CN102163799A - Coaxial laser device based on semiconductor cooler - Google Patents
Coaxial laser device based on semiconductor cooler Download PDFInfo
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- CN102163799A CN102163799A CN 201110055603 CN201110055603A CN102163799A CN 102163799 A CN102163799 A CN 102163799A CN 201110055603 CN201110055603 CN 201110055603 CN 201110055603 A CN201110055603 A CN 201110055603A CN 102163799 A CN102163799 A CN 102163799A
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- coaxial laser
- printed board
- pin
- heat sink
- semiconductor cooler
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Abstract
The invention relates to a coaxial laser device based on a semiconductor cooler, comprising a cooling base, wherein the cooling base is provided with a semiconductor cooler, a heat sink and a coaxial laser; a printed board is connected with the coaxial laser and the semiconductor cooler; the surface of the coaxial laser is in close contact with the heat sink; a temperature-collecting resistor connected with the printed board is inserted into the heat sink; the semiconductor cooler, the heat sink, the coaxial laser, the printed board and the temperature-collecting resistor are encapsulated in an shell; a part of the tail end of the coaxial laser, which is connected with an optical fiber, extends out of the shell; pins of the printed board extend out of the shell; the coaxial laser and the semiconductor cooler are welded together; the temperature-collecting resistor is inserted into the heat sink so as to accurately collect the temperature of the heat sink; and the base of the shell is connected with the upper cover of the shell by using glues so as to ensure stable and reliable work of the coaxial laser. The coaxial laser device has the advantages of simple structure; and compared with traditional distributed feedback (DFB) lasers, the coaxial laser device has reduced production difficulty and cost, and the thermal stability of the coaxial laser is ensured.
Description
Technical field
The present invention relates to a kind of coaxial laser apparatus of based semiconductor refrigerator, be used for optical communication field.
Background technology
For index and the reliability of developing skill, the CATV(cable TV of optical communication industry) the dish-shaped DFB(distributed Feedback that band freezes has been adopted in the signal transmission more) laser.This butterfly laser manufacturing process complexity, rate of finished products is low, production cost is high, and the consequence that causes is that the optical communication equipment cost is high.Though the nothing of coaxial packaging refrigeration Distributed Feedback Laser cost is lower, unstable properties during work.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of coaxial laser apparatus of based semiconductor refrigerator is provided, can guarantee the stability of coaxial laser.
According to technical scheme provided by the invention, the coaxial laser apparatus of described based semiconductor refrigerator comprises: heat dissipation base, on described heat dissipation base, semiconductor cooler is set, heat sink, coaxial laser, printed board links to each other with semiconductor cooler with coaxial laser, the surface of coaxial laser and heat sink tight the contact, the warm resistance of adopting that links to each other with printed board inserts heat sink, described semiconductor cooler, heat sink, coaxial laser, printed board and Cai Wen resistive seal are cased, the afterbody of coaxial laser connects the part of optical fiber and stretches out shell, and the pin of printed board stretches out shell; Circuit in the printed board comprises first resistance, second resistance, electric capacity and inductance, and the anode of semiconductor cooler is connected with the 6th pin of printed board, and the negative terminal of semiconductor cooler is connected with the 7th pin of printed board; One end of first resistance is connected simultaneously with the 12 pin of printed board, an end of electric capacity, and the negative pole of an end of the other end of first resistance and inductance, the other end of electric capacity, the laser diode in the coaxial laser is connected simultaneously; The other end of inductance is connected with the 3rd pin of printed board; The positive pole of the laser diode in the coaxial laser is connected with the 11 pin of printed board; The positive pole of the diode backlight of coaxial laser is connected with the 4th pin of printed board, and the negative pole of the diode backlight of coaxial laser is connected with the 5th pin of printed board; One end of second resistance is connected with first pin of printed board, and the other end of second resistance is connected with second pin of printed board; The 8th pin of printed board, the 9th pin, the 13 pin are connected to each other.
Described semiconductor cooler and heat dissipation base welding are fixing.Described semiconductor cooler and heat sink welding are fixed.
