CN102169950A - SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation - Google Patents
SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation Download PDFInfo
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- CN102169950A CN102169950A CN2011100529914A CN201110052991A CN102169950A CN 102169950 A CN102169950 A CN 102169950A CN 2011100529914 A CN2011100529914 A CN 2011100529914A CN 201110052991 A CN201110052991 A CN 201110052991A CN 102169950 A CN102169950 A CN 102169950A
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- liquid heat
- led
- heat dissipation
- circuit board
- liquid
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Abstract
The invention relates to an SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation, and the SMD LED is characterized by mainly comprising a substrate, pins, a rubber base, a lens, a wafer and a heat dissipation part, wherein the heat dissipation part comprises a heat dissipation wafer on the back surface of the LED substrate and a liquid heat dissipation cover which surrounds the heat dissipation wafer; the liquid heat dissipation cover is an inverted funnel; and a heat dissipation liquid is filled in the liquid heat dissipation cover. The SMD LED provided by the invention can be used for solving the defects of the existing LED and has the characteristics of good heat dissipation effect, high heat dissipation speed, long service life, environment friendliness and the like.
Description
One, technical field
The present invention relates to a kind of LED, especially a kind of paster LED that utilizes the liquid heat radiation.
Two, background technology
Along with the development of LED, led light source have use low-tension supply, power consumption less, strong, the stability height of applicability, response time weak point, environmentally safe, advantage such as multicolor luminous, so the extensive use of LED has become a kind of development trend.
Because LED can produce a large amount of heats in luminescence process, suitable heat abstractor must be set, to avoid that the life-span of luminescence chip itself is caused damage.Yet, the encapsulation technology of general traditional LED, thermal paste or thermal grease that LED and engaging of cooling base all are to use the tool stickiness, but no matter be thermal paste or thermal grease, it all is to mix among macromolecule resin having the preferable metal of thermal conductivity, even thermal conductivity is good again, the metal covering of itself and LED and the metal level of cooling base belong to the dielectric layer of unlike material, can't reach the efficient of high heat radiation, and radiating rate is rapid inadequately.
Three, summary of the invention
The objective of the invention is to solve the deficiency of above-mentioned existing LED, a kind of paster LED that utilizes liquid heat radiation is provided, make it have characteristics such as good heat dissipation effect, radiating rate are fast, long service life, environmental protection.
The objective of the invention is to adopt and realize: a kind of paster LED of liquid heat radiation as the bottom case, it mainly is made up of pedestal, pin, rubber base, lens and wafer, be characterized in: it also comprises radiator portion, promptly at the heat radiation crystalline substance plate at the LED pedestal back side and the liquid heat dissipating housing of the brilliant plate encirclement of will dispelling the heat; Described liquid heat dissipating housing is inverted funnel, and the interior dress of liquid heat dissipating housing cooling fluid.
Above-mentioned paster LED is when being connected with circuit board, and LED is welded on the circuit board, and opens taper hole with in the whole embedding of the liquid heat dissipating housing circuit board on circuit board.In addition, use the circuit board of this iron paster LED need be contained in the seal chamber of dress cooling fluid in, the cooling fluid that dispels the heat to circuit board can be entered in the liquid heat dissipating housing dispel the heat to LED.
Above-mentioned cooling fluid is an iknsulating liquid, and it can be insulating radiation liquid such as superconducting fluid, transformer oil, pure water.
The present invention adopts the beneficial effect of such scheme to be: use the cooling fluid cooling LED, can more effectively control its heating, thereby prolong its life-span and reduce price.This measure is expected to enlarge the customer group of LED lamp.
Four, description of drawings
Fig. 1 is the structural representation of the paster LED of liquid heat radiation of the present invention;
Fig. 2 is the scheme of installation of the paster LED of liquid heat radiation of the present invention.
As follows to the label declaration in each width of cloth accompanying drawing:
1-liquid heat dissipating housing; The 2-pedestal; The 3-pin; The 4-rubber base; The 5-lens; The 6-brilliant plate that dispels the heat; The 7-cooling fluid; The 8-sealing ring; The 9-circuit board.
Five, embodiment
Be described in detail below in conjunction with the embodiment of accompanying drawing the paster LED of the sharp liquid heat radiation of the present invention.
As shown in Figure 1, a kind of paster LED of liquid heat radiation, it mainly is made up of pedestal 2, pin 3, rubber base 4, lens 5 and wafer, and it also comprises the radiator portion of being made up of the liquid heat dissipating housing 11 of the brilliant plate 6 of the heat radiation at LED pedestal 2 back sides and brilliant plate 6 encirclements of will dispelling the heat; Described liquid heat dissipating housing 1 is inverted funnel, and cooling fluid 7 is housed in the liquid heat dissipating housing 1.
