CN102081180B - Method for manufacturing micro step reflecting mirror by extruding substrates with adjustable inclination angles - Google Patents
Method for manufacturing micro step reflecting mirror by extruding substrates with adjustable inclination angles Download PDFInfo
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- CN102081180B CN102081180B CN2010105927788A CN201010592778A CN102081180B CN 102081180 B CN102081180 B CN 102081180B CN 2010105927788 A CN2010105927788 A CN 2010105927788A CN 201010592778 A CN201010592778 A CN 201010592778A CN 102081180 B CN102081180 B CN 102081180B
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Abstract
The invention relates to a method for manufacturing a micro step reflecting mirror by extruding substrates with adjustable inclination angles. The method comprises the following steps of: grinding and polishing N+1 rectangular substrates; arranging a manufactured standard block at one end of a first base, and arranging a flatwise substrate on the first base; arranging one end of a second base of which the lower surface is provided with metal scale marks at a contact included angle between the standard block and the first base, and suspending the other end of the second base above the flatwise substrate; adjusting a fine adjustment frame to ensure that the distance between the flatwise substrate and the standard block meets the set requirement; sequentially stacking the rest of substrates on the second base and tightly pressing; extruding the substrates to the direction of the standard block and extruding the substrates downwards simultaneously to form a step structure, and bonding and fixing the substrates; and depositing a reflection increasing film layer and a protective film layer on the upper surface of the step surface. The method effectively improves the control accuracy of roughness of a step surface, and longitudinal dimensional accuracy, and has high process controllability and repeatability.
Description
Technical field
The present invention relates to a kind of method for making of little ladder catoptron, the method that particularly a kind of adjustable inclination extruding substrate is made little ladder catoptron.
Background technology
Little ladder catoptron with a plurality of steps is a kind of reflection of light device, and application is more and more widely arranged in optical system, as: spectral analysis, beam shaping and optical fiber coupling etc.
Along with optical system is little to volume, the compact conformation direction develops, the device miniature in the optical system changes into an important subject into optical device, and minitype optical device design and fabrication level directly determines the performance of optical instrument.At present, through binary optical technique can be on multiple material substrate such as quartz through repeatedly photoetching and repeatedly corrosion (dry method or wet method) preparation multi-ladder microstructure, still, there is following shortcoming in this method: 1, because of alignment repeatedly, horizontal accuracy is difficult to assurance; 2, corrosion or etching depth are difficult to accurate control, and precision is relatively poor with repeatability; 3, corrode or the mirror surface roughness that etches is difficult to satisfy the optical instrument requirement.
Summary of the invention
It is strong that the technical matters that the present invention will solve provides a kind of process controllability, the method that micro-reflector surfaceness, horizontal accuracy, face shape, ladder height control accuracy adjustable inclination extruding substrate high, good reproducibility are made little ladder catoptron.
