CN102029089B - System and method for circulating and filtering chemical copper deposition solution - Google Patents
System and method for circulating and filtering chemical copper deposition solution Download PDFInfo
- Publication number
- CN102029089B CN102029089B CN 201010268942 CN201010268942A CN102029089B CN 102029089 B CN102029089 B CN 102029089B CN 201010268942 CN201010268942 CN 201010268942 CN 201010268942 A CN201010268942 A CN 201010268942A CN 102029089 B CN102029089 B CN 102029089B
- Authority
- CN
- China
- Prior art keywords
- plating solution
- major trough
- copper plating
- electroless copper
- heavy copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention discloses a system and a method for circulating and filtering chemical copper deposition solution, relating to the technical field of printed wiring board production. The system and the method are invented for better avoiding the production of poor printed wiring boards. The system for circulating and filtering the chemical copper deposition solution comprises: a main tank for copper deposition reaction, a filtering device and a circulation pipe for the entering solution. An entering part of the circulation pipe adjacent to a second end of the circulation pipe extends along a direction parallel or perpendicular or sloping down to a bottom face of the main tank. The entering part of the circulation pipe is provided with one or more openings, and the openings are arranged above or below the liquid level of the chemical copper deposition solution in the main tank and are located at least a predetermined height from the bottom of the main tank. The system and the method of the invention can be used for filtering the chemical copper deposition solution.
Description
Technical field
The present invention relates to the printed substrate production technical field, relate in particular to a kind of electroless copper plating solution circulation filtration system and method.
Background technology
In the production process of printed substrate, need to pass through electroless copper plating technique at nonconducting substrate surface or cross deposition one deck copper film on hole wall, to form printed wire by etching or to realize that the ectonexine of multilayer circuit board interconnects.The characteristics of electroless copper plating technique are not need impressed current, but utilize chemical reaction to come depositing copper film.This technique is not subjected to the restriction of base material character, and metal or nonmetallic materials all can adopt, and is therefore applied widely.
The reaction of electroless copper plating is carried out in electroless copper plating solution.In production technology; the impurity such as break flour that copper powder, copper residue and printed wire base board (epoxy resin base plate) bring inevitably can appear; these impurity have not only accelerated the aging of electroless copper plating solution; and easily cause the plate surface deposition shot copper that carries out electroless copper plating or cross the bad problem such as hole plug; make like this in the plate face of printed substrate and hole flaw to have occurred, affected the quality of print circuit board surface metallization coating.Need electroless copper plating solution is carried out circulating filtration, existing electroless copper plating solution circulation filtration system as shown in Figure 1 for this reason.
Referring to Fig. 1, this electroless copper plating solution circulation filtration system comprises by interconnective heavy copper reaction major trough 1, the attached groove 2 of circulating filtration of solution circulation pipeline 4 and is circulated throughout lauter tub 3.Electroless copper plating solution in heavy copper reaction major trough 1 flows into first paragraph solution circulation pipeline 4 by the overfall 11 on it, and then flow in the attached groove 2 of circulating filtration, and then be circulated throughout lauter tub 3 from the attached groove 2 of circulating filtration by 4 inflows of second segment solution circulation pipeline, after being circulated throughout cotton core in lauter tub 3 and filtering by this, finally again flow in heavy copper reaction major trough 1 by the 3rd section solution circulation pipeline 4, so just completed the circulating filtration process.Particularly, the bottom even of heavy copper reaction major trough 1 be placed with a plurality of laterals 5, the bottom of lateral 5 is provided with opening 6, and at first the electroless copper plating solution after circulating filtration enter lateral 5 by the 3rd section solution circulation pipeline 4, then by opening 6 ejections on lateral 5.
When but the electroless copper plating solution in prior art after circulating filtration sprays from the opening 6 on lateral 5; causing originally being deposited in the impurity such as break flour that copper powder, copper residue and substrate that copper reacts major trough 1 bottom bring has been rushed; these impurity spread in whole heavy copper reaction major trough 1, finally cause carrying out the plate surface deposition shot copper of electroless copper plating or cross the bad problem such as hole plug.
Summary of the invention
Embodiments of the invention provide a kind of electroless copper plating solution circulation filtration system, and are bad to avoid better printed substrate to produce.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of electroless copper plating solution circulation filtration system comprises:
Heavy copper reaction major trough, it has for the overfall of discharging electroless copper plating solution;
Filter, it has entrance and exit, and described entrance is connected to described overfall by discharging the solution circulation pipeline; With
Enter the solution circulation pipeline, it has first end and the second end, and described first end is connected with the outlet of described filter, and described the second end extends to the backflow position of described heavy copper reaction major trough; Preferably, described backflow position is positioned at the side-walls relative with described overfall;
Wherein, the described part that enters that enters described the second end of being adjacent to of solution circulation pipeline is extended along or direction that tilt parallel or vertical with the bottom surface of described heavy copper reaction major trough, described enter the solution circulation pipeline enter the part in have one or more openings, described opening be located on the liquid level of the electroless copper plating solution in described heavy copper reaction major trough or under, and the bottom that is in the described heavy copper reaction major trough of distance predetermined height at least.
the electroless copper plating solution circulation filtration system that embodiments of the invention provide, due to described bottom that the ducted one or more openings of solution circulation are located at the described heavy copper reaction of the distance major trough predetermined height at least that enters, therefore pass through the cushioning effect of this predetermined altitude, the electroless copper plating solution that enters from described opening can not impact the bottom of described heavy copper reaction major trough, can make copper powder like this, copper residue and substrate break flour remain in the state of the bottom deposition that is deposited on described heavy copper reaction major trough effectively, the cleaning that keeps described heavy copper reaction major trough middle and upper part electroless copper plating solution, avoided better print circuit board surface deposition shot copper or plug-hole etc. bad.
Embodiments of the invention also provide a kind of electroless copper plating solution circulation filter method, and are bad to avoid better printed substrate to produce.
For achieving the above object, embodiments of the invention adopt following technical scheme:
A kind of electroless copper plating solution circulation filter method comprises:
Electroless copper plating solution in heavy copper reaction major trough is entered in filter;
By described filter, described electroless copper plating solution is filtered;
The predetermined height at least in the heavy copper reaction major trough of distance bottom refluxes electroless copper plating solution after filtration and is ejected in described heavy copper reaction major trough, and preferably by towards identical or different a plurality of open closed being ejected in described heavy copper reaction major trough.
the electroless copper plating solution circulation filter method that the embodiment of the present invention provides, owing to being in the heavy copper reaction major trough of distance bottom at least during predetermined height, electroless copper plating solution after filtering is refluxed be ejected in described heavy copper reaction major trough, therefore this predetermined altitude has played the effect of buffering to the backflow of the electroless copper plating solution after filtering, make the electroless copper plating solution that enters from described opening can not impact the bottom of described heavy copper reaction major trough, can make copper powder like this, copper residue and substrate break flour remain on the state of described heavy copper reaction major trough bottom deposition effectively, the cleaning that keeps described heavy copper reaction major trough middle and upper part electroless copper plating solution, avoided better print circuit board surface deposition shot copper or plug-hole etc. bad.
