CN102197501A - 多芯片led封装 - Google Patents
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Abstract
本发明涉及多芯片LED封装,本发明的多芯片LED封装包含锥形模样的通孔,且在一面上设置形成有电路配线的PCB,以将所述通孔的倾斜面用作从LED芯片发出的光的反射板。并且,所述LED芯片和所述通孔可形成为多个,而且所述LED芯片直接键合到作为散热板的金属底座上。如此构成的本发明直接在易散热的金属底座上键合LED芯片,且将PCB(印制电路板)的倾斜的通孔表面用作反射板,从而不需要专门的散热结构以及反射板,由此简化了结构以及制造工艺,因此具有降低制造费的效果。
Description
技术领域
本发明涉及一种多芯片LED封装,尤其涉及一种无需具备专门的反射板以及散热结构的多芯片LED封装。
背景技术
通常,发光二极管(Light Emitting Diode,以下简称“LED”)是根据施加的电流而产生光的元件,相比现有的光源,具有能用低电压、低电流连续发光,且耗电量小的优点。利用该优点,最近有利用LED的照明装置以及平板显示装置的背光源,其应用领域正逐步扩大。
LED封装方法可大致分为,对分别产生红光、绿光、蓝光的各元件的光进行混合,以在所述照明装置以及背光源中产生白光的形态封装到基板的方法和将单个的芯片内包含所述红色、绿色、蓝色LED的LED芯片接合到基板,并通过引线键合(wire bonding)来进行封装的方法。以下,参照附图详细说明如上现有的LED封装。
图1是现有LED封装的截面构成图。
参照图1,现有的LED封装包含:金属底座1;蒸镀在所述金属底座1的整个上表面上的绝缘层2;附着在部分所述绝缘层2的上部的LED芯片3;位于所述绝缘层2的上部,用于分别给所述LED芯片3供电的配线层4;分别连接所述配线层4和LED芯片3的引线5;与各个所述LED芯片3隔离预定距离,且位于所述配线层4以及绝缘层2的上部的反射板6;位于从形成所述反射板6的空间到所述LED芯片3的上部部分的包封剂(环氧模塑料:Epoxy Molding Compound)7;位于从所述包封层7的上部到所述反射板6的高度为止的扩散剂8;位于所述结构的整个上部的透镜9。
以下,详细说明如上构成的现有LED封装的结构和制造方法。
首先,在金属底座1的上部蒸镀绝缘层2,并在该绝缘层3的上部整个表面蒸镀金属配线物质之后,用光刻工艺(photo lithograpy)来进行蚀刻,以形成配线层4。
此时,配线层4之间相互隔离,以确保能够安装LED芯片3。
然后,将LED芯片3附着在该配线层4之间的绝缘层2之上。此时的附着可利用粘合剂。之后,将引线5分别键合到配线层4和LED芯片3,以给各个LED芯片3供电。
其次,准备作为可以扩散光的无机材料或者有机材料的反射板6,该反射板6形成通孔,以使对应于所述LED芯片3和引线5的部分露出,并将该反射板6键合到所述绝缘层2以及配线层4之上,以露出LED芯片3和引线5。
此时,形成于反射板6的通孔,其该侧面部以竖直状态形成。之后,在所述反射板6的通孔部中填充环氧树脂或者硅树脂的包封剂7。此时,包封剂7的填充高度为所述LED芯片3的高度以上,且没有达到该反射板6的高度的程度。其次,向所述包封剂7的上部填充作为无机材料或者有机材料可以扩散光的扩散剂8。所述扩散剂8的高度可与反射板6相同。然后,在所述反射板6和扩散剂8的上部的整个表面接合透镜9。
如上构成的现有多芯片LED封装是,只有具备专门的反射板6才能扩散所产生的光的结构,因此其结构和制造方法相对地复杂,从而存在增加制造成本和收益率降低的问题。并且,虽然为了散发热量而使用金属底座1,但是该金属底座1和LED芯片3之间隔着绝缘层2,因此散热效率低下,从而作为照明器件使用时,存在需要专门的散热结构的问题。
而且,由于反射板6的使用,缩小LED芯片3之间的距离方面受到限制,从而存在无法提供小型的高输出照明装置的问题。
发明内容
技术问题
考虑到如上的问题,本发明的目的在于提供一种即使不使用专门的反射板,也能够充分反射光以使光发散的多芯片LED封装。
并且,本发明的另一个目的在于提供一种将LED芯片直接接合到金属底座上,从而有效地散发由LED产生的热量的多芯片LED封装。