Describedly have an arc groove on heat sink, coaxial laser embeds in the described arc groove.
Described arc groove is provided with recessed, and described recessed center is provided with circular hole, adopts warm resistance and inserts circular hole.
Described coaxial laser is by anchor ear and heat sink fixing.
Described shell comprises outer casing base and outer casing upper cover, and outer casing base is connected by viscose glue with outer casing upper cover; Outer casing base comprises sidewall and bottom, and the bottom of outer casing base is provided with annular groove, gluing in the annular groove, and gluing rear casing base through screws and heat dissipation base are fixed.
The bottom of described outer casing base also is provided with through hole, and semiconductor cooler passes described through hole and is connected with heat dissipation base.
Advantage of the present invention is: the present invention is simple in structure, and more original Distributed Feedback Laser has reduced production difficulty and cost, has guaranteed the thermal stability of coaxial laser simultaneously.
Description of drawings
The outline drawing of Fig. 1 embodiment of the invention.
The coaxial laser that Fig. 2 is based on semiconductor cooler is packaged into the structural representation of butterfly embodiment.
Fig. 3 is the A-A cutaway view of Fig. 2.
Fig. 4 is the printed circuit board schematic diagram.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
As Fig. 1, shown in 2, this device comprises: heat dissipation base 4, semiconductor cooler 3, heat sink 2, coaxial laser 1 are set on described heat dissipation base 4, printed board 6 links to each other with semiconductor cooler 3 with coaxial laser 1, the surface of coaxial laser 1 closely contacts with heat sink 2, the warm resistance 8 of adopting that links to each other with printed board 6 inserts heat sink 2, described semiconductor cooler 3, heat sink 2, coaxial laser 1, printed board 6 and Cai Wen resistance 8 are encapsulated in the shell 5, the afterbody of coaxial laser 1 connects the part of optical fiber and stretches out shell 5, and the pin 9 of printed board 6 stretches out shell 5.
Described shell comprises outer casing base 5-1 and outer casing upper cover 5-2, and outer casing base 5-1 is connected by viscose glue with outer casing upper cover 5-2; Outer casing base 5-1 comprises sidewall and bottom, and the bottom of outer casing base 5-1 is provided with in first annular groove, 13, the first annular grooves 13 and is used for gluing, and gluing rear casing base 5-1 is fixing by screw and heat dissipation base 4; The bottom of described outer casing base 5-1 also is provided with through hole, and semiconductor cooler 3 passes described through hole and is connected with heat dissipation base 4.
Described heat dissipation base 4 is the guaranteed performance index, adopts copper, and its one side with semiconductor cooler 3 is welded.Outer casing base 5-1, certain airtight for guaranteeing, adopt plastics one compression-molded structures.The another side of semiconductor cooler 3 and heat sink 2 welding are to guarantee good heat-conducting.Coaxial laser 1 is fixing with heat sink 2 by Ω type anchor ear 12, for coaxial laser 1 closely is connected with heat sink 2, heat sink 2 parts that link to each other with coaxial laser 1 have been made particular design, wherein heat sink 2 center is designed to arc groove 10, arc groove 10 both sides have two recessed 11, one of them recessed 11 bottom is established a hole again and is adopted warm resistance 8 in order to insertion, and the pin of coaxial laser 1 and printed board 6 are connected by welding manner, and semiconductor cooler 3 is connected with printed board 6 by lead-in wire.Outer casing upper cover 5-2 links to each other with outer casing base 5-1 by viscose glue, has reached fixed printed board 6 and has guaranteed airtight purpose.
As shown in Figure 3, heat sink 2 is rectangular structure, groove 14 of the facing cut that it is connected with semiconductor cooler 3 becomes the arc groove 10 that matches with coaxial laser 1 surface with the facing cut that is connected of coaxial laser 1, and a circular hole is milled at wherein one recessed 11 center of arc groove 10.Adopt warm resistance 8 and insert this circular hole of welding back insertion, accurately gather heat sink temperature from printed board 6 reverse side.Stretch out shell 5 places at coaxial laser 1 afterbody, and be provided with the second annular groove 13-1, be used for behind the gluing contacting and guarantee air-tightness with coaxial laser 1 at shell 5 inner surfaces.