Description of drawings
Fig. 1 is the schematic diagram of electroless copper plating solution circulation filtration system in prior art;
Fig. 2 is the schematic diagram of electroless copper plating solution circulation filtration system embodiment one of the present invention;
Fig. 3 is the schematic diagram after electroless copper plating solution circulation filtration system shown in Figure 2 is improved;
Fig. 4 is the schematic diagram of electroless copper plating solution circulation filtration system embodiment two of the present invention;
Fig. 5 is the schematic diagram of electroless copper plating solution circulation filtration system embodiment three of the present invention;
Fig. 6 is the schematic diagram of electroless copper plating solution circulation filter method of the present invention;
Fig. 7 is the detailed maps of electroless copper plating solution circulation filter method of the present invention.
Reference numeral:
The heavy copper reaction of 1-major trough 11-overfall
The attached groove 3-of 2-circulating filtration is circulated throughout lauter tub
4-solution circulation pipeline 41-discharges the solution circulation pipeline
42-enters solution circulation pipeline 43-intermediate solution circulating line
5-lateral 6-opening
The 7-screen pack
The specific embodiment
Below in conjunction with accompanying drawing, embodiment of the present invention electroless copper plating solution circulation filtration system and method are described in detail.
Should be clear and definite, described embodiment is only a part of embodiment of the present invention, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills belong to the scope of protection of the invention not making all other embodiment that obtain under the creative work prerequisite.
Referring to Fig. 2, Fig. 4 or Fig. 5, comprise according to the electroless copper plating solution circulation filtration system of the embodiment of the present invention: heavy copper reaction major trough 1, this heavy copper reaction major trough 1 has for the overfall 11 of discharging electroless copper plating solution; Filter (comprising coarse filter and/or fine filtrator), this filter has entrance and exit, and this entrance is connected to overfall 11 by discharging solution circulation pipeline 41; Enter solution circulation pipeline 42, this enters solution circulation pipeline 42 and has first end and the second end, this first end is connected with the outlet of described filter, and this second end extends to the backflow position of heavy copper reaction major trough 1, described backflow position refers to sprays the position that enters into heavy copper reaction major trough 1 when electroless copper plating solution after filtration refluxes, preferably, described backflow position is positioned at the side-walls relative with described overfall; Wherein, the part that enters that enters described the second end of being adjacent to of solution circulation pipeline 42 can be along direction extension parallel or vertical with the bottom surface of heavy copper reaction major trough 1 or that tilt, this enters entering in part of solution circulation pipeline and has one or more openings 6, opening 6 can be located on the liquid level of the electroless copper plating solution in heavy copper reaction major trough 1 or under, and the bottom that is in the heavy copper reaction of distance major trough 1 predetermined height at least.
the electroless copper plating solution circulation filtration system that the present embodiment provides, be provided with one or more openings 6 owing to entering entering in part of solution circulation pipeline 42, and the bottom that opening 6 is located at the heavy copper reaction of distance major trough 1 is predetermined height at least, therefore pass through the cushioning effect of this predetermined altitude, the electroless copper plating solution that enters from opening 6 can be not directly produce large impact to the deposit of heavy copper reaction major trough 1 bottom, can make copper powder like this, copper residue and substrate break flour remain in the state in the bottom deposition of heavy copper reaction major trough 1 effectively, and then keep heavy copper to react the cleaning of the middle and upper part electroless copper plating solution of major trough 1, the print circuit board surface deposition shot copper of electroless copper plating or plug-hole etc. have effectively been avoided carrying out bad.
In various embodiments of the present invention, described filter can comprise coarse filter and fine filtrator simultaneously, also can only comprise coarse filter or only comprise fine filtrator.When described filter comprises coarse filter and fine filtrator simultaneously, the entrance of described filter can be the entrance of coarse filter, the outlet of described filter can be the outlet of fine filtrator, and described coarse filter is connected with fine filtrator and is connected by intermediate solution circulating line 43, that is, coarse filter is in the upstream of fine filtrator; But, if necessary, coarse filter also can be in the downstream of fine filtrator.When described filter only comprised coarse filter, the entrance of described filter, outlet can be entrance, the outlet of described coarse filter respectively.When described filter only comprised fine filtrator, the entrance of described filter, outlet can be entrance, the outlet of described fine filtrator respectively.Preferably, coarse filter is provided with one or more screen packs; And/or fine filtrator is provided with one or more filter cores and/or fie screen.
Wherein need to prove, in various embodiments of the present invention, described coarse filter can preferentially be selected the form of the attached groove of circulating filtration, and described fine filtrator can preferentially be selected the form that is circulated throughout lauter tub.In following examples, describe the solution of the present invention as an example of the fine filtrator of the coarse filter of the attached flute profile formula of circulating filtration and the barrel-shaped formula of circulating filtration example, but the invention is not restricted to this.
Below in conjunction with accompanying drawing and by specific embodiment, electroless copper plating solution circulation filtration system of the present invention is described.
Embodiment one
As shown in Figure 2, be a specific embodiment of electroless copper plating solution circulation filtration system of the present invention.In the present embodiment, described electroless copper plating solution circulation filtration system comprises heavy copper reaction major trough 1, the attached groove 2 of circulating filtration that connects by solution circulation pipeline 4 and is circulated throughout lauter tub 3.Wherein, the overfall 11 of heavy copper reaction major trough 1 is connected with the entrance of the attached groove 2 of circulating filtration by discharging solution circulation pipeline 41, the outlet of the attached groove 2 of circulating filtration is connected with the entrance that is circulated throughout lauter tub 3 by intermediate solution circulating line 43, the outlet that is circulated throughout lauter tub 3 is connected to the backflow position of heavy copper reaction major trough 1 by entering solution circulation pipeline 42, spray the position that enters into heavy copper reaction major trough 1 when reflux for the electroless copper plating solution after filtering in described backflow position.
Preferably, can be provided with one or more screen packs 7 in the attached groove 2 of the circulating filtration of the present embodiment, be provided with one or more filter cores and/or fie screen in being circulated throughout lauter tub 3.because the attached groove 2 of circulating filtration is located at the overfall 11 of heavy copper reaction major trough 1 and is circulated throughout between the entrance of lauter tub 3, be circulated throughout between the backflow position that lauter tub 3 is located at the outlet of the attached groove 2 of circulating filtration and heavy copper reaction major trough 1, when the electroless copper plating solution that flows out from overfall 11 like this enters into the attached groove 2 of circulating filtration by discharging solution circulation pipeline 41, at first by screen pack 7, it is filtered, reach the purpose of preliminary filtration, be circulated throughout in lauter tub 3 filter core (generally to alleviate, filter core can use the wound form cotton core, folding type filter element, integrate shaped type filter core etc.) and/or the filtration of fie screen burden, filter core and/or fie screen are difficult for blocked, extended the service life of filter core and/or fie screen.
