KR20050070713A - Apparatus for cutting anisotropic conducting film and method of cutting thereof - Google Patents

Abstract

The present invention relates to an anisotropic conductive film cutting device, the cutting device of the present invention is provided with a cutting reference portion provided in the lower portion of the target material, a moving unit for moving the target material according to the point to be cut, and one cutter And a cutting portion for cutting the target material by the cutter, and a peeling portion for attaching and peeling the cutting portion of the target material cut by the cutting portion.

Description

Anisotropic conductive film cutting device and its cutting method {APPARATUS FOR CUTTING ANISOTROPIC CONDUCTING FILM AND METHOD OF CUTTING THEREOF}

The present invention relates to an anisotropic conducting film (ACF) cutting device and a cutting method thereof, and more particularly, an anisotropic conductive film cutting device to suppress the wear of the cutter to the maximum, and to accurately cut the anisotropic conductive film and The cutting method relates to.

In today's information society, display is more important as a visual information transmission medium. In order to occupy a major position in the future, display needs to satisfy requirements such as low power consumption, thinning, light weight, and high quality.

The display itself has a cathode ray tube (CRT), an electroluminescent element (EL), a light emitting diode (LED), a vacuum fluorescence display (VFD), an electric field It can be divided into emission type such as Field Emission Display (FED), Plasma Display Panel (PDP), and non-emission type such as Liquid Crystal Display (LCD). .

A liquid crystal display device displays an image by using optical anisotropy of liquid crystal. Plasma display panels or electric fields are not only small in view of conventional CRTs, but also smaller than CRT tubes having the same average power consumption. Along with the emission display, it is recently attracting attention as a next generation display device.

A liquid crystal display device is a display device in which an image correcting signal is individually supplied to pixels arranged in a matrix form so as to display a desired image by adjusting light transmittance of the pixels.

In general, a liquid crystal display is filled with a thin film transistor array substrate and a color filter substrate bonded together so that a constant cell-gap is maintained to face each other, and a constant cell-gap between the two substrates. A liquid crystal panel comprising a liquid crystal layer, a driving unit for driving the liquid crystal panel, and a backlight unit provided on a rear surface of the liquid crystal panel to supply light to the liquid crystal layer of the liquid crystal panel. do.

In the thin film transistor array substrate, a plurality of gate lines that are regularly spaced apart laterally and a plurality of data lines that are regularly spaced apart vertically intersect with each other, and the gate lines and the data lines intersect each other and partition. Are provided with a plurality of pixels. The pixel is provided with a switching element and a pixel electrode, the switching element serves to open and close the image signal applied through the data line to the pixel, the pixel electrode together with the common electrode provided in the color filter An electric field is applied to the liquid crystal layer.

Red, green and blue color filter layers are formed on the color filter substrate to display various color images by mixing light supplied from the backlight unit into red light, green light, and blue light. A black matrix is formed in the shape of a net to prevent light leakage from leaking out of each of the red, green, and blue color filters. In addition, a common electrode is formed on the front surface of the color filter substrate, and as described above, an electric field is applied to the liquid crystal layer together with the pixel electrodes of the thin film transistor array substrate to change the arrangement of liquid crystal molecules, thereby providing light supplied from the backlight unit. The image is displayed on the liquid crystal panel by adjusting the light transmittance.

Recently, many demands have been generated for the liquid crystal display devices as described above, and have been mass-produced and supplied to consumers to satisfy the demands.

In producing a liquid crystal display device, first, two substrates having a large area are bonded together, and a liquid crystal layer is formed between the two substrates. The large area liquid crystal panel is cut into a plurality of unit liquid crystal panels. As described above, various circuits and wirings for driving the liquid crystal panel are mounted or connected to the liquid crystal panel formed by bonding the two substrates together.

Hereinafter, a general liquid crystal panel will be described with reference to the accompanying drawings.

1 is a view schematically showing a general liquid crystal panel.

Referring to FIG. 1, the liquid crystal panel is composed of a thin film transistor array substrate 10 and a color filter substrate 12 bonded together so that a constant cell gap is maintained, and a liquid crystal layer filled between the cell gaps. .

Since the thin film transistor array substrate 10 is larger than the area of the color filter substrate 12, when the two substrates are bonded to each other, the edge region of the thin film transistor array substrate 10 is exposed to the outside. 20,21). The pad parts 20 and 21 may be divided into a gate pad part 21 and a data pad part 20.

As described above, a driver for driving the liquid crystal panel is connected to the liquid crystal panel, and the driver includes a gate driver integrated circuit and a data driver integrated circuit. There are two methods of electrically connecting the gate driving integrated circuit and the data driving integrated circuit to the liquid crystal panel. That is, tap automated bonding (TAB) and chip-on-glass methods are available.

