KR100259377B1 - A cutting device of anisotropic conductive film - Google Patents

A cutting device of anisotropic conductive film Download PDF

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Publication number
KR100259377B1
KR100259377B1 KR1019970068019A KR19970068019A KR100259377B1 KR 100259377 B1 KR100259377 B1 KR 100259377B1 KR 1019970068019 A KR1019970068019 A KR 1019970068019A KR 19970068019 A KR19970068019 A KR 19970068019A KR 100259377 B1 KR100259377 B1 KR 100259377B1
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South Korea
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plate
conductive film
anisotropic conductive
cutting device
cutter
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KR1019970068019A
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Korean (ko)
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KR19990049154A (en
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유상욱
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윤종용
삼성전자주식회사
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: An anisotropic conductive film cutting device controls the cut-off depth and the cut-off level of an anisotropic conductive film(ACF) precisely, thereby improving the precision of half cutting working. CONSTITUTION: A fine controlling device mounted in a compressing plate(62) comprises an operating hole(1) penetrated toward a controlling part(52), an operating device for moving a controlling member(3) finely, and the controlling member(3). An auxiliary fine controlling device for controlling the level of the compressing plate(62) is mounted between a top plate(60) and the compressing plate(62). A spindle(5) of the first micrometer(6) slides into an extended hole(5) and the second micrometer(6) mounted in the top plate(60) compresses a reference member(10). An adjusting bolt(57) adjusts the cut-off height of a cutter(54) firstly and the controlling member(3) controls the cut-off depth of an anisotropic conductive film(ACF). Exactly, the fine controlling device controls the cut-off depth of the ACF of the cutter(54) and the auxiliary fine controlling device controls the level finely.

Description

이방성 도전막 커팅 장치Anisotropic Conductive Film Cutting Device

본 발명은 커팅 장치에 관한 것으로서, 보다 상세하게는 액정 표시 소자와 구동 집적 회로를 연결할 때 사용되는 이방성 도전막의 하프 커팅 장치에 관한 것이다.The present invention relates to a cutting device, and more particularly, to a half cutting device of an anisotropic conductive film used when connecting a liquid crystal display element and a driving integrated circuit.

일반적으로, 액정 표시 소자의 구동을 위해 집적 회로를 연결하게 되는 바, 이는 TAB(Tape Automated Bonding)방식, COG(Chip On Glass) 방식등이 사용되는 바, 이는 액정 표시 소자의 해상도에 따라 적절하게 선택하게 된다.In general, an integrated circuit is connected to drive a liquid crystal display device, and a tape automated bonding (TAB) method or a chip on glass (COG) method is used, which is appropriately determined according to the resolution of the liquid crystal display device. Will be chosen.

즉, 액정 표시 소자의 해상도가 높아질수록 연결되는 리드의 폭이 작아지게 됨으로써 상기한 리드의 폭을 수용할 수 있는 집적 방식을 사용하게 되는 것이다.That is, the higher the resolution of the liquid crystal display device, the smaller the width of the leads to be connected, so that the integrated method that can accommodate the width of the leads is used.

여기서, 상기한 액정 표시 소자와 집적 회로의 연결에는 이방성 도전막(ACF : Anisotropic Conductive Film)이 사용되는 바, 이는 두께 15∼30㎛의 접착성 필름에 도전성 재료를 분산하여 형성한다.Here, an anisotropic conductive film (ACF) is used to connect the liquid crystal display device and the integrated circuit, which is formed by dispersing a conductive material in an adhesive film having a thickness of 15 to 30 μm.

상기한 이방성 도전막은 절연체인 보호막이 코팅된 상태이고, 사용할 때에는 도3에 도시된 바와 같이 이방성 도전막(ACF)만을 커팅하고 보호막(C)을 제거하는 소위, 하프 커팅 과정을 거치게 되는 것이다.The anisotropic conductive film is coated with a protective film as an insulator, and when used, is subjected to a so-called half-cutting process of cutting only the anisotropic conductive film (ACF) and removing the protective film (C) as shown in FIG. 3.

