CN102096216A - Mounting device and mounting method of flat-panel display - Google Patents

Abstract

The invention provides a mounting device and a mounting method of a flat-panel display. With the method, electronic parts can be stably pasted by an anisotropic conductive film (ACF) which approaches the edge of an electronic part and is cut in a manner that the ACF is a litter longer than the edge of the electronic part. The ACF pasting device (132) of a flat-panel display (FPD) comprises a temporary pasting component of a tape automated boding (TAB) sucker component (20), a notch component with a notch (30) and a peeling component with a recovery reel (6). The temporary pasting component is used for temporarily pasting a TAB (1) to an ACF layer (2a) of an ACF ribbon (2). The notch component is used for cutting a notch on the ACF layer (2a) which is temporarily pasted with the TAB (1). The peeling component is used for peeling a basal membrane (2b) of the ACF ribbon (2) which has a notch on the ACF layer (2a).

Description

The erecting device of flat-panel monitor and installation method

Technical field

The present invention relates to a kind of LCD, organic EL (Electro-luminescence: electroluminescence) erecting device and the installation method of the flat-panel monitor of display, plasma display etc. (FPD:Flat Panel Display).

Background technology

(Flexible Printed Circuit: FPC) etc. TAB (Tape Automated Bonding: the automatic coating technique of coil type crystal grain, i.e. tape aotomated bonding) connects to have carried out installation, COF (Chip on Film: make the packaged chip carrier with FPC chip is engaged the assembly that is formed by connecting with the FPC circuit), the FPC of drive IC at the periphery of the display base plate of FPD.In addition, the periphery at display base plate for example also is equipped with PCB (Print Circuit Board: etc. peripheral substrate printed-wiring board (PWB)).

Display base plate assembled line is by carry out the next device that drive IC, TAB and PCB etc. are installed at the periphery of this substrate of a plurality of treatment components in order on display base plate such as the FPD of liquid crystal, plasma etc.Below, only be called for short display base plate and be " substrate ", other substrate, for example PCB then clearly remembers work " PCB substrate "

As an example of the treatment process of display base plate assembled line, the cleaning terminal operation of TAB paste section of (1) cleaning substrate end and the ACF operation that anisotropic conductive film (ACF:Anisotropic Conductive Film) is pasted in (2) substrate end after cleaning are arranged.In addition, also have (3) on the position of the stickup ACF of substrate, locate and installation procedure and (4) that TAB, IC be installed add thermo-compressed to mounted TAB, IC, fix the crimping process of above-mentioned TAB, IC by ACF.In addition, the PCB operation that also has (5) to paste, the PCB substrate of having pasted ACF in advance is installed to the side opposite of TAB with substrate-side.The PCB operation is made of a plurality of operations.

As long as ACF is sticked on a certain side in the member that will engage in advance.That is, in other examples of above-mentioned ACF operation, ACF sticks on the side that TAB, IC are installed in advance.On display base plate assembled line, correspondingly need to make the treating apparatus etc. of substrate rotation with the number on the limit of substrate to be processed, the number of packages of TAB to be processed, IC, the number of each treating apparatus etc.

By through a series of like this operation, the electrode on the substrate and be located at thermo-compressed between the electrode on TAB, the IC etc., by the conductive particle of ACF inside, two electrodes are electrically connected.In addition, after crimping process finished, because the sclerosis of ACF substrate resin, therefore when two electrodes were electrically connected, substrate and TAB, IC etc. went back mechanical connection.

Usually, when the TAB that install, the increase of IC number, the stickup number of ACF also increases.Though also exist ACF is made the method that long single sheet shaped piece is pasted, owing to the ACF that sticks on the part that TAB, IC are not installed is wasted, so not preferred this method.In addition, under the situation that TAB, IC are installed in order, also can in the crimping process that makes the ACF sclerosis (formal crimping process), adopt the method that TAB, the IC that forms a line is added together thermo-compressed.

