CN102029488B - 一种免洗型高温浸焊助焊剂 - Google Patents
一种免洗型高温浸焊助焊剂 Download PDFInfo
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CN201010593847.7A CN102029488B (zh) | 2010-12-17 | 2010-12-17 | 一种免洗型高温浸焊助焊剂 |
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CN201010593847.7A CN102029488B (zh) | 2010-12-17 | 2010-12-17 | 一种免洗型高温浸焊助焊剂 |
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CN102029488A CN102029488A (zh) | 2011-04-27 |
CN102029488B true CN102029488B (zh) | 2012-12-12 |
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Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102689114B (zh) * | 2012-06-18 | 2014-11-26 | 东莞市剑鑫电子材料有限公司 | 无铅免清洗助焊剂及其制备方法 |
CN103350291A (zh) * | 2013-06-27 | 2013-10-16 | 东莞市和阳电子科技有限公司 | 一种助焊剂 |
CN103537822B (zh) * | 2013-10-25 | 2017-02-08 | 广州汉源新材料股份有限公司 | 一种预成型焊片喷涂用高浓度助焊剂 |
CN103862198B (zh) * | 2014-03-24 | 2016-08-17 | 吉安谊盛电子材料有限公司 | 一种太阳能自动焊接专用助焊剂 |
CN105269180B (zh) * | 2014-06-09 | 2017-11-07 | 深圳市菲尼的科技有限公司 | 一种烫漆焊接剂的配方及制备工艺 |
CN104384753A (zh) * | 2014-09-23 | 2015-03-04 | 明光旭升科技有限公司 | 一种环保型电路板焊接剂 |
CN104384752B (zh) * | 2014-09-23 | 2016-06-08 | 明光旭升科技有限公司 | 一种应用于传感器的助焊剂 |
JP5790862B1 (ja) * | 2014-12-25 | 2015-10-07 | 千住金属工業株式会社 | やに入りはんだ用フラックス、フラックスコートはんだ用フラックス、やに入りはんだ及びフラックスコートはんだ |
US9824998B2 (en) | 2015-02-06 | 2017-11-21 | Semigear, Inc. | Device packaging facility and method, and device processing apparatus utilizing DEHT |
US9472531B2 (en) * | 2015-02-06 | 2016-10-18 | Semigear, Inc. | Device packaging facility and method, and device processing apparatus utilizing phthalate |
CN105855746B (zh) * | 2016-05-13 | 2018-11-09 | 深圳市唯特偶新材料股份有限公司 | 一种高拉力光伏组件用助焊剂 |
CN108274158A (zh) * | 2018-02-02 | 2018-07-13 | 安阳师范学院 | 免清洗助焊剂及其制备方法 |
CN109267072A (zh) * | 2018-09-28 | 2019-01-25 | 五邑大学 | 一种水溶性助焊剂和一种铜材的酸洗方法 |
CN112453762B (zh) * | 2020-11-26 | 2022-05-03 | 厦门市匠焊新材料技术有限公司 | 一种助焊膏的制备方法 |
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JP2002001581A (ja) * | 2000-06-21 | 2002-01-08 | Fujikura Ltd | 無鉛はんだ用フラックス |
JP2005153020A (ja) * | 2003-11-07 | 2005-06-16 | Shinko Alcoa Yuso Kizai Kk | アルミニウム合金ろう材、その製造方法及びアルミニウム合金製熱交換器の製造方法 |
CN101362264A (zh) * | 2008-09-28 | 2009-02-11 | 厦门大学 | 一种环保型无铅焊料用免清洗助焊剂及其制备方法 |
CN101391353A (zh) * | 2008-11-05 | 2009-03-25 | 太仓市首创锡业有限公司 | 一种免清洗无铅焊料助焊剂 |
CN101543943A (zh) * | 2009-04-29 | 2009-09-30 | 云南锡业集团(控股)有限责任公司 | 无铅松香芯低卤素免清洗助焊剂及其制备方法 |
CN101733589A (zh) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | 一种无铅焊料用无卤素免清洗助焊剂 |
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JPH05220595A (ja) * | 1992-02-13 | 1993-08-31 | Fujitsu Ltd | 無洗浄フラックス |
US20060147683A1 (en) * | 2004-12-30 | 2006-07-06 | Harima Chemicals, Inc. | Flux for soldering and circuit board |
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2010
- 2010-12-17 CN CN201010593847.7A patent/CN102029488B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002001581A (ja) * | 2000-06-21 | 2002-01-08 | Fujikura Ltd | 無鉛はんだ用フラックス |
JP2005153020A (ja) * | 2003-11-07 | 2005-06-16 | Shinko Alcoa Yuso Kizai Kk | アルミニウム合金ろう材、その製造方法及びアルミニウム合金製熱交換器の製造方法 |
CN101362264A (zh) * | 2008-09-28 | 2009-02-11 | 厦门大学 | 一种环保型无铅焊料用免清洗助焊剂及其制备方法 |
CN101391353A (zh) * | 2008-11-05 | 2009-03-25 | 太仓市首创锡业有限公司 | 一种免清洗无铅焊料助焊剂 |
CN101543943A (zh) * | 2009-04-29 | 2009-09-30 | 云南锡业集团(控股)有限责任公司 | 无铅松香芯低卤素免清洗助焊剂及其制备方法 |
CN101733589A (zh) * | 2010-01-27 | 2010-06-16 | 浙江一远电子科技有限公司 | 一种无铅焊料用无卤素免清洗助焊剂 |
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Address after: 510663, No. two, No. 58, South Cloud Road, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou Patentee after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Address before: 510663, No. two, No. 58, South Cloud Road, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou Patentee before: Guangzhou Solderwell Enterprise Co.,Ltd. |
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Address after: 510663, No. two, No. 58, South Cloud Road, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou Patentee after: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Address before: 510663, No. two, No. 58, South Cloud Road, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou Patentee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. |
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Effective date of registration: 20220922 Address after: Room 404, Building B, No. 58, Nanyun 2nd Road, Science City, Huangpu District, Guangzhou City, Guangdong Province, 510663 Patentee after: Guangzhou Hanyuan microelectronic packaging material Co.,Ltd. Address before: 510663 No.58, Nanyun 2nd Road, Guangzhou hi tech Industrial Development Zone, Guangzhou City, Guangdong Province Patentee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. |
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