상기한 하프 커팅 공정은 도4와 도5에 도시된 바와 같은 커팅 장치를 사용하게 되는 바, 이는 저면에 실린더(50)가 설치된 하부 플레이트(51)와, 상기한 하부 플레이트(51)에 수평 이동 가능하도록 설치됨과 아울러 절단 깊이를 조절하도록 조절부(52)가 형성된 조절 플레이트(53)와, 상기한 조절 플레이트(53) 측면에 고정되고 커터(54)가 끼워지도록 고정홈(55)이 형성된 고정 플레이트(56)와, 상기한 커터(54)를 간헐 고정하도록 조절 볼트(57)로 고정홈(55)에 결합된 조절 플레이트(53)로 하부 블록(58)이 구성되어 있다.The half-cutting process uses a cutting device as shown in FIGS. 4 and 5, which includes a lower plate 51 having a cylinder 50 installed on the bottom thereof, and a horizontal movement on the lower plate 51. It is installed to be possible and the adjustment plate 53 is formed to adjust the cutting depth and the fixing plate 53 is fixed to the side of the control plate 53 and the fixing groove 55 is formed so that the cutter 54 is fitted The lower block 58 is constituted by the plate 56 and the adjusting plate 53 coupled to the fixing groove 55 by the adjusting bolt 57 so as to intermittently fix the cutter 54.

또한, 상기한 하부 블록(58)에 대응되도록 상부 블록(59)이 설치되는 바, 이는 하부 블록(58)의 상면에 위치되도록 고정된 상부 플레이트(60)와, 상기한 상부 플레이트(60)에 회전 가능하게 일측이 힌지(61)로 결합된 압착 플레이트(62)와, 상기한 압착 플레이트(62)의 회전 상태를 조절하도록 상부 플레이트(60)의 관통공(63)에 삽입됨과 아울러 압착 플레이트(62)에 일단이 고정되고 타단이 너트(64)로 상부 플레이트(60)에 지지된 조절 볼트(65)와, 상기한 압착 플레이트(62)와 상부 플레이트(60)를 연결한 스프링(66)으로 구성되어 있다.In addition, the upper block 59 is installed to correspond to the lower block 58, which is fixed to the upper plate 60 to be located on the upper surface of the lower block 58, the upper plate 60 One side is rotatably coupled to the pressing plate 62 coupled to the hinge 61, and inserted into the through hole 63 of the upper plate 60 to adjust the rotation state of the pressing plate 62 and the pressing plate ( 62, one end of which is fixed, and the other end of which is a nut 64, an adjustment bolt 65 supported on the upper plate 60, and a spring 66 that connects the pressing plate 62 and the upper plate 60. Consists of.

즉, 이방성 도전막(ACF)을 커팅하기 위해서는 작업자가 조절 볼트(57)를 풀은 후 고정홈(55)에 커터(54)를 끼우게 된다.That is, in order to cut the anisotropic conductive film (ACF), the operator loosens the adjustment bolt 57 and then inserts the cutter 54 into the fixing groove 55.

커터(54)를 끼운 후 조절부(52)와의 높이차를 이용하여 절단 깊이를 조정하게 되고, 상기한 조정 후 조절 볼트(57)를 돌려 고정시키게 된다.After inserting the cutter 54, the cutting depth is adjusted by using the height difference with the adjusting unit 52, and the adjustment bolt 57 is fixed by turning the adjusting bolt 57 after the adjustment.

조절 볼트(57)로 커터가(54) 고정되면 상기한 커터(54)와 대응되는 압착 플레이트(62)의 수평도를 조절하게 되는 바, 이는 상기한 상부 플레이트(60)에 설치된 너트(64)를 회전시키면서 조절하게 된다.When the cutter 54 is fixed by the adjustment bolt 57, the level of the pressing plate 62 corresponding to the cutter 54 is adjusted, which is the nut 64 installed on the upper plate 60. Rotate to adjust.