Wherein, screen pack 7 can adopt double-deck 36t grenadine, and this screen pack 7 can be unpicked and washed, and long-term use need not change, and is economical and practical.Installing, screen pack 7 can be directly installed on the entrance of the attached groove 2 of circulating filtration, and one section preset distance of outlet of distance discharge solution circulation pipeline 41, and this preset distance can be between 1 cun to 5 cun, for example can be preferably 3 cun.After filtering through screen pack 7, electroless copper plating solution is discharged from the outlet of the attached groove 2 of circulating filtration again, and enter into by intermediate solution circulating line 43 and be circulated throughout lauter tub 3, the filter core and/or the fie screen that are circulated throughout in lauter tub 3 carry out secondary filter to this electroless copper plating solution, with impurity such as the most copper powder of filtering, copper ashes and substrate powder, electroless copper plating solution is cleaned more.Electroless copper plating solution after filtration is discharged from the outlet that is circulated throughout lauter tub 3, and enters into heavy copper reaction major trough 1 by entering solution circulation pipeline 43.
Although in the present embodiment, screen pack 7 is arranged on the porch of the attached groove 2 of circulating filtration, but be not limited to this, in other embodiments of the invention, also screen pack 7 can be arranged on the exit of the attached groove 2 of circulating filtration or screen pack 7 be arranged on any desired location place between the entrance and exit of the attached groove 2 of circulating filtration.And not only can in the attached groove 2 of circulating filtration, a screen pack 7 be set, and a plurality of screen packs 7 can also be set to form multistage filtering in the attached groove 2 of circulating filtration, strengthen filter effect.
Under state shown in Figure 2, the part that enters that enters solution circulation pipeline 42 is vertically arranged in heavy copper reaction major trough 1, but the present invention is not limited thereto, and this enters part and also can arrange or along inclined direction arrange by along continuous straight runs.Preferably, this enters solution circulation pipeline 42 and is arranged in the position relative with overfall 11 (in this case, the backflow position can be positioned at the side-walls relative with overfall), so that electroless copper plating solution circulates better, perhaps can also will enter solution circulation pipeline 42 and be arranged on other positions of overfall 11 both sides.Enter solution circulation pipeline 42 too near overfall 11 but preferably will avoid making, discharge via overfall 11 immediately via the electroless copper plating solution that enters after the filtration that solution circulation pipeline 42 refluxes avoiding just.Wherein, enter and have one or more openings 6 in solution circulation pipeline 42.
according to an aspect of the present invention, the bottom that opening 6 is located at the heavy copper reaction of distance major trough 1 is at least on predetermined altitude H place, the electroless copper plating solution that enters from opening 6 so can not impact the copper powder in the bottom deposition of heavy copper reaction major trough 1, copper residue and substrate break flour, therefore can make copper powder, copper residue and substrate break flour remain in the state in the bottom deposition of heavy copper reaction major trough 1 effectively, and then keep heavy copper to react the cleaning of the middle and upper part electroless copper plating solution of major trough 1, the print circuit board surface deposition shot copper of electroless copper plating or plug-hole etc. have effectively been avoided carrying out bad.
Shown in Figure 2, particularly, the ratio of the height of the predetermined altitude H in the present embodiment and heavy copper reaction major trough 1 can be more than or equal to 20% and less than or equal to 50%, is preferably more than or equals 30% and less than or equal to 50%, for example can be 40%.In practical application, the numerical value of this predetermined altitude H can be set as required.Generally speaking, the effect of avoiding having rushed the impurity that is deposited in copper reaction major trough 1 bottom when height H is higher is better, but the circulating effect of the electroless copper plating solution in heavy copper reaction major trough 1 is with possible deviation.for this reason, the ratio of the height of described predetermined altitude H and heavy copper reaction major trough 1 can be set between 20% to 50%, can avoid like this via the bottom of the electroless copper plating fluid challenge that enters solution circulation pipeline 42 to heavy copper reaction major trough 1, and then avoid having rushed the impurity that is deposited in copper reaction major trough 1 bottom, and the top that is opened in heavy copper reaction major trough 1 due to overfall 11 (will be flowed out from overfall 11 when arriving overfall 11 place due to the liquid level of the electroless copper plating solution in heavy copper reaction major trough 1, for guaranteeing to have enough electroless copper plating solution in heavy copper reaction major trough 1, overfall 11 can be arranged on the top of heavy copper reaction major trough 1), when by opening 6, electroless copper plating solution being drained into the middle and lower part of heavy copper reaction major trough 1 like this, the electroless copper plating solution that has guaranteed the middle and upper part of heavy copper reaction major trough 1 has circulating effect preferably.Wherein, better in the time of between the ratio with the height of described predetermined altitude H and heavy copper reaction major trough 1 is set in 30% to 50%, best when the ratio that for example described predetermined altitude H and heavy copper is reacted the height of major trough 1 is set in 40%.
The above mentions the top that overfall 11 is arranged on heavy copper reaction major trough 1, guaranteeing to form circulating effect preferably in the middle and upper part of heavy copper reaction major trough 1 when solution-stabilized district (impurity of avoiding being deposited on the bottom has been rushed) is formed on the bottom of heavy copper reaction major trough 1.And in order to guarantee further circulating effect preferably, heavy copper reaction can fully be carried out, the part (this enters in part and is provided with one or more openings 6) that enters that enters solution circulation pipeline 42 can also be immersed in electroless copper plating solution.And another advantage of this structure is to avoid the solution of ejection from opening 6 to spill the outside that heavy copper reacts major trough 1, pollutes working environment.Certainly, in another embodiment, if necessary, also the part that enters that is provided with one or more openings 6 can be remained on the liquid level of electroless copper plating solution, make the reflux solution that drops on the electroless copper plating liquid level of solution can not impact the bottom of heavy copper reaction major trough 1 fully.
As can be seen from Figure 2, discharge electroless copper plating solution by the second end that enters solution circulation pipeline 42 and can play ringing, discharge electroless copper plating solution by the opening 6 that enters solution circulation pipeline 42 and mainly play shunting action.This is because when entering electroless copper plating solution in solution circulation pipeline 42 and being discharged by opening 6, the electroless copper plating solution that can reduce or avoid to discharge from the second end reacts the impact of major trough 1 basic sediment to heavy copper, make the impurity such as copper powder, copper ashes and substrate powder be deposited on the bottom of copper reaction major trough 1 with remaining valid.But second rectify the bottom surface of heavy copper reaction major trough 1 and may produce greater impact to the deposit of heavy copper reaction major trough 1 bottom due to what enter solution circulation pipeline 42, therefore preferably also can with this second end sealing, only discharge electroless copper plating solution by opening 6.