The tab method attaches a tape carrier package (TCP) on which a gate driving integrated circuit or a data driving integrated circuit is mounted on a flexible film to one side of a pad portion of a liquid crystal panel, thereby providing electrical power to the gate driving integrated circuit or a data driving integrated circuit. To form a connection.

Although not shown in the drawing, a plurality of data lines and a plurality of gate lines are formed in the pad part, pads are formed at ends of the data lines and the gate lines, and the pads are connected to respective output lines of TCP. Are connected individually.

On the other hand, an anisotropic conductive film is used to electrically connect the gate driving integrated circuit and the data driving integrated circuit or TCP to the pad portion. The anisotropic conductive film is composed of an adhesive resin, a plurality of conductive particles contained in the adhesive resin, and a protective film to protect the adhesive resin from both sides.

For example, the process of electrically connecting the pads 20 and 21 and TCP will be described below. The anisotropic conductive film is coated on the pads 20 and 21, and TCP is laminated on the coated anisotropic conductive film. In addition, when the thermocompression bonding is performed at high heat and pressure on the upper portion of the TCP, the pads 20 and 21 and the TCP are adhered to each other by an adhesive resin in the anisotropic conductive film, and the pad unit is formed by the conductive particles in the anisotropic conductive film. 20 and 21 and TCP are electrically connected to each other.

In general, since the anisotropic conductive film is provided in a roll manner, the anisotropic conductive film must be cut after being applied to the lengths of the pad portions 20 and 21. If the length of the pad portions 20 and 21 and the length of the anisotropic conductive film applied to the pad portions 20 and 21 are not the same and become shorter or longer, the liquid crystal display device may be formed by the conductivity of the anisotropic conductive film. It may cause a malfunction.

As described above, an anisotropic conductive film cutting device is used to accurately cut the anisotropic conductive film. Referring to the anisotropic conductive film cutting device in detail with reference to the accompanying drawings as follows.

Figure 2 is a simplified view showing a general anisotropic conductive film cutting device.

In FIG. 2, only the main parts related to the cutting of the anisotropic conductive film of the cutting device internal structure are enlarged, and the remaining parts are omitted.

Referring to the drawings, the cutting device is a cylinder 140 that is operated up and down, the peeling unit 130 is attached to the cylinder 140 is operated in accordance with the movement of the cylinder 140, and the peeling unit 130 And a cutting unit 135 connected by a spring and driven according to the movement of the peeling unit 130, and a stopper 140 for stopping the driving of the cylinder 140 at a predetermined length.

Although not shown in the drawings, an anisotropic conductive film to be cut is positioned on the upper portion of the cylinder 140.

The cylinder 140 is driven up and down by hydraulic and pneumatic pressure, etc., the peeling unit 130 is fixed to one side of the cylinder 140, the peeling unit 130 when the cylinder 140 is raised or lowered The cylinder 140 is raised or lowered together.

The peeling unit 130 has a driving source called the cylinder 140. However, the cut portion 135 does not have a separate drive source. Instead, the cutting part 135 is connected to the peeling part 130 by a spring to be driven by the elasticity of the spring.

Looking at the relationship between the peeling unit 130 and the cutting unit 135 in detail, first, the cutting unit 135 actually supports the cutter 135a for cutting the anisotropic conductive film, and the cutter 135b from below. In addition, it is composed of a support portion 135b connected to the peeling part 130. The cutout part 135 is connected to the peeling part 130 by a spring. The spring is a connection medium having elasticity and restoring force. When the peeling part 130 is raised or lowered by the cylinder 140, the cut part 135 is also raised by the restoring force of the spring. However, since the restoring force of the spring must be increased to some extent, when the peeling unit 130 is raised by a certain height, the cutting unit 135 is driven.

On the other hand, the height at which the cylinder 140 ascends or descends is limited, and the stopper 145 determines this limited height. That is, the rise of the cylinder 140 is suppressed by the stopper 145 and stopped. Since the stopper 145 may adjust the height in the cutting device, the rising height of the cylinder 140 may also be adjusted by adjusting the stopper 145.

Looking at the driving of the anisotropic conductive film cutting device as described above in detail as follows.

3a to 3c show a series of actuations of the cutting device.

Referring to the drawings, the cutting device is a peeling for separating the cutting base portion (cutter base block, 250) provided on the lower surface of the anisotropic conductive film, the cutting portion 235 for cutting the anisotropic conductive film, and the cut anisotropic conductive film It is configured to include a unit 239.

As shown in Figure 3a, the lower surface of the cutting reference portion 250 is provided with an anisotropic conductive film to be cut. In addition, when the peeling part 239 is lifted by the driving of a cylinder (not shown), the peeling part 239 is raised by a certain height, and then the cutting part 235 is started to rise by the restoring force of the spring.