즉, 상기한 커터(54)의 수평도와 정확하게 일치하도록 압착 플레이트(62)를 조절함으로써 이방성 도전막(ACF)의 커팅 시 절단되는 각도가 전체적으로 균일하게 절단되도록 하는 것이다.That is, by adjusting the pressing plate 62 to exactly match the horizontality of the cutter 54, the angle cut during the cutting of the anisotropic conductive film ACF is uniformly cut as a whole.

그러나, 상기한 바와 같이 커터에 의한 절단 깊이와 절단 수평도를 조절 볼트로 조절하게 되면 상기한 조절 볼트의 나사산이 비교적 큰 피치를 갖고 있기 때문에 정밀한 조절이 어렵게 되는 문제점이 있다.However, as described above, when the cutting depth and the cutting horizontality of the cutter are adjusted by the adjustment bolt, the adjustment thread is difficult because the thread of the adjustment bolt has a relatively large pitch.

즉, 커터의 절단 깊이에 비해 비교적 큰 피치를 갖고 있는 조절 볼트로 이를 조절하는 것이 매우 어렵게 되는 것이다.That is, it becomes very difficult to adjust it with an adjusting bolt having a relatively large pitch compared to the cutting depth of the cutter.

따라서, 본 발명의 목적은 상기한 문제점을 해결하기 위한 것으로서, 커터에 의한 이방성 도전막의 절단 깊이 및 절단 수평도를 보다 정밀하게 제어함으로써 하프 커팅 작업 정밀도를 향상시킬 수 있는 이방성 도전막 커팅 장치를 제공함에 있다.Accordingly, an object of the present invention is to solve the above problems, to provide an anisotropic conductive film cutting device that can improve the half-cutting work precision by more precisely controlling the cutting depth and the cutting horizontality of the anisotropic conductive film by the cutter. Is in.

상기한 목적을 실현하기 위하여 본 발명은 커터가 높이 조절 가능하도록 끼워지고 커터에 의한 절단 깊이를 조절하도록 조절부가 형성된 조절 플레이트와, 상기한 조절부와 밀착되면서 절단 깊이를 조절하고 절단 시 수평도를 조절하도록 상부 플레이트에 힌지로 설치된 압착 플레이트를 포함하는 이방성 도전막 커팅 장치에 있어서, 상기한 조절 플레이트의 조절부와 접촉되면서 조절부 상단과 압착 플레이트 하면의 이격 거리를 미세 조절함으로써 커터의 절단 깊이를 조절하도록 압착 플레이트에 설치된 미세 조절 수단을 포함함을 특징으로 한다.In order to achieve the above object, the present invention is inserted into the cutter to adjust the height and the adjustment plate formed with an adjustment portion to adjust the cutting depth by the cutter, while adjusting the cutting depth while being in close contact with the control unit and the horizontal degree at In the anisotropic conductive film cutting device comprising a pressing plate hinged to the upper plate to adjust, the cutting depth of the cutter by finely adjusting the separation distance between the top of the adjusting portion and the lower surface of the pressing plate while being in contact with the adjusting portion of the adjusting plate And fine adjustment means installed on the pressing plate to adjust it.

도1은 본 발명에 따른 이방성 도전막 커팅 장치를 도시한 정면도.1 is a front view showing an anisotropic conductive film cutting device according to the present invention.

도2는 도1에서 커팅 장치 상부를 도시한 측면도.Figure 2 is a side view showing the cutting device top in Figure 1;

도3은 일반적인 이방성 도전막의 하프 커팅 상태를 도시한 개략도.3 is a schematic diagram showing a half cutting state of a general anisotropic conductive film.

도4는 도3에 따른 이방성 도전막 커팅 장치를 도시한 정면도.4 is a front view showing the anisotropic conductive film cutting device according to FIG.

