KR100741956B1 - Apparatus for Bonding Anisotropic Conductive Film - Google Patents

Abstract

The present invention relates to an anisotropic conductive film bonding apparatus. The anisotropic conductive film bonding apparatus according to the present invention is set to correspond to a work table, a bonding table mounted on the work table and loaded with glass, and a pattern portion of the glass installed on the work table and loaded on the bonding table, thereby setting the film on the glass. Bonding apparatus for bonding to the film, film supply means for supplying the film, cutting means for cutting the conductive adhesive layer of the film supplied by the film supply means to a predetermined length, and the back surface of the film attached to the back surface of the conductive adhesive layer of the film. It may be made of a back surface recovery means for recovery. The film supply means includes tension adjusting means for adjusting the tension of the film. The tension control means, the rotating bracket is installed on the base plate to be rotated via a rotating shaft, the tension control roller is installed on one side of the rotating bracket, the film is wound, the movement is installed to be slidable to the other guide hole of the rotating bracket Weight, while the screw is coupled to the rotating bracket is made of a tension control lever is fixed to the moving end.

Bonding device, anisotropic conductive film, ACF, tension roller, cutter

Description

Anisotropic conductive film bonding device {Apparatus for Bonding Anisotropic Conductive Film}

1 is a block diagram of an anisotropic conductive film bonding apparatus according to the present invention.

Figure 2 is a perspective view of the tension control means applied to the anisotropic conductive film bonding apparatus according to the present invention.

Figure 3 is a front view of the tension control means applied to the anisotropic conductive film bonding apparatus according to the present invention.

Figure 4 is a perspective view of the cutting means applied to the anisotropic conductive film bonding apparatus according to the present invention.

Figure 5 is a side view of the cutting means applied to the anisotropic conductive film bonding apparatus according to the present invention.

<Code Descriptions Used in Main Parts of Drawing>

100: workbench, 110: base plate

200: bonding table, 210: LM guide

220: stage, 300: bonding device

400: film supply means, 410: film supply roller

420,620: guide roller, 430: tension control means

431: rotating shaft, 432: rotating bracket

433: tensioning roller, 434: moving weight

435: tension control lever, 500: cutting means

510: cutter, 520: cutting plate

521: steel plate, 522: sheet paper

600: back side recovery means, 610: back side recovery roller

The present invention relates to an anisotropic conductive film bonding apparatus, and more particularly, to an anisotropic conductive film bonding apparatus that can easily work for the tension control of the film, and to prevent damage to the film.

Generally, ACF-Anisotropic Conductive Films are composed of particulate conductive particles (metal particles, carbon, coated plastic particles coated with metal), adhesives (thermoplastic or thermosetting), and additives. It forms a conductive adhesive layer in the form of a thin film by mixing (dispersing agent) and the like, and has excellent connection reliability, microconnectivity, low temperature connection, etc., so it is a liquid crystal panel (LCD) panel and a tape carrier package (TCP) or PCB. In addition to being widely used for electrical connection such as (Printed Circuit Board), in recent years, it is also used as a mounting material of COG (Chip On Glass) that directly mounts a Bare Chip on an LCD panel.

In the case of the COG, before the chip is bonded to the pattern of the glass, the film is set in the patterned part in which one or more patterns are formed. Then, the film is electrically heated and pressed to a predetermined temperature by a separate bonding device. Bond the adhesive layer.

The film adhered to the pattern portion of the LCD by the bonding process is conductive by the conductive particles on the upper side of each pattern, and the conductive particles are independently present between the pattern and the pattern spaced apart at predetermined intervals. The pattern is insulated so that the chips bonded on the upper side of the pattern are bonded so as to have conductivity independently only on the corresponding pattern.

A brief description of the general structure of the anisotropic conductive film bonding apparatus includes a worktable, a loading stage installed on an upper side of the worktable, and a glass loaded thereon, and a glass installed on the worktable and a bonding head loaded on the loading stage. And a film supply device for supplying an anisotropic conductive film between the bonding device and the glass.

Such anisotropic conductive film bonding apparatuses include, for example, an anisotropic conductive line film bonding apparatus proposed by Korean Registered Utility Model Publication No. 283911, and a transfer film peeling apparatus of an ACF bonding machine proposed by Korean Laid-Open Patent Publication No. 2001-99068.

According to the pre- filed anisotropic conductive film bonding apparatus, if the film does not have a certain amount of tension during bonding, defects may occur during bonding, so that a weight is installed at the end of the film as a method for adjusting the tension of the film to be transported. .

On the other hand, the cutting means for cutting the conductive adhesive layer of the anisotropic conductive film has a simple structure of cutting the conductive adhesive layer of the anisotropic conductive film in contact with the cutting plate made of steel on the opposite side of the anisotropic conductive film while the cutter is raised or lowered. .