According to a further aspect in the invention, can regulate opening 6 towards, to avoid from the solution of opening 6 ejection, the deposit of heavy copper reaction major trough 1 bottom being produced large impact.Preferably, these a plurality of openings 6 towards can be mutually identical or different, and parallel or vertical with the bottom surface of heavy copper reaction major trough 1 or be inclined upwardly or downward-sloping, make the diapire that can not impact heavy copper reaction major trough 1 along the solution towards ejection of these a plurality of openings 6, can reduce so the sedimental impact to the diapire of heavy copper reaction major trough 1, make the impurity on this diapire keep sedimentation state.
As shown in Figure 2, the opening injection direction of left-half opening is parallel with the bottom surface of heavy copper reaction major trough 1, the opening injection direction right half part opening is downward-sloping towards the bottom surface of heavy copper reaction major trough 1; Perhaps as shown in Figure 3, on the branch road of level, the opening injection direction of the first half opening along the bottom surface of heavy copper reaction major trough 1 vertically upward, the opening injection direction of the latter half opening towards the bottom surface of heavy copper reaction major trough 1 vertically downward.
For example, in the present embodiment, when the part that enters that enters solution circulation pipeline 42 is arranged on apart from the higher position of diapire or when being arranged on the liquid level top of electroless copper plating solution, the height of the opening 6 heavy copper reaction of distance major troughs 1 is larger, enough cushioning effects can be provided, even therefore opening 6 towards parallel or downward-sloping with respect to the diapire of heavy copper reaction major trough 1 or even downward vertically, can not produce large impact to the deposit of heavy copper reaction major trough 1 bottom yet.Again for example, when enter solution circulation pipeline 42 enter that part is arranged on liquid level below and during apart from the lower position of diapire, the height of the opening 6 heavy copper reaction of distance major troughs 1 is less, this moment is in order to provide enough cushioning effects, can make opening 6 towards parallel with respect to the diapire of heavy copper reaction major trough 1 or be inclined upwardly or even upwards vertical, to avoid that the deposit of heavy copper reaction major trough 1 bottom was produced large impact.Perhaps, enter arranging of partial distance diapire when highly moderate when what enter solution circulation pipeline 42, can make the diapire towards with respect to heavy copper reaction major trough 1 of opening 6 be arranged in parallel or be inclined upwardly or downward-sloping setting, and the angle that tilts can be determined as required, for example can tilt to the scope of 60 degree at 30 degree, more for example can tilt with the angle of 45 degree.
Above-mentioned to opening 6 towards various settings, purpose is to avoid from the solution of opening 6 ejections, the deposit of heavy copper reaction major trough 1 bottom to be caused large impact.This makes from the electroless copper plating solution of these openings 6 ejection can powerfully not impact copper powder, copper residue and the substrate break flour that the bottom surface of heavy copper reaction major trough 1 deposits, and can reduce better or avoid the impact to heavy copper reaction major trough 1 basic sediment.Need to prove, above-mentioned opening 6 towards being only some examples, be not a kind of limitation, according to the setting position of opening (as under liquid level or liquid level first-class) can arrange needed opening towards.
Preferably, opening 6 parallel or be inclined upwardly with respect to the bottom surface of heavy copper reaction major trough 1 towards (that is, the injection direction of reflux solution), the impurity that reacts being deposited in copper with the electroless copper plating solution of avoiding ejecting on the bottom surface of major trough 1 impacts.
In one embodiment, opening 6 towards (namely, the injection direction of reflux solution) be downward-sloping, at this moment, opening 6 towards extended line preferably do not intersect with the bottom surface of heavy copper reaction major trough 1, directly impact the impurity that is deposited on the bottom surface that copper reacts major trough 1 with the electroless copper plating solution of avoiding ejecting.
Preferably, can make opening 6 towards the madial wall setting of heavy copper reaction major trough 1, in order to be ejected on the madial wall of heavy copper reaction major trough 1 from the solution of opening 6 ejections, can play better cushioning effect like this, react on the diapire of major trough 1 to avoid better being directly injected to heavy copper from the solution of opening 6 ejections.
Preferably, enter the structure that part can form translation and/or rotation that enters of solution circulation pipeline 42 in the present embodiment.Can adjust like this this and enter the setting position of part in heavy copper reaction major trough 1, so that the electroless copper plating solution in heavy copper reaction major trough 1 reaches better circulating effect.
In the present embodiment, the part that enters that enters solution circulation pipeline 42 is slender type, opening 6 is that the electroless copper plating solution that enters like this in solution circulation pipeline 42 can be along the radially outward outflow that enters solution circulation pipeline 42 (for example shown in Fig. 2 and 4) along longilineal described vertical or one or more groups opening that circumferentially distribute that enters part.
In another embodiment, enter entering partly of solution circulation pipeline 42 and can also be bent to annular (not shown), opening 6 is described one or more groups opening that enters the part distribution along annular.In this case, opening 6 towards preferably with respect to the center of annular and radially outside, that is, solution is from radially outwards ejection of opening 6, and the tiltedly ejection that can abreast or be inclined upwardly or dip down.More preferably, each opening 6 that arranges along annular is in the center position of heavy copper reaction major trough 1.
According to another aspect of the invention, can be by the flow velocity of valve regulation from the solution of opening 6 ejection, to avoid from the solution of opening 6 ejections, the deposit of heavy copper reaction major trough 1 bottom being produced large impact.Preferably, can also in entering solution circulation pipeline 42, valve be installed in the present embodiment, to control reflux state, back-flow velocity and the spouting velocity of electroless copper plating solution.Wherein said reflux state refers to and allows electroless copper plating solution to be back to heavy copper reaction major trough 1 or stop electroless copper plating solution to be back to heavy copper reaction major trough 1, as can by switch valve open or close realize; Described back-flow velocity refers to the flowing velocity of electroless copper plating solution in entering solution circulation pipeline 42; Speed when described spouting velocity refers to electroless copper plating solution and sprays from opening 6.For example, can in entering solution circulation pipeline 42, switch valve be installed, open this switch valve, electroless copper plating solution is back in heavy copper reaction major trough 1, close this switch valve, can stop electroless copper plating solution to flow in heavy copper reaction major trough 1.More preferably, one or more choke valves can be installed in entering solution circulation pipeline 42, this choke valve not only can be controlled the reflux state (opening or closing) of electroless copper plating solution, can also control back-flow velocity and/or spouting velocity by the flow that this choke valve is flow through in control; The independent valve that is used for controlling spouting velocity of installing in described backflow position of opening 6 can certainly be adjacent to.In addition, according to user demand, the valve of other types can also be installed in entering solution circulation pipeline 42.
According to a preferred embodiment of the invention, can with opening arrange height, opening towards and opening in the jet velocity triplicity of electroless copper plating solution use, namely, control any combination in this three, thereby avoid from the reflux electroless copper plating solution that sprays of the opening 6 that enters part that enters solution circulation pipeline 42, the deposit of heavy copper reaction major trough 1 bottom being produced large impact, more effectively make copper powder, copper residue and substrate break flour etc. remain in state in the bottom deposition of heavy copper reaction major trough 1.