In order to solve the problems of the technologies described above, the method that adjustable inclination extruding substrate of the present invention is made little ladder catoptron comprises the steps:
(1), select for use the N+1 sheet can process the substrate of solid material as little ladder catoptron, and it is carried out clean;
(2), the left surface and the right flank of each substrate ground and polish, make its surfaceness reach 0.1nm～1 μ m, left surface is parallel to right flank, and the thickness of each substrate reaches the same size of setting; Then each substrate is carried out clean;
(3), substrate that the N+1 slice lapping is accomplished stacks successively, and the right flank of each substrate is contacted with the left surface face of adjacent substrate, stacks afterwards upper surface coplane, the lower surface coplane of each substrate; Be adhesively fixed together with each substrate that will solidify after glue will stack then;
(4), the substrate that will be adhesively fixed together places on the grinding table, grinds the upper surface of each substrate, makes its surfaceness reach 0.1nm～1 μ m, face shape reaches 0.1～10nm; And the upper surface of each substrate is perpendicular to its left surface and right flank; Spend sol solution then and remove curing glue, clean substrate;
(5), grind and polish two rectangular parallelepipeds as first substrate and second substrate of regulating the inclination angle; Make upper surface, the lower surface of upper surface and second substrate of first substrate, the surfaceness of left surface reach 0.1nm～1 μ m; And the upper surface of second substrate is parallel to lower surface, and left surface is perpendicular to its upper surface; Clean first substrate and second substrate;
(6), on the lower surface of second substrate, adopt magnetron sputtering or radio-frequency sputtering or ion beam sputtering or d.c. sputtering or electron beam evaporation or thermal evaporation method vapor deposition or sputter to set the metal film of thickness; Resist coating, mask exposure, development then forms the equidistant tree lace bar of setting width; In acid solution, erode the metal film that is not covered, remove photoresist then, form the metal scale mark that is parallel to the second substrate left surface by photoresist;
(7), grind and polish rectangular parallelepiped as being fixed on the first suprabasil calibrated bolck, the right flank of calibrated bolck and the surfaceness of lower surface reach 0.1nm～1 μ m, and the right flank of calibrated bolck is perpendicular to lower surface; Clean calibrated bolck;
(8), the calibrated bolck that will in step (seven), complete places an end of first substrate, the lower surface of calibrated bolck contacted with the upper surface coplane of first substrate and be adhesively fixed;
(9), the wherein a slice substrate in the N+1 sheet substrate that step (four) is completed lies in first substrate, and this right flank that keeps flat substrate is contacted with the upper surface face of first substrate; One end of second substrate is placed on the angle that contacts of calibrated bolck and first substrate, and the other end is suspended in the top that keeps flat substrate; Staircase structure size according to little ladder catoptron is calculated the upper surface that keeps flat substrate, and the setpoint distance between the right flank of calibrated bolck, and finds the second suprabasil respective metal scale mark corresponding with this setpoint distance; Regulate the position that keeps flat substrate through being fixed on the first suprabasil fine adjustment frame, make to keep flat substrate and aim at above-mentioned respective metal scale mark with the osculatory between second substrate; After regulating second substrate and the relative position that keeps flat between the substrate are fixed;
(10), remaining N sheet substrate is overlayed in second substrate successively and compresses, the right flank of each substrate is contacted with the left surface face of adjacent substrate; When the direction of calibrated bolck is pushed each substrate, push each substrate downwards, treat with solidifying glue each substrate to be adhesively fixed after N the step surface formation, form staircase structure with mass;
The upper surface deposition of (11), the staircase structure that obtains in step (ten) increases anti-rete and protective film.
The present invention is owing to adopt the method for inclination angle extruding substrate to make little ladder catoptron, and the height of every layer of ladder can accurately be controlled, and the reflecting surface of each step is that same batch of grinding and polishing forms; So surface shape can both be consistent with roughness; And reach the parameter of designing requirement, improved control accuracy, the longitudinal size precision of stepped surfaces roughness effectively, process controllability is strong; Good reproducibility, the micro-reflector surfaceness is low, flatness is high.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is done further explain.
Fig. 1 a, 1b are respectively the front view and the stereographic map of substrate.
Fig. 2 is the upward view of second substrate.
Fig. 3 makes the apparatus structure synoptic diagram of little ladder mirror approach for realizing adjustable inclination extruding substrate of the present invention.
Embodiment
Embodiment 1
The method concrete steps that adjustable inclination extruding substrate of the present invention is made little ladder catoptron are following:
(1), the used material of the substrate of little ladder catoptron is that silicon chip, glass, silicon dioxide, silit, molybdenum sheet or piezoid etc. can be processed solid material.Select 21 substrates for use; Six faces of substrate are respectively left surface 21, right flank 22, upper surface 23, lower surface 24, surface, back 25, front surface 26 (shown in Fig. 1 a, 1b); Wherein, left surface 21 is the face of broad with right flank 22, and all the other four faces are narrower face; Little ladder catoptron number of steps is 20; Substrate is carried out clean, and the step of its clean is:
1) with toluene, acetone, ethanol ultrasonic cleaning 15 minutes, removes organism such as greasy dirt;
2) use the deionized water ultrasonic cleaning, absolute ethyl alcohol dehydration back oven dry.
