CN102151998A - Method for leveling laser processing crater - Google Patents
Method for leveling laser processing crater Download PDFInfo
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- CN102151998A CN102151998A CN2011100358681A CN201110035868A CN102151998A CN 102151998 A CN102151998 A CN 102151998A CN 2011100358681 A CN2011100358681 A CN 2011100358681A CN 201110035868 A CN201110035868 A CN 201110035868A CN 102151998 A CN102151998 A CN 102151998A
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Abstract
The invention relates to a method for leveling a laser processing crater, which is realized by the following steps: providing a substrate, carrying out laser processing to the surface of the substrate, so that at least one miniature concave hole is formed on the surface of the substrate, wherein at least one bulge is formed on the periphery of an opening of the miniature concave hole; removing the bulge on the periphery of the opening of the miniature concave hole after the laser processing is finished; and leveling the periphery of the miniature concave hole. The method has the beneficial effects that the opportunity of filling the miniature concave hole due to the falling-off of the bulge on the periphery of the miniature concave hole is reduced or particularly avoided, and the substrate is further avoided, for example, after a light guide plate is manufactured, the guide and rotation light performance of the light guide plate is bad; or for example, when a stamping die of the metal material is used for carrying out the stamping work of an optical microstructure pattern to the light guide plate subsequently, an accurate optical microstructure pattern can not be stamped on the surface of the light guide plate; and furthermore, the service life of a stamping die is also improved.
Description
Technical field
The present invention relates to a kind of radium-shine processing volcanic crater, relate in particular to the levelling method at a kind of radium-shine processing volcanic crater.
Background technology
When tradition forms a shrinkage pool utilizing laser beam that one substrate surface is carried out the high temperature bombardment, the slag splash phenomenon of base material will be caused unavoidablely, so that each shrinkage pool place forms outside the volcanic crater (volcano crater) and sees, and meaning promptly forms one or more irregular thrust in the periphery of shrinkage pool.These a little thrusts are for the burden that brings inconvenience on continuous use the after this base material.
For example, when tradition is made optical microstructures on LGP surface, is to utilize laser beam that the coining mould is formed many miniature shrinkage pools, so that utilize this type shrinkage pool slightly on the coining die surface, go out the optical microstructures of correspondence at the surperficial coining of LGP.
Yet, when the coining mould to the LGP coining repeatedly, make miniature shrinkage pool periphery thrust therefore and bending or avalanche and fall in the miniature shrinkage pool and when filling up miniature shrinkage pool, to cause the coining mould intactly coining go out complete optical microstructures pattern, and then cause the deterioration of leading rotary light performance of LGP.
This shows that the structure of above-mentioned coining mould still exists inconvenience and defective, and remains further to be improved.In order to address the above problem, association area is there's no one who doesn't or isn't sought solution painstakingly, but does not see always that for a long time suitable mode finished by development.
Therefore, how to provide the structure that effectively addresses the above problem, avoid reproducing above-mentioned fruit afterwards, real one of the current important research and development problem that belongs to also becomes current association area and needs improved target badly.
Summary of the invention
The technical issues that need to address of the present invention have provided the levelling method at a kind of radium-shine processing volcanic crater, are intended to solve the above problems.
In order to solve the problems of the technologies described above, the present invention realizes by following steps:
One base material is provided;
Radium-shine processing is carried out on surface to this base material, makes the surface of this base material form at least one miniature shrinkage pool, and wherein the opening periphery of this miniature shrinkage pool has at least one thrust; And
After radium-shine completion of processing, remove this thrust of this miniature shrinkage pool opening periphery, the periphery of this miniature shrinkage pool of leveling.
Compared with prior art, the invention has the beneficial effects as follows: can reduce or even avoid the thrust of miniature shrinkage pool periphery to fill up the chance of miniature shrinkage pool because of coming off, and then avoid base material, for example for LGP after completing, cause it to lead the deterioration of rotary light performance; Or base material, when for example LGP being carried out the coining work of optical microstructures pattern, can't go out correct optical microstructures pattern at LGP surface coining for the coining mould of metal material is follow-up, further, also improve the life of product of coining mould.
