CN102067306A - 具有降低的磁耦合的集成电路电感器 - Google Patents
具有降低的磁耦合的集成电路电感器 Download PDFInfo
- Publication number
- CN102067306A CN102067306A CN2009801222622A CN200980122262A CN102067306A CN 102067306 A CN102067306 A CN 102067306A CN 2009801222622 A CN2009801222622 A CN 2009801222622A CN 200980122262 A CN200980122262 A CN 200980122262A CN 102067306 A CN102067306 A CN 102067306A
- Authority
- CN
- China
- Prior art keywords
- inductor
- magnetic field
- inductor element
- conducting ring
- effective magnetic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000008878 coupling Effects 0.000 title description 9
- 238000010168 coupling process Methods 0.000 title description 9
- 238000005859 coupling reaction Methods 0.000 title description 9
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims description 8
- 230000009467 reduction Effects 0.000 claims description 3
- 230000004907 flux Effects 0.000 description 21
- 229910052751 metal Inorganic materials 0.000 description 17
- 239000002184 metal Substances 0.000 description 17
- 238000005516 engineering process Methods 0.000 description 8
- 230000005855 radiation Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000004891 communication Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5227—Inductive arrangements or effects of, or between, wiring layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (19)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2009/037529 WO2010107430A1 (en) | 2009-03-18 | 2009-03-18 | Integrated circuit inductors with reduced magnetic coupling |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102067306A true CN102067306A (zh) | 2011-05-18 |
CN102067306B CN102067306B (zh) | 2014-03-19 |
Family
ID=41417477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980122262.2A Active CN102067306B (zh) | 2009-03-18 | 2009-03-18 | 具有降低的磁耦合的集成电路电感器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8143696B2 (zh) |
EP (1) | EP2401762A1 (zh) |
JP (1) | JP2012521089A (zh) |
KR (1) | KR101575387B1 (zh) |
CN (1) | CN102067306B (zh) |
TW (1) | TWI394180B (zh) |
WO (1) | WO2010107430A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102915930A (zh) * | 2012-09-19 | 2013-02-06 | 天津大学 | 改变射频螺旋电感之间的互感的方法和射频电路 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8860390B2 (en) * | 2010-06-04 | 2014-10-14 | Apple Inc. | Switching power supply opposite polarity inductor arrangement |
WO2012108254A1 (ja) | 2011-02-09 | 2012-08-16 | 株式会社村田製作所 | 高周波モジュール |
JP5304811B2 (ja) * | 2011-02-14 | 2013-10-02 | 株式会社村田製作所 | 高周波モジュール |
US9203373B2 (en) | 2013-01-11 | 2015-12-01 | Qualcomm Incorporated | Diplexer design using through glass via technology |
US9129817B2 (en) * | 2013-03-13 | 2015-09-08 | Intel Corporation | Magnetic core inductor (MCI) structures for integrated voltage regulators |
US9634640B2 (en) | 2013-05-06 | 2017-04-25 | Qualcomm Incorporated | Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods |
US9264013B2 (en) | 2013-06-04 | 2016-02-16 | Qualcomm Incorporated | Systems for reducing magnetic coupling in integrated circuits (ICS), and related components and methods |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0389548A (ja) * | 1989-08-31 | 1991-04-15 | Fujitsu Ltd | 半導体集積回路 |
JPH0555043A (ja) * | 1991-08-22 | 1993-03-05 | Fujitsu Ltd | 小型コイルとその製造方法,磁気ヘツドの製造方法及び磁気記憶装置 |
JP3487461B2 (ja) * | 1994-12-17 | 2004-01-19 | ソニー株式会社 | 変成器及び増幅器 |