并且,本发明的又一个目的在于提供一种最小化LED芯片之间的距离,从而可提高集成度的多芯片LED封装。
技术方案
为了实现上述目的,本发明的多芯片LED封装,其LED封装包含锥形模样的通孔,且在一面上设置形成有电路配线的PCB,以将所述通孔的倾斜面用作从LED芯片发出的光的反射板。
并且,所述LED芯片和通孔可形成为多个,而且所述LED芯片直接键合到作为散热板的金属底座之上。
有益效果
本发明直接在易散热的金属底座上接合LED芯片,且对PCB(印制电路板)的倾斜的通孔表面进行金属镀覆,以用作反射板,从而不需要专门的反射板,简化了结构以及制造工艺,具有降低制造费的效果。
并且,如上所述,LED芯片之间没有使用反射板,从而能够通过最小化该LED芯片之间的距离来提高集成度,并且通过该集成度的提高,具有可提供高输出的照明装置的效果。
并且,将LED芯片直接接合到金属底座之上,具有可有效地散发由LED芯片产生的热量的效果。
附图说明
图1是现有LED封装的截面构成图;
图2是本发明多芯片LED封装的单个像素(picture element)部的剖视图;
图3是本发明多芯片LED封装的多个像素部的剖视图;
图4是本发明多芯片LED封装的分解立体图;
图5是本发明中的PCB的平面图;
图6是本发明另一实施例的剖视图;
图7是根据本发明另一实施例的PCB的平面图;
图8是使用多层PCB的本发明另一实施例的剖视图。
主要符号说明:10为金属底座,20为LED芯片,30为PCB,31为通孔,32为电路配线,33为金属层,34为电极板,35为第一反射板,36为第二反射板,41为第一引线,42为第二引线,50为透镜板。
具体实施方式
以下,参照附图来详细说明如上构成的本发明的优选实施例。
图2是本发明多芯片LED(发光二极管)封装的单个像素部的剖视图,图3是本发明多芯片LED封装的多个像素部的剖视图,图4是本发明多芯片LED封装的分解立体图。
分别参照图2至图4,本发明多芯片LED封装的优选实施例包含:在用于散热的金属底座10的上部上附着的多个LED芯片20;在对应于所述LED芯片20的位置具备锥形(taper)的通孔(via hole)31,且上表面形成有用于连接LED芯片20的电路配线32的PCB(印制电路板)30;连接各所述LED芯片和所述电路配线32的第一及第二引线41、42;粘接在所述PCB30的整个表面上的光学板50。
未说明的符号60为填充于所述锥形通孔31里的包封剂,符号33为布置在该通孔31内的用作反射板的金属层。
以下,参照图2至图4来详细说明如上构成的本发明多芯片LED封装的优选实施例。
首先,金属底座10为散热片(HEAT SINK)或散热金属板,在该金属底座10上附着LED芯片20。
即,不使用现有的散热配线基板。
附图中使用了圆形的金属底座10,但是可使用上表面为三角形、正方形、长方形等的多边形金属底座。这可根据照明器件的形状任意变更。
并且,当PCB 30粘接到金属底座10时对应于该LED芯片20的位置上形成通孔,以露出全部的所述LED芯片20。
此时,所述通孔31形成为非现有的圆筒形的锥形模样。即,通孔31的形状为上部比下部宽。
优选地,所述PCB 30的大小及形状与所述金属底座10相同。
其次,所述PCB 30的上表面形成有用于连接所述LED芯片20的电路配线32。此时,电路配线32没有连接到所述通孔31的内部侧。
另外,所述通孔31用于用作所述LED芯片20所产生的光的反射板,且为了提高反射效率,可通过专门的镀覆工艺在其内部形成金属层33。
所述金属层33的材料可使用白金、银、镍、铝等反射率优秀的金属。
并且,将所述PCB 30堆叠到所述金属底座10之后,在LED芯片20与电路配线32之间利用第一及第二引线41、42键合。
其次,将包封剂60填充到所述通孔31,并在所述PCB 30上粘接包含多个透镜的光学板50,由此完成封装。
并且,符号34为给所述电路配线32供电的电极板,所述电极板34贯穿PCB 30的局部而形成,并通过布置在金属底座10的孔11暴露于底面侧。向如此暴露的电极板34供电,从而可驱动LED芯片20。
如此的电路配线32及电极板34的结构仅仅是一个实施例,本领域技术人员可进行多种变形来实施,这应该属于本发明的权利范围之内。
图5是示出所述PCB 30的局部的平面图,参照该图来进一步详细说明所述电路配线32以及通孔31。