도5는 도4의 측면도.Figure 5 is a side view of Figure 4;

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

1 : 동작공 2, 8 : 스프링1: operation hole 2, 8: spring

3 : 조절 부재 4 : 연장공3: adjustment member 4: extension hole

5 : 스핀들 6 : 제1마이크로미터5: spindle 6: first micrometer

7 : 경사부 9 : 연동 부재7 inclined portion 9 interlocking member

10 : 기준 부재 11 : 제2마이크로미터10 reference member 11: second micrometer

52 : 조절부 53 : 조절 플레이트52: adjusting part 53: adjusting plate

62 : 압착 플레이트62: crimp plate

도1과 도2는 본 발명에 따른 이방성 도전막 커팅 장치를 도시한 정면도와 도1에서 상부 블록만 도시한 측면도로서, 상기한 조절 플레이트(53)의 조절부(52)와 접촉되면서 조절부(52) 상단과 압착 플레이트(62) 하면의 이격 거리를 조절함으로써 커터(54)의 절단 깊이를 조절하도록 설치된 미세 조절 수단이 압착 플레이트(62)에 설치되어 있다.1 and 2 is a front view showing an anisotropic conductive film cutting device according to the present invention and a side view showing only the upper block in FIG. 1, while being in contact with the control unit 52 of the control plate 53, the control unit ( 52) Fine adjustment means provided to adjust the cutting depth of the cutter 54 by adjusting the separation distance between the upper end and the lower surface of the pressing plate 62 is provided on the pressing plate 62.

상기한 미세 조절 수단은 압착 플레이트(62)에 형성됨과 아울러 조절부(52)측으로 관통되어 있는 동작공(1)과, 상기한 동작공(1)에 삽입되어 승강 운동함과 아울러 상면이 스프링(2)으로 연결되어 상향힘을 받는 조절 부재(3)와, 상기한 조절 부재(3)를 미세 이동시킬 수 있도록 구성된 동작 수단으로 구성되어 있다.The fine adjustment means is formed in the pressing plate 62 and is inserted into the operation hole (1), which is penetrated toward the control unit 52 side, the operation hole (1) and the lifting motion and the upper surface of the spring ( It is composed of a control member (3) connected to 2) is subjected to an upward force, and the operating means configured to move the control member (3) finely.

즉, 상기한 조절 볼트(57)로 커터(54)의 절단 높이를 1차 조정한 후 상기한 미세 조절 수단을 조절함으로써 조절 부재(3)가 조절부(52)와의 간격을 조절하게 되고, 상기한 조절부(52)와의 이격 거리에 따라 이방성 도전막(ACF)의 절단 깊이를 조절할 수 있게 되는 것이다.That is, by adjusting the cutting height of the cutter 54 with the adjustment bolt 57 as described above, the adjustment member 3 adjusts the distance from the adjustment unit 52 by adjusting the fine adjustment means. The cutting depth of the anisotropic conductive film (ACF) can be adjusted according to the distance from the control unit 52.

상기한 동작 수단은 상기한 동작공(1)과 직교 상태로 형성된 연장공(4)과, 상기한 연장공(4)에 고정 설치됨과 아울러 상기한 연장공(4) 내부에서 스핀들(5)이 슬라이드 운동 가능하게 설치된 제1마이크로미터(6)와, 상기한 스핀들(5)과 접촉되어 슬라이드 운동함과 아울러 조절 부재(3)의 상단 경사부(7)에 일단이 밀착되어 조절부재(3)를 수직 운동시키고 제1마이크로미터(6)측으로 당기도록 스프링(8)이 연결된 연동 부재(9)로 구성되어 있다.The operation means is an extension hole (4) formed in a state orthogonal to the operation hole (1), and is fixed to the extension hole (4) and the spindle (5) inside the extension hole (4) The first micrometer 6 is installed to be able to slide and the spindle 5 is in contact with the slide movement, and one end is in close contact with the upper inclined portion 7 of the adjustment member (3) It consists of an interlocking member 9 connected with a spring 8 to vertically move and pull it toward the first micrometer 6 side.

