CN112441465A

CN112441465A - Mixed adhesive tape cutting device

Info

Publication number: CN112441465A
Application number: CN202010886680.7A
Authority: CN
Inventors: 金玟秀; 郑镇明
Original assignee: Dna Systems Ltd
Current assignee: Dna Systems Ltd
Priority date: 2019-08-30
Filing date: 2020-08-28
Publication date: 2021-03-05
Anticipated expiration: 2040-08-28
Also published as: CN112441465B; WO2021040121A1; KR102083453B1

Abstract

The invention provides a device for cutting off a mixed adhesive tape in a state that a protective film is adhered to an anisotropic conductive film, which is characterized by comprising: a supply unit around which the mixed tape is wound; a force linear member slidingly moved from one side surface to the other side surface of the hybrid tape; and a cutting unit which is coupled to the force linear member, cuts only the anisotropic conductive film, and restricts the degree of sliding movement of the force linear member when a set pressure reaches a set value.

Description

Mixed adhesive tape cutting device

Technical Field

The present invention relates to a cutting device for cutting only an Anisotropic Conductive Film (ACF) from a protective Film to which the ACF is attached.

More particularly, the present invention relates to a hybrid tape cutting device which includes a cutting unit for cutting an anisotropic conductive film so as to be slidable, and limits the extent of slidable movement of the cutting unit within a pressure range applied when cutting the anisotropic conductive film, so that the cutting unit stops when reaching a desired position, thereby cutting only the anisotropic conductive film from a protective film.

Background

An Anisotropic Conductive Film (ACF) is an Anisotropic Conductive Film in which fine Conductive particles are mixed with a paste resin (usually thermosetting) to form a Film (Film), and electricity is conducted only in one direction.

Such an anisotropic conductive film is mainly used for electrically connecting a Liquid Crystal Display (LCD) and a Printed Circuit Board (PCB).

On the other hand, since the anisotropic conductive film is supplied in a Roll (Roll) manner, a cutting device is indispensable for use in a liquid crystal display device (LCD) or a Printed Circuit Board (PCB).

Further, since the anisotropic conductive film is attached to the protective film during storage and handling, a process of cutting only the anisotropic conductive film from the protective film is required for use.

For this reason, in the prior art, as a technique for cutting the anisotropic conductive film, an anisotropic conductive film cutting apparatus is disclosed in korean laid-open patent publication No. 10-0259377.

A conventional anisotropic conductive film cutting apparatus is provided to adjust the height of a cutter, and includes: an adjustment plate having an adjustment portion formed so as to limit a cutting depth of the anisotropic conductive film by the cutter; and a pressing plate which is provided on the upper plate through a hinge so as to be in close contact with the adjusting portion to adjust the cutting depth and to adjust the levelness at the time of cutting, wherein the anisotropic conductive film cutting apparatus includes a fine adjustment mechanism which is provided on the pressing plate so as to adjust the cutting depth of the cutter by adjusting the distance between the upper end of the adjusting portion and the lower surface of the pressing plate by being in contact with the adjusting portion of the adjusting plate.

Such a conventional anisotropic conductive film cutting apparatus can adjust the cutting depth of the anisotropic conductive film by adjusting the cutting height of the cutter by adjusting the adjustment bolt, and can cut only the anisotropic conductive film from the protective film.

However, in the conventional anisotropic conductive film cutting apparatus, although it is certain that the cutting depths are the same by adjusting the cutting depths at which the anisotropic conductive films are cut by the cutter using the adjustment bolt and the fine adjustment mechanism, when the cutting edges of the cutter for cutting are worn out or the life of the cutter is reduced, the setting values for adjusting the adjustment bolt are different every time, and thus the cutting depth for cutting the anisotropic conductive films is hardly constant, and therefore, there is a problem that a defect may occur due to a phenomenon of lifting or rolling up of the anisotropic conductive films, and the time taken for the operator to set the anisotropic conductive films may be long.

Documents of the prior art

Patent document

(patent document 1) korean patent laid-open publication No. 10-0259377 (2000.03.21).