As shown in Figure 4, circuit in the printed board 6 comprises first resistance R 1, second resistance R 2, capacitor C 1 and inductance L 1, the anode of semiconductor cooler 3 is connected with the 6th pin 6 ' of printed board 6, and the negative terminal of semiconductor cooler 3 is connected with the 7th pin 7 ' of printed board 6; One end of first resistance R 1 is connected simultaneously with the 12 pin 12 ' of printed board 6, an end of capacitor C 1, and the negative pole of an end of the other end of first resistance R 1 and inductance L 1, the other end of capacitor C 1, the laser diode in the coaxial laser 1 is connected simultaneously; The other end of inductance L 1 is connected with the 3rd pin 3 ' of printed board 6; The positive pole of the laser diode in the coaxial laser 1 is connected with the 11 pin 11 ' of printed board 6; The positive pole of the diode backlight of coaxial laser 1 is connected with the 4th pin 4 ' of printed board 6, and the negative pole of the diode backlight of coaxial laser 1 is connected with the 5th pin 5 ' of printed board 6; One end of second resistance R 2 is connected with first pin 1 ' of printed board 6, and the other end of second resistance R 2 is connected with second pin 2 ' of printed board 6; The 8th pin 8 ' of printed board 6, the 9th pin 9 ', the 13 pin 13 ' are connected to each other.Printed board 6 leaves the tenth pin 10 ' and the 14 pin 14 ' is the industry standard that has dish-shaped Distributed Feedback Laser now in order to abide by, the convenient replacement, and the pin setting of printed board 6 and shape adopt other designs also to be fine.
During installation, coaxial laser 1 is connected with printed board 6 and is placed on heat sink 2, semiconductor cooler 3 respectively with heat sink 2, heat dissipation base 4 welding, welding is placed among the outer casing base 5-1.Outer casing base 5-1 places above the heat dissipation base 4 fastening by screw.Adopting warm resistance 8 inserts in heat sink 2 in printed board 6 reverse side welding back.Pin 9 passes from outer casing base 5-1 after being welded in the printed board 6.Outer casing upper cover 5-2 places outer casing base 5-1 to go up by the extruding port and offsets, and provides good assurance to the air-tightness of integral body.
Claims (8)
1. the coaxial laser apparatus of based semiconductor refrigerator, comprise heat dissipation base (4), it is characterized in that: semiconductor cooler (3) is set on described heat dissipation base (4), heat sink (2), coaxial laser (1), printed board (6) links to each other with semiconductor cooler (3) with coaxial laser (1), the surface of coaxial laser (1) closely contacts with heat sink (2), the warm resistance (8) of adopting that links to each other with printed board (6) inserts heat sink (2), described semiconductor cooler (3), heat sink (2), coaxial laser (1), printed board (6) and adopt warm resistance (8) and be encapsulated in the shell (5), the afterbody of coaxial laser (1) connects the part of optical fiber and stretches out shell (5), and the pin (9) of printed board (6) stretches out shell (5); Circuit in the printed board (6) comprises first resistance (R1), second resistance (R2), electric capacity (C1) and inductance (L1), the anode of semiconductor cooler (3) is connected with the 6th pin of printed board (6), and the negative terminal of semiconductor cooler (3) is connected with the 7th pin of printed board (6); One end of first resistance (R1) is connected simultaneously with an end of the 12 pin of printed board (6), electric capacity (C1), and the negative pole of an end of the other end of first resistance (R1) and inductance (L1), the other end of electric capacity (C1), the laser diode in the coaxial laser (1) is connected simultaneously; The other end of inductance (L1) is connected with the 3rd pin of printed board (6); The positive pole of the laser diode in the coaxial laser (1) is connected with the 11 pin of printed board (6); The positive pole of the diode backlight of coaxial laser (1) is connected with the 4th pin of printed board (6), and the negative pole of the diode backlight of coaxial laser (1) is connected with the 5th pin of printed board (6); One end of second resistance (R2) is connected with first pin of printed board (6), and the other end of second resistance (R2) is connected with second pin of printed board (6); The 8th pin of printed board (6), the 9th pin, the 13 pin are connected to each other.