(2), the left surface 21 and the right flank 22 of every substrate ground and polish, make its thickness reach the setting size, left surface 21 is parallel to right flank 22, and every substrate thickness is measure-alike, all is 1.5mm.After the grinding, the left surface 21 of every substrate and the surfaceness of right flank 22 all reach 0.1nm～1 μ m.Substrate to after grinding carries out clean, and the step of its clean is:
1) with toluene, acetone, ethanol ultrasonic cleaning 15 minutes, removes organism such as greasy dirt;
2) use the deionized water ultrasonic cleaning, absolute ethyl alcohol dehydration back oven dry.
(3), the substrate of accomplishing is ground, cleaned to step (two) neatly stacks successively; The right flank 22 of each substrate is contacted with 21 of the left surfaces of adjacent substrate; Promptly the right flank 22 of first substrate contacts with 21 of the left surfaces of second substrate; The right flank 22 of second substrate contacts with 21 of the left surfaces of the 3rd substrate, Upper surface 23 coplanes of 21 substrates after stacking, lower surface 24 coplanes; Then, be coated with ultra-violet curing glue and curing, each overlapping substrate is bonded together on the front surface 25 and the surface, back 26 of each substrate.
(4), the substrate that is bonded together that step (three) is completed places on the grinding table, grinds the upper surface 23 of each substrate, makes its surfaceness reach 0.1nm～1 μ m, face shape reaches 0.1～10nm; And the upper surface 23 of each substrate is perpendicular to its left surface 21 and right flank 22.Spend sol solution and remove ultra-violet curing glue, clean substrate.
(5), select for use silicon, glass, silicon dioxide, silit, molybdenum or quartz etc. can process solid material and grind and polish two rectangular parallelepipeds as first substrate 31 and second substrate 32 (as shown in Figure 3) of regulating the inclination angle; First substrate 31 is of a size of 160 * 160 * 4mm, and second substrate 32 is of a size of 160 * 140 * 4mm.The upper surface 311 and lower surface 312 broads of first substrate 31, remaining surface is narrower, the upper surface 321 and lower surface 322 broads of second substrate 32, remaining surface is narrower; Require upper surface 311 and the upper surface 321 of second substrate 32, the surfaceness of lower surface 322 of first substrate 31 to reach 0.1nm～1 μ m; Polish the left surface 323 of second substrate 32, make its surfaceness reach 0.1nm～1 μ m, and the upper surface 321 of second substrate 32 is parallel to lower surface 322, left surface 323 is perpendicular to its upper surface 321; Because left surface 323 surfacenesses of second substrate 32 are less, and perpendicular to its upper surface 321 and lower surface 322, thereby can contact fully with the right flank 12 of calibrated bolck 1, the precision of second substrate, 32 angular adjustment guaranteed; Clean first substrate 31 and second substrate 32.
(6), as shown in Figure 2; On the lower surface 322 of second substrate 32, adopt the metal film of magnetron sputtering or radio-frequency sputtering or ion beam sputtering or d.c. sputtering or electron beam evaporation or thermal evaporation method vapor deposition or sputter 10～300nm; Resist coating, mask exposure, development then; Form the equidistantly tree lace bar of (spacing is 500 μ m), the wide 500 μ m of tree lace bar; In acid solution, erode the metal film that is not covered by photoresist, remove photoresist then, forming spacing is the metal scale mark of 500 μ m; The metal scale mark is parallel with the left surface 323 of second substrate 32, and this metal scale mark is used for the accurate demarcation of adjustable range.