Disclosure of Invention

Technical problem

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a hybrid tape cutting device including a cutting portion for cutting an anisotropic conductive film so as to be slidable, the cutting portion being slidable within a pressure range applied when cutting the anisotropic conductive film, the cutting portion being stopped when reaching a desired position so as to cut only the anisotropic conductive film from a protective film.

Another object of the present invention is to provide a setting-free function that can minimize the time required for setting, while eliminating the trouble of the operator having to change the setting of the cutting depth of the cutting portion at any time, by limiting the extent of the sliding movement of the cutting portion to the range of the pressure applied when cutting the anisotropic conductive film.

Technical scheme

In order to solve the above-described problems, the present invention provides a hybrid tape cutting device for cutting a hybrid tape in which a protective film is bonded to an anisotropic conductive film, the hybrid tape cutting device including: a supply unit around which the mixed tape is wound; a force linear member which slides from one side surface of the mixed adhesive tape to the other side surface; and a cutting part which is combined with the force linear member, cuts off the anisotropic conductive film only, and limits the sliding movement degree of the force linear member when the set pressure reaches the set value.

ADVANTAGEOUS EFFECTS OF INVENTION

The present invention has a significant effect that a cutting portion for cutting the anisotropic conductive film is provided in the hybrid tape cutting device of the present invention so as to be slidable, and the extent of the slidable movement of the cutting portion is limited within a pressure range applied when the anisotropic conductive film is cut, so that the cutting portion stops when reaching a desired position, so that only the anisotropic conductive film is cut from the protective film.

Further, the present invention has a significant effect that the degree of the sliding movement of the cutting portion is limited to the range of the pressure applied when the anisotropic conductive film is cut, so that the trouble of the operator in setting the cutting depth of the cutting portion to be changed at any time can be eliminated, and the time required for the setting operation can be minimized.

Drawings

Fig. 1 is a perspective view of a hybrid tape cutting device according to an embodiment of the present invention.

Fig. 2 is a partial perspective view of a supply part in the hybrid tape cutting device according to the embodiment of the present invention.

Fig. 3 is a partial perspective view showing a force linear member, a cutting portion, and a supporting portion in the hybrid tape cutting device according to the embodiment of the present invention.

Fig. 4 is a side view showing a cutting portion in the hybrid tape cutting device according to the embodiment of the present invention.

Fig. 5 is a partial perspective view showing an embodiment of a nip portion in the hybrid tape cutting apparatus according to an embodiment of the present invention.

Fig. 6 is a diagram showing an example of actuating the nip portion of fig. 5.

Fig. 7 is a partial perspective view showing another example of a nip portion in the hybrid tape cutting apparatus according to the embodiment of the present invention.

Fig. 8 is a diagram showing an example of activating the nip portion of fig. 7.

Fig. 9 is a side view showing an example of cutting the hybrid tape in the hybrid tape cutting device according to the embodiment of the present invention.

Fig. 10 is a view showing an example of the sliding movement of the force restricting linear member in the hybrid tape cutting apparatus according to the embodiment of the present invention.

Fig. 11 is a diagram showing an example of a cutting device using a hybrid tape cutting device of the present invention and a conventional cylinder.

Fig. 12 is a flowchart showing a procedure of setting a pressure for cutting (Force) in the hybrid tape cutting device according to the embodiment of the present invention.

Fig. 13 is a partial perspective view of a hybrid tape cutting device according to another embodiment of the present invention.

Fig. 14 is a partial perspective view of a hybrid tape cutting apparatus according to still another embodiment of the present invention.

Fig. 15 is a side view showing an example of cutting a hybrid tape in a hybrid tape cutting apparatus of still another embodiment of the present invention.

Reference numerals

10: hybrid tape, 11: protective film, 12: anisotropic conductive film, 20: supply unit, 21: reel unit, 22: tension maintaining member, 30: force linear member, 40: cutting unit, 41: coating, 50: clamping portion, 60: support portion, 61: cutting the plate.

Detailed Description

Advantages and features of embodiments of the present invention, and methods of attaining the advantages and features, will become apparent by reference to the embodiments described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be embodied in various forms different from each other, which are provided only for the purpose of completeness of disclosure and to inform the scope of the invention to a person having ordinary skill in the art to which the present invention pertains, and the present invention is defined only by the scope of the claims. Throughout the specification, the same reference numerals denote the same constituent elements.