JPH0945866A (ja) * | 1995-08-02 | 1997-02-14 | Hitachi Ltd | マイクロ波集積回路 |
JPH0963847A (ja) * | 1995-08-25 | 1997-03-07 | Nec Corp | インダクタ素子及びその製造方法 |
CN2435825Y (zh) * | 2000-07-17 | 2001-06-20 | 佳叶科技有限公司 | 一种电感器 |
JP2003021915A (ja) * | 2001-07-05 | 2003-01-24 | Murata Mfg Co Ltd | パターン形成方法及び電子部品の製造方法 |
JP2003060050A (ja) * | 2001-08-09 | 2003-02-28 | Ricoh Co Ltd | インダクタンス素子、トランス及び容量素子 |
JP2005347286A (ja) * | 2002-05-29 | 2005-12-15 | Ajinomoto Co Inc | コイル内蔵多層基板、半導体チップ、及びそれらの製造方法 |
EP1573754B1 (en) * | 2002-12-13 | 2016-06-29 | Nxp B.V. | A planar inductive component and an integrated circuit comprising a planar inductive component |
KR100898463B1 (ko) * | 2003-02-04 | 2009-05-21 | 액세스 비지니스 그룹 인터내셔날 엘엘씨 | 유도 코일 어셈블리 |
WO2004112138A1 (ja) * | 2003-06-16 | 2004-12-23 | Nec Corporation | 半導体デバイスおよびその製造方法 |
JP4509826B2 (ja) * | 2005-03-03 | 2010-07-21 | 日本電信電話株式会社 | インダクタ |
JP2007189499A (ja) * | 2006-01-13 | 2007-07-26 | Fujikura Ltd | 半導体装置 |
US7498918B2 (en) * | 2006-04-04 | 2009-03-03 | United Microelectronics Corp. | Inductor structure |
US20100300318A1 (en) | 2007-09-20 | 2010-12-02 | Koen Alixe Mauritz Dhooge | Blast Hole Plugging Apparatus |
-
2009
- 2009-03-18 US US12/516,301 patent/US8143696B2/en active Active
- 2009-03-18 JP JP2012500769A patent/JP2012521089A/ja active Pending
- 2009-03-18 WO PCT/US2009/037529 patent/WO2010107430A1/en active Application Filing
- 2009-03-18 EP EP09789524A patent/EP2401762A1/en not_active Withdrawn
- 2009-03-18 KR KR1020107028513A patent/KR101575387B1/ko active IP Right Grant
- 2009-03-18 CN CN200980122262.2A patent/CN102067306B/zh active Active
- 2009-07-02 TW TW098122453A patent/TWI394180B/zh active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102915930A (zh) * | 2012-09-19 | 2013-02-06 | 天津大学 | 改变射频螺旋电感之间的互感的方法和射频电路 |
Also Published As
Publication number | Publication date |
---|---|
KR20110129331A (ko) | 2011-12-01 |
TWI394180B (zh) | 2013-04-21 |
US8143696B2 (en) | 2012-03-27 |
EP2401762A1 (en) | 2012-01-04 |
TW201036005A (en) | 2010-10-01 |
KR101575387B1 (ko) | 2015-12-07 |
WO2010107430A1 (en) | 2010-09-23 |
US20100314713A1 (en) | 2010-12-16 |
JP2012521089A (ja) | 2012-09-10 |
CN102067306B (zh) | 2014-03-19 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: AGERE SYSTEMS GUARDIAN CORP. Free format text: FORMER NAME: EGREE SYSTEM CO. LTD. |
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CP03 | Change of name, title or address |
Address after: Delaware Patentee after: Agere Systems Inc. Address before: American Pennsylvania Patentee before: AGERE SYSTEMS Inc. |
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C41 | Transfer of patent application or patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP02 | Change in the address of a patent holder |
Address after: American Pennsylvania Patentee after: Agere Systems Inc. Address before: Delaware Patentee before: Agere Systems Inc. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20160906 Address after: Singapore Singapore Patentee after: Avago Technologies General IP (Singapore) Pte. Ltd. Address before: American Pennsylvania Patentee before: Agere Systems Inc. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200123 Address after: Illinois, USA Patentee after: Bell Semiconductor Co.,Ltd. Address before: Singapore City Patentee before: Avago Technologies General IP (Singapore) Pte. Ltd. |