CN102043119A - 崩应测试方法 - Google Patents
崩应测试方法 Download PDFInfo
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- CN102043119A CN102043119A CN2009101976833A CN200910197683A CN102043119A CN 102043119 A CN102043119 A CN 102043119A CN 2009101976833 A CN2009101976833 A CN 2009101976833A CN 200910197683 A CN200910197683 A CN 200910197683A CN 102043119 A CN102043119 A CN 102043119A
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CN2009101976833A CN102043119A (zh) | 2009-10-26 | 2009-10-26 | 崩应测试方法 |
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CN2009101976833A CN102043119A (zh) | 2009-10-26 | 2009-10-26 | 崩应测试方法 |
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CN102043119A true CN102043119A (zh) | 2011-05-04 |
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Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104808131A (zh) * | 2015-04-30 | 2015-07-29 | 湖北丹瑞新材料科技有限公司 | 一种氮氧传感器芯片老化测试装置及老化测试方法 |
CN106153232A (zh) * | 2016-06-22 | 2016-11-23 | 杨越 | 无人船电子器件的在线监测组件 |
CN106197793A (zh) * | 2016-06-22 | 2016-12-07 | 杨越 | 无人船电子器件的在线监测方法 |
CN106908711A (zh) * | 2017-02-06 | 2017-06-30 | 张家港市欧微自动化研发有限公司 | 一种应用于ic测试的高低温测试装置 |
CN106908712A (zh) * | 2017-02-06 | 2017-06-30 | 张家港市欧微自动化研发有限公司 | 一种应用于ic测试的高低温测试方法 |
CN109342921A (zh) * | 2018-10-09 | 2019-02-15 | 天津芯海创科技有限公司 | 一种高速交换芯片的老化测试方法与系统 |
US11862269B2 (en) | 2020-07-17 | 2024-01-02 | Changxin Memory Technologies, Inc. | Testing method for packaged chip, testing system for packaged chip, computer device and storage medium |
WO2024021163A1 (zh) * | 2022-07-27 | 2024-02-01 | 长鑫存储技术有限公司 | 崩应测试装置以及测试设备 |
-
2009
- 2009-10-26 CN CN2009101976833A patent/CN102043119A/zh active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104808131A (zh) * | 2015-04-30 | 2015-07-29 | 湖北丹瑞新材料科技有限公司 | 一种氮氧传感器芯片老化测试装置及老化测试方法 |
CN106153232A (zh) * | 2016-06-22 | 2016-11-23 | 杨越 | 无人船电子器件的在线监测组件 |
CN106197793A (zh) * | 2016-06-22 | 2016-12-07 | 杨越 | 无人船电子器件的在线监测方法 |
WO2017219467A1 (zh) * | 2016-06-22 | 2017-12-28 | 杨越 | 无人船电子器件的在线监测方法 |
WO2017219466A1 (zh) * | 2016-06-22 | 2017-12-28 | 杨越 | 无人船电子器件的在线监测组件 |
CN106908711A (zh) * | 2017-02-06 | 2017-06-30 | 张家港市欧微自动化研发有限公司 | 一种应用于ic测试的高低温测试装置 |
CN106908712A (zh) * | 2017-02-06 | 2017-06-30 | 张家港市欧微自动化研发有限公司 | 一种应用于ic测试的高低温测试方法 |
CN106908712B (zh) * | 2017-02-06 | 2020-04-28 | 上海实真微电子有限公司 | 一种应用于ic测试的高低温测试方法 |
CN109342921A (zh) * | 2018-10-09 | 2019-02-15 | 天津芯海创科技有限公司 | 一种高速交换芯片的老化测试方法与系统 |
US11862269B2 (en) | 2020-07-17 | 2024-01-02 | Changxin Memory Technologies, Inc. | Testing method for packaged chip, testing system for packaged chip, computer device and storage medium |
WO2024021163A1 (zh) * | 2022-07-27 | 2024-02-01 | 长鑫存储技术有限公司 | 崩应测试装置以及测试设备 |
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C06 | Publication | ||
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ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING (BEIJING) INTERNATIONA Effective date: 20121101 |
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Effective date of registration: 20121101 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant after: Semiconductor Manufacturing International (Shanghai) Corporation Applicant after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Applicant before: Semiconductor Manufacturing International (Shanghai) Corporation |
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Application publication date: 20110504 |