In describing the embodiments of the present invention, when it is judged that a detailed description of a known function or means may unnecessarily obscure the gist of the present invention, a detailed description will be omitted. Further, the terms or words used in the present specification and claims are terms defined in consideration of functions of the embodiments of the present invention, and should not be interpreted as being limited to general or dictionary meanings, but should be interpreted as meanings and concepts conforming to the technical idea of the present invention on the basis of the principle that the inventor can appropriately define the concept of the terms in order to explain his own invention in an optimal manner.

Therefore, the embodiments described in the present specification and the members shown in the drawings are merely the most preferable embodiments of the present invention and do not represent all the technical ideas of the present invention, and therefore, it should be understood that various equivalents and modifications which can replace the embodiments may be possible at the time of the present application.

Hereinafter, before the description with reference to the drawings, it is to be noted that, in order to highlight the gist of the present invention, an additional well-known structure, which is obvious to those skilled in the art, may be added, and is not illustrated or specifically described.

First, before explaining a plurality of embodiments of the present invention in detail with reference to the drawings, it is to be noted that terms such as directions of constituent elements (for example, "front", "rear", "left", "right", "upper", "lower", "lateral", "longitudinal", "front", "rear", "one side", "the other side", "inner side", and "outer side") described in the following detailed description or shown in the drawings do not simply mean or mean to have a specific direction, and the description of the directions is for facilitating the description between the members with reference to the drawings.

On the other hand, in the present specification, it is to be noted that fig. 1 to 12 illustrate an example of the upward and downward sliding movement of the force linear member 30 to be described later, fig. 13 illustrates an example of the lateral sliding movement of the force linear member 30, and fig. 14 and 15 illustrate an example of the double configuration of the cut portion 40.

The present invention relates to a hybrid tape cutting apparatus for cutting only an Anisotropic Conductive Film (12) in a hybrid tape (10) in which a protective Film (11) and the Anisotropic Conductive Film (12) are bonded, and more particularly, to a hybrid tape cutting apparatus capable of cutting only the Anisotropic Conductive Film (12) except the protective Film (11) by regulating the degree of sliding movement of a cutting unit (40) by using a pressure when cutting the Anisotropic Conductive Film (12) and accurately adjusting a cutting depth.

Hereinafter, a hybrid tape cutting device according to an embodiment of the present invention will be described in detail with reference to the drawings.

The hybrid tape cutting device of the present invention includes a cutting unit 40 for cutting only an anisotropic conductive film 12 so as to be slidable, and is configured to limit the extent of the slidable movement of the cutting unit 40 within a pressure range applied when cutting the anisotropic conductive film so that the cutting unit 40 stops when reaching a desired position, thereby cutting only the anisotropic conductive film 12 from a protective film 11, and includes a supply unit 20, a force linear member 30, a cutting unit 40, a clamping unit 50, and a support unit 60.

Such a hybrid tape cutting apparatus is used to eliminate a defect caused by an uneven cutting depth of the anisotropic conductive film 12 due to abrasion or damage of the cutting part (knife) during the sliding movement of the cutting part (knife) at the same height by the operation of the cylinder in the related art, and is characterized in that the cutting part 40 is not slid at the same height but cut based on a pressure change for cutting only the anisotropic conductive film 12 from the protective film 11 by controlling the pressure of the force linear member 30 to be described later, thereby preventing the above defect and enabling the only anisotropic conductive film 12 to be completely cut even if the cutting part 40 is abraded or damaged.

The supply unit 20 performs a function of unwinding the hybrid tape 10 in order to cut the hybrid tape 10 in a state where the hybrid tape 10 is wound.

As shown in fig. 2, the supply unit 20 may be in a roll form for winding the hybrid tape 10, and may include a reel unit 21 and a tension maintaining member 22 according to design conditions.

The reel unit 21 is formed in a roll form to wind the hybrid tape 10.

That is, the hybrid tape 10 is wound up when rotating in one direction, and the hybrid tape 10 which is originally wound up is unwound when rotating in the opposite direction.