Description of drawings
Fig. 1 illustrates the flow chart of the levelling method at the radium-shine processing of the present invention volcanic crater.
Fig. 2 illustrates base material of the present invention and reaches the wherein partial enlarged drawing of a miniature shrinkage pool in the schematic diagram of an embodiment.
Fig. 3 illustrates the 3-3 cutaway view of Fig. 2.
Fig. 4 illustrates the thin portion flow chart of step 103 in one first embodiment of Fig. 1.
Fig. 5 A illustrates the operation chart (I) of first embodiment of the invention.
Fig. 5 B illustrates the operation chart (II) of first embodiment of the invention.
Fig. 6 illustrates the thin portion flow chart of step 103 in one second embodiment of Fig. 1.
Fig. 7 illustrates the operation chart of second embodiment of the invention.
Fig. 8 illustrates the thin portion flow chart of step 103 in one the 3rd embodiment of Fig. 1.
Fig. 9 illustrates the operation chart of third embodiment of the invention.
Figure 10 illustrates the thin portion flow chart of step 103 in one the 4th embodiment of Fig. 1.
Figure 11 illustrates the operation chart of fourth embodiment of the invention.
Figure 12 illustrates the thin portion flow chart of step 103 in one the 5th embodiment of Fig. 1.
Figure 13 illustrates the operation chart of fifth embodiment of the invention.
The specific embodiment
Below in conjunction with the accompanying drawing and the specific embodiment the present invention is described in further detail:
The present invention discloses the levelling method at a kind of radium-shine processing volcanic crater, in order to the base material of a plurality of miniature shrinkage pools of a tool to be provided.
The present invention discloses the levelling method at a kind of radium-shine processing volcanic crater, fills up the chance of miniature shrinkage pool because of coming off in order to the thrust that reduces miniature shrinkage pool periphery.
The present invention discloses the levelling method at a kind of radium-shine processing volcanic crater.The method comprises step for a base material is provided, radium-shine processing is carried out on surface to base material, so that the surface of base material forms at least one miniature shrinkage pool, the opening periphery of wherein miniature shrinkage pool has at least one thrust, and after radium-shine completion of processing, remove the thrust of miniature shrinkage pool opening periphery, so that the periphery of the miniature shrinkage pool of leveling.
One of the present invention first embodiment, the step that removes the thrust of miniature shrinkage pool periphery can comprise step for excise the thrust of miniature shrinkage pool periphery by cutter.In changing one of among this first embodiment,, only excise the thrust of the miniature shrinkage pool periphery on the substrate surface by cutter along the direction of parallel substrate surface.During among this first embodiment another changes,,, comprise the thrust of miniature shrinkage pool periphery with the surface of excision base material by the surface that cutter is excluded base material along the direction of parallel substrate surface.Wherein the thickness range on the surface of cutter excision base material is 1 micron-5 microns.And the cutter among this first embodiment is diamond cutter or carbon fiber cutter.
One of the present invention second embodiment, the step that removes the thrust of miniature shrinkage pool periphery can comprise step for corroded the thrust of each miniature shrinkage pool periphery by an acid solution, consequently eliminates the thrust of each miniature shrinkage pool periphery, and wherein base material is a metal module.Specifically, it is that base material is soaked in the phosphoric acid solution that the step that is corroded the thrust of each miniature shrinkage pool periphery by acid solution more comprises step, and wherein the concentration of phosphoric acid solution is 10%.
One of the present invention the 3rd embodiment, the step that removes the thrust of miniature shrinkage pool periphery can comprise step and be the surface of ejection high pressure sand grains with the bump base material.Among this 3rd embodiment, the high pressure sand grains is glass sand, diamond dust, white sand or red sand.Among this 3rd embodiment, the gait of march of high pressure sand grains be the 15-30 meter/minute.Among this 3rd embodiment, the pressure of high pressure sand grains is 0.003-0.3 MPa (MPA).
One of the present invention the 4th embodiment, the step that removes the thrust of miniature shrinkage pool periphery can comprise step for ground the surface of base material by a milling tool.