In various embodiments of the present invention, for fear of from the electroless copper plating solution that enters of opening 6 that enters part that enters solution circulation pipeline 42, the deposit of heavy copper reaction major trough 1 bottom being produced large impact, make copper powder, copper residue and substrate break flour etc. effectively remain in the state that deposits in the bottom of heavy copper reaction major trough 1, can use following three kinds of features.The first feature can be arranged on opening 6 predetermined height at least that the heavy copper of distance reacts major trough 1 bottom, with the solution that sprays from opening 6 by the solution buffering in heavy copper reaction major trough 1; The second feature, can make opening 6 towards parallel or vertical with the bottom surface of heavy copper reaction major trough 1 or be inclined upwardly or downward-sloping, to avoid from the solution of opening 6 ejections, the deposit that heavy copper reacts major trough 1 bottom being produced large impact; The third feature can enter the ducted valve of solution circulation and controls from the jet velocity of the heavy copper solution of refluxing chemical of opening 6 ejection by being arranged on.
Above-mentioned three kinds of features can be used separately as the case may be or be combined with.For example, when the jet velocity of the electroless copper plating solution that refluxes is very fast, opening 6 can be located at the higher position, bottom of the heavy copper reaction of distance major trough 1, can also make opening 6 towards parallel with respect to the bottom surface of heavy copper reaction major trough 1 or upwards vertical or be inclined upwardly.Again for example, when opening 6 towards with respect to the bottom surface of heavy copper reaction major trough 1 downward vertically the time, can make the jet velocity of electroless copper plating solution of backflow slower, perhaps opening 6 can also be located at the higher position, bottom of the heavy copper reaction of distance major trough 1.The example that the above is combined with above-mentioned three kinds of features can reach the Expected Results of the embodiment of the present invention, and the electroless copper plating fluid challenge of namely avoiding refluxing is deposited in the impurity that copper reacts major trough 1 bottom.
As shown in Figure 3, in other embodiments of the invention, enter solution circulation pipeline 42 and can have one or more branch roads, for example can be provided with in the both sides that enter solution circulation pipeline 42 the first branch road and second branch road of two levels, and one or more openings can be set on each branch road.Certainly, the described bearing of trend that enters solution circulation pipeline 42, the first branch road and the second branch road also is not limited to vertical direction or horizontal direction, can also be incline direction as required.
In sum, and learn by test of many times, use the electroless copper plating solution circulation filtration system in this enforcement can effectively avoid printed substrate plate face deposition shot copper and mistake hole plug etc. bad, and can reduce use cost.Wherein, in the filter effect of the present embodiment electroless copper plating solution circulation filtration system and use cost and prior art, filter effect and the use cost of electroless copper plating solution circulation filtration system seen as following table 1.
Table 1
Embodiment two
As shown in Figure 4, be another specific embodiment of electroless copper plating solution circulation filtration system of the present invention.In the present embodiment, described electroless copper plating solution circulation filtration system comprises heavy copper reaction major trough 1 and the attached groove 2 of circulating filtration that connects by solution circulation pipeline 4, wherein the overfall 11 of heavy copper reaction major trough 1 is connected with the entrance of the attached groove 2 of circulating filtration by discharging solution circulation pipeline 41, and the outlet of the attached groove 2 of circulating filtration is connected to the backflow position of heavy copper reaction major trough 1 by entering solution circulation pipeline 42.
In the present embodiment, the porch of the attached groove 2 of circulating filtration has screen pack 7, and the attached groove 2 of circulating filtration is located between the overfall 11 and backflow position of heavy copper reaction major trough 1.Like this, when the electroless copper plating solution that flows out from overfall 11 enters into the attached groove 2 of circulating filtration by discharging solution circulation pipeline 41, can filter it by screen pack 7, with the impurity such as copper powder, copper ashes and substrate powder that carry in filtering electroless copper plating solution.After filtering through screen pack 7, electroless copper plating solution is discharged from the outlet of the attached groove 2 of circulating filtration, and enters into heavy copper reaction major trough 1 by entering solution circulation pipeline 42.Impurity due to deposition in heavy copper reaction major trough 1 in the present embodiment is difficult to rushed, and therefore the attached groove 2 of circulating filtration can only be set and filter.For the attached groove 2 of circulating filtration and screen pack 7 can adopt with aforementioned the first embodiment in identical mode, do not repeat them here.The below only describes difference.
Under state shown in Figure 4, entering solution circulation pipeline 42 arranges along horizontal-extending at the inwall place of major trough 1, and enter and have one or more openings 6 that along continuous straight runs distributes in solution circulation pipeline 42, opening 6 is located on the bottom predetermined altitude H of the heavy copper reaction of distance major trough 1, and opening 6 towards with bottom surface almost parallel or the inclination of heavy copper reaction major trough 1, and opening 6 is arranged on below the liquid level of heavy copper reaction major trough 1.The electroless copper plating solution that enters from opening 6 so can not produce large impact to the deposit of heavy copper reaction major trough 1 bottom; can make copper powder, copper residue and substrate break flour be deposited on the bottom of copper reaction major trough 1 with remaining valid; and then keep heavy copper to react the cleaning of the middle and upper part electroless copper plating solution of major trough 1, avoided better print circuit board surface deposition shot copper or plug-hole etc. bad.
Embodiment three
As shown in Figure 5, be another specific embodiment of electroless copper plating solution circulation filtration system of the present invention.In the present embodiment, described electroless copper plating solution circulation filtration system comprises the heavy copper reaction major trough 1 that connects by solution circulation pipeline 4 and is circulated throughout lauter tub 3, wherein the overfall 11 of heavy copper reaction major trough 1 is connected with the entrance that is circulated throughout lauter tub 3 by discharging solution circulation pipeline 41, and major trough 1 is reacted in the outlet that is circulated throughout lauter tub 3 by entering solution circulation pipeline 42 and heavy copper backflow position is connected.
In the present embodiment, be circulated throughout between the backflow position that lauter tub 3 is located at the outlet of the attached groove 2 of circulating filtration and heavy copper reaction major trough 1.Like this, the electroless copper plating solution that flows out from overfall 11 enters into and is circulated throughout lauter tub 3 by discharging solution circulation pipeline 41, and the cotton core that is circulated throughout in lauter tub 3 filters this electroless copper plating solution, with impurity such as filtering copper powder, copper ashes and substrate powder.Electroless copper plating solution after filtration is discharged from the outlet that is circulated throughout lauter tub 3, and enters into heavy copper reaction major trough 1 by entering solution circulation pipeline 43.