3B, the peeling unit 239 stops in contact with the anisotropic conductive film to be peeled off. At this time, the cylinder is in a state where the driving is stopped by the stopper. On the other hand, the cut portion 235 that is raised together by the rise of the peeling portion 239 is to cut the anisotropic conductive film. As shown, two cutters 237 are attached to the conventional cutout 235 to cut two points of the anisotropic conductive film.

Referring to FIG. 3C, the anisotropic conductive film cut by the cut part 235 is adhered to the peeling part 239 and peeled off. The peeling part 239 is lowered by the lowering of the cylinder, and the cut part 235 is also lowered by the elasticity of the spring connected to the peeling part 235.

By repeating the above series of processes, the anisotropic conductive film is cut.

By the way, when cutting the anisotropic conductive film with the cutting portion 235 attached to the two cutters 237 as in the prior art may cause various problems.

First, if the cutting process of the anisotropic conductive film is repeated repeatedly, the two cutters 237 of the cutting unit 235 also continuously hit the anisotropic conductive film and the cutting reference unit 250, and each of them is affected by the impact. A deviation occurs in the height of the cutter 237 or the cutter 237 is inclined back and forth. That is, the alignment of the two cutters 237 may be shifted. Therefore, when the cutting is performed by the two cutters 237 misaligned, the anisotropic conductive film may not be cut or only one point may be cut.

Secondly, when misalignment of the two cutters 237 occurs as described above, the alignment of the cutters 237 is to be adjusted for accurate work. Thus, there are many ways to accurately set the alignment states of the cutters 237. It takes time, so workability is poor.

Third, the spacing between two cutters 237 is about 8 mm. When the cutting operation is continuously performed with the cutters 237 having such minute spacing, the separated anisotropic conductive material may be left between the two cutters 237 without being completely removed, which may cause peeling defects.

Therefore, the present invention was devised to solve the conventional problems as described above, and an object of the present invention is to apply a single cutter having fluidity to the cutting portion, thereby solving the misalignment occurring in the conventional two cutters The present invention provides a cutting device and a cutting method for cutting an anisotropic conductive film accurately.

The cutting device of the present invention as described above is provided with a cutting reference portion provided with the target material at the bottom, a moving part for moving the target material according to the point to be cut, and one cutter, and the target material is cut by the cutter. And a peeling part for attaching and peeling a cutting part of the target material cut by the cutting part.

The characteristics of the present invention as described above is to reduce the two cutters attached to the cutting unit in the conventional cutting device to one, to have the fluidity of the cutter, to solve the problem of misalignment between the cutters, the cutter to the anisotropic conductive film to cut When contacted, the cutter automatically contacts the anisotropic conductive film by the fluidity of the cutter so that the cutting is performed accurately.

Such a cutting device will be described in detail with reference to the accompanying drawings as follows.

4 is an enlarged view of a part of a cutting device according to the present invention.

A feature of the present invention lies in the structure of the cutout part and the peeling part. Among them, the cutting part can be driven separately from the peeling part, thereby enabling accurate cutting compared to the prior art.

Therefore, the overall cutting device will be described based on the cutting part illustrated in the drawings.

Referring to the drawings, the cutout 335 is composed of one cutter 335a for cutting the anisotropic conductive film, and a support 335b for fixing the lower portion of the cutter 335a.

The cylinder 370 drives up or down, and one side of the cylinder 370 penetrates a part of the cutout 335. A fixing cap 372 is formed at a lower portion of the cylinder 370 formed through the cutting portion 335, and the fixing cap 372 is connected to the support 335b by a spring. That is, the cylinder 370 is not directly connected to the cutout 335, but is indirectly connected by a spring.

Therefore, when the cylinder 370 is raised, the fixing cap 372 formed on the lower portion of the cylinder 370 is also raised to raise the support 335b by the elasticity of the spring attached to the fixing cap 372. Will also be pushed up.

As such, the cut portion 335 is not directly raised by being in contact with the cylinder 370, but is lifted by the elasticity of the spring. It is buffered by it so that it is not subjected to strong shocks. That is, even when the continuous cutting operation is performed, wear of the cutter 335a may be reduced, thereby increasing the life of the cutter 335a.

Meanwhile, although not shown in the drawings, the cutting device of the present invention is provided with two cylinders, one cylinder drives the cutout 335, and another cylinder drives the peeling part. Therefore, the driving of the cutout portion 335 can be driven independently without being affected by the driving of the peeling portion as in the prior art.

The driving process of the cutting device as described above will be described with reference to the accompanying drawings.

5a to 5e are views showing the operation of the cutting device according to the present invention.

Referring to the drawings, a cutting reference portion 450 provided with a lower portion of the anisotropic conductive film to be cut, a moving portion 453 for moving the anisotropic conductive film, a cutting portion 435 for cutting the anisotropic conductive film, and the cut portion And a peeling portion 439 attached to the anisotropic conductive film cut by 435 to be peeled off.