One of the present invention the 5th embodiment, the step that removes the thrust of miniature shrinkage pool periphery can comprise step for fitted in the surface of base material by a compressing instrument, and the compressing instrument is begun along the surface of the direction compressing base material on the surface of a vertical base material, so that flatten the thrust of each miniature shrinkage pool periphery.
As mentioned above, slag splash phenomenon will be caused unavoidablely because utilize laser beam that substrate surface is carried out the high temperature irradiation, so that forming outside the volcanic crater, each miniature shrinkage pool place sees, to cause the thrust of volcanic crater periphery may drop in the miniature shrinkage pool, and the pressing mold work of unfavorable follow-up base material or influence the optical performance of LGP.
, see also shown in the 1st figure to the 3 figure, the 1st figure illustrates the flow chart of the levelling method at the radium-shine processing of the present invention volcanic crater for this reason.The 2nd figure illustrates base material of the present invention and reaches the wherein partial enlarged drawing of a miniature shrinkage pool 210 in the schematic diagram of an embodiment.The 3rd figure illustrates the 3-3 cutaway view of the 2nd figure.
The invention provides the levelling method at a kind of radium-shine processing volcanic crater, step comprises:
Step (101) provides a base material 100.
In this step, base material 100 is tabular, can for example be a metal die, diffusion barrier sheet or a LGP.Metal die, coining mould for example can be made by materials such as stainless steel, copper, iron or aluminium.LGP is for example by PET (polyethylene Terephthalate, PET), Merlon (polycarbonate, PC) or polymethyl methacrylate (Poly (methyl methacrylate) PMMA) waits transparent material made.
Step (102) is carried out radium-shine processing to the surface 110 of base material 100, so that the miniature shrinkage pool 210 of surface 110 one or more tool crater shapes of formation of base material 100, and wherein the opening periphery of each miniature shrinkage pool 210 has one or more thrust 220 (the 3rd figure).Because the bore tool micron order size of these a little shrinkage pools is so be referred to as miniature shrinkage pool 210.
For example, this step is according to a design, export the surface 110 of a plurality of laser beams respectively by radium-shine generator to base material 100, make laser beam go out many miniature shrinkage pools 210 (the 2nd figure) with fusion in the surface 110 of bombarding base material 100 respectively, this slightly type shrinkage pool 210 form a micropore in the surface 110 of base material 100 and assemble pattern 200.
Step (103) removes the volcanic crater outer rim of each miniature shrinkage pool 210 after radium-shine completion of processing.
Be in this step after radium-shine procedure for processing is finished, utilize the mode of physics or chemistry to remove the thrust 220 of each miniature shrinkage pool 210 opening periphery, so that eliminate the volcanic crater outer rim of each miniature shrinkage pool 210; Even the thrust 220 that removes each miniature shrinkage pool 210 opening periphery is so that the periphery of each miniature shrinkage pool 210 of leveling, even the surface 110 of each miniature shrinkage pool 210 opening periphery of meaning and base material 100 is substantially flush.
In addition, when base material 100 for metal die 130 and after finishing the levelling method at the radium-shine processing of the present invention volcanic crater, wherein a purposes can utilize above-mentioned micropore to assemble pattern 200, to be used for that the surperficial coining of a LGP is gone out an optical texture pattern.When base material 100 is a LGP and behind the levelling method of finishing the radium-shine processing of the present invention volcanic crater, can be mounted in the backlight module and lead rotary light performance to provide.
More disclose the various ways of more embodiment below the present invention with the levelling method of further illustrating the radium-shine processing of the present invention volcanic crater.
See also shown in the 4th figure and the 5A figure, the 4th figure illustrates the thin portion flow chart of step 103 in one first embodiment of the 1st figure.5A figure illustrates the operation chart (I) of first embodiment of the invention.
When the base material 100 of this first embodiment can be a LGP, metal die or a diffusion barrier sheet, in step 103, can comprise step (103A1) particularly and step (103A2) is as follows.
Step (103A1): these a little thrusts 220 that excise miniature shrinkage pool 210 peripheries.