(7), grind and polish a rectangular parallelepiped as being fixed on the calibrated bolck 1 (as shown in Figure 3) in first substrate 31; Calibrated bolck 1 is of a size of 40 * 30 * 20mm, the left surface 11 and right flank 12 broads of calibrated bolck 1, and its lap is narrower; Require the right flank 12 of calibrated bolck 1 and the surfaceness of lower surface 13 to reach 0.1nm～1 μ m, and the right flank 12 that requires calibrated bolck 1 is perpendicular to lower surface 13.Clean calibrated bolck 1.
(8), as shown in Figure 3, the calibrated bolck 1 that will in step (seven), complete places an end of first substrate 31, and the lower surface 13 of calibrated bolck 1 is contacted with upper surface 311 coplanes of first substrate 31; With ultra-violet curing glue the calibrated bolck 1 and first substrate 31 are adhesively fixed.
(9), as shown in Figure 3; Wherein a slice substrate 20 in 21 substrates that step (four) is completed lies in first substrate 31; This right flank that keeps flat substrate 20 22 is contacted with 311 of the upper surfaces of first substrate 31, and the upper surface 23 that keeps flat substrate 20 is near calibrated bolck 1; Keeping flat substrate 20 can slip on first substrate 31.One end of second substrate 32 is placed on the angle that contacts of calibrated bolck 1 and first substrate 31, and the other end is suspended in the top that keeps flat substrate 20, makes second substrate 32 respectively with first substrate 31, calibrated bolck 1 with keep flat substrate 20 lines and contact; Use the fine adjustment frame that is fixed in first substrate 31 7 to regulate to be provided with the distance between the right flank 12 of the upper surface 23 that keeps flat substrate 20 and calibrated bolck 1 to be 75mm, this distance is read by the middle metal scale mark for preparing of step (six); After regulating with second substrate 32 with keep flat substrate 20 lockings, like this by first substrate 31, second substrate 32, calibrated bolck 1 with keep flat the anchor clamps that substrate 20 has just been formed adjustable inclination.
(10), remaining 20 substrates 2 are overlayed in second substrate 32 again successively, and the right flank 22 of each substrate 2 is contacted with 21 of the left surfaces of adjacent substrate; Second catch 43 is placed the left side of calibrated bolck 1; First catch 42 places the right side of last a slice substrate; One end of extruding screw 43 is fixedly connected with second catch 44; The other end is fixedly connected with the left end of extrusion spring 5, and extruding screw 41 is connected with the right-hand member of spring 5, and the other end passes first catch 42 and flexibly connects with extruding nut 45; Rotation extrusion nut 45 makes first catch 42 compress each substrate; Adopt mass 64 to push each substrate successively downwards, each substrate is contacted with second matrix lines, formation has the staircase structure of 20 step surfaces; Front surface 26 at 20 substrates 2 applies infrared or ultra-violet curing glue with surface, back 25, and infrared or ultra-violet curing forms 20 ledge structures, and each step is 30 μ m, and error is about 100nm.
The upper surface deposition of (11), the staircase structure that obtains in step (ten) increases anti-rete and protective film.
So far, little ladder catoptron of accomplishing 20 steps is made.
The method concrete steps that extruding substrate in inclination angle of the present invention is made little ladder catoptron are following:
(1), the used material of the substrate of little ladder catoptron is that silicon chip, glass, silicon dioxide, silit, molybdenum sheet or piezoid etc. can be processed solid material.Select 31 substrates for use, six faces of substrate are respectively left surface 21, right flank 22, upper surface 23, lower surface 24, surface, back 25, front surface 26, and wherein, left surface 21 is the face of broad with right flank 22, and all the other four faces are narrower face; Little ladder catoptron number of steps is 30; Substrate is carried out clean, and the step of its clean is:
1) with toluene, acetone, ethanol ultrasonic cleaning 15 minutes, removes organism such as greasy dirt;
2) use the deionized water ultrasonic cleaning, absolute ethyl alcohol dehydration back oven dry.