如图5所示,形成在所述通孔内部的金属层33形成为连接至离PCB 30上表面的通孔31外沿有预定长度为止。
这是为了在从所述LED芯片20发出的光被所述光学板50反射而入射到PCB 30上表面时提高反射效率。
图6是本发明的另一实施例的截面构成图。
参照图6,为了提高从LED芯片20发出的光的反射效率,通孔31具备非单一倾斜面的多个倾斜面。
此时,在所述通孔31的侧面倾斜面内设置平坦的部分,由此能够使引线键合容易进行。
但是,此时需要相互连接形成在所述PCB 30的上表面的电路配线32和通孔31内部的金属层,因此如图7所示的平面图,将金属层分成第一及第二反射板35、36,并且对第一及第二反射板35、36进行电气分离。
并且,所述第一及第二反射板35、36形成为其下部未到达通孔31的下端部,从而不与所述金属底座10的电气连接。
在上述实施例中,以PCB 30为单层的印制电路板为例来进行了说明,但是可使用多层的印制电路板(Multi-layer PCB)。
图8是使用所述多层PCB 70的本发明的另一实施例的截面构成图。
参照图8,所述多层的PCB 70可在中间层形成驱动电路部71,从而在外部无需使用专门的LED驱动电路,因此可提供更薄的光源。
所述驱动电路部71可布置有能调节配线或其他电压的电路图案。
现有的LED照明需要经过,在专门的PCB上设置形成有能够给LED芯片供电的配线的LED模块和个别地驱动该LED模块的LED芯片的驱动电路部,以及将两者相互连接的工艺。
但是,本发明LED封装将驱动LED的驱动电路部形成在同一个PCB的中间层,从而简化制造工艺,且能够提供更薄的照明器件。
产业上的可利用性
在易散热的金属底座上直接接合LED芯片,并对PCB(印制电路板)的倾斜的通孔表面进行金属镀覆而用作反射板,从而无需专门的反射板,同时可简化结构及制造工艺,并且能够降低制造费,因此具有产业上的可利用性。
Claims (9)
1.一种多芯片LED封装,LED封装包含形成有锥形模样的通孔的印制电路板(PCB),
将所述通孔的倾斜面使用为从LED芯片发出的光的反射用途。
2.根据权利要求1所述的多芯片LED封装,包含多个所述通孔和多个所述LED芯片。
3.根据权利要求2所述的多芯片LED封装,所述LED芯片键合到作为散热板的金属底座上。
4.根据权利要求3所述的多芯片LED封装,所述PCB堆叠到所述金属底座上。
5.根据权利要求1至4中的任意一项所述的多芯片LED封装,还包含填充在所述通孔的包封剂。
6.根据权利要求5所述的多芯片LED封装,包含堆叠于所述PCB的上部的光学板,所述光学板包含透镜,所述透镜位于对应于所述LED芯片的位置。
7.根据权利要求5所述的多芯片LED封装,所述通孔的倾斜面上具备反射板。
8.根据权利要求1至4中的任意一项所述的多芯片LED封装,所述通孔的倾斜面上具备反射板。
9.根据权利要求1至4中的任意一项所述的多芯片LED封装,所述PCB为多层的PCB,并且在中间层布置有驱动所述LED芯片的驱动电路部。
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KR10-2008-0104135 | 2008-10-23 | ||
KR1020080113575A KR101006357B1 (ko) | 2008-10-21 | 2008-11-14 | 멀티칩 엘이디 패키지 |
KR10-2008-0113575 | 2008-11-14 | ||
PCT/KR2009/006090 WO2010047528A2 (ko) | 2008-10-21 | 2009-10-21 | 멀티칩 엘이디 패키지 |
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JP2012505543A (ja) | 2012-03-01 |
KR101006357B1 (ko) | 2011-01-10 |
KR20100044060A (ko) | 2010-04-29 |
US20110198628A1 (en) | 2011-08-18 |
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