At this, the electronic component that is known as TAB is not equal according to its concrete shape, part thickness, is called as TCP (Tape Carrier Package: tape carrier package), or be called as COF (Chip On Film) in the present invention.These TCP, COF are after having the FPC (Flexible Printed Circuit) that has carried out wiring on the long polyimide film of sprocket hole to go up the IC chip is installed, and cut that this FPC forms, and do not have difference installing.In addition, according to the difference of the design of display base plate, the FPC that does not have the IC chip only is installed also sometimes.Install in the assembly process at FPD,, in the present invention it is called TAB because these parts substantially do not have difference.

In advance ACF is pasted the TAB side, will be pasted with the mode that the TAB of ACF is installed on the display base plate again and for example in patent documentation 1, disclose.But, in patent documentation 1, do not have record about ACF being pasted the mechanism on the TAB.In addition, in patent documentation 2, disclose the length that only epilamellar ACF unification is cut into regulation, paste the mode that TAB went up and peelled off basement membrane afterwards.

Patent documentation 1: Japanese kokai publication hei 4-352442 communique

Patent documentation 2: Japanese kokai publication hei 7-74208 communique

At this, the characteristic aspect of ACF, elongation becomes problem easily.ACF is approximately the PET of 30 μ m at thickness, and (polyethylene Terephthalate: polyethylene terephthalate) ACF that applied thickness is approximately 30 μ m on Zhi the basement membrane forms, and is supplied with by spool.Therefore, even if in order to obtain ACF and adopt hemisect processing etc. on ACF, to cut out breach in advance by the Len req cutting, also can be owing to elongation of basement membrane etc. produces error on the length of ACF.Wherein, be to instigate on the ACF layer to cut out otch in this hemisect of mentioning processing, base membrane layer is not cut off fully but keep successional otch processing.

From the installation assembly process of the FPD that brought into use in the past, paste the ACF that leaves the cutting of surplus ground in the FPD of glass display base plate side in advance, locate, paste TAB afterwards.Therefore, the hemisect of ACF precision at interval need not be high precision.But, when the TAB side was pasted ACF, following problem appearred easily.

At first, in the stickup length of ACF than the width of TAB in short-term, the peel strength after TAB pastes is low.This is because under the effect of the external force of wanting to peel off TAB, stress concentrates on the starting point of the ACF between glass display substrate and the TAB.Therefore, the stickup length of ACF than the width peel strength in short-term of TAB than make ACF exceed TAB some and a little less than the peel strength when making the outer rim of TAB be absorbed among the ACF.

On the other hand, when ACF was also longer than TAB, the reliability of peeling off basement membrane was low.As above-mentioned illustrated because ACF and basement membrane all are thin and soft resin molding, therefore when peeling off the ACF that is pasted on more securely on the TAB from basement membrane, need be to peel off with respect to the mode of ACF warpage basement membrane.At this moment, if the long then stress of ACF concentrates on the intersection at the junction surface of ACF and TAB, thereby, be attached to the such problem of basement membrane side even being formed with hemisect on ACF also occurs ACF easily and stripped down from TAB.

In addition, because unhardened ACF is soft, therefore exceed the long easy warpage of ACF of part of TAB.As a result, promptly allow to ACF is successfully stripped down from basement membrane, with TAB when display base plate is pasted, ACF may bending be pasted together overlappingly.

Like this, when ACF is longer than TAB, go wrong easily when peeling off basement membrane and when pasting TAB, more in short-term, TAB is stripped from probably in use at ACF.In addition, adjust Cutting Length, also because the paste position of ACF produces error, so be difficult to the ACF of hemisect processing is stably sticked on the TAB even consider the elongation of ACF.

Summary of the invention

The objective of the invention is to, present situation in view of above-mentioned conventional art, provide a kind of can by make ACF near the edge of electronic component (TAB), cut into the mode that only grows a bit, stably paste the erecting device and the installation method of the flat-panel monitor of electronic component (TAB).

In order to solve above-mentioned problem, reach purpose of the present invention, the erecting device of flat-panel monitor of the present invention comprises interim stickup parts, otch parts and peeling member.The interim parts of pasting are used for pasting electronic component to the ACF layer of ACF band temporarily.The otch parts are used for cutting out otch being pasted with on the ACF layer of electronic component temporarily, and peeling member is used to peel off the basement membrane of the ACF band that is cut with otch on the ACF layer.