(2), the left surface 21 and the right flank 22 of every substrate ground and polish, make its thickness reach the setting size, left surface 21 is parallel to right flank 22, and every substrate thickness is measure-alike, all is 0.8mm.After the grinding, the left surface 21 of every substrate and the surfaceness of right flank 22 all reach 0.1nm～1 μ m.Substrate to after grinding carries out clean, and the step of its clean is:
1) with toluene, acetone, ethanol ultrasonic cleaning 15 minutes, removes organism such as greasy dirt;
2) use the deionized water ultrasonic cleaning, absolute ethyl alcohol dehydration back oven dry.
(3), the substrate of accomplishing is ground, cleaned to step (two) neatly stacks successively; The right flank 22 of each substrate is contacted with 21 of the left surfaces of adjacent substrate; Promptly the right flank 22 of first substrate contacts with 21 of the left surfaces of second substrate; The right flank 22 of second substrate contacts with 21 of the left surfaces of the 3rd substrate, And upper surface 23 coplanes of 31 substrates after stacking, lower surface 24 coplanes; Then, be coated with ultra-violet curing glue and curing, each overlapping substrate is bonded together on the front surface 25 and the surface, back 26 of each substrate.
(4), the substrate that is bonded together that step (three) is completed places on the grinding table, grinds the upper surface 23 of each substrate, makes its surfaceness reach 0.1nm～1 μ m, face shape reaches 0.1～10nm; And the upper surface 23 of each substrate is perpendicular to its left surface 21 and right flank 22.Spend sol solution and remove ultra-violet curing glue, clean substrate.
(5), select for use silicon, glass, silicon dioxide, silit, molybdenum or quartz etc. can process solid material and grind and polish two rectangular parallelepipeds as first substrate 31 and second substrate 32 (as shown in Figure 3) of regulating the inclination angle; First substrate 31 is of a size of 160 * 160 * 4mm, and second substrate 32 is of a size of 160 * 140 * 4mm.The upper surface 311 and lower surface 312 broads of first substrate 31, remaining surface is narrower, the upper surface 321 and lower surface 322 broads of second substrate 32, remaining surface is narrower; Require upper surface 311 and the upper surface 321 of second substrate 32, the surfaceness of lower surface 322 of first substrate 31 to reach 0.1nm～1 μ m; Polish the left surface 323 of second substrate 32, make its surfaceness reach 0.1nm～1 μ m, and the upper surface 321 of second substrate 32 is parallel to lower surface 322, left surface 323 is perpendicular to its upper surface 321; Because left surface 323 surfacenesses of second substrate 32 are higher, and perpendicular to its upper surface 321 and lower surface 322, thereby can contact fully with the right flank 12 of calibrated bolck 1, the precision of second substrate, 32 angular adjustment guaranteed; Clean first substrate 31 and second substrate 32.
(6), as shown in Figure 2; On the lower surface 322 of second substrate 32, adopt the metal film of magnetron sputtering or radio-frequency sputtering or ion beam sputtering or d.c. sputtering or electron beam evaporation or thermal evaporation method vapor deposition or sputter 10～300nm; Resist coating, mask exposure, development then; Form the equidistantly tree lace bar of (spacing is 500 μ m), the wide 500 μ m of tree lace bar; In acid solution, erode the metal film that is not covered by photoresist, remove photoresist then, forming spacing is the metal scale mark of 500 μ m, and the metal scale mark is parallel with the left surface 323 of second substrate 32; This metal scale mark is used for the accurate demarcation of adjustable range;
(7), grind and polish a rectangular parallelepiped as being fixed on the calibrated bolck 1 in first substrate 31; Calibrated bolck 1 is of a size of 40 * 30 * 20mm, the left surface 11 and right flank 12 broads of calibrated bolck 1, and its lap is narrower; Require the right flank 12 of calibrated bolck 1 and the surfaceness of lower surface 13 to reach 0.1nm～1 μ m, and the right flank 12 that requires calibrated bolck 1 is perpendicular to lower surface 13.Clean calibrated bolck 1.
