CN102159036A - Improvement in rigid double-layer printed circuit board process flow - Google Patents
Improvement in rigid double-layer printed circuit board process flow Download PDFInfo
- Publication number
- CN102159036A CN102159036A CN201010600862XA CN201010600862A CN102159036A CN 102159036 A CN102159036 A CN 102159036A CN 201010600862X A CN201010600862X A CN 201010600862XA CN 201010600862 A CN201010600862 A CN 201010600862A CN 102159036 A CN102159036 A CN 102159036A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- printed circuit
- tin
- copper
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Abstract
The invention discloses an improvement in a rigid double-layer printed circuit board process flow, which relates to a printed circuit board molding process, in particular to a related process for the partial electroplating or coating protection of a printed circuit board. The technical problem to be solved is to avoid the wasting of raw materials in a conventional printed circuit board production process by only electroplating a part of which a copper thickness is required to be increased and adopting an electrophoretic paint as a protective material of a coating instead of tin. Key points of a technical scheme for solving the problem are that: the electroplating is not performed on the whole pattern after a board surface is electroplated, and hole electroplating is performed only on the part of which the copper thickness is required to be increased; and the electrophoretic paint protects the coating instead of the tin. The technical scheme has the advantages of greatly saving the raw materials copper and tin at the same time of ensuring the quality of the printed circuit board, along with a simple technological process.
Description
Technical field: the present invention relates to a kind of moulding process of printed circuit board, the parcel plating technology and the coating protective material that relate in particular to printed circuit board are selected.
Background technology: at present, the production method of known printed circuit board has subraction (subtractive process), addition process (additive process), semi-additive process (semi-additive process).Domestic nearly all printed board enterprise all uses subraction production PCB, and most technological processes of making rigid printed circuit boards are: blanking, and---------------------------welding resistance+character---sprays tin-on off test (E-test)---FQA---finished product to copper facing/tin to graphic plating to photoimaging to panel plating to heavy copper to move back tin to move back film/etching in boring.But traditional handicraft is behind the process panel plating, and it is thick that major part has reached the copper that needs, and it is thick to have only local a little place to need to thicken copper.So the graphic plating technology taked behind the panel plating has caused the waste of copper, tin raw material; In addition, the protection of doing coating with tin also can strengthen production cost.
Summary of the invention: the waste of raw material in the traditional printed circuit board production process; the invention provides a kind of method of improved production printed circuit board; it is thick that this method can not only make each part of circuit board reach the copper that needs on the basis of not wasting, and can effective protective coating.According to the present invention, solve this technical problem the technical scheme that is adopted and be: blanking that------------------plate electrophoretic paint---------welding resistance+character---sprays tin---on off test (E-test)---FQA---finished product to photoimaging to panel plating to heavy copper to move back electrophoretic paint to move back film/etching in the hole in hole platings in boring.The invention has the beneficial effects as follows that technical matters is simple, when guaranteeing the printed circuit board quality, copper, tin greatly can also save material.
Embodiment: (1), selection are through heavy copper, the copper-clad plate piece or the circuit board of panel plating.(2), through after (1) step, the hole is carried out in the thick hole of needs thickening copper electroplates.Need protect with printing ink when carrying out this technology does not need the position that thickeies, and contraposition exposure is then carried out the hole and electroplated.(3), utilize principle of electrophoresis to hole plating electrophoretic paint protective coating.(4), move back film.(5), silk-screen sensitization circuit printing ink.(6), contraposition exposure, develop, etching, the plate face moves back film again.(7), electrophoretic paint is moved back in the hole.
Description of drawings: figure of the present invention (2) improves the technology of mark position among the figure (1).Only changed into by traditional graphic plating the hole is electroplated, when carrying out this step, other positions of plate face must cover printing ink, a small opening; Again to hole plating electrophoretic paint (purpose is the copper on the protection hole); Move back film again; Sensitization silk-screen circuit printing ink (for circuit is protected); Contraposition exposure, develop (expose at unnecessary position, etching, move back film); The plate face moves back film (to the operation of circuit) again, and electrophoretic paint is moved back at the position, hole; Forward subsequent handling again to.
Claims (3)
1. the production technology of a printed circuit board, it comprises electric plating method and to the material of coating protection.Technical characterictic of the present invention is: improved and traditional circuit board carried out plating once more---the graphic plating of whole plate face, but the simple only hole being electroplated, all the other positions then cover with printing ink; Improved that traditional usefulness is zinc-plated utilizes principle of electrophoresis to coating protection, adopted electrophoretic paint to come protective coating.Therefore, adopt this technology to save raw material copper, tin greatly, reduced production cost.