In addition, the installation method of flat-panel monitor of the present invention has interim stickup operation, otch operation and stripping process.Paste in the operation interim, utilize the interim parts of pasting to paste electronic component temporarily to the ACF layer of ACF band.In the otch operation, utilize the otch parts to cut out otch being pasted with on the ACF layer of electronic component temporarily, in stripping process, the basement membrane of the ACF band that utilizes peeling member to peel off on the ACF layer, to be cut with otch.

Adopt the erecting device and the installation method of flat-panel monitor of the present invention,, can carry out the hemisect processing of ACF, therefore have the stable advantage of stickup that can realize ACF near the outside the outer rim of electronic component when electronic component (TAB) is pasted ACF.In addition and since make ACF near electronic component be configured, and have the advantage that can not utilize ACF lavishly.

Description of drawings

Fig. 1 is the level layout (Floor Layout) of integral body of installation assembly line of the FPD of expression the 1st embodiment of the present invention.

(a) of Fig. 2 is the vertical view of expression the 1st embodiment of the present invention, and (b) of Fig. 2 is the front view of expression the foregoing description

(a) of Fig. 3 is the vertical view of expression the 2nd embodiment of the present invention, and (b) of Fig. 3 is the front view of expression the 2nd embodiment.

(a) of Fig. 4 is the vertical view of expression the 3rd embodiment of the present invention, and (b) of Fig. 4 is the front view of expression the 3rd embodiment.

(a) of Fig. 5 is the vertical view of expression the 4th embodiment of the present invention, and (b) of Fig. 5 is the front view of expression the 4th embodiment.

(a) of Fig. 6 is the vertical view of expression the 5th embodiment of the present invention, and (b) of Fig. 6 is the front view of expression the 5th embodiment.

Fig. 7 is the front view of expression the 6th embodiment of the present invention.

Fig. 8 is the front view of expression the 7th embodiment of the present invention.

(a) of Fig. 9 is the vertical view of expression the 8th embodiment of the present invention, and (b) of Fig. 9 is the front view of expression the 8th embodiment.

Embodiment

Below, with reference to Fig. 1～Fig. 9 to being used to implement the erecting device of flat-panel monitor and the mode of installation method describes.Wherein, in each figure, identical components is marked same Reference numeral.

1. the 1st embodiment

FPD installs assembly line

At first, with reference to Fig. 1 the FPD as the erecting device of flat-panel monitor being installed assembly line describes.

As shown in Figure 1, install in the assembly line 200, move into the display base plate 100 of FPD from the left side at FPD, Yi Bian utilize conveying device 110 to carry each unit in turn along the arrow directions X, Yi Bian through installation procedure.This FPD installs assembly line 200 and comprises the installation unit 130A of cleaning end subelement 120, source side and the installation unit 130B of gate electrode side.In addition, FPD installation assembly line 200 also comprises the formal crimping unit 140A of source side, the formal crimping unit 140B and the PCB installation unit 150 of gate electrode side.

In cleaning end subelement 120, the cleaning head 121 that is used for the portion of terminal of the display base plate 100 that wiping moved into is installed in guide rail 122, one side 121 pairs of display base plates 100 of this cleaning head to carry out the mounting terminal place carry out the wiping cleaning.

Then, utilize the installation unit 130A of source side that the TAB of source side is installed.TAB supplies with long spool state, by 131 punchings of TAB punching unit TAB is divided into each monomer.Afterwards, utilize AC F sticker 132, the mounting terminal side of ACF course TAB is pasted, afterwards basement membrane is peeled off.Peel off the TAB that is through with and be delivered to installation head 134 via shifting apparatus 133.Installation head 134 is heating and pressurizing heads, is used for successively to the installation of the source electrode limit of display base plate 100, interim crimping TAB.

Afterwards, utilize the TAB of 141 pairs of source side of formal crimp head of formal crimping unit 140A of source side and the crimping of display base plate 100 partly to carry out heating and pressurizing, thereby finish the installation assembling of the TAB of source side.