물론, 상기한 제1마이크로미터(6)의 스핀들(5)이 직접 조절 부재(3)의 경사부(7)를 동작시켜도 되지만 압착 플레이트(62)에 제1마이크로미터(6)를 설치할 때 스핀들(5)의 운동 거리를 최소화하도록 연동 부재(9)가 설치되는 것이다.Of course, the above-described spindle 5 of the first micrometer 6 may operate the inclined portion 7 of the adjusting member 3 directly, but when the first micrometer 6 is installed on the pressing plate 62, the spindle The interlocking member 9 is provided so as to minimize the movement distance of (5).

특히, 상기한 압착 플레이트(62)의 수평도를 조절하기 위하여 상부 플레이트(60)와 압착 플레이트(62)의 사이에 보조 미세 조절 수단이 설치되어 있는 바, 이는 압착 플레이트(62)의 상단에 설치된 기준 부재(10)와, 상기한 기준 부재(10)를 압박하도록 상부 플레이트(60)에 수직 설치된 제2마이크로미터(11)로 구성되어 있다.Particularly, in order to adjust the horizontality of the pressing plate 62, an auxiliary fine adjusting means is installed between the upper plate 60 and the pressing plate 62, which is installed at the top of the pressing plate 62. It consists of the reference member 10 and the 2nd micrometer 11 installed perpendicular to the upper plate 60 so that the said reference member 10 may be pressed.

즉, 상기한 미세 조절 수단으로 커터(54)에 의한 이방성 도전막(ACF)의 절단 깊이를 조절하고, 보조 미세 조절 수단으로 절단 시 수평도를 미세 조절하게 되는 것이다.That is, the cutting depth of the anisotropic conductive film (ACF) by the cutter 54 is controlled by the fine adjustment means, and the horizontal degree is finely adjusted when cutting by the auxiliary fine adjustment means.

상기한 바와 같은 본 발명의 작용 효과를 설명하면 작업자가 이방성 도전막(ACF)을 하프 커팅하기 위하여 고정 플레이트(56)의 고정홈(55)에 커터(54)를 끼우게 된다. 커터(54)를 끼운 후 미리 설정된 높이로 커터(54)를 조절함과 아울러 조절 볼트(57)로 이를 고정시키게 된다.Referring to the operation and effect of the present invention as described above, the operator inserts the cutter 54 in the fixing groove 55 of the fixing plate 56 in order to half-cut the anisotropic conductive film (ACF). After inserting the cutter 54, the cutter 54 is adjusted to a preset height, and the fixing bolt 57 is fixed thereto.

커터(54)가 고정되면 상기한 커터(54)와 압착 플레이트(62)의 수평도를 조절하기 위하여 상기한 너트(64)를 회전시키게 된다.When the cutter 54 is fixed, the nut 64 is rotated to adjust the horizontality of the cutter 54 and the pressing plate 62.

너트(64)가 회전되면 조절 볼트(65)가 압착 플레이트(62)를 당기게 되고, 상기한 압착 플레이트(62)가 힌지(61)를 중심으로 회전하게 되는 바, 상기한 회전 시 커터(54)와의 수평도를 일치시키게 된다.When the nut 64 is rotated, the adjustment bolt 65 pulls the pressing plate 62, and the pressing plate 62 rotates about the hinge 61. To match the horizontal level.

특히, 상기한 조절 후 시험적으로 이방성 도전막(ACF)을 절단하게 되는 바, 상기한 절단 시 정확한 절단 깊이 및 수평도가 이루어지지 않게 되면 제1, 2마이크로미터(6, 11)를 조절하게 되는 것이다.In particular, the anisotropic conductive film (ACF) is experimentally cut after the above-described adjustment, and when the above-described cutting does not achieve accurate cutting depth and level, the first and second micrometers 6 and 11 are adjusted. Will be.

예를 들어, 절단 깊이가 너무 깊을 경우에는 제1마이크로미터(6)를 회전시키면서 연동 부재(9)를 전진시킴과 아울러 이와 경사부(7)로 접촉되어 있는 조절 부재(3)가 압착 플레이트(62)의 저면으로 일정 높이 돌출되도록 한다.For example, when the cutting depth is too deep, the interlocking member 9 is advanced while the first micrometer 6 is rotated, and the adjusting member 3 which is in contact with the inclined portion 7 is pressed against the pressing plate ( Protrude a certain height to the bottom of 62).