According to the bonding apparatus of the pre- filed anisotropic conductive film as described above has the following problems.

Since the weight is attached to the film to maintain the tension of the film, if the tension of the film is to be adjusted, another weight or additional weight should be added or removed in order to adjust the overall weight of the weight. Since it is placed on the back of the additional equipment, such weight change work is performed by hand at the back of the equipment, and thus the workability is decreased. Also, when the weight change is performed, safety accidents occur due to the weight added worker or the bonding machine falling down due to the carelessness of the operator. Can be.

In addition, since the cutting plate is made of steel when cutting the anisotropic conductive film, the backing paper attached to the back surface of the anisotropic conductive film together with the conductive adhesive layer of the anisotropic conductive film may be cut to protect the conductive adhesive layer according to the pressure of the cutter and the cutting plate. There are also disadvantages.

Thus, the present invention was invented to solve the above problems, in adjusting the tension of the film so that the conductive adhesive layer is normally bonded during bonding of the anisotropic conductive film, it is easy to control the tension of the film The purpose is to provide an anisotropic conductive film bonding device.

In addition, another object of the present invention is to prevent the cutting of the backing paper attached to the back side to protect the conductive adhesive layer when cutting the anisotropic conductive film.

Anisotropic conductive film bonding apparatus according to the present invention for achieving the above object, the worktable 100; A bonding table 200 mounted on the work table and loaded with glass; A bonding apparatus 300 installed on the work table and set to correspond to the pattern portion of the glass loaded on the bonding table; Film supply means / back paper recovery means (400,600) for supplying a film (1) having a conductive adhesive layer (1a) formed on the back paper (1b) from the bonding apparatus or for recovering the back paper of the film (1); A rotating bracket 432 rotatably installed around the rotating shaft on the base plate 110, a tension adjusting roller 433 installed on one side of the rotating bracket, and guiding film transfer, and a tension adjusting roller 433. Tension adjusting means 430 made of a moving weight 434 to adjust the tension of the film by adjusting the position of the; And cutting means (500) for cutting the conductive adhesive layer of the film (1) supplied from the film supply means (400) to a predetermined length, wherein the film supply means / back paper recovery means includes a supply / recovery roller to which the film is wound. 410 and 610, guide rollers 420 and 620 for guiding the transfer of the film, and one or more tension adjusting rollers 433 which the film is wound and installed to be movable in the tension adjusting direction on the base plate 110. The tension of the film can be adjusted while moving the adjusting roller, and the cutting means includes a cutter 510 which is lifted by a driving means, and a cutting plate 520 installed above the cutter, wherein the cutting plate is Steel plate 521 is attached to the bottom of the steel plate, characterized in that made of a synthetic resin sheet 522 that absorbs the pressure applied from the cutter when cutting the film The.

The tension adjusting roller is installed at one end of the rotating bracket, the center portion of which is rotatably installed on the base plate, and the other end of the rotating bracket is installed to be movable from the rotating shaft, and the tension adjusting roller is moved. The position is variable while being rotated according to the position of the weight.

A guide hole is formed at the other end of the rotating bracket along its length direction, and the moving weight is fixed to the tension control lever screwed to the rotation bracket while sliding in the guide hole to move the handle by the tension control lever. The weight can be slid.

The film cutting means according to the present invention includes a cutter which is lifted by a driving means, a cutting plate installed on the upper side of the cutter, the cutting plate is attached to the steel plate and the bottom of the steel plate and the cutting of the film It may comprise a sheet of synthetic resin material that absorbs the pressure applied from the cutter.

The sheet paper may be made of Teflon.

The features and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments based on the accompanying drawings. Prior to this, the terms or words used in the present specification and claims are defined in the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way. It must be interpreted to mean meanings and concepts.

As shown in FIG. 1, the anisotropic conductive film bonding apparatus according to the present invention includes a work table 100, a bonding table 200 installed on the work table 100 and loaded with glass (not shown), and the work table ( The bonding device 300 is installed in the 100 and is set to correspond to the pattern portion of the glass loaded on the bonding table 200, and a film supply device for supplying anisotropic conductive film between the bonding device 300 and the glass do.

The film supply apparatus includes film supply means 400 for supplying a film, cutting means 500 for cutting a conductive adhesive layer of the film 1 supplied by the film supply means 400 to a predetermined length, and a film 1 It may comprise a back surface recovery means 600 for recovering the back paper of the film attached to the back surface of the conductive adhesive layer.

The film supply means 400 includes a film supply roller 410 on which the film 1 is wound, one or more guide rollers 420 for guiding the transport of the film 1, and a tension for adjusting the tension of the film 1. Adjusting means 430 is included.