Then, utilize the installation unit 130B of gate electrode side that the TAB of gate electrode side is installed, utilize the formal crimping unit 140B of gate electrode side that the TAB of gate electrode side and the crimping of display base plate 100 are partly carried out heating and pressurizing, because gate electrode side is present in the right and left of display base plate 100, therefore carry out twice formal crimping.Therefore, at FPD the formal crimping unit 140B that is provided with two gate electrode side in the assembly line 200 is installed.

Afterwards, utilize PCB installation unit 150 to a side connection PCB substrate opposite with the TAB1 of source side.In PCB installation unit 150, by PCB feedway 151 utilize pallet with the PCB substrate that is supplied to singly to the left and right ACF sticker 152 supply with, paste ACF.Utilize shifting apparatus 153 to about formal pressure contact portion 154, to dispose two ACF of meter and paste the PCB substrate that finishes.Then, carry out pressurized, heated together by about 154 pairs two PCB substrates of formal pressure contact portion, and the TAB of a plurality of source side is connected with two PCB substrates.

The ACF sticker

Then, with reference to Fig. 2 major part ACF sticker 132 of the present invention and step from ACF sticker 132 to TAB stickup ACF layer that utilize are described.

TAB1 shown in Figure 2 is provided with the P.e.c. that is made of Copper Foil and the TAB part that the IC chip forms is installed on polyimide film.The IC chip is installed near the central authorities of TAB1, P.e.c. is arranged on the rear side of TAB1, in Fig. 2, for easy and omitted the diagram of IC chip, P.e.c..In addition, in (a) of Fig. 2, the outer lead terminal is located on (paper side among the figure) edge, the outside and inboard edge of the rear side of TAB1.ACF sticker 132 is used for pasting ACF layer 2a to the outer lead part in the outer part of TAB1.

ACF is with 2 by being that coating ACF layer 2a forms on the one side of 35 μ m, wide banded PET system basement membrane 2b for 1.2mm at thickness, is that the inboard is wrapped on the supply spool 3 and supplies with ACF layer 2a.

Supply spool 3 is exported ACF and is with 2 by output motor (not shown) control output length and output speed.ACF is influenced by the surplus of the band of supply spool 3 with 2 output quantity, therefore utilize flanged deflector roll 4 to measure output quantity.Usually, when the output quantity that band is advanced manages, be provided with the pinch roll that the surface is a rubber, come by pressure zone so that band does not slide in the mode relative with deflector roll 4.Yet, in this example,, therefore do not use pinch roll because ACF layer 2a has viscosity.

ACF is with 2 to utilize deflector roll 4 to change direction, and the assigned position on ACF platform 10 is carried.ACF platform 10 be the surface through level and smooth accurately machined stainless steel component, carried out fluororesin processing on the surface in the zone relative with the TAB sucker parts 20 that are built-in with well heater.Thus, exceed ACF layer 2a beyond the basement membrane 2b can fixed bonding on ACF platform 10.

The TAB sucker parts 20 that utilization is built-in with well heater are carried TAB1 and this TAB1 are pressed into the ACF that extends along ACF platform 10 with on 2 the ACF layer 2a.At this, TAB sucker parts 20 are examples of interim stickup parts of the present invention, have the pore that is used for vacuum suction TAB1 on it.

TAB sucker parts 20 be built-in with well heater with ACF with 2 relative parts, TAB1 for example is heated to 70～90 ℃.Under this state, TAB sucker parts 20 are pushed downwards so that ACF is for example applied the mode of the pressure of 2MPa with 2 surface.The surface temperature of the TAB1 of this moment and suitably set according to the characteristic of employed ACF with 2 applied pressures to ACF.

Afterwards, Tab sucker parts 20 are opened vacuum cup, and TAB1 is positioned on the TAB platform 12.Thus, TAB1 is pasted on ACF with on 2 the ACF layer 2a temporarily, pastes operation temporarily and finishes.TAB platform 12 is belt conveyor that two ends have cylinder (not shown), is controlled operational throughput and the transporting velocity of TAB1 by the cylinder at two ends.

