CN102088010A - Packaging structure of resin circuit board, chip and inverted heat dissipation block externally provided with radiator - Google Patents

Packaging structure of resin circuit board, chip and inverted heat dissipation block externally provided with radiator Download PDF

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Publication number
CN102088010A
CN102088010A CN2010105587555A CN201010558755A CN102088010A CN 102088010 A CN102088010 A CN 102088010A CN 2010105587555 A CN2010105587555 A CN 2010105587555A CN 201010558755 A CN201010558755 A CN 201010558755A CN 102088010 A CN102088010 A CN 102088010A
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CN
China
Prior art keywords
chip
radiator
circuit board
heat dissipation
resin circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2010105587555A
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Chinese (zh)
Inventor
王新潮
梁志忠
承杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu Changjiang Electronics Technology Co Ltd filed Critical Jiangsu Changjiang Electronics Technology Co Ltd
Priority to CN2010105587555A priority Critical patent/CN102088010A/en
Publication of CN102088010A publication Critical patent/CN102088010A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

The invention relates to a packaging structure of resin circuit board, chip and inverted heat dissipation block externally provided with radiator comprising a chip (3), single layer or multiple layers of resin circuit boards (9), metal lugs and a plastic package body (8). The packaging structure is characterized in that the a heat dissipation block (7) is arranged above the chip (3); an electric conduction or non electric conduction heat-conduction bonding substance II (6) is embedded between the heat dissipation block (7) and the chip (3); a radiator (11) is arranged above the heat dissipation block (7); and an electric conduction or non electric conduction heat-conduction bonding substance III (13) is embedded between the radiator (11) and the heat dissipation block (7). The packaging structure has strong heat dissipation capability, and the heat of the chip can be quickly transferred to the outside of the package body.

Description

Resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure
Technical field
The present invention relates to a kind of resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure.Belong to the semiconductor packaging field.
Background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
Summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, providing a kind of can provide heat dissipation capability strong resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure.
The object of the present invention is achieved like this: a kind of resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure, include the single or multiple lift resin circuit board that is carried of chip, chip below, conduction or nonconducting heat conduction bonding material I and the plastic-sealed body between metal coupling, chip and the described single or multiple lift resin circuit board that chip is used to the signal interconnection of single or multiple lift resin circuit board, above described chip, be provided with radiating block, be equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; Above described radiating block, be provided with radiator, be equipped with conduction or nonconducting heat conduction bonding material III between this radiator and the described radiating block.
The invention has the beneficial effects as follows:
The present invention passes through addition radiating block above chip, and sets up radiator outside plastic-sealed body, serves as the function of the heat radiation of high heat, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
Description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure embodiment 1 schematic diagram of the present invention.
Fig. 6 is resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure embodiment 2 schematic diagrames of the present invention.
Fig. 7 is resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure embodiment 3 schematic diagrames of the present invention.
Fig. 8 is resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure embodiment 4 schematic diagrames of the present invention.
Fig. 9 is resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure embodiment 5 schematic diagrames of the present invention.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I 2, chip 3, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, plastic-sealed body 8, resin circuit board 9, metal coupling 10, radiator 11, conduction or nonconducting heat conduction bonding material III 13.
Embodiment
Embodiment 1:
Referring to Fig. 5, Fig. 5 is resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure embodiment 1 schematic diagram of the present invention.As seen from Figure 5, resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure of the present invention, include the single or multiple lift resin circuit board 9 that is carried of chip 3, chip below, conduction or nonconducting heat conduction bonding material I 2 and the plastic-sealed body 8 between metal coupling 10, chip and the described single or multiple lift resin circuit board that chip is used to the signal interconnection of single or multiple lift resin circuit board, above described chip 3, be provided with radiating block 7, be equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Above described radiating block 7, be provided with radiator 11, be equipped with conduction or nonconducting heat conduction bonding material III 13 between this radiator 11 and the described radiating block 7.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
The material of described metal coupling 10 can be tin, gold or alloy etc.
The material of described radiator 11 can be copper, aluminium, pottery or alloy etc.
Embodiment 2:
Embodiment 2 only is with the difference of embodiment 1: described radiator 11 is for radiating cap, as Fig. 6.
Embodiment 3:
Embodiment 3 only is with the difference of embodiment 1: described radiator 11 is for heating panel, as Fig. 7.
Embodiment 4:
Embodiment 4 only is with the difference of embodiment 1: described radiating block 7 is inverted T-shape structure, as Fig. 8.
Embodiment 5:
Embodiment 5 only is with the difference of embodiment 1: described radiating block 7 rectangular structures, and as Fig. 9.