This step can only be excised these a little thrusts 220 of each miniature shrinkage pool 210 periphery by cutter 300 in first embodiment.
This step is under one of first embodiment changes (5A figure), be meant by cutter 300 on the surface 110 of base material 100, direction R1 along the surface 110 of parallel base material 100 slides, and only strikes off these a little thrusts 220 of each miniature shrinkage pool 210 periphery, and does not destroy the surface 110 of base material 100; Preferably, this step can make the surface 110 of miniature shrinkage pool 210 peripheries and base material 100 substantially flush under one of first embodiment changes.
Step (103A2): clean base material 100.
In this step, be the surface 110 by cleaning fluid flushing base material 100, making that the thrust 220, particle or the material that have broken away from the base material 100 are considered to be worth doing can be with cleaning fluid away from base material 100.Cleaning procedure can for example be cleaned for ultrasonic.Cleaning fluid can for example be pure water, alcohol or isopropyl alcohol (IPA) etc.
In addition, see also shown in the 5B figure, 5B figure illustrates the operation chart (II) of first embodiment of the invention.Above-mentioned steps (103A1) is under another changes (5B figure), be meant by the direction R1 of cutter 300 along the surface 110 of parallel base material 100, the outer L in one of surface 110 of excluding base material 100, make cutter to comprise the thrust 220 of each miniature shrinkage pool 210 periphery on it with the surface 110 of removing base material 100 in the lump in order laterally by each miniature shrinkage pool 210; Preferably, it is substantially flush that this another variation can make one of miniature shrinkage pool 210 peripheries and base material 100 new surperficial 120.
Particularly, this another change, outside the cutter 300 excision base materials 100 thickness range of layer L is roughly between 1 micron-5 microns.In addition, described cutter 300 can be a flying shear cutter (Flycut), is that the direction with the surface 110 of vertical base material 100 is an axle, strikes off to rotation the surface 110 of base material 100 or protrudes in the object (thrust 220) on the surface 110 of base material 100.In addition, above-mentioned cutter 300 contains diamond or carbon fiber material, is diamond cutter or carbon fiber cutter.
See also shown in the 6th figure and the 7th figure, the 6th figure illustrates the thin portion flow chart of step 103 in one second embodiment of the 1st figure.The 7th figure illustrates the operation chart of second embodiment of the invention.
When the base material 100 of this second embodiment can be metal die 130, in step 103, can comprise step (103B1) particularly and step (103B2) is as follows.
Step (103B1): corrode these a little thrusts 220 of each miniature shrinkage pool 210 periphery by an acid solution 400, so that eliminate these a little thrusts 220 of each miniature shrinkage pool 210 periphery.
This step can be soaked in metal die 130 one and have in the container 410 of acid solution 400 in a second embodiment, makes this a little thrusts 220 of each miniature shrinkage pool 210 periphery on surface 110 of metal die 130 be etched the back gradually and unlikely so outstanding.Preferably, it is substantially flush that this step can make the surface 110 of miniature shrinkage pool 210 peripheries and metal die 130 in a second embodiment.
For example, acid solution 400 for example is a phosphoric acid solution, the concentration of phosphoric acid solution is 10%, when metal die 130 was soaked in the phosphoric acid solution after 30 minutes, the a little thrusts 220 of this of each miniature shrinkage pool 210 periphery are subjected to the corrosion of phosphoric acid solution gradually and are dissolved in gradually in the acid solution 400, and then break away from metal die 130 surfaces (being the periphery of each miniature shrinkage pool 210).Yet, be the phosphoric acid seasoning liquid though go up employed in the example, operating personnel can change along with the kind difference (as nickel plating, aluminium, copper etc.) of metal die material.
It should be noted that, because Acidity of Aikalinity (pH value), concentration and the setting of time, only can controlling, these a little thrusts 220 of each miniature shrinkage pool 210 periphery are acted on, and roughly break away from the surface of metal die 130 (being the periphery of each miniature shrinkage pool 210), unlikely to metal die 130 the surface or each miniature shrinkage pool 210 within wall cause too major injury.