Utilize the conveying of TAB platform 12 and synchronously be with 2, will carry the amount of 1 spacing from the TAB1 that TAB sucker parts 20 are decontroled from supplying with the ACF that spool 3 sends with this conveying.This 1 spacing has avoided ACF with 2 waste, basement membrane 2b can be peeled off reliably, and for unnecessary ACF layer 2a when TAB1 is installed can not bend, this 1 spacing is only a little long than the width of TAB1.It is short more that ACF exceeds the length of TAB1 with 2, just can make peeling off of basement membrane 2b stable more, but in order stably to carry out following hemisect processing, this length can not be 0.

For example, if TAB1 disposes conveying with the interval of 0.5mm, then can utilize cutting knife 30 on the ACF layer 2a between adjacent TAB1, to cut out otch.Particularly, be installed on the cutting knife 30 on the underarm 31 is pressed ACF platform 10 by ACF cutter unit 32 (with reference to (a) of Fig. 2) 20～30 μ m places, surface.Thus, be with at ACF and carry out hemisect processing on 2, and the otch operation finishes.At this moment, ACF is with 2 to be that ACF layer 2a is cut off and basement membrane 2b maintains successional state.

Like this, cutting knife 30, last underarm 31 and ACF cutter unit 32 are an example of otch parts of the present invention.

Inlayed the high speed tool steel of cure process in its surface for the part of carrying out hemisect processing that makes ACF platform 10 is wear-resistant.This high speed tool steel can be changed after wearing and tearing,

By TAB platform 12 and ACF with 2 conveying and the TAB1 that is sent be sent to be located at ACF platform 10 ends hold up 11, by peeling off the whole surface of sucker 40 vacuum suction.What this peeled off that sucker 40 had is not common vacuum suction hole, but the suction tray that constitutes by porous ceramic, vacuum suction TAB1 reliably.

Be about to be suspended to when holding up on 11 in hemisect place, the TAB1 of being stripped from sucker 40 absorption is by to pull out with the synchronous left of speed in Fig. 2 of 2 transporting velocity with ACF.Thus, basement membrane 2b is stripped from, and stripping process finishes.At this moment, utilize and hold up 11 acute angle portion handle basement membrane 2b on one side, on one side basement membrane 2b is stripped down from TAB1, so basement membrane 2b peels off with being stabilized.

Particularly near the left part that becomes the TAB1 that peels off starting point (end of the front side of direct of travel), on ACF layer 2a, carry out hemisect processing in advance, and obtained the starting point peeled off easily.Even if just in case second phase is bonding again across the adjacent ACF layer 2a of hemisect part, than the ACF layer 2a of the forward side of hemisect part also since before peel off and pullled left in Fig. 2, the direction that quilt is pullled is different with basement membrane 2b direction, so peel off easily.

The basement membrane 2b of being stripped from batches with the operational throughput of regulation, the transporting velocity of regulation by flanged deflector roll 4 with by the pinch roll 5 that rubber processing forms, and batches and reclaims on the spool 6.Therefore at this, pinch roll 5 batches the basement membrane 2b that loses ACF layer 2a, does not worry can adhering to ACF layer 2a on the surface of pinch roll 5 and contaminated.

Like this, reclaim spool 6, hold up 11 and peel off the example that sucker 40 becomes peeling member of the present invention.

More than, utilize Fig. 1 and Fig. 2 that the 1st embodiment of the present invention is illustrated, but can also applying flexibly its aim, the present invention makes following distortion.

2. the 2nd embodiment

The ACF sticker

Then, with reference to Fig. 3 the 2nd embodiment of major part ACF sticker of the present invention is described.

The ACF sticker 132 (with reference to Fig. 2) of ACF sticker 132A shown in Figure 3 and the 1st embodiment has same structure.The difference of this ACF sticker 132A and ACF sticker 132 is also to be provided with interim compression bonding apparatus 50 except TAB sucker parts 20.

TAB sucker parts 20 are other examples of interim stickup parts of the present invention with interim compression bonding apparatus 50.Interim compression bonding apparatus 50 carries out heating and pressurizing by TAB sucker parts 20 TAB1 being pressed into after ACF is with on 2 to this TAB1.Thus, the heating and pressurizing of appending by interim compression bonding apparatus 50 can access following operation, that is, TAB sucker parts 20 as long as the short time to the TAB1 pressurization, can stand degree that ACF2a the is peeled off operation of crimping temporarily reliably.

