CN102110665A - 流体冷却式散热器 - Google Patents

流体冷却式散热器 Download PDF

Info

Publication number
CN102110665A
CN102110665A CN2010105859263A CN201010585926A CN102110665A CN 102110665 A CN102110665 A CN 102110665A CN 2010105859263 A CN2010105859263 A CN 2010105859263A CN 201010585926 A CN201010585926 A CN 201010585926A CN 102110665 A CN102110665 A CN 102110665A
Authority
CN
China
Prior art keywords
cooling fluid
cooling
fluid
radiator
fins
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010105859263A
Other languages
English (en)
Chinese (zh)
Inventor
安达昭夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of CN102110665A publication Critical patent/CN102110665A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN2010105859263A 2009-12-25 2010-12-08 流体冷却式散热器 Pending CN102110665A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-294937 2009-12-25
JP2009294937A JP2011134978A (ja) 2009-12-25 2009-12-25 流体冷却式ヒートシンク

Publications (1)

Publication Number Publication Date
CN102110665A true CN102110665A (zh) 2011-06-29

Family

ID=44174779

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010105859263A Pending CN102110665A (zh) 2009-12-25 2010-12-08 流体冷却式散热器

Country Status (2)

Country Link
JP (1) JP2011134978A (https=)
CN (1) CN102110665A (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109640601A (zh) * 2019-01-31 2019-04-16 英特换热设备(浙江)有限公司 一种用介质冷却的散热器，以及具有该散热器的空调变频器、电子设备
CN111182769A (zh) * 2020-01-15 2020-05-19 盐城工业职业技术学院 一种用于电子仪器仪表的温度补偿散热装置
CN112344781A (zh) * 2019-08-06 2021-02-09 波音公司 用于感应焊接的散热器和形成散热器的方法
CN117878078A (zh) * 2024-01-19 2024-04-12 派德芯能半导体(上海)有限公司 液冷散热器

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101314723B1 (ko) 2011-07-27 2013-10-08 주식회사 글로벌스탠다드테크놀로지 공정냉각시스템용 열교환기
JP2015038903A (ja) * 2011-11-04 2015-02-26 アイシン・エィ・ダブリュ株式会社 半導体モジュール
JP6911816B2 (ja) * 2018-06-19 2021-07-28 株式会社豊田中央研究所 熱交換器
CN119009540B (zh) * 2024-10-25 2024-12-17 浙江合丰科技有限公司 一种新能源汽车连接器

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11126870A (ja) * 1997-10-21 1999-05-11 Denso Corp フィン一体型放熱板及びその製造方法
JP2003008264A (ja) * 2001-06-26 2003-01-10 Nissan Motor Co Ltd 電子部品の冷却装置
CN101473432A (zh) * 2006-06-14 2009-07-01 丰田自动车株式会社 散热装置以及冷却器
CN101578701A (zh) * 2007-01-11 2009-11-11 丰田自动车株式会社 半导体元件的冷却构造

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60139182U (ja) * 1984-02-23 1985-09-14 三菱自動車工業株式会社 熱交換装置
WO2002092659A1 (en) * 2001-05-14 2002-11-21 Vantico Ag Moulding composition for producing bipolar plates
JP2004128439A (ja) * 2002-08-07 2004-04-22 Fuji Electric Fa Components & Systems Co Ltd 発熱体冷却装置
JP2005136278A (ja) * 2003-10-31 2005-05-26 Mitsubishi Electric Corp パワー半導体モジュール及びその製造方法
JP4777264B2 (ja) * 2007-01-11 2011-09-21 株式会社ティラド フィンタイプ液冷ヒートシンク
JP2008288330A (ja) * 2007-05-16 2008-11-27 Toyota Motor Corp 半導体装置
JP4989574B2 (ja) * 2008-07-10 2012-08-01 株式会社日本自動車部品総合研究所 半導体素子冷却用ヒートシンク

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11126870A (ja) * 1997-10-21 1999-05-11 Denso Corp フィン一体型放熱板及びその製造方法
JP2003008264A (ja) * 2001-06-26 2003-01-10 Nissan Motor Co Ltd 電子部品の冷却装置
CN101473432A (zh) * 2006-06-14 2009-07-01 丰田自动车株式会社 散热装置以及冷却器
CN101578701A (zh) * 2007-01-11 2009-11-11 丰田自动车株式会社 半导体元件的冷却构造

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109640601A (zh) * 2019-01-31 2019-04-16 英特换热设备(浙江)有限公司 一种用介质冷却的散热器，以及具有该散热器的空调变频器、电子设备
CN112344781A (zh) * 2019-08-06 2021-02-09 波音公司 用于感应焊接的散热器和形成散热器的方法
CN111182769A (zh) * 2020-01-15 2020-05-19 盐城工业职业技术学院 一种用于电子仪器仪表的温度补偿散热装置
CN117878078A (zh) * 2024-01-19 2024-04-12 派德芯能半导体(上海)有限公司 液冷散热器

Also Published As

Publication number Publication date
JP2011134978A (ja) 2011-07-07

Similar Documents

Publication Publication Date Title
CN102110665A (zh) 流体冷却式散热器
CN112840497B (zh) 用于车辆电池模块的蛇形逆流冷却板
CN102136461A (zh) 液体冷却式散热器
CN110164835B (zh) 一种歧管式复杂结构微通道微型散热器
US8472193B2 (en) Semiconductor device
JP5769834B2 (ja) 液冷式冷却器
WO2012147544A1 (ja) 半導体モジュール用冷却器及び半導体モジュール
JP2008171840A (ja) 液冷ヒートシンクおよびその設計方法
CN105308739A (zh) 液冷散热器
JP7091103B2 (ja) 冷却装置
JP2016207928A (ja) 複数の発熱部品を冷却するヒートシンク
CN112015253A (zh) 一种液冷板散热器和计算设备
CN114615866A (zh) 液冷板及电子设备
GB2582653A (en) Cooling arrangement
CN213340362U (zh) 一种新能源汽车半导体器件液冷散热器
CN114828598A (zh) 液冷散热器、电驱控制器和汽车
JP2016015381A (ja) コールドプレート
CN221766007U (zh) 一种液冷机箱及液冷服务器
CN115279111A (zh) 液冷板及散热设备
JP2019114682A (ja) 液冷式冷却装置
JP2019054224A (ja) 液冷式冷却装置
JP2008235572A (ja) 電子部品冷却装置
CN111366020A (zh) 一种扩展水冷式热管散热器
JP2005011928A (ja) 液冷循環システム
JP2020004766A (ja) 冷却器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20110629