And operating personnel can select the acid solution 400 of suitable setting according to the unlike material of metal die 130, to remove these a little thrusts 220 of each miniature shrinkage pool 210 periphery.
Step (103B2): clean metal mould 130.
In this step, be surface 110, make that the thrust 220, particle, the material that have broken away from the metal die 130 are considered to be worth doing and acid solution 400 can be with cleaning fluid away from metal die 130 by cleaning fluid flushing metal die 130.Cleaning procedure can for example be cleaned for ultrasonic.Cleaning fluid can for example be pure water, alcohol or isopropyl alcohol (IPA) etc.
See also shown in the 8th figure and the 9th figure, the 8th figure illustrates the thin portion flow chart of step 103 in one the 3rd embodiment of the 1st figure.The 9th figure illustrates the operation chart of third embodiment of the invention.
The base material 100 of this 3rd embodiment can be when LGP, metal die or a diffusion barrier sheet, can comprise step (103C1) particularly and step (103C2) is as follows in step 103.
Step (103C1): ejection high pressure sand grains 510 surfaces, these a little thrusts 220 of each miniature shrinkage pool 210 periphery of flattening thus with bump base material 100.
This step is in the 3rd embodiment, the high pressure sand grains 510 that is sprayed by jetting tool 500 is with these a little thrusts 220 of each miniature shrinkage pool 210 periphery on the surface 110 of bump base material 100, so, these a little thrusts 220 of miniature shrinkage pool 210 peripheries of each of the surface 110 of base material 100 can be by bump and after the flattening and unlikely so outstanding.Preferably, it is substantially flush that this step can make the surface 110 of miniature shrinkage pool 210 peripheries and base material 100 in the 3rd embodiment.
For example, described sand grains can for example be glass sand, diamond dust, white sand or red sand or the like.The gait of march of described high pressure sand grains 510 can for example be the 15-30 meter/minute.The pressure of described high pressure sand grains 510 can for example be 0.003-0.3 MPa (MPA).
It should be noted that, be sprayed at the surface 110 of base material 100 when described high pressure sand grains 510 after, make the surface of base material 100 just can present the project grain shape.Step (103C2): clean base material 100.
In this step, be surface 110, make that the thrust 220, particle, the material that have broken away from the base material 100 are considered to be worth doing or the high pressure sand grains 510 of remnants can be with cleaning fluid away from base material 100 by cleaning fluid flushing base material 100.Cleaning procedure can for example be cleaned for ultrasonic.Cleaning fluid can for example be pure water, alcohol or isopropyl alcohol (IPA) etc.
So, when base material 100 when this embodiment is applied on the LGP, the LGP surface presents the project grain shape just can be provided and form atomizing and handle, the light of failing for homogenising.Similarly, when base material 100 when this embodiment is applied to metal die, can carry out the coining of optical texture pattern to the surface of a LGP, wherein the project grain shape on metal die surface 110 just can make the surface of this LGP form atomizing to handle.
In addition, operating personnel can select suitable jetting tool 500, with these a little thrusts 220 of each miniature shrinkage pool 210 periphery of certain flattening according to the protrusion degree of this a little thrusts 220 of each miniature shrinkage pool 210 periphery.
See also shown in the 10th figure and the 11st figure, the 10th figure illustrates the thin portion flow chart of step 103 in one the 4th embodiment of the 1st figure.The 11st figure illustrates the operation chart of fourth embodiment of the invention.
The base material 100 of this 4th embodiment can be applicable on LGP, metal die or the diffusion barrier sheet, can comprise step (103D1) particularly especially in step 103 and step (103D2) is as follows.
Step (103D1): grind the surface of base material 100, to remove these a little thrusts 220 of each miniature shrinkage pool 210 periphery.
This step can be by a milling tool 600 in the 4th embodiment, and for example abrasive machine gives these a little thrusts 220 of each miniature shrinkage pool 210 periphery worn; Preferably, it is substantially flush that this step can make the surface 110 of miniature shrinkage pool 210 peripheries and base material 100 in the 4th embodiment.