조절 부재(3)가 일정 높이로 돌출되면 상기한 조절부(52)와 접촉되면서 압착 플레이트(62)와 커터(54)의 실질적인 거리를 넓게 하는 바, 상기한 바와 같이 커터(54)와 압착 플레이트(62)의 거리를 넓게 하면 커터(54)가 이방성 도전막(ACF)을 커팅할 때 상기한 일정 높이만큼 절단하기 못하게 된다.When the adjusting member 3 protrudes to a predetermined height, the contacting part 52 is contacted with the adjusting member 52 to widen the substantial distance between the pressing plate 62 and the cutter 54, as described above. If the distance of 62 is widened, the cutter 54 will not be able to cut by the predetermined height when cutting the anisotropic conductive film ACF.

즉, 상기한 조절 부재(3)의 돌출 높이만큼 커터가 이방성 도전막(ACF)을 절단하지 못하게 됨으로써 실질적으로 절단 깊이를 조절하는 것이 된다.That is, the cutter cannot cut the anisotropic conductive film ACF by the height of the above-described protruding member 3, thereby substantially controlling the cutting depth.

또한, 상기한 절단 높이 조절이 완료되면 이방성 도전막(ACF)의 절단면이 수평이 되도록 함으로써 균일한 절단면을 얻기 위해 제2마이크로미터(11)를 조절하게 된다.In addition, when the cutting height adjustment is completed, the second micrometer 11 is adjusted to obtain a uniform cut surface by making the cut surface of the anisotropic conductive film ACF horizontal.

제2마이크로미터(11)를 미세 조절하면 제2마이크로미터(11)의 스핀들이 승강하면서 이와 접촉되는 기준 부재(10)를 압박하면서 미세한 수평 상태를 조절하게 되는 것이다.Fine adjustment of the second micrometer 11 is to adjust the fine horizontal state while pressing the reference member 10 which is in contact with the spindle while the second micrometer 11 is raised and lowered.

물론, 상기한 기준 부재(10)의 압박 시 상기한 스프링(66)이 압착 플레이트(62)를 상향시키고 있기 때문에 스핀들과 기준 부재(10)가 이격되면서 조절 불량이 발생되지 않게 된다.Of course, when the reference member 10 is pressed, the spring 66 raises the pressing plate 62 so that the spindle and the reference member 10 are spaced apart from each other so that poor adjustment does not occur.

이상과 같이 본 발명은 압착 플레이트에 제1, 2마이크로미터를 설치하여 조절 플레이트와 커터와의 간격 및 수평도를 미세 조절함으로써 정밀한 하프 커팅 공정 조절이 용이하게 되는 잇점이 있는 것이다.As described above, the present invention is advantageous in that it is easy to precisely control the half cutting process by installing the first and second micrometers on the crimping plate to finely adjust the spacing and horizontality between the adjusting plate and the cutter.

Claims (5)