In this embodiment, owing to can shorten time of the heating and pressurizing of TAB sucker parts 20, so the replacing of TAB1, carry and in the time of interim crimping time, to carry out.Can carry out the stickup of ACF layer 2a and peeling off of basement membrane 2b more reliably when as a result, improving assembling rhythm.

3. the 3rd embodiment

The ACF sticker

Then, with reference to Fig. 4 the 3rd embodiment of major part ACF sticker of the present invention is described.

ACF device 132B shown in Figure 4 has the same structure of ACF sticker 132 (with reference to Fig. 2) with the 1st embodiment.The difference of this ACF sticker 132B and ACF sticker 132 is that TAB platform 12 is carried for the walking ladder type (walking ladder) of using two rotating ladders (ladder) 12a, 12b.

In the ACF of the 1st embodiment sticker 132, carrying the TAB platform 12 of TAB1 is belt conveyor.Yet in order stably to carry out the conveying action of prescribed distance, the back side of vacuum suction TAB1 is better.Therefore, as shown in Figure 4, in ACF sticker 132B, adopted the walking ladder type of using two rotating ladder 12a and 12b to carry.Therefore in this case, can be provided with vacuum suction hole (not shown) on the surface of rotating ladder 12a, 12b, have the TAB1 of not worrying and slide, even and the crooked residual bigger situation of TAB1 can realize that also reliable delivery moves such advantage.

In this embodiment, as long as will hold up 11 front ends that are fixed in rotating ladder 12b.Thus, make TAB1 be adsorbed in that rotating ladder 12a goes up and when advancing,, do not peel off sucker 40 and synchronously carry, also can peel off basement membrane 2b even do not rely on as long as synchronously batch basement membrane 2b.

4. the 4th embodiment

The ACF sticker

Then, with reference to Fig. 5 the 4th embodiment of major part ACF sticker of the present invention is described.

ACF sticker 132C shown in Figure 5 has the same structure of ACF sticker 132 (with reference to Fig. 2) with the 1st embodiment.The difference of this ACF sticker 132C and ACF sticker 132 is, adopts the pneumatic conveying of using arm 51 and thrower 52 to be used as reclaiming the method for basement membrane 2b.

As shown in Figure 5, ACF sticker 132C comes pneumatic conveying, reclaims basement membrane 2b by supplying with air pressure by arm 51 to thrower 52.In this case, control the recovery speed of basement membrane 2b by the driven roller 53 of being located at thrower 52 fronts.Adopt this mode not need to guarantee to be used to dispose the space of reclaiming spool, make the design transfiguration of machines configurations easy.

In addition, in ACF sticker 132C, dispose and be used for video camera 70 and close-up lens 71 that the stickup situation of the ACF layer 2a of TAB1 is confirmed.71 pairs of these video cameras 70 and close-up lenses are stripped from the bottom surface photography of the TAB1 of sucker 40 maintenances.Like this, by after just having peeled off basement membrane 2b, the stickup situation of ACF layer 2a being confirmed, can prevent a large amount of substandard products.

Arm 51, thrower 52, pneumatic feedway, hold up 11 and peel off another example that sucker 40 is peeling members of the present invention.

In above-mentioned the 1st～the 4th embodiment, make TAB1 in the mechanism error allowed band, closely dispose, be pasted on ACF and be with on 2, and between adjacent TAB1, carried out the hemisect processing.Thus, exceeding of unnecessary ACF layer 2a can be reduced, thereby the failure of peeling off basement membrane 2b can be reduced, in the problem of the ACF layer 2a warpage that when display base plate 100 (with reference to Fig. 1) is pasted TAB1, exceeds.But conception of the present invention is that pasting the higher TAB1 of rigidity by the ACF layer 2a that length is easily disorderly cuts off after going up, and prevents because unnecessary ACF layer 2a, sticking strength that the curtailment of ACF layer 2a causes are not enough.Therefore, also can be distortion as ensuing the 5th embodiment.