Step (103D2): clean base material 100.
In this step, be the surface 110 by cleaning fluid flushing base material 100, making that the thrust 220, particle or the material that have broken away from the base material 100 are considered to be worth doing can be with cleaning fluid away from base material 100.Cleaning procedure can for example be cleaned for ultrasonic.Cleaning fluid can for example be pure water, alcohol or isopropyl alcohol (IPA) etc.
So, when base material 100 when this embodiment is applied on the LGP, can be provided to form atomizing and handle the light of failing for homogenising after LGP surface is ground.
See also shown in the 12nd figure and the 13rd figure, the 12nd figure illustrates the thin portion flow chart of step 103 in one the 5th embodiment of the 1st figure.The 13rd figure illustrates the operation chart of fifth embodiment of the invention.
The base material 100 of this 4th embodiment can be applicable on LGP, metal die or the diffusion barrier sheet, can comprise step (103E1) particularly especially in step 103 and step (103E2) is as follows.
Step (103E1): these a little thrusts 220 that flatten miniature shrinkage pool 210 peripheries of base material 100 by a compressing instrument 700.
This step is flattened by a compressing instrument 700 these a little thrusts 220 with each miniature shrinkage pool 210 periphery in the 5th embodiment, makes that these a little thrusts 220 of each miniature shrinkage pool 210 periphery can be unlikely so outstanding.
Particularly, the 5th embodiment can fit in the miniature shrinkage pool of base material 100 tools 210 surfaces (the 13rd figure (a)) earlier by a compressing instrument 700, afterwards, make this compressing instrument 700 begin to oppress the surface of base material 100, so that flatten these a little thrusts 220 (the 13rd figure (b)) of these miniature shrinkage pool 210 peripheries along the direction R2 on the surface of a vertical base material 100; Preferably, it is substantially flush that this step can make the surface 110 of miniature shrinkage pool 210 peripheries and base material 100 in the 5th embodiment.
Step (103E2): clean base material 100.
In this step, be the surface 110 by cleaning fluid flushing base material 100, making that the thrust 220, particle or the material that have broken away from the base material 100 are considered to be worth doing can be with cleaning fluid away from base material 100.Cleaning procedure can for example be cleaned for ultrasonic.Cleaning fluid can for example be pure water, alcohol or isopropyl alcohol (IPA) etc.
In sum, because the various embodiments described above all can force these a little thrust 220 unlikely like this giving prominence to of each miniature shrinkage pool 210 periphery, the levelling method at the radium-shine processing of the present invention volcanic crater can reduce or even avoid the thrust 220 of miniature shrinkage pool 210 peripheries to fill up the chance of miniature shrinkage pool 210 because of coming off, and then avoid base material 100, after for example LGP completes, cause it to lead the deterioration of rotary light performance; Or base material 100, for example the coining mould of metal material is follow-up carries out coining when work of optical microstructures pattern to LGP, can't go out correct optical microstructures pattern in LGP surface coining, further, also improves the life of product of coining mould.
The present invention discloses among as above each embodiment; be not in order to limiting the present invention, anyly have the knack of this skill, without departing from the spirit and scope of the invention; when can doing various changes and retouching, so the present invention's protection domain is when looking being as the criterion that the appended claim scope defined.
Claims (13)
1. the levelling method at a radium-shine processing volcanic crater, realize by following steps:
One base material is provided;
Radium-shine processing is carried out on surface to this base material, makes the surface of this base material form at least one miniature shrinkage pool, and wherein the opening periphery of this miniature shrinkage pool has at least one thrust; And
After radium-shine completion of processing, remove this thrust of this miniature shrinkage pool opening periphery, the periphery of this miniature shrinkage pool of leveling.
2. the levelling method at radium-shine processing according to claim 1 volcanic crater, wherein: remove the step of this thrust of this miniature shrinkage pool periphery, comprise: by this thrust of this miniature shrinkage pool periphery of cutter excision.