At this time, the reel unit 21 may be configured to be replaceable from the supply unit 20.

Accordingly, when the hybrid tape 10 is unwound from the reel unit 21 and exhausted, the operation can be performed by merely replacing the reel unit 21 on which another hybrid tape 10 is wound.

The tension maintaining member 22 performs a function of performing a reverse rotation or a stop function to maintain the tension of the hybrid tape 10 during the rotation of the reel unit 21.

Such a tension maintaining member 22 may be formed of a motor, and may further include an additional sensor for measuring the tension of the hybrid tape 10 according to design conditions.

The force linear member 30 is coupled to be replaceable by a cutting portion 40 to be described later, and is slid from one side surface of the hybrid tape 10 to the other side surface thereof, thereby cutting the anisotropic conductive film 12 of the hybrid tape 10.

Such a Force linear member 30 may be constituted by a linear motor, and may be constituted to restrict the degree of sliding movement of the Force linear member 30 when a set value is reached by a set pressure (Force).

That is, unlike the conventional cutting device in which the cutting depth is adjusted by the height of the sliding movement of the cutting unit (knit) by the cylinder, the present invention sets the cutting depth by the pressure (Force), so that even if abrasion or damage occurs to the cutting unit 40 to be described later, it is possible to always keep cutting only the anisotropic conductive film 12 from the protective film 11, and it is possible to shorten the time for replacing the cutting unit 40, and it is possible to prevent the problem that the cutting depth varies depending on the set value of the cutting depth of a plurality of operators.

Of course, the Force linear member 30 may be provided with a pressure sensor for setting a pressure (Force) or an additional pressure sensor limiting the degree of sliding movement by the set pressure (Force) sensor to limit the degree of sliding movement, depending on design conditions.

The cutting unit 40 is coupled to the force linear member 30 so as to be replaceable, performs a function of cutting only the anisotropic conductive film 12, and includes a coating layer 41.

That is, the cutting unit 40 is coupled to the end of the linear force element 30, and cuts the hybrid tape 10 by sliding from one side surface to the other side surface of the hybrid tape 10 along with the sliding movement of the linear force element 30, and repeats the sliding movement from the other side surface to the one side surface of the hybrid tape 10, thereby performing the cutting process a plurality of times at the same cutting depth on the entire hybrid tape 10.

In this case, the cutting unit 40 may be formed in a sharp-ended blade (Knife) shape.

On the other hand, in the cutting section 40, when the anisotropic conductive film 12 is cut by the viscosity of the anisotropic conductive film 12 in the process of cutting only the anisotropic conductive film 12, there is a possibility that the anisotropic conductive film 12 sticks to the cutting section 40.

Therefore, in order to solve the above-described problems, the hybrid tape cutting device of the present invention may be formed with a coating layer 41 wrapping the surface of the cut part 40.

As illustrated in fig. 4, the coating 41 is formed to wrap the surface of the cut portion 40 to prevent the problem of the anisotropic conductive film 12 adhering to the cut portion 40 in advance, and such a coating 41 may be formed of an ultra-thin film coating or a nano coating by coating fluorine.

For example, when the coating 41 is formed of an ultra-thin film coating formed by coating fluorine, as shown in table 1 below, the film characteristics can be obtained, and the phenomenon that the anisotropic conductive film 12 is adhered to the non-adhesive coating formed on the cutting portion 40 can be prevented.

[ Table 1]

For another example, the coating 41 may be constituted by a nano-coating by coating with fluorine.

In the case of the nano coating, as shown in table 2 below, coating film characteristics can be obtained, the anisotropic conductive film 12 can be prevented from sticking by a non-stick coating, and the coating thickness is 1 μm, so that the coating can be made fine, and the coating can be made damage-free in a sharp product which is easily damaged such as the cut portion 40.

[ Table 2]

With this arrangement, when the set pressure (Force) reaches a set value, the degree of the slide movement of the Force linear member 30 is limited, and the set pressure (Force) can be set so that the minimum value among the values of cutting the anisotropic conductive film 12 by the slide movement of the cutting section 40 is the minimum value, and the lower value among the maximum value among the values of not cutting the protective film 11 by the slide movement of the cutting section 40 or the maximum value of the values of not adhering the anisotropic conductive film 12 to the coating layer 41 is the maximum value.