(8), as shown in Figure 3, the calibrated bolck 1 that will in step (seven), complete places an end of first substrate 31, and the lower surface 13 of calibrated bolck 1 is contacted with upper surface 311 coplanes of first substrate 31; With ultra-violet curing glue the calibrated bolck 1 and first substrate 31 are adhesively fixed.
(9), the wherein a slice substrate 20 in 31 substrates that step (four) is completed lies in first substrate 31, and this right flank that keeps flat substrate 20 22 is contacted with 311 of the upper surfaces of first substrate 31, the upper surface 23 that keeps flat substrate 20 is near calibrated bolck 1; Keeping flat substrate 20 can slip on first substrate 31.One end of second substrate 32 is placed on the angle that contacts of calibrated bolck 1 and first substrate 31, and the other end is suspended in the top that keeps flat substrate 20, makes second substrate 32 respectively with first substrate 31, calibrated bolck 1 with keep flat substrate 20 lines and contact; Use the fine adjustment frame that is fixed in first substrate 31 7 to regulate to be provided with the distance between the right flank 12 of the upper surface 23 that keeps flat substrate 20 and calibrated bolck 1 to be 128mm, this distance is read by the middle metal scale mark for preparing of step (six); After regulating with second substrate 32 with keep flat substrate 20 lockings, like this by first substrate 31, second substrate 32, calibrated bolck 1 with keep flat the anchor clamps that substrate 20 has just been formed adjustable inclination.
(10), remaining 30 substrates 2 are overlayed in second substrate 32 again successively, and the right flank 22 of each substrate 2 is contacted with 21 of the left surfaces of adjacent substrate; Second catch 43 is placed the left side of calibrated bolck 1; First catch 42 places the right side of last a slice substrate; One end of extruding screw 43 is fixedly connected with second catch 44; The other end is fixedly connected with the left end of extrusion spring 5, and extruding screw 41 is connected with the right-hand member of spring 5, and the other end passes first catch 42 and flexibly connects with extruding nut 45; Rotation extrusion nut 45 makes first catch 42 compress each substrate; Adopt mass 64 to push each substrate successively downwards, each substrate is contacted with second matrix lines, formation has the staircase structure of 20 step surfaces; Front surface 26 at 30 substrates 2 applies infrared or ultra-violet curing glue with surface, back 25, and infrared or ultra-violet curing forms 30 ledge structures, and each step is 5 μ m, and error is about 80nm.
The upper surface deposition of (11), the staircase structure that obtains in step (ten) increases anti-rete and protective film.
So far, little ladder catoptron of accomplishing 30 steps is made.
Among the embodiment 1,2:
Described substrate, mass, calibrated bolck and first substrate, second base material can adopt fused quartz, molybdenum sheet, silit, glass or silicon dioxide; The solution that removes photoresist that solidifies glue is sulfuric acid and nitric acid mixed solution or acetone and ether mixed solution.
Increase anti-rete is deposited on the staircase structure that step (ten) obtains through magnetron sputtering or radio-frequency sputtering or ion beam sputtering or d.c. sputtering or electron beam evaporation or thermal evaporation method upper surface in the described step (11).
Described increasing on the anti-rete deposits protective film, to prevent the film material oxidation.