As shown in Figures 1 to 3, the tension adjusting means 430, the rotating bracket 432 is rotatably installed around the rotating shaft 431 on the base plate 110 (shown in Figure 1), The film 1 is installed on one side of the rotating bracket 432 so as to be idle, and the film 1 is wound to adjust the positions of the tension adjusting roller 433 and the tension adjusting roller 433 to guide the transfer of the film 1. It consists of a moving weight 434 to adjust the tension of the).

The moving weight 434 changes the position of the tension adjusting roller 433 by changing the relative weight with respect to the tension adjusting roller 433 while the position thereof is changed around the rotating shaft 431 on the rotating bracket 432.

For example, the guide bracket 432a is punctured along the longitudinal direction in the rotating bracket 432, and the moving weight 434 is slidably installed through the guide bar 434a in the guide slot 432a, and the guide bar ( 434a may be fixed to an end portion of the tension control lever 435 (shown in FIGS. 2 and 3) that is screwed to one side of the rotating bracket 432. That is, the position of the moving weight 434 is closer to or away from the rotation axis 431 by tightening / releasing the tension control lever 435, the relative weight is changed according to the position of the moving weight 434 to adjust the tension It becomes heavier or lighter than the roller 433, so the position of the tension adjusting roller 433 is changed through the rotation of the rotation bracket 431.

As shown in Figure 1, the back surface recovery means 600, the back surface recovery roller 610, which is wound around the backing paper 1b from which the conductive adhesive layer of the film is cut, one or more guide rollers for guiding the transfer of the backing paper 1b ( 620 and the tension adjusting means 630 for adjusting the tension of the backing paper (1b).

Since the tension adjusting means is the same as the tension adjusting means of the film supply means, a detailed description thereof will be omitted.

Cutting means applied to the anisotropic conductive film bonding apparatus according to the present invention is as follows.

As shown in Figures 4 and 5, the cutting means 500, the cutter 510 is installed on the one side of the bonding table 200 on which the glass is mounted via the drive means, and the upper side of the cutter 510 It consists of a cutting plate 520 is installed on.

The cutting plate 520 is attached to the plate 521 made of steel and the bottom surface of the steel plate 521, and the film 1 (shown in FIG. 1) cut by the cutter 510 is contacted at a constant pressure. It is made of sheet paper 522.

The sheet paper 522 absorbs excessive cutting so that the backing paper 1b attached to the back surface is not cut for protection of the conductive adhesive layer 1a when the conductive adhesive layer 1a of the film 1 is cut by the cutter. It may be made of Teflon material.

The bonding table 200 in which the glass is mounted and the bonding operation is performed may be installed on the stage 220 that is moved by the LM guide 210 to the X and Y axes.

The action of the anisotropic conductive film bonding apparatus according to the present invention configured as described above is as follows.

First, as shown in FIG. 1, the glass is loaded at the bonding position of the bonding table 200. The loading of the glass may be loaded by a supply unit which is integrally installed on the work bench 100 or configured separately.

At this time, the film supply roller 410 is rotated in one direction to supply the film 1 to the cutting means 500 on the upstream side. When the film 1 is supplied, a certain tension is given to the film 1 so that the film 1 can be supplied to the glass in the correct length. The film 1 wound on the film feed roller 410 is supplied by the guide roller 420 of the loading place through the tension adjusting roller 433, and the film 1 is adjusted by adjusting the position of the tension adjusting roller 433. The tension of 1) can be given.

Referring to the method of adjusting the tension of the film, as shown in Figure 3, when the tensioning lever 435 is rotated while the film 1 is hooked on the tension control roller 433 to tighten or release the rotating bracket 432 By the tension control lever 435, the moving weight 434 is slid along the guide long hole 432a to change its position. When the moving weight 434 is closer or farther away from the rotating shaft 431, the relative weight of the tension adjusting roller 433 relative to the moving weight 434 becomes heavier or lighter, and accordingly the rotating bracket 432 is a rotating shaft ( The position of the tension adjusting roller 433 is changed while rotating in one direction about the center 431, and the tension of the film 1 wound on the tension adjusting roller 433 is changed.

In this manner, the film 1 is supplied to the cutting means 500 in a state in which the tension of the film 1 is adjusted.

When the film 1 reaches the setting position, the conductive bonding layer 1a of the film 1 is continuously cut by the set length by the cutting means 500 and then supplied to the next bonding apparatus 300. As shown in FIG. 5, when the film 1 reaches the setting position of the cutting means 500, the cutter 510 is lifted by the driving means to cut the film 1, and at this time, the cutter 510 is The film 1 is cut while contacting the sheet paper 522 of the cutting plate 520 at a predetermined pressure, and the sheet paper 522 absorbs excessive pressure applied from the cutter 510 to absorb the conductive adhesive layer 1a of the film 1. ) Is cut off, and the backing paper 1b protecting the conductive adhesive layer 1a is not damaged.