That is, the set pressure (Force) is limited to the minimum value to the maximum value, so that only the anisotropic conductive film 12 can be cut from the protective film 11 during the sliding movement of the cutting section 40, and the anisotropic conductive film 12 can be prevented from sticking to the cutting section 40.

Fig. 5 is a partial perspective view showing a nip portion in the hybrid tape cutting device according to the embodiment of the present invention, and fig. 6 is a view showing an example of activating the nip portion of fig. 5.

The nip 50 performs a function of fixing the end of the hybrid tape 10 and unwinding the hybrid tape 10 from the supply part 20.

As an example, as illustrated in fig. 5 and 6, such a nip 50 may be provided with a grip member (reference numeral not shown) for fixing the tip of the hybrid tape 10, and may be configured to move after fixing the hybrid tape 10 to unwind the hybrid tape 10 from the supply part 20.

At this time, as illustrated in fig. 5 and 6, the grip members may be configured such that the space therebetween is expanded or contracted, and thus, the hybrid tape 10 may be configured in a state of being fixed or released.

Further, the grip member may be configured to be slid to the side or upper and lower sides, so that the hybrid tape 10 may be unwound from the supply part 20 at a predetermined pitch in accordance with the sliding movement after the hybrid tape 10 is fixed.

Fig. 7 is a partial perspective view showing another example of a nip portion in the hybrid tape cutting apparatus according to the embodiment of the present invention, and fig. 8 is a view showing an example of actuating the nip portion of fig. 7.

As shown in fig. 7 and 8, the nip portion 50 may be configured in a Roller removing Type (Roller removing Type) according to design conditions.

As another example of such a nip 50, as shown in fig. 7 and 8, a portion of the hybrid tape 10 may be supported by a plurality of rollers (not shown), and the hybrid tape 10 may be unwound from the supply portion 20 by the operation of the rollers as shown in fig. 8.

As shown in the drawing, the support portion 60 performs a function of supporting the hybrid tape 10 unwound from the supply portion 20, is provided in a plurality of roller forms, supports the hybrid tape 10 so as to maintain tension thereof, and may include a cutting plate 61 supporting the other side surface of the hybrid tape 10.

Here, the cutting plate 61 is provided at a position corresponding to the cutting section 40 when the cutting section 40 slides, that is, at the other side surface of the hybrid tape 10 where the cutting section 40 is located when the cutting section 40 slides from one side surface to the other side surface of the hybrid tape 10.

Accordingly, the other side surface of the hybrid tape 10 is brought into contact with the cutting portion 40 while the anisotropic conductive film 12 is cut by the sliding movement of the hybrid tape 10 from one side surface to the other side surface, thereby preventing the hybrid tape 10 from moving in the sliding movement direction of the cutting portion 40 and enabling accurate cutting work.

Fig. 10 is a view showing an example of the sliding movement of the force-restricting linear member in the hybrid tape cutting device according to the embodiment of the present invention, and fig. 11 is a view showing an example of a cutting device using the hybrid tape cutting device according to the present invention and a conventional cylinder.

In the hybrid tape cutting device of the present invention, when the set pressure (Force) reaches the set value, the Force linear member 30 and the cutting section 40 are restricted from sliding, so that only the anisotropic conductive film 12 can be accurately cut from the protective film 11.

Such an embodiment will be described with reference to fig. 10. When the set value of the pressure (Force) is set to 1200mA, as shown in part a of fig. 1, it can be confirmed from the graph that the Force linear member 30 stops without sliding when the set value is reached.

That is, unlike the conventional cutting apparatus, the hybrid tape cutting apparatus of the present invention does not adjust the cutting depth by the height at which the cutting unit (knit) slides by the cylinder, but sets the cutting depth by the pressure (Force), so that only the anisotropic conductive film 12 can be cut from the protective film 11 at all times even if a plurality of cutting operations or replacement managers are repeated.