Wherein, the arrangement that enters solution circulation pipeline 42 embodiment illustrated in fig. 5 is identical with the arrangement that enters solution circulation pipeline 42 embodiment illustrated in fig. 2.Enter and have opening 6 in solution circulation pipeline 42; opening 6 is located on the bottom predetermined altitude H of the heavy copper reaction of distance major trough 1; the electroless copper plating solution that enters from opening 6 so can not produce large impact to the deposit of heavy copper reaction major trough 1 bottom; can make copper powder, copper residue and substrate break flour effectively be deposited on the bottom of copper reaction major trough 1; the cleaning that keeps heavy copper reaction major trough 1 middle and upper part electroless copper plating solution has avoided print circuit board surface deposition shot copper or plug-hole etc. bad better.Impurity due to deposition in heavy copper reaction major trough 1 in the present embodiment is difficult to rushed, so can only arrange and be circulated throughout lauter tub 3 and filter.For be circulated throughout lauter tub 3 adopt with aforementioned the first embodiment in identical mode, do not repeat them here.
In addition, the embodiment of the present invention also provides a kind of electroless copper plating circulating filtration method.As shown in Figure 6, described electroless copper plating solution circulation filter method comprises:
S601 enters the electroless copper plating solution in heavy copper reaction major trough in filter;
S602 filters described electroless copper plating solution by described filter;
S603, the predetermined height at least in the heavy copper reaction major trough of distance bottom refluxes electroless copper plating solution after filtration and is ejected in described heavy copper reaction major trough.
the present embodiment electroless copper plating solution circulation filter method, owing to being in the heavy copper reaction major trough of distance bottom at least during predetermined height, electroless copper plating solution after filtering is refluxed be ejected in described heavy copper reaction major trough, therefore the electroless copper plating solution that enters from described opening can be not directly produce large impact to the deposit bottom described heavy copper reaction major trough, can make copper powder like this, copper residue and substrate break flour are deposited on the bottom of described heavy copper reaction major trough effectively, the cleaning that keeps described heavy copper reaction major trough middle and upper part electroless copper plating solution, avoided better print circuit board surface deposition shot copper or plug-hole etc. bad.
Illustrate described electroless copper plating solution circulation filter method below in conjunction with accompanying drawing.As shown in Figure 7, the method comprises:
S701 enters the electroless copper plating solution in heavy copper reaction major trough in filter.
Particularly, offer overfall on the sidewall of described heavy copper reaction major trough, can electroless copper plating solution be drained in described filter by the discharge solution circulation pipeline that is connected on overfall.
In various embodiments of the present invention, described filter can comprise coarse filter and fine filtrator simultaneously, also can only comprise coarse filter or only comprise fine filtrator.Preferably, coarse filter is provided with one or more screen packs; And/or fine filtrator is provided with one or more filter cores and/or fie screen.Wherein when described filter not only comprised coarse filter but also comprises fine filtrator, coarse filter was in the upstream of fine filtrator; But, if necessary, coarse filter also can be in the downstream of fine filtrator.Wherein need to prove, in various embodiments of the present invention, described coarse filter can preferentially be selected the form of the attached groove of circulating filtration, and described fine filtrator can preferentially be selected the form that is circulated throughout lauter tub.In following examples, describe the solution of the present invention as an example of the fine filtrator of the coarse filter of the attached flute profile formula of circulating filtration and the barrel-shaped formula of circulating filtration example, but the invention is not restricted to this.
S702, described coarse filter tentatively filters electroless copper plating solution, preferably uses screen pack that electroless copper plating solution is tentatively filtered, with impurity such as filtering part copper powder, copper ashes and substrate powder.And the electroless copper plating solution after tentatively filtering enters in described fine filtrator by pipeline.
S703, the described fine filtrator electroless copper plating solution after to preliminary filtration carries out secondary filter, with impurity such as the most copper powder of filtering, copper ashes and substrate powder, electroless copper plating solution is cleaned more.
S704, make electroless copper plating solution after filtration in the heavy copper reaction major trough of distance bottom at least predetermined height reflux and be ejected into described heavy copper reaction major trough.
Preferably, the electroless copper plating solution after filtering described in the present embodiment refluxes to be ejected in described heavy copper reaction major trough and is specifically as follows: the electroless copper plating solution after filtering is ejected into described heavy copper and reacts in major trough by refluxing dispersedly towards identical or different a plurality of openings.Make Solution Dispersion ground backflow by described a plurality of openings, can reduce the amount of the electroless copper plating solution of each described opening discharge, and then the electroless copper plating solution that reduces to discharge further makes the impurity such as copper powder, copper ashes and substrate powder effectively be deposited on the bottom of described heavy copper reaction major trough to the impulsive force of described heavy copper reaction major trough basic sediment.
Preferably, when the electroless copper plating solution in the present embodiment after filtering is ejected in described heavy copper reaction major trough by refluxing dispersedly towards identical or different a plurality of openings, the flow direction of the electroless copper plating solution after described filtration is parallel or vertical with the bottom surface of described heavy copper reaction major trough or be inclined upwardly or downward-sloping, so also can reduce described heavy copper is reacted the impulsive force of major trough basic sediment.For example, the position that enters described heavy copper reaction major trough when electroless copper plating solution apart from the diapire height of described heavy copper reaction major trough hour, the flow direction that can make electroless copper plating solution is parallel with the bottom surface of described heavy copper reaction major trough or be inclined upwardly, so that entering of electroless copper plating solution produced certain cushioning effect, avoid the deposit on described heavy copper reaction major trough diapire is caused excessive shock.Wherein, the flow direction of the electroless copper plating solution after can controlled filter by described a plurality of openings.
At this on the one hand, preferably, can arrange described a plurality of openings towards and make its towards extended line do not intersect with the bottom surface of heavy copper reaction major trough 1, and the impurity of therefore avoiding electroless copper plating solution to react being deposited in copper on the bottom surface of major trough 1 impacts.For example, with reference to shown in Figure 2, the opening injection direction of its left-half opening is parallel with the bottom surface of heavy copper reaction major trough 1, the opening of this part opening towards extended line crossing with the bottom surface of heavy copper reaction major trough 1; The opening injection direction of its right half part opening is downward-sloping towards the bottom surface of heavy copper reaction major trough 1, by regulate this part opening height is set or from the spouting velocity of the electroless copper plating solution of this opening ejection, also can reach the opening that makes this part opening towards the effect that do not intersect with the bottom surface of heavy copper reaction major trough 1 of extended line.Perhaps as shown in Figure 3 horizontal branches, the opening injection direction of the first half opening along the bottom surface of heavy copper reaction major trough 1 vertically upward, the opening of this part opening towards extended line do not intersect with the bottom surface of heavy copper reaction major trough 1.The opening injection direction of its latter half opening towards the bottom surface of heavy copper reaction major trough 1 vertically downward, similarly, by regulate this part opening height is set or from the spouting velocity of the electroless copper plating solution of this opening ejection, also can reach the opening that makes this part opening towards the effect that do not intersect with the bottom surface of heavy copper reaction major trough 1 of extended line.In the present embodiment by the jet velocity triplicity that electroless copper plating solution in height and opening is set of opening injection direction, opening is used, make the bottom surface that can not impact heavy copper reaction major trough 1 along the solution towards ejection of these a plurality of openings 6, can reduce so the sedimental impact to the diapire of heavy copper reaction major trough 1, make the impurity on this bottom surface keep sedimentation state.