As described above, the film 1 from which the conductive adhesive layer 1a is cut is supplied between the pattern portions of the bonding head (not shown) glass of the bonding apparatus 300.

In the above state, the bonding head of the bonding apparatus 300 moves downward to press while bonding the conductive adhesive layer 1a of the film 1 positioned above the pattern to a predetermined temperature.

When the conductive adhesive layer 1a is bonded to one pattern by such a bonding operation, the back paper 1b attached to the back surface of the conductive adhesive layer a1 is recovered while being sequentially wound on the back surface recovery means 600 described above.

The back paper 1b is wound on the back paper collection roller 610 while maintaining a constant tension by the tension adjusting means 630. The action of the backing paper tension adjusting means 630 is the same as the film tension adjusting means 430 configured in the above-described film supply means 400 will not be described in detail.

The glass on which the conductive adhesive layer 1a is bonded is unloaded and stored in a separate storage tray (not shown), a new glass is loaded on the bonding table 200, and then the film is bonded to the glass through the above-described process. do.

According to the present invention, it has been described that the tension control means is applied to both the film supply side and the back paper recovery side, but may be selected only one of them.

Therefore, since the tension of the film 1 can be adjusted by adjusting the tension control lever 435 in the front of the installation, it is inconvenient to replace several other weights in the rear of the installation, which is a narrow space for adjusting the tension of the film as in the prior art. The box disappears.

Then, the backing paper which absorbs excessive pressure applied from the cutter 510 when cutting the film 1 is absorbed by the sheet paper 522 supporting the cutter 510 to protect the conductive adhesive layer 1a of the film 1 as in the prior art. (1b) is not cut | disconnected.

As described above, according to the anisotropic conductive film bonding apparatus according to the present invention, it is possible to control the tension of the film by adjusting the bolt in front of the facility of the tension of the film in a wide space, in particular, the film is placed on the tension control roller Since the tension of the film can be adjusted while adjusting the tension control lever in the state, the tension adjusting operation becomes simpler, and the safety of the worker and the damage of the equipment can be prevented.

In addition, since the malfunction of the back paper protecting the conductive adhesive layer is cut and damaged during the cutting of the film does not occur, there is an effect that the automated process of the bonding operation may proceed smoothly.

While the invention has been described and illustrated in connection with a preferred embodiment for illustrating the principles of the invention, the invention is not limited to the configuration and operation as such is shown and described. Rather, those skilled in the art will appreciate that many modifications and variations of the present invention are possible without departing from the spirit and scope of the appended claims. Accordingly, all such suitable changes and modifications and equivalents should be considered to be within the scope of the present invention.

Claims (5)

Working table 100; A bonding table 200 mounted on the work table and loaded with glass; A bonding apparatus 300 installed on the work table and set to correspond to the pattern portion of the glass loaded on the bonding table; Film supply means / back paper recovery means (400,600) for supplying a film (1) having a conductive adhesive layer (1a) formed on the back paper (1b) from the bonding apparatus or for recovering the back paper of the film (1); A rotating bracket 432 rotatably installed around the rotating shaft on the base plate 110, a tension adjusting roller 433 installed on one side of the rotating bracket, and guiding film transfer, and a tension adjusting roller 433. Tension adjusting means 430 made of a moving weight 434 to adjust the tension of the film by adjusting the position of the; It includes; cutting means 500 for cutting the conductive adhesive layer of the film (1) supplied from the film supply means 400 to a predetermined length; The film supply means / back paper recovery means, the supply / recovery rollers (410, 610), the film is wound, the guide rollers (420, 620) for guiding the transfer of the film and the film is wound in the tension control direction to the base plate 110 Including one or more tension control rollers 433 which are movable to adjust the tension of the film while moving the tension control rollers, The cutting means includes a cutter 510 which is lifted by a driving means and a cutting plate 520 installed above the cutter. The cutting plate is attached to a steel plate 521 and a bottom surface of the steel plate. Anisotropic conductive film bonding apparatus comprising a synthetic resin sheet 522 that absorbs the pressure applied from the cutter when cutting the film. According to claim 1, wherein the tension adjusting roller is installed at one end of the rotating bracket 432, the center portion of which is rotatably installed on the base plate, the moving weight 434 is at the other end of the rotating bracket from the rotating shaft It is installed to be movable, the tension control roller is anisotropic conductive film bonding apparatus, characterized in that to adjust the tension in accordance with the position change of the moving weight. According to claim 2, The rotating bracket has a guide hole (432a) is formed along the longitudinal direction, the movement is fixed to the tension control lever 435 screwed to the rotating bracket while the slide is sliding in the guide hole and the tension Anisotropic conductive film bonding apparatus, characterized in that the movable lever is configured to be slidable by the operation of the control lever. delete delete

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