As shown in Figure 2, paster LED is when connecing with circuit board 9, and the pin 3 of LED is welded on circuit board 9, and opens taper hole with the liquid heat dissipating housing 1 whole circuit board 9 that embeds at circuit board 9.Circuit board 9 is contained in the airtight cavity of hat of dress cooling fluid 7 in, and the cooling fluid 7 to circuit board 9 heat is entered in the liquid heat dissipating housing 1.For avoiding cooling fluid 7 to leak, establish sealing ring 8. in the liquid heat dissipating housing 1 and the contact position of circuit board 9
Above-mentioned cooling fluid 7 is iknsulating liquids, and it can be insulating radiation liquid such as superconducting fluid, transformer oil, pure water.
During use, the heat that LED produces distributes by the cooling fluid 7 in the airtight cavity of cooling fluid 7 in the brilliant plate 6 that dispels the heat, the liquid heat dissipating housing 1 and device, circuit board 9.
Claims (3)
1. the paster LED of liquid heat radiation, it mainly is made up of pedestal (2), pin (3), rubber base (4), lens (5) and wafer, it is characterized in that: further comprising radiator portion, promptly at the liquid heat dissipating housing (1) of brilliant plate (6) of the heat radiation at LED pedestal (2) back side and the brilliant plate (6) that will dispel the heat encirclement; Described liquid heat dissipating housing (1) is inverted funnel, and liquid heat dissipating housing (1) interior dress cooling fluid (7).
2. the paster LED of liquid heat radiation according to claim 1, it is characterized in that: described paster LED with circuit board (9) when connecing, the pin of LED (3) is welded on circuit board (9), and opens taper hole with the whole circuit board (9) that embeds of liquid heat dissipating housing (1) at circuit board (9); Circuit board (9) is contained in the airtight cavity of adorning cooling fluid (7) in one, and the cooling fluid (7) to circuit board (9) heat is entered in the liquid heat dissipating housing (1); For avoiding cooling fluid (7) to leak, establish sealing ring (8) in the liquid heat dissipating housing (1) and the contact position of circuit board (9).
3. the paster LED of liquid heat radiation according to claim 1, it is characterized in that: described cooling fluid (7) is an iknsulating liquid, it can be insulating radiation liquid such as superconducting fluid, transformer oil, pure water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100529914A CN102169950A (en) | 2011-03-02 | 2011-03-02 | SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100529914A CN102169950A (en) | 2011-03-02 | 2011-03-02 | SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102169950A true CN102169950A (en) | 2011-08-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100529914A Pending CN102169950A (en) | 2011-03-02 | 2011-03-02 | SMD (Surface Mounted Device) LED (Light Emitting Diode) with liquid heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102169950A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030057421A1 (en) * | 2001-09-27 | 2003-03-27 | Tzer-Perng Chen | High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate |
| CN101101948A (en) * | 2007-06-04 | 2008-01-09 | 朱建钦 | A high-power LED luminescent part |
| CN201448619U (en) * | 2009-08-18 | 2010-05-05 | 陕西日升源创能科技有限公司 | Liquid heat radiation LED lamp |
| CN201507809U (en) * | 2009-07-28 | 2010-06-16 | 重庆万道光电科技有限公司 | High-power LED lighting lamp of liquid heat dissipation |
| CN101916821A (en) * | 2010-07-14 | 2010-12-15 | 四川九洲光电科技股份有限公司 | High-power packaged SMD LED (Surface Mounted Device Light-Emitting Diode) with high heat radiation property |
-
2011
- 2011-03-02 CN CN2011100529914A patent/CN102169950A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030057421A1 (en) * | 2001-09-27 | 2003-03-27 | Tzer-Perng Chen | High flux light emitting diode having flip-chip type light emitting diode chip with a transparent substrate |
| CN101101948A (en) * | 2007-06-04 | 2008-01-09 | 朱建钦 | A high-power LED luminescent part |
| CN201507809U (en) * | 2009-07-28 | 2010-06-16 | 重庆万道光电科技有限公司 | High-power LED lighting lamp of liquid heat dissipation |
| CN201448619U (en) * | 2009-08-18 | 2010-05-05 | 陕西日升源创能科技有限公司 | Liquid heat radiation LED lamp |
| CN101916821A (en) * | 2010-07-14 | 2010-12-15 | 四川九洲光电科技股份有限公司 | High-power packaged SMD LED (Surface Mounted Device Light-Emitting Diode) with high heat radiation property |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110831 |