커터의 높이 조절이 가능하도록 설치됨과 아울러 커터에 의한 이방성 도전막의 절단 깊이를 제한하도록 조절부가 형성된 조절 플레이트와, 상기한 조절부와 밀착되면서 절단 깊이를 조절하고 절단 시 수평도를 조절하도록 상부 플레이트에 힌지로 설치된 압착 플레이트를 포함하는 이방성 도전막 커팅 장치에 있어서, 상기한 조절 플레이트의 조절부와 접촉되면서 조절부 상단과 압착 플레이트 하면의 이격 거리를 미세 조절함으로써 커터의 절단 깊이를 조절하도록 압착 플레이트에 설치된 미세 조절 수단을 포함함을 특징으로 하는 이방성 도전막 커팅 장치.It is installed to adjust the height of the cutter and the control plate formed with an adjustment portion to limit the cutting depth of the anisotropic conductive film by the cutter, and the upper plate to adjust the depth of cut and adjust the level of the cutting while being in close contact with the control In the anisotropic conductive film cutting device comprising a crimp plate installed by a hinge, the contact plate to the crimp plate to adjust the cutting depth of the cutter by finely adjusting the separation distance of the upper end of the crimp plate and the lower surface of the crimp plate while in contact with the control portion of the control plate Anisotropic conductive film cutting device comprising a fine control means installed. 제1항에 있어서, 상기한 미세 조절 수단은 압착 플레이트에 형성됨과 아울러 조절부측으로 관통되어 있는 동작공과, 상기한 동작공에 삽입되어 승강 운동함과 아울러 상면이 스프링으로 연결되어 상향힘을 받는 조절 부재와, 상기한 조절 부재를 미세 이동시킬 수 있도록 구성된 동작 수단으로 구성함으로 특징으로 하는 이방성 도전막 커팅 장치.According to claim 1, wherein the fine adjustment means is formed in the pressing plate and the operation hole penetrated to the control unit side, the movement is inserted into the operation hole as well as the upper surface is connected to the spring is adjusted to receive the upward force An anisotropic conductive film cutting device, characterized by comprising a member and an operating means configured to finely move the adjustment member. 제2항에 있어서, 상기한 동작 수단은 상기한 동작공과 직교 상태로 형성된 연장공과, 상기한 연장공에 고정 설치됨과 아울러 상기한 연장공 내부에서 스핀들이 슬라이드 운동 가능하게 설치된 제1마이크로미터와, 상기한 스핀들의 수평 운동에 대해 직교 운동하도록 조절 부재의 상단에 형성된 경사부로 구성함을 특징으로 하는 이방성 도전막 커팅 장치.The method according to claim 2, wherein the operation means comprises an extension hole formed in a state perpendicular to the operation hole, a first micrometer fixedly installed in the extension hole and in which the spindle is slidably movable in the extension hole; An anisotropic conductive film cutting device, characterized in that consisting of an inclined portion formed on the upper end of the adjustment member to orthogonal to the horizontal movement of the spindle. (정정) 제1항에 있어서, 상기한 압착 플레이트의 수평도를 미세 조절하기 위하여 상부 플레이트와 압착 플레이트의 사이에 설치된 보조 미세 조절 수단을 포함함을 특징으로 하는 이방성 도전막 커팅 장치.(Correction) The anisotropic conductive film cutting device according to claim 1, further comprising auxiliary fine adjustment means provided between the upper plate and the pressing plate in order to finely adjust the horizontality of the pressing plate. 제4항에 있어서, 보조 미세 조절 수단은 압착 플레이트의 상단에 설치된 기준 부재와, 상기한 기준 부재를 압박하도록 스핀들의 밀착된 상부 플레이트에 수직 설치된 제2마이크로미터로 구성함을 특징으로 하는 이방성 도전막 커팅 장치.5. The anisotropic challenge according to claim 4, wherein the auxiliary fine adjustment means comprises a reference member provided on an upper end of the crimping plate and a second micrometer vertically installed on a close upper plate of the spindle so as to press the reference member. Membrane cutting device.
KR1019970068019A 1997-12-12 1997-12-12 A cutting device of anisotropic conductive film KR100259377B1 (en)

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KR102083453B1 (en) 2019-08-30 2020-03-02 주식회사 디앤에이시스템 Mixed tape cutting device

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KR102031690B1 (en) * 2018-02-01 2019-10-17 (주)안마이크론시스템 Cutting device for Anisotropic Conductive Film
KR102193858B1 (en) * 2019-09-25 2020-12-22 (주)제이스텍 ACF cutting block device
CN110978117B (en) * 2019-12-04 2024-09-06 深圳市联得自动化装备股份有限公司 ACF cutting device
KR102331363B1 (en) * 2020-06-19 2021-11-29 리노정밀(주) Jig Block Cutting Device for Inspection Apparatus

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* Cited by examiner, † Cited by third party
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KR102083453B1 (en) 2019-08-30 2020-03-02 주식회사 디앤에이시스템 Mixed tape cutting device

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