3. the levelling method at radium-shine processing according to claim 2 volcanic crater, wherein: the step that removes this thrust of this miniature shrinkage pool periphery, more comprise: make this cutter on this substrate surface, direction along parallel this substrate surface slides, only exclude this base material should the surface on this thrust of this miniature shrinkage pool periphery.
4. the levelling method at radium-shine processing according to claim 2 volcanic crater, wherein: the step that removes this thrust of this miniature shrinkage pool periphery, more comprise: make the direction of this cutter along parallel this substrate surface, that excludes this base material should the surface, comprises this thrust of this miniature shrinkage pool periphery with this surface of excising this base material.
5. the levelling method at radium-shine processing according to claim 4 volcanic crater, wherein: this cutter excise this base material should the surface thickness range be 1 micron-5 microns.
6. the levelling method at radium-shine processing according to claim 1 volcanic crater, wherein: remove the step of this thrust of this miniature shrinkage pool periphery, comprise: this base material is a metal module, is corroded this thrust of this miniature shrinkage pool periphery by an acid solution.
7. the levelling method at radium-shine processing according to claim 6 volcanic crater, wherein: remove the step of those thrusts of each those miniature shrinkage pool periphery, more comprise: this base material is immersed in the phosphoric acid solution, and the concentration of this phosphoric acid solution is 10%.
8. the levelling method at radium-shine processing according to claim 1 volcanic crater, wherein: remove the step of this thrust of this miniature shrinkage pool periphery, comprise: ejection high pressure sand grains is to clash into the surface of this base material.
9. the levelling method at radium-shine processing according to claim 8 volcanic crater, wherein: this high pressure sand grains is glass sand, diamond dust, white sand or red sand.
10. the levelling method at radium-shine processing according to claim 8 volcanic crater, wherein: the gait of march of this high pressure sand grains be the 15-30 meter/minute.
11. the levelling method at radium-shine processing according to claim 1 volcanic crater, wherein: the pressure of this high pressure sand grains is 0.003-0.3 MPa (MPA).
12. the levelling method at radium-shine processing according to claim 1 volcanic crater, wherein: remove the step of this thrust of this miniature shrinkage pool periphery, comprise: the surface of grinding this base material by a milling tool.
13. the levelling method at radium-shine processing according to claim 1 volcanic crater, wherein: remove the step of this thrust of this miniature shrinkage pool periphery, comprise: the surface that fits in this base material by a compressing instrument; And make this compressing instrument begin to oppress the surface of this base material, so that flatten this thrust of this miniature shrinkage pool periphery along the direction on the surface of vertical this base material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100358681A CN102151998A (en) | 2011-02-10 | 2011-02-10 | Method for leveling laser processing crater |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100358681A CN102151998A (en) | 2011-02-10 | 2011-02-10 | Method for leveling laser processing crater |
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| CN102151998A true CN102151998A (en) | 2011-08-17 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1579697A (en) * | 2003-08-07 | 2005-02-16 | 鸿富锦精密工业（深圳）有限公司 | Laser working method |
| JP2007152374A (en) * | 2005-12-02 | 2007-06-21 | Fuji Electric Device Technology Co Ltd | Through-hole forming method for ferrite plate |
| US20080067157A1 (en) * | 2006-09-14 | 2008-03-20 | Disco Corporation | Via hole forming method |
| JP2010125466A (en) * | 2008-11-26 | 2010-06-10 | Aru Techno:Kk | Method of manufacturing plate with extremely small perforation worked therein |
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2011
- 2011-02-10 CN CN2011100358681A patent/CN102151998A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1579697A (en) * | 2003-08-07 | 2005-02-16 | 鸿富锦精密工业（深圳）有限公司 | Laser working method |
| JP2007152374A (en) * | 2005-12-02 | 2007-06-21 | Fuji Electric Device Technology Co Ltd | Through-hole forming method for ferrite plate |
| US20080067157A1 (en) * | 2006-09-14 | 2008-03-20 | Disco Corporation | Via hole forming method |
| JP2010125466A (en) * | 2008-11-26 | 2010-06-10 | Aru Techno:Kk | Method of manufacturing plate with extremely small perforation worked therein |
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Application publication date: 20110817 |