Referring to fig. 11 for a more detailed description, fig. 11 is a view showing an example of a hybrid tape cut by a conventional cutting device and a hybrid tape cutting device according to the present invention, and first, although the anisotropic conductive film 12 is perfectly cut by the conventional cutting device using a cylinder in the left side of FIG. 11, however, when the cylinder is used, the protective film such as "A" is broken at a wavelength due to vibration after cutting, as shown in the right side view of fig. 11, the hybrid tape cutting apparatus of the present invention performs the sliding movement of the Force linear member 30 by a set pressure (Force), so that an additional Stopper (Stopper) required when the cylinder operates in the conventional cutoff device is not required, but has a structure that stops when a set pressure (Force) value is reached, so that vibration does not occur, and thus damage applied to the protective film 11 can be minimized.

Incidentally, it can be seen that the thickness of the protective film of the work result by the cutting device of the conventional cylinder in the left side of fig. 11 is about 36 μm, and the thickness of the protective film 11 of the work result by the cutting device of the hybrid tape of the present invention in the right side of fig. 11 is about 40 μm, so that the cutting operation can be performed more accurately and stably than the conventional cutting device and constantly.

With this arrangement, referring to fig. 12, the process of setting the pressure (Force) in the hybrid tape cutting device of the present invention is tested by setting the sliding movement speed and position of the Force linear element 30 at the start of the operation and performing the operation based on the sliding movement (S10).

Next, it is observed whether the distance between the anisotropic conductive film 12 and the cutting section 40 is appropriate or not in the data inputted at one time (S20).

Here, whether the distance between the anisotropic conductive film 12 and the cutting portion 40 is in an appropriate range can be considered based on whether the anisotropic conductive film 12 can be completely cut by a previously set operation.

That is, the appropriate distance between the anisotropic conductive film 12 and the cutting section 40 is a value that can be traced by the accumulated data.

Based on the result of such a process S20, for example, when the distance between the anisotropic conductive film 12 and the cutting section 40 is narrow or long, the test is performed by resetting the sliding movement speed and position of the force linear member 30 and restarting (S21).

For another example, when it is determined from the data inputted once that the distance between the anisotropic conductive film 12 and the cutting section 40 is appropriate, the slide movement speed and the DIF of the force linear member 30 are set for the second time, and a test is performed so as to perform an operation based on the slide movement (S30).

Here, the DIF refers to a pressure (Force) for the Force linear member 30 to slide to cause the cutting section 40 to cut the anisotropic conductive film 12.

Next, whether or not the cutting portion 40 is in contact with the anisotropic conductive film 12 is observed (S40).

For example, if the cutting portion 40 is not in contact with the anisotropic conductive film 12, the DIF is reset and the operation is restarted (S41).

For another example, when the cutting portion 40 is in contact with the anisotropic conductive film 12, the force linear member 30 is slid and moved so that the cutting portion 40 cuts the anisotropic conductive film 12 (S50).

Next, whether or not the anisotropic conductive film 12 is completely cut is observed (S60).

For example, if the anisotropic conductive film 12 is not completely cut, the DIF value is increased, and then the anisotropic conductive film 12 is cut again (S61).

For another example, when the anisotropic conductive film 12 is completely cut, it is observed whether the anisotropic conductive film 12 is damaged or not or whether the protective film 11 is damaged or not (S70).

At this time, if the anisotropic conductive film 12 is damaged or the protective film 11 is damaged, the DIF value is lowered, and then the anisotropic conductive film 12 is cut again (S71).

Thereafter, when the anisotropic conductive film 12 or the protective film 11 is not damaged, the setting operation is terminated, and the anisotropic conductive film 12 is cut.

Through the above process, the pressure is set to limit the degree of sliding movement of the linear member 30, so that the cutting unit 40 can accurately cut only the anisotropic conductive film 12 from the protective film 11.

The adhesive part and the separating part may be provided according to design conditions.

The adhesive portion performs a function of attaching the anisotropic conductive film 12 cut by the cutting portion 40 to a Panel (Panel), and the separating portion performs a function of separating the anisotropic conductive film 12 from the protective film 11 when the anisotropic conductive film 12 is attached to the Panel (Panel).