Referring to Figure 5a, the cut portion 435 is raised together by the rise of the cylinder, the moving portion 452 is cut again after cutting the anisotropic conductive film provided on the lower surface. At this time, the peeling unit 439 does not drive.

Referring to FIG. 5B, when the cut part 435 is lowered by driving a cylinder after cutting the anisotropic conductive film, the moving part 453 moves in one direction to the left or right, and is provided on the bottom of the moving part 453. Transfer the anisotropic conductive film. At this time, the cut surface 436 already cut by the cut portion 453 is also moved. When the moving part 453 stops at a point to be moved and cut in one direction, the cutting part 435 is raised again as shown in FIG. 5C. In this case, the peeling portions 439 are raised together and bonded to the cut portions of the anisotropic conductive film. If the peeling portion 439 is not bonded to the cut portion of the anisotropic conductive film and is cut only by the cut portion 435, the peeling portion 439 may fall off the cut portion of the anisotropic conductive film.

On the other hand, when the peeling portion 439 is bonded to the cut portion, and the cutting of the anisotropic conductive film of the cut portion 435 is completed, the peeling portion 439 and the cut portion 435 is lowered.

As the above cutting and peeling processes are repeatedly performed, anisotropic conductive film cutting is performed.

However, when the cutting process is continuously performed as described above, the cutter 435 is repeatedly contacted with the anisotropic conductive film and the moving part 452, so that the cutter 435 may be worn. Therefore, as described above, the cutting part 435 and the cylinder are connected by a spring to cushion the elasticity of the spring, thereby alleviating the impact of the cutter 435, thereby suppressing wear. As described above, by changing the coupling of the support 435b and the cutter 435a in addition to the buffering action by the spring, wear of the cutter 435a can be reduced, as shown in FIG.

6 is a view showing a coupling state of the cutter and the support in the cutting unit according to the present invention.

Referring to FIG. 6, the cutout 535 includes a cutter 535a for cutting an anisotropic conductive material, a support 535b fastened to the cutter 535a, and the cutter 535a to the support 535b. It comprises a rotating bearing 580 for coupling.

The cutter 535a is fastened to the support 535b by the rotary bearing 580 without fixing the cutter 535a as in the related art. Since the rotation bearing 580 is free to rotate even when coupled to the support 535b, the cutter 535a fixed to the rotation bearing 580 is also freely to the left and right to some extent even in a state where it is fastened to the support 535b. Flows. Due to the fluidity of the cutter 535b, the impact is alleviated when the cutter 535b contacts the anisotropic conductive material or the moving part, thereby reducing wear of the cutter 535b. In addition, since the cutter 535b is closely adhered to the anisotropic conductive material, cutting may be performed accurately.

As described above, the cutting device of the present invention includes a cutter having fluidity in the cutting part, and the cutting part is driven by connecting the cutting part by a cylinder and a spring, whereby foreign matter is caught between the plurality of cutters, thereby causing a defect in cutting and peeling. The conventional problem can be eliminated and the damping action of the spring can reduce the wear of the cutter in continuous operation.

In addition, since the cutter has fluidity, the cutter can be closely adhered to the anisotropic conductive material, thereby accurately cutting the anisotropic conductive material.

1 is a view schematically showing a general liquid crystal panel.

Figure 2 is a simplified view showing a typical anisotropic conductive film cutting device.

3A-3C show a series of actuations of a cutting device.

4 is an enlarged view of a part of a cutting device according to the present invention;

5a to 5e are views showing the operation of the cutting device according to the present invention.

Figure 6 is a view showing a coupling state of the cutter and the support in the cutting portion according to the present invention.

** Description of the symbols for the main parts of the drawings **

335a: cutter 335b: support

335: cutting portion 370: cylinder

372: fixing cap 375: spring

Claims (8)

A cutting reference part provided at a lower portion of the target material; A moving unit for moving a target material according to a point to be cut; One cutter is provided, the cutting portion for cutting the target material by the cutter; And And a peeling part for attaching and peeling the cutting part of the target material cut by the cutting part. The cutting device according to claim 1, wherein the target material is an anisotropic conducting film. 2. The cutting device according to claim 1, wherein the cutout and the peeler are driven separately by a cylinder. 4. The cutting device according to claim 3, wherein the cutting portion and the cylinder are connected by springs. The cutting device according to claim 1, wherein the cutter of the cutting part has fluidity. The cutting device according to claim 5, wherein the cutter is coupled to the cutting unit by a rotary bearing. The cutting device according to claim 1, wherein the target material is cut twice by the cutting part and peeled by the peeling part. Providing a target material; Cutting the descending material by cutting the descending portion; Moving the target material in one direction; Attaching the cut target material by rising the cutting part and cutting the target material by lifting the peeling part; And a step of lowering the cutting part and the peeling part, and performing the steps repeatedly.