2. printed circuit board according to claim 1 improves technology, it is characterized in that: reduced the plating area, only need thicken the thick hole of copper to the part and electroplate, but not whole plate face is carried out graphic plating.
3. the production technology of printed circuit board according to claim 1 and 2 is characterized in that: changing tin is that electrophoretic paint is protected coating, has reduced cost.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010600862XA CN102159036A (en) | 2010-12-21 | 2010-12-21 | Improvement in rigid double-layer printed circuit board process flow |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010600862XA CN102159036A (en) | 2010-12-21 | 2010-12-21 | Improvement in rigid double-layer printed circuit board process flow |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102159036A true CN102159036A (en) | 2011-08-17 |
Family
ID=44440112
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201010600862XA Pending CN102159036A (en) | 2010-12-21 | 2010-12-21 | Improvement in rigid double-layer printed circuit board process flow |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102159036A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102510671A (en) * | 2011-10-19 | 2012-06-20 | 天津市德中技术开发有限公司 | Method for producing anti-corrosion pattern in production of printed circuit board |
| CN104883820A (en) * | 2015-05-20 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Manufacturing method for external layer line of asymmetric backboard with warped structure |
| CN108811359B (en) * | 2018-07-03 | 2019-11-08 | 刘平 | A kind of two-sided and multilayer printed circuit board production method |
-
2010
- 2010-12-21 CN CN201010600862XA patent/CN102159036A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102510671A (en) * | 2011-10-19 | 2012-06-20 | 天津市德中技术开发有限公司 | Method for producing anti-corrosion pattern in production of printed circuit board |
| CN102510671B (en) * | 2011-10-19 | 2015-12-02 | 天津市德中技术发展有限公司 | A kind of method of producing anti-corrosion pattern in production of printed circuit board |
| CN104883820A (en) * | 2015-05-20 | 2015-09-02 | 深圳崇达多层线路板有限公司 | Manufacturing method for external layer line of asymmetric backboard with warped structure |
| CN104883820B (en) * | 2015-05-20 | 2018-09-04 | 深圳崇达多层线路板有限公司 | A kind of outer-layer circuit production method of the structure asymmetry backboard of warpage |
| CN108811359B (en) * | 2018-07-03 | 2019-11-08 | 刘平 | A kind of two-sided and multilayer printed circuit board production method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100546439C (en) | Electroplating technique for thickening mask hole cuprum of printed circuit board | |
| CN101702869B (en) | Method for directly producing circuit boards from insulated substrate without cladding copper | |
| CN103619125B (en) | A kind of PCB electro-plating method for improving electroplating evenness | |
| CN104105361B (en) | A kind of method of circuit board selective electroplating conductive hole | |
| CN102510671B (en) | A kind of method of producing anti-corrosion pattern in production of printed circuit board | |
| CN104080275B (en) | A kind of preparation method of ladder wiring board | |
| CN101695219A (en) | Selective immersion process of PCB | |
| CN103228112A (en) | Electroless copper plating method for PCBs (printed circuit boards) with high aspect ratios | |
| CN104202922B (en) | Method for manufacturing rigid-flex printed circuit board with rigid areas different in thickness | |
| CN101845625A (en) | Method for chemically plating gold on surface of capacitive touch screen | |
| CN105323958A (en) | Surface-processed copper foil, copper foil with carrier, laminated body, printed circuit board, electronic equipment, manufacturing method for surface-processed copper foil and manufacturing method for printed circuit board | |
| CN101835346A (en) | Nickel-gold electroplating process of PCB | |
| CN102056413B (en) | Method for manufacturing printed circuit board | |
| CN103491710A (en) | Process for processing two-sided and multilayer circuit board | |
| CN101815409A (en) | Method for manufacturing circuit board through injection molding | |
| CN102159036A (en) | Improvement in rigid double-layer printed circuit board process flow | |
| CN101521991B (en) | Manufacturing method of circuit board with selectively plated copper and tin | |
| CN110602893B (en) | Pattern electroplating method capable of repeatedly utilizing plating accompanying plate | |
| KR20120116297A (en) | Manufacturing method of flexible printed circuit board using polyimide ink and polyimide sheet | |
| CN104582297A (en) | Printed circuit selective electroplating addition and preparation technology | |
| CN106169647A (en) | A kind of laser carving gold plating method | |
| CN102647857A (en) | Manufacture process of printed circuit board | |
| CN107545943A (en) | A kind of silver-colored nickel slurry and the method for making printed circuit using silver-colored nickel slurry | |
| CN106211595A (en) | A kind of printed circuit board processing method | |
| CN102703885B (en) | Gold plating process for PCB (Printed Circuit Board) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110817 |