According to design conditions, as illustrated in fig. 13, the hybrid tape cutting apparatus according to another embodiment of the present invention may be configured such that the direction in which the force linear member 30 slides moves is sideways.

Preferably, of course, the support portion 60 and the cutting plate 61 may be formed to be vertically disposed to vertically move a portion of the hybrid tape 10 corresponding to the direction in which the force linear member 30 is slidingly moved.

In this case, the arrangement of the force linear element 30 and the support portion 60 may be configured to be freely coupled to a lower member supporting the cutting device, and to be coupled by selectively adjusting the direction in which the force linear element 30 slides, as illustrated in the drawing.

Accordingly, the sliding direction of the force linear member 30 can be freely adjusted, and the cutting work can be performed according to the case where the left and right widths of the hybrid tape 10 are formed to be wide or short.

Fig. 14 is a partial perspective view of a hybrid tape cutting apparatus according to still another embodiment of the present invention, and fig. 15 is a side view showing an example of cutting a hybrid tape in the hybrid tape cutting apparatus according to still another embodiment of the present invention.

In accordance with design conditions, in the hybrid tape cutting device according to still another embodiment of the present invention, the pair of cutting portions 40 may be formed in a coupled double (dual) form on the force linear element 30, with reference to fig. 14.

At this time, the pair of cutting portions 40 may be configured to be spaced apart from each other, so that, when the cutting operation is finished by the pair of cutting portions 40, the anisotropic conductive film 12 positioned between the pair of cutting portions 40 may be configured to be separated from the protective film 11 by an additional adhesive tape, as illustrated in fig. 15.

With such a configuration, the hybrid tape cutting apparatus of the present invention is provided with the cutting section 40 for cutting the anisotropic conductive film 12 in a slidable manner, and the extent of slidable movement of the cutting section 40 is limited within the range of pressure applied when cutting the anisotropic conductive film 12, so that the cutting section 40 is stopped when reaching a desired position, so as to stably cut only the anisotropic conductive film 12 from the protective film 11.

Although various embodiments of the present invention have been shown and described in the above description, the present invention is not limited to these embodiments, and those skilled in the art to which the present invention pertains will appreciate that various substitutions, modifications and changes can be made without departing from the technical spirit of the present invention.

Claims

1. A hybrid tape cutting device for cutting a hybrid tape (10) in a state in which a protective film (11) and an anisotropic conductive film (12) are bonded to each other, the hybrid tape cutting device comprising:

a supply unit (20) around which the mixed tape (10) is wound;

a force linear member (30) which is slidingly moved from one side surface to the other side surface of the hybrid tape (10); and

a cutting unit (40) which is bonded to the force linear member (30) and cuts only the anisotropic conductive film (12),

when the set pressure is reached, the degree of sliding movement of the force linear member (30) is limited.

2. The hybrid tape cutting device according to claim 1, comprising:

a nip portion (50) that fixes a tip of the hybrid tape (10) and unwinds the hybrid tape (10) from the supply portion (20); and

a support part (60) which supports the mixed adhesive tape (10) unwound from the supply part (20).

3. The hybrid tape cutting device according to claim 2,

the support portion (60) includes:

and a cutting plate (61) which supports the other side surface of the hybrid tape (10) when the force linear member (30) and the cutting part (40) slide and move from one side surface to the other side surface of the hybrid tape (10).

4. The hybrid tape cutting device according to claim 1,

the cutting part (40) is formed with a coating (41) wrapping the surface of the cutting part (40).

5. The hybrid tape cutting device according to claim 1,

the set pressure is set to be a minimum value among values of the anisotropic conductive film (12) cut by the sliding movement of the cutting section (40), and a maximum value among values of the protective film (11) not to be cut by the sliding movement of the cutting section (40) or a maximum value among values of the anisotropic conductive film (12) not to adhere to the coating (41) is set to be a lower value.

6. The hybrid tape cutting device according to claim 1,

the cutting part (40) is composed of a pair of mutually separated parts,

when the cutting operation of the anisotropic conductive film (12) is finished, the anisotropic conductive film (12) positioned between the pair of cutting portions (40) is separated from the protective film (11) by the adhesive tape.