For example, in the present embodiment, when the part that enters that enters solution circulation pipeline 42 is arranged on apart from the higher position of diapire or when being arranged on the liquid level top of electroless copper plating solution, the height of the opening 6 heavy copper reaction of distance major troughs 1 is larger, enough cushioning effects can be provided, even therefore opening 6 towards parallel or downward-sloping with respect to the diapire of heavy copper reaction major trough 1 or even downward vertically, can not produce large impact to the deposit of heavy copper reaction major trough 1 bottom yet.Again for example, when enter solution circulation pipeline 42 enter that part is arranged on liquid level below and during apart from the lower position of diapire, the height of the opening 6 heavy copper reaction of distance major troughs 1 is less, this moment is in order to provide enough cushioning effects, can make opening 6 towards parallel with respect to the diapire of heavy copper reaction major trough 1 or be inclined upwardly or even upwards vertical, to avoid that the deposit of heavy copper reaction major trough 1 bottom was produced large impact.Perhaps, enter arranging of partial distance diapire when highly moderate when what enter solution circulation pipeline 42, can make the diapire towards with respect to heavy copper reaction major trough 1 of opening 6 be arranged in parallel or be inclined upwardly or downward-sloping setting, and the angle that tilts can be determined as required, for example can tilt to the scope of 60 degree at 30 degree, more for example can tilt with the angle of 45 degree.
Above-mentioned to opening 6 towards various settings, purpose is to avoid from the solution of opening 6 ejections, the deposit of heavy copper reaction major trough 1 bottom to be caused large impact.This makes from the electroless copper plating solution of these openings 6 ejection can powerfully not impact copper powder, copper residue and the substrate break flour that the bottom surface of heavy copper reaction major trough 1 deposits, and can reduce better or avoid the impact to heavy copper reaction major trough 1 basic sediment.Need to prove, above-mentioned opening 6 towards being only some examples, be not a kind of limitation, according to the setting position of opening (as under liquid level or liquid level first-class) can arrange the opening that needs towards.
Preferably, electroless copper plating solution in the present embodiment after making filtration refluxes when being ejected in described heavy copper reaction major trough, can make on the madial wall that is ejected into described heavy copper reaction major trough of the electroless copper plating solution after described filtration.The concrete opening 6 that can make in realization is towards the madial wall setting of heavy copper reaction major trough 1, in order to be ejected on the madial wall of heavy copper reaction major trough 1 from the solution of opening 6 ejections, can play better cushioning effect like this, react on the diapire of major trough 1 to avoid better being directly injected to heavy copper from the solution of opening 6 ejections.
Perhaps, electroless copper plating solution after filtration is refluxed be ejected in described heavy copper reaction major trough specifically to reflux with predetermined back-flow velocity and/or jet velocity for: the electroless copper plating solution after filtering and be ejected into described heavy copper and react in major trough.This can be by installing valve on the pipeline that enters electroless copper plating solution, and the flow velocity of the solution that sprays from described opening by valve regulation is realized.
In various embodiments of the present invention, for fear of the electroless copper plating solution that enters, the deposit bottom described heavy copper reaction major trough was produced large impact, make copper powder, copper residue and substrate break flour etc. effectively be in the state of the bottom deposition of described heavy copper reaction major trough, can use following three kinds of features.The first feature can be at the heavy copper reaction solution after predetermined height enters filtration at least of the described heavy copper reaction major trough of distance bottom; The second feature, the flow direction when electroless copper plating solution is entered is parallel or vertical with the bottom surface of described heavy copper reaction major trough or be inclined upwardly or downward-sloping; The third feature can be controlled back-flow velocity and/or the jet velocity of the electroless copper plating solution that enters.
Above-mentioned three kinds of features can be used separately as the case may be or be combined with.For example, when the jet velocity of the electroless copper plating solution that refluxes is very fast, described opening can be located at the higher position, bottom of the described heavy copper reaction of distance major trough, can also make the parallel or upwards vertical or be inclined upwardly with respect to the bottom surface of heavy copper reaction major trough 1 towards (and electroless copper plating solution flow direction when entering) of described opening.Again for example, when described opening towards with respect to the bottom surface of described heavy copper reaction major trough downward vertically the time, can make the jet velocity of electroless copper plating solution of backflow slower, perhaps described opening can also be located at the described heavy copper reaction of distance higher position, major trough 1 bottom.The example that the above is combined with above-mentioned three kinds of features can reach the Expected Results of the embodiment of the present invention, and the electroless copper plating fluid challenge of namely avoiding refluxing is deposited in the impurity that copper reacts major trough 1 bottom.
The above; be only the specific embodiment of the present invention, but protection scope of the present invention is not limited to this, anyly is familiar with those skilled in the art in the technical scope that the present invention discloses; can expect easily changing or replacing, within all should being encompassed in protection scope of the present invention.Therefore, protection scope of the present invention should be as the criterion by described protection domain with claim.
Claims (15)
1. an electroless copper plating solution circulation filtration system, is characterized in that, comprising:
Heavy copper reaction major trough, it has for the overfall of discharging electroless copper plating solution;
Filter, it has entrance and exit, and described entrance is connected to described overfall by discharging the solution circulation pipeline; With
Enter the solution circulation pipeline, it has first end and the second end, and described first end is connected with the outlet of described filter, and described the second end extends to the backflow position of described heavy copper reaction major trough; Described backflow position is positioned at the side-walls relative with described overfall;
Wherein, the described part that enters that enters described the second end of being adjacent to of solution circulation pipeline is extended along or direction that tilt parallel or vertical with the bottom surface of described heavy copper reaction major trough, described enter the solution circulation pipeline enter the part in have one or more openings, described opening be located on the liquid level of the electroless copper plating solution in described heavy copper reaction major trough or under, and the bottom that is in the described heavy copper reaction major trough of distance predetermined height at least; Described opening makes from the solution of described opening ejection to be ejected on the madial wall of described heavy copper reaction major trough towards the madial wall setting of described heavy copper reaction major trough.
2. electroless copper plating solution circulation filtration system according to claim 1, is characterized in that, described filter comprises:
One or more coarse filters, described coarse filter are located between the overfall and backflow position of described heavy copper reaction major trough;
And/or
One or more fine filtrators, described fine filtrator are located between the overfall and backflow position of described heavy copper reaction major trough.
3. electroless copper plating solution circulation filtration system according to claim 2, is characterized in that, described coarse filter is provided with one or more screen packs; And/or
Described fine filtrator is provided with one or more filter cores and/or fie screen.
4. electroless copper plating solution circulation filtration system according to claim 1, is characterized in that, described predetermined altitude is the 20-50% of the height of described heavy copper reaction major trough.
5. electroless copper plating solution circulation filtration system according to claim 4, is characterized in that, described predetermined altitude be described heavy copper reaction major trough height be 30-50%.