Described protective film material adopts MgF
2, Al
2O
3Or SiO
2
Claims (1)
1. the method that adjustable inclination extruding substrate is made little ladder catoptron is characterized in that comprising the steps:
(1), select for use the N+1 sheet can process the substrate of solid material as little ladder catoptron, and it is carried out clean;
(2), the left surface (21) and the right flank (22) of each substrate ground and polish, make its surfaceness reach 0.1nm～1 μ m, left surface (21) is parallel to right flank (22), and the thickness of each substrate reaches the same size of setting; Then each substrate is carried out clean;
(3), substrate that the N+1 slice lapping is accomplished stacks successively, and the right flank (22) of each substrate is contacted with left surface (21) face of adjacent substrate, stacks afterwards upper surface (23) coplane, lower surface (24) coplane of each substrate; Be adhesively fixed together with each substrate that will solidify after glue will stack then;
(4), the substrate that will be adhesively fixed together places on the grinding table, grinds the upper surface (23) of each substrate, makes its surfaceness reach 0.1nm～1 μ m, face shape reaches 0.1～10nm; And the upper surface of each substrate (23) is perpendicular to its left surface (21) and right flank (22); Spend sol solution then and remove curing glue, clean substrate;
(5), grind and polish two rectangular parallelepipeds as first substrate (31) and second substrate (32) of regulating the inclination angle; Make upper surface (321), the lower surface (322) of upper surface (311) and second substrate (32) of first substrate (31), the surfaceness of left surface (323) reach 0.1nm～1 μ m; And the upper surface (321) of second substrate (32) is parallel to lower surface (322), and left surface (323) is perpendicular to its upper surface (321); Clean first substrate (31) and second substrate (32);
(6), go up the metal film that adopts magnetron sputtering or radio-frequency sputtering or ion beam sputtering or d.c. sputtering or electron beam evaporation or thermal evaporation method vapor deposition or sputter setting thickness at the lower surface (322) of second substrate (32); Resist coating, mask exposure, development then forms the equidistant tree lace bar of setting width; In acid solution, erode the metal film that is not covered, remove photoresist then, form the metal scale mark that is parallel to second substrate (32) left surface (323) by photoresist;
(7), grind and polish a rectangular parallelepiped as being fixed on the calibrated bolck (1) in first substrate (31); The right flank (12) of calibrated bolck (1) and the surfaceness of lower surface (13) reach 0.1nm～1 μ m, and the right flank (12) of calibrated bolck (1) is perpendicular to lower surface (13); Clean calibrated bolck (1);
(8), the calibrated bolck (1) that will in step (seven), complete places an end of first substrate (31), the lower surface (13) of calibrated bolck (1) contacted with upper surface (311) coplane of first substrate (31) and be adhesively fixed;
(9), the wherein a slice substrate (20) in the N+1 sheet substrate that step (four) is completed lies in first substrate (31), and this right flank that keeps flat substrate (20) (22) is contacted with upper surface (311) face of first substrate (31); One end of second substrate (32) is placed on the angle that contacts of calibrated bolck (1) and first substrate (31), and the other end is suspended in the top that keeps flat substrate (20); Staircase structure size according to little ladder catoptron is calculated the upper surface (23) that keeps flat substrate (20), and the setpoint distance between the right flank (12) of calibrated bolck (1), and finds the respective metal scale mark in second substrate (32) corresponding with this setpoint distance; Fine adjustment frame (7) through being fixed in first substrate (31) is regulated the position keep flat substrate (20), makes to keep flat substrate (20) and aim at above-mentioned respective metal scale mark with the osculatory between second substrate (32); After regulating second substrate (32) and the relative position that keeps flat between the substrate (20) are fixed;
(10), remaining N sheet substrate is overlayed second substrate (32) successively go up and compress, the right flank (22) of each substrate is contacted with left surface (21) face of adjacent substrate; When the direction of calibrated bolck (1) is pushed each substrate, push each substrate downwards, treat with solidifying glue each substrate to be adhesively fixed after N the step surface formation, form staircase structure with mass (64);
The upper surface deposition of (11), the staircase structure that obtains in step (ten) increases anti-rete and protective film.
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| CN1786742A (en) * | 2005-12-07 | 2006-06-14 | 乐孜纯 | Process for mfg. unidimensional X ray refracted diffraction micro structural component of aluminium material |
| CN1920476A (en) * | 2006-06-30 | 2007-02-28 | 西安交通大学 | Nano multi-step height sample plate and its preparation |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1786742A (en) * | 2005-12-07 | 2006-06-14 | 乐孜纯 | Process for mfg. unidimensional X ray refracted diffraction micro structural component of aluminium material |
| CN1920476A (en) * | 2006-06-30 | 2007-02-28 | 西安交通大学 | Nano multi-step height sample plate and its preparation |
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