5. the 5th embodiment

The ACF sticker

Then, with reference to Fig. 6 the 5th embodiment of major part ACF sticker of the present invention is described.

ACF sticker 132D shown in Figure 6 has the same structure of ACF sticker 132 (with reference to Fig. 2) with the 1st embodiment.The difference of this ACF sticker 132D and ACF sticker 132 is, two cutting knifes 30 are set on last underarm 31, utilizes splicing tape 60 to remove unnecessary ACF layer 2a1.

As shown in Figure 6, in ACF sticker 132D, a plurality of TAB1 are pasted on ACF with being separated with predetermined distance are with on 2, utilize two cutting knifes 30 to carry out hemisect afterwards.Two cutting knifes 30 are installed on the underarm 31, and the back side to back side ground relatively and separate the interval narrower than the interval between adjacent TAB1.

In addition, in ACF sticker 132D, remove in the middle of utilizing unit 62 make volume have splicing tape 60 in the middle of remove arm 61 work, will paste by the unnecessary ACF layer 2a1 that two cutting knifes 30 form on the splicing tape 60 and it will be removed.Can freely set the gap between adjacent TAB1 in this embodiment.

Usually, if the width of splicing tape 60 is extremely narrow, the roll coil of strip then may occurs and snap, reclaim unnecessary problems such as ACF layer 2a1 failure.Therefore, also consider to make under the manageable situation of operation, the gap between preferred adjacent TAB1 is approximately 3mm.In this embodiment, even the gap between adjacent TAB1 is bigger, also cutting knife 30 can be set near the edge of TAB1.As a result, can Min. the exceeding of ground restriction ACF layer 2a, thereby can will peel off basement membrane 2b, occur situation such as mistake when pasting TAB1 and be limited in Min..

In addition, locate near meeting at right angles in the both sides of TAB1, therefore ACF layer 2a carried out being difficult for affecting both sides when remove the centre by cutting knife 30 back sides are provided with the cross sectional shape that exceeds part that makes ACF layer 2a to ground, the back side.Thus, by the effect that remove the centre, can reduce and cause that to remove the relative ACF layer 2a of part across the centre bonding once more and make the possibility of peeling off failure of basement membrane 2b.In addition, ACF sticker 132D adjacent TAB1 such as when having jut on the edge of TAB1 situation about can not fully closely arrange is also effective.

Two cutting knifes 30 are not set certainly, but move left and right carries out twice hemisect and handles and also can obtain same effect, to this not special diagram.Under situation as constituted above, handle gap between the adjacent TAB1 of actual measurement by utilizing MIcrosope image, also can make cutting knife 30 be number μ m near the edge of TAB1.

6. the 6th embodiment

The ACF sticker

Then, with reference to Fig. 7 the 6th embodiment of major part ACF sticker of the present invention is described.

ACF sticker 132E shown in Figure 7 has the same structure of AC F sticker 132 (with reference to Fig. 2) with the 1st embodiment.The difference of this ACF sticker 132E and AC F sticker 132 is that TAB platform 12 is configured in the both sides of ACF platform 10.

As shown in Figure 7, in ACF sticker 132E, for example as TAB1A, the width of display base plate 100 sides and PCB substrate-side differently is configured in TAB1A on the TAB platform 12,12 not simultaneously mutually.Thus, can make the closely configuration of part that is stuck of the ACF layer 2a of TAB1A, thus can Min. ground restriction ACF with 2 waste.

7. the 7th embodiment

The ACF sticker

Then, with reference to Fig. 8 the 7th embodiment of major part ACF sticker of the present invention is described.

ACF sticker 132F shown in Figure 8 has the same structure of ACF sticker 132 (with reference to Fig. 2) with the 1st embodiment.The difference of this ACF sticker 132F and ACF sticker 132 is, prepared two groups about carrying ACF with 2 and the mechanism that reclaims basement membrane 2b, and has been configured in the both sides of TAB platform 12.

