CN102194765A - 功率模块用基板及制法、自带散热器的该基板及功率模块 - Google Patents

功率模块用基板及制法、自带散热器的该基板及功率模块 Download PDF

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Publication number
CN102194765A
CN102194765A CN2011100459324A CN201110045932A CN102194765A CN 102194765 A CN102194765 A CN 102194765A CN 2011100459324 A CN2011100459324 A CN 2011100459324A CN 201110045932 A CN201110045932 A CN 201110045932A CN 102194765 A CN102194765 A CN 102194765A
Authority
CN
China
Prior art keywords
power module
metallic plate
layer
circuit layer
ceramic substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2011100459324A
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English (en)
Chinese (zh)
Inventor
殿村宏史
长友义幸
长濑敏之
黑光祥郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of CN102194765A publication Critical patent/CN102194765A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
CN2011100459324A 2010-03-03 2011-02-23 功率模块用基板及制法、自带散热器的该基板及功率模块 Pending CN102194765A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010047114A JP5359936B2 (ja) 2010-03-03 2010-03-03 パワーモジュール用基板、パワーモジュール用基板の製造方法、ヒートシンク付パワーモジュール用基板及びパワーモジュール
JP2010-047114 2010-03-03

Publications (1)

Publication Number Publication Date
CN102194765A true CN102194765A (zh) 2011-09-21

Family

ID=44602585

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2011100459324A Pending CN102194765A (zh) 2010-03-03 2011-02-23 功率模块用基板及制法、自带散热器的该基板及功率模块

Country Status (3)

Country Link
JP (1) JP5359936B2 (ja)
KR (1) KR20110100153A (ja)
CN (1) CN102194765A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111566074A (zh) * 2018-01-25 2020-08-21 三菱综合材料株式会社 铜-陶瓷接合体、绝缘电路基板及铜-陶瓷接合体的制造方法、绝缘电路基板的制造方法
TWI737894B (zh) * 2017-03-29 2021-09-01 日商三菱綜合材料股份有限公司 附有散熱片絕緣電路基板之製造方法

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5564999B2 (ja) * 2010-03-03 2014-08-06 三菱マテリアル株式会社 パワーモジュール用基板、パワーモジュール用基板の製造方法、ヒートシンク付パワーモジュール用基板及びパワーモジュール
JP2013058537A (ja) * 2011-09-07 2013-03-28 Mitsubishi Materials Corp パワーモジュール用基板、パワーモジュール用基板の製造方法、ヒートシンク付パワーモジュール用基板及びパワーモジュール
EP3106447B1 (en) * 2014-02-12 2019-04-24 Mitsubishi Materials Corporation Copper-ceramic bonded body and power module substrate
JP6613144B2 (ja) * 2016-01-05 2019-11-27 昭和電工株式会社 絶縁基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4487881B2 (ja) * 1999-03-24 2010-06-23 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP4434545B2 (ja) * 2001-03-01 2010-03-17 Ｄｏｗａホールディングス株式会社 半導体実装用絶縁基板及びパワーモジュール
JP2007027703A (ja) * 2005-06-15 2007-02-01 Kumamoto Univ 機能性基板の製造方法および機能性基板、並びに半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI737894B (zh) * 2017-03-29 2021-09-01 日商三菱綜合材料股份有限公司 附有散熱片絕緣電路基板之製造方法
US11735434B2 (en) 2017-03-29 2023-08-22 Mitsubishi Materials Corporation Method for producing insulating circuit substrate with heat sink
CN111566074A (zh) * 2018-01-25 2020-08-21 三菱综合材料株式会社 铜-陶瓷接合体、绝缘电路基板及铜-陶瓷接合体的制造方法、绝缘电路基板的制造方法
CN111566074B (zh) * 2018-01-25 2022-04-22 三菱综合材料株式会社 铜-陶瓷接合体、绝缘电路基板及铜-陶瓷接合体的制造方法、绝缘电路基板的制造方法

Also Published As

Publication number Publication date
KR20110100153A (ko) 2011-09-09
JP5359936B2 (ja) 2013-12-04
JP2011181846A (ja) 2011-09-15

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