2. the coaxial laser apparatus of based semiconductor refrigerator according to claim 1 is characterized in that described semiconductor cooler (3) is fixing with heat dissipation base (4) welding.
3. the coaxial laser apparatus of based semiconductor refrigerator according to claim 1 is characterized in that described semiconductor cooler (3) is fixing with heat sink (2) welding.
4. the coaxial laser apparatus of based semiconductor refrigerator according to claim 1 is characterized in that having an arc groove (10) on described heat sink (2), and coaxial laser (1) embeds in the described arc groove (10).
5. as the coaxial laser apparatus of based semiconductor refrigerator as described in the claim 4, it is characterized in that described arc groove (10) is provided with recessed (11), described recessed 11 center is provided with circular hole.
6. the coaxial laser apparatus of based semiconductor refrigerator according to claim 1 is characterized in that described coaxial laser (1) is fixing by anchor ear (12) and heat sink (2).
7. the coaxial laser apparatus of based semiconductor refrigerator according to claim 1 is characterized in that described shell comprises outer casing base (5-1) and outer casing upper cover (5-2), and outer casing base (5-1) is connected by viscose glue with outer casing upper cover (5-2); Outer casing base (5-1) comprises sidewall and bottom, and the bottom of outer casing base (5-1) is provided with first annular groove (13), the interior gluing of first annular groove (13).
8. as the coaxial laser apparatus of based semiconductor refrigerator as described in the claim 7, it is characterized in that described
The bottom of outer casing base (5-1) is provided with through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110055603 CN102163799A (en) | 2011-03-09 | 2011-03-09 | Coaxial laser device based on semiconductor cooler |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110055603 CN102163799A (en) | 2011-03-09 | 2011-03-09 | Coaxial laser device based on semiconductor cooler |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102163799A true CN102163799A (en) | 2011-08-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110055603 Pending CN102163799A (en) | 2011-03-09 | 2011-03-09 | Coaxial laser device based on semiconductor cooler |
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| Country | Link |
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| CN (1) | CN102163799A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395123A (en) * | 2001-06-28 | 2003-02-05 | 康宁Oti股份公司 | Optical bench for photoelectric device |
| US20030044128A1 (en) * | 2001-08-29 | 2003-03-06 | Crane Stanford W. | Optoelectronic packaging assembly |
| US20070189677A1 (en) * | 2005-08-12 | 2007-08-16 | Applied Optoelectronics, Inc. | Modular laser package system |
| CN201004104Y (en) * | 2006-12-05 | 2008-01-09 | 深圳新飞通光电子技术有限公司 | Small cooling light radiation component |
| CN201417882Y (en) * | 2009-03-02 | 2010-03-03 | 大连艾科科技开发有限公司 | Two-body type base semiconductor laser |
-
2011
- 2011-03-09 CN CN 201110055603 patent/CN102163799A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1395123A (en) * | 2001-06-28 | 2003-02-05 | 康宁Oti股份公司 | Optical bench for photoelectric device |
| US20030044128A1 (en) * | 2001-08-29 | 2003-03-06 | Crane Stanford W. | Optoelectronic packaging assembly |
| US20070189677A1 (en) * | 2005-08-12 | 2007-08-16 | Applied Optoelectronics, Inc. | Modular laser package system |
| CN201004104Y (en) * | 2006-12-05 | 2008-01-09 | 深圳新飞通光电子技术有限公司 | Small cooling light radiation component |
| CN201417882Y (en) * | 2009-03-02 | 2010-03-03 | 大连艾科科技开发有限公司 | Two-body type base semiconductor laser |
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Application publication date: 20110824 |