As shown in Figure 8, in ACF sticker 132F, can on the both sides of the terminal of the terminal of display base plate 100 sides of TAB1 and PCB substrate-side, paste ACF layer 2a.Thus, carry out PCB after going up when connecting just TAB1 being installed to display base plate 100 (with reference to Fig. 1), there is no need to carry out the ACF stickup in the PCB substrate-side.As a result, in PCB installation unit 150 (with reference to Fig. 1), ACF sticker 152 can be set.And, because the stickup of ACF layer 2a can be finished once, therefore can further reduce installation cost.

8. the 8th embodiment

The ACF sticker

Then, with reference to Fig. 9 the 8th embodiment of major part ACF sticker of the present invention is described.

ACF sticker 132G shown in Figure 9 has the same structure of ACF sticker 132D (with reference to Fig. 6) with the 5th embodiment.The difference of this ACF sticker 132G and ACF sticker 132D is, cutting knife 30 is cut in the mode that moves obliquely from the outside of TAB1.

As shown in Figure 9, in ACF sticker 132G,, cutting knife 30 is moved obliquely relative to above-below direction by ACF cutter unit 32A for there is not ACF layer 2a deficiency in the downside that makes the TAB1 edge part.The otch angle of this moment is approximately 30 degree～60 degree.Thus, ACF with 2 on from beginning to be formed obliquely otch from the tens of μ m of the edge part of TAB 1 outside.

Therefore the point of a knife angle difference at the cutting knife 30 positive back sides when blade back side incision upside, need make the angle of inclination of underarm 31 just in time be equivalent to the point of a knife angle.The ACF sticker 132G of Gou Chenging has and further peels off basement membrane 2b easily and do not hinder TAB1 to the such advantage of the installation of display base plate 100 like this.In ACF sticker 132G, also carried out the hemisect processing of incision of tilting at the edge part of TAB1 rear side, but, therefore also can adopt the mode of vertical incision because posterior edges portion is less to peeling off basement membrane 2b influence.

More than, to the erecting device of flat-panel monitor of the present invention and the embodiment of installation method, comprise that its action effect is illustrated.But the erecting device and the installation method of flat-panel monitor of the present invention are not limited to the foregoing description, can carry out various distortion in the scope that does not break away from the invention main idea that claims put down in writing.

In the 1st～the 8th above-mentioned embodiment, hold up 11 cutting edges that adopted acute angle, but in order to peel off basement membrane 2b easily, apply ultrasonic vibration and also produce effect holding up 11.This mechanism also can and use with above-mentioned arbitrary embodiment.Make and hold up 11 and peeling off further of basement membrane 2b begun effectively along the direction vibration vertical with the bonding plane of ACF layer 2a.

, may make ACF layer 2a self thermoplastic, be full of cracks occurs or make basement membrane 2b breakage holding up 11 when having applied powerful ultrasonic vibration because of carelessness.Therefore, to hold up 11 vibrations that apply need according to employed ACF with 2 and TAB1 correspondingly be adjusted to suitable intensity.

In addition, stopping ultrasonic vibration after peeling off beginning can avoid ACF with 2 and bad influence thereby the preferred this mode of TAB1.By applying suitable ultrasonic vibration, can make in the beginning of peeling off of the edge part of TAB1 and successfully carry out, thereby can reduce the problem that related ACF layer 2a strips down together when peeling off basement membrane 2b holding up 11.

Claims (2)

1. the erecting device of a flat-panel monitor comprises:

The interim parts of pasting, it is used for pasting electronic component to the ACF layer of ACF band temporarily;

The otch parts, it is used for cutting out otch being pasted with on the above-mentioned ACF layer of above-mentioned electronic component temporarily;

Peeling member, it is used to peel off the basement membrane of the above-mentioned ACF band that is cut with otch on above-mentioned ACF layer.

2. the installation method of a flat-panel monitor comprises:

The interim operation of pasting, it utilizes the interim parts of pasting to paste electronic component to the ACF layer of ACF band temporarily;

The otch operation, it utilizes the otch parts to cut out otch being pasted with on the above-mentioned ACF layer of above-mentioned electronic component temporarily;

Stripping process, it utilizes peeling member to peel off to be cut with the basement membrane of the above-mentioned ACF band of otch on above-mentioned ACF layer.

Images