | 2011-05-16 | 2011-05-16 | 器件封装结构及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201110124921 CN102201379B (zh) | 2011-05-16 | 2011-05-16 | 器件封装结构及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102201379A true CN102201379A (zh) | 2011-09-28 |
CN102201379B CN102201379B (zh) | 2013-07-17 |
Family
ID=44661951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201110124921 Expired - Fee Related CN102201379B (zh) | 2011-05-16 | 2011-05-16 | 器件封装结构及其封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102201379B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106098649A (zh) * | 2016-07-28 | 2016-11-09 | 广东百圳君耀电子有限公司 | 大功率贴片元件及其加工工装、制作方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0331289A2 (en) * | 1988-02-26 | 1989-09-06 | Hitachi, Ltd. | Semiconductor device with impedance matching means |
CN1150336A (zh) * | 1995-11-16 | 1997-05-21 | 戴超智 | 陶瓷片型半导体二极管及其制造方法 |
JP2005277328A (ja) * | 2004-03-26 | 2005-10-06 | Kyocera Corp | 光半導体素子収納用パッケージおよび光半導体装置 |
JP2007150235A (ja) * | 2005-10-27 | 2007-06-14 | Daishinku Corp | 気密封止型電子部品 |
US20080197481A1 (en) * | 2007-02-16 | 2008-08-21 | Denso Corporation | Semiconductor sensor having flat mounting plate |
CN201194227Y (zh) * | 2008-05-09 | 2009-02-11 | 如皋市易达电子有限责任公司 | 一种整流二极管 |
-
2011
- 2011-05-16 CN CN 201110124921 patent/CN102201379B/zh not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0331289A2 (en) * | 1988-02-26 | 1989-09-06 | Hitachi, Ltd. | Semiconductor device with impedance matching means |
CN1150336A (zh) * | 1995-11-16 | 1997-05-21 | 戴超智 | 陶瓷片型半导体二极管及其制造方法 |
JP2005277328A (ja) * | 2004-03-26 | 2005-10-06 | Kyocera Corp | 光半導体素子収納用パッケージおよび光半導体装置 |
JP2007150235A (ja) * | 2005-10-27 | 2007-06-14 | Daishinku Corp | 気密封止型電子部品 |
US20080197481A1 (en) * | 2007-02-16 | 2008-08-21 | Denso Corporation | Semiconductor sensor having flat mounting plate |
CN201194227Y (zh) * | 2008-05-09 | 2009-02-11 | 如皋市易达电子有限责任公司 | 一种整流二极管 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106098649A (zh) * | 2016-07-28 | 2016-11-09 | 广东百圳君耀电子有限公司 | 大功率贴片元件及其加工工装、制作方法 |
CN106098649B (zh) * | 2016-07-28 | 2019-02-05 | 广东百圳君耀电子有限公司 | 大功率贴片元件及其加工工装、制作方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102201379B (zh) | 2013-07-17 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20110928 Assignee: JINAN SEMICONDUCTOR RESEARCH INSTITUTE Assignor: JINAN JINGHENG ELECTRONICS Co.,Ltd. Contract record no.: 2013370000299 Denomination of invention: Packaging structure and packaging method of semiconductor device Granted publication date: 20130717 License type: Exclusive License Record date: 20131227 |
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LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170214 Address after: 250014 Heping Road, Lixia District, Shandong, Ji'nan, China, No. 51 Patentee after: JINAN SEMICONDUCTOR Research Institute Address before: 250014 Heping Road, Lixia District, Shandong, Ji'nan, China, No. 51 Patentee before: JINAN JINGHENG ELECTRONICS Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130717 |
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CF01 | Termination of patent right due to non-payment of annual fee |