Claims (8)

1. resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure, include chip (3), the single or multiple lift resin circuit board (9) that is carried of chip below, the metal coupling that chip is used to the signal interconnection of single or multiple lift resin circuit board (10), conduction between chip and the described single or multiple lift resin circuit board or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), it is characterized in that being provided with radiating block (7), be equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3) in described chip (3) top; Be provided with radiator (11) in described radiating block (7) top, be equipped with conduction or nonconducting heat conduction bonding material III (13) between this radiator (11) and the described radiating block (7).
2. a kind of resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
3. a kind of resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described metal coupling (10) is tin, gold or alloy.
4. a kind of resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structure according to claim 1, the material that it is characterized in that described radiator (11) is copper, aluminium, pottery or alloy.
5. according to claim 1,2,3 or 4 described a kind of resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structures, it is characterized in that: described radiator (11) is a radiating cap.
6. according to claim 1,2,3 or 4 described a kind of resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structures, it is characterized in that: described radiator (11) is a heating panel.
7. according to claim 1,2,3 or 4 described a kind of resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structures, it is characterized in that: described radiating block (7) is inverted T-shape structure.
8. according to claim 1,2,3 or 4 described a kind of resin circuit board chip-flip heat dissipation block externally connected with radiator encapsulating structures, it is characterized in that: the rectangular structure of described radiating block (7).
CN2010105587555A 2010-01-30 2010-11-25 Packaging structure of resin circuit board, chip and inverted heat dissipation block externally provided with radiator Pending CN102088010A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010105587555A CN102088010A (en) 2010-01-30 2010-11-25 Packaging structure of resin circuit board, chip and inverted heat dissipation block externally provided with radiator

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
CN201010117375 2010-01-30
CN201010117375.8 2010-01-30
CN201010117302 2010-01-30
CN201010117733 2010-01-30
CN201010117803 2010-01-30
CN201010117870.9 2010-01-30
CN201010117302.9 2010-01-30
CN201010117870 2010-01-30
CN201010117733.5 2010-01-30
CN201010117803.7 2010-01-30
CN2010105587555A CN102088010A (en) 2010-01-30 2010-11-25 Packaging structure of resin circuit board, chip and inverted heat dissipation block externally provided with radiator

Publications (1)

Publication Number Publication Date
CN102088010A true CN102088010A (en) 2011-06-08

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CN2010105587555A Pending CN102088010A (en) 2010-01-30 2010-11-25 Packaging structure of resin circuit board, chip and inverted heat dissipation block externally provided with radiator

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CN (1) CN102088010A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814536A (en) * 1995-12-27 1998-09-29 Lsi Logic Corporation Method of manufacturing powdered metal heat sinks having increased surface area
CN1355564A (en) * 2000-11-24 2002-06-26 矽品精密工业股份有限公司 Semiconductor package and its making method
CN1630073A (en) * 2003-12-19 2005-06-22 威宇科技测试封装有限公司 Chip ball grid array packaging structure
CN1725460A (en) * 2005-05-27 2006-01-25 江苏长电科技股份有限公司 Plane button type packing technology of integrated circuit or discrete component and its packing structure
CN101221944A (en) * 2007-01-09 2008-07-16 矽品精密工业股份有限公司 Cooling type semiconductor packaging member

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5814536A (en) * 1995-12-27 1998-09-29 Lsi Logic Corporation Method of manufacturing powdered metal heat sinks having increased surface area
CN1355564A (en) * 2000-11-24 2002-06-26 矽品精密工业股份有限公司 Semiconductor package and its making method
CN1630073A (en) * 2003-12-19 2005-06-22 威宇科技测试封装有限公司 Chip ball grid array packaging structure
CN1725460A (en) * 2005-05-27 2006-01-25 江苏长电科技股份有限公司 Plane button type packing technology of integrated circuit or discrete component and its packing structure
CN101221944A (en) * 2007-01-09 2008-07-16 矽品精密工业股份有限公司 Cooling type semiconductor packaging member

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Application publication date: 20110608