6. electroless copper plating solution circulation filtration system according to claim 5, is characterized in that, described predetermined altitude be described heavy copper reaction major trough height be 40%.
7. the described electroless copper plating solution circulation of any one filtration system according to claim 1-6, it is characterized in that, described opening towards mutually identical or different and parallel or vertical with the bottom surface of described heavy copper reaction major trough or be inclined upwardly or downward-sloping, make from the solution of described opening ejection and do not impact the diapire that described heavy copper reacts major trough.
8. the described electroless copper plating solution circulation of any one filtration system according to claim 1-6, is characterized in that, described enter that part has can translation and/or the structure of rotation.
9. the described electroless copper plating solution circulation of any one filtration system according to claim 1-6, is characterized in that, the described part that enters is elongated shape, described opening for along longilineal described enter part vertically or one or more groups opening that circumferentially distributes;
And/or
The described part that enters is bent to annular, and described opening is described one or more groups opening that enters the part distribution along annular.
10. the described electroless copper plating solution circulation of any one filtration system according to claim 1-6, is characterized in that, described the second end sealing that enters the solution circulation pipeline.
11. according to claim 1-6, the described electroless copper plating solution circulation of any one filtration system, is characterized in that, is provided with in entering the solution circulation pipeline for the reflux state of controlling electroless copper plating solution and/or the valve of back-flow velocity and/or jet velocity described.
12. the electroless copper plating solution circulation filter method of an electroless copper plating solution circulation filtration system as claimed in claim 1 is characterized in that, comprising:
Electroless copper plating solution in heavy copper reaction major trough is entered in filter;
By described filter, described electroless copper plating solution is filtered;
The predetermined height at least in the heavy copper reaction major trough of distance bottom refluxes electroless copper plating solution after filtration and is ejected in described heavy copper reaction major trough, and by on the identical or different a plurality of open closed madial walls that are ejected into described heavy copper reaction major trough.
13. electroless copper plating solution circulation filter method according to claim 12 is characterized in that described filter comprises coarse filter and/or fine filtrator, and by described filter, described electroless copper plating solution is filtered and comprise:
By described coarse filter, described electroless copper plating solution is filtered;
And/or,
By described fine filtrator, described electroless copper plating solution is filtered.
14. electroless copper plating solution circulation filter method according to claim 12, it is characterized in that, when electroless copper plating solution after making filtration refluxes on the madial wall that is ejected into described heavy copper reaction major trough, the injection direction of the electroless copper plating solution after described filtration is parallel or vertical with the bottom surface of described heavy copper reaction major trough or be inclined upwardly or downward-sloping, makes the electroless copper plating solution of ejection not impact the diapire that described heavy copper reacts major trough.
15. according to claim 12-14, the described electroless copper plating solution circulation of any one filter method, is characterized in that, described electroless copper plating solution after filtration is refluxed be ejected into described heavy copper reaction major trough comprise:
Electroless copper plating solution after filtration is refluxed with predetermined back-flow velocity and/or jet velocity to be ejected in described heavy copper reaction major trough.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010268942 CN102029089B (en) | 2010-08-31 | 2010-08-31 | System and method for circulating and filtering chemical copper deposition solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010268942 CN102029089B (en) | 2010-08-31 | 2010-08-31 | System and method for circulating and filtering chemical copper deposition solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102029089A CN102029089A (en) | 2011-04-27 |
| CN102029089B true CN102029089B (en) | 2013-05-15 |
Family
ID=43882880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010268942 Active CN102029089B (en) | 2010-08-31 | 2010-08-31 | System and method for circulating and filtering chemical copper deposition solution |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102029089B (en) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102230170B (en) * | 2011-05-30 | 2013-03-27 | 江苏菲达宝开电气有限公司 | Efficient cyclic purification and phosphorization device |
| CN102912330B (en) * | 2012-09-30 | 2015-04-22 | 合肥长城制冷科技有限公司 | Processing process for coating copper to steel pipe |
| CN104342722A (en) * | 2013-07-31 | 2015-02-11 | 南昌欧菲光科技有限公司 | Electroforming equipment |
| CN104342723A (en) * | 2013-07-31 | 2015-02-11 | 南昌欧菲光科技有限公司 | Electroforming device |
| CN105401136A (en) * | 2015-11-30 | 2016-03-16 | 广东骏亚电子科技股份有限公司 | Copper filtering device and method for improving situation that copper residues block holes |
| CN106914048A (en) * | 2015-12-25 | 2017-07-04 | 惠州中京电子科技有限公司 | One kindization gold thread nickel groove filter |
| CN106731175B (en) * | 2016-12-13 | 2024-03-22 | 博敏电子股份有限公司 | Composite filtering device for copper-deposited wire glue removal slag groove and application method of composite filtering device |
| CN109395428B (en) * | 2017-08-18 | 2024-04-30 | 北京化工大学 | Extraction and separation device and system and extraction and separation method thereof |
| CN107653482A (en) * | 2017-11-15 | 2018-02-02 | 江门市信通通信工程有限公司 | A kind of filtration system of Novel electric plating solution |
| CN109936928A (en) * | 2017-12-18 | 2019-06-25 | 东莞文殊电子科技有限公司 | A kind of pcb board welding method |
| CN109628914B (en) * | 2019-01-26 | 2020-08-21 | 北京工业大学 | Treatment method for recycling aluminum powder chemical copper plating solution |
| CN110408916B (en) * | 2019-08-26 | 2021-08-17 | 惠州市安泰普表面处理科技有限公司 | Chemical nickel plating method |
| CN110468393B (en) * | 2019-08-26 | 2021-09-14 | 惠州市安泰普表面处理科技有限公司 | Chemical nickel plating system |
| CN111760339B (en) * | 2020-06-28 | 2022-05-27 | 宁波纬诚科技股份有限公司 | Centrifugal separation device for suspended substances in continuous flowing liquid and chemical nickel plating liquid |
| CN113873774B (en) * | 2021-09-15 | 2023-08-29 | 江苏贺鸿电子有限公司 | Horizontal copper deposition device for manufacturing printed circuit board |
| CN114164420A (en) * | 2021-12-07 | 2022-03-11 | 上达电子（深圳）股份有限公司 | Tin melting tank structure and use method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004143478A (en) * | 2002-10-22 | 2004-05-20 | Ebara Udylite Kk | Acid copper plating method, and acid copper plating device |
| JP4059976B2 (en) * | 1998-04-27 | 2008-03-12 | ニチハ株式会社 | Lightweight inorganic board |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2696568B2 (en) * | 1989-07-04 | 1998-01-14 | 日本化薬株式会社 | Transfer recording ink |
| JPH0459976A (en) * | 1990-06-27 | 1992-02-26 | Hitachi Chem Co Ltd | Electroless plating method and apparatus |
| JP3196092B2 (en) * | 1992-12-11 | 2001-08-06 | イビデン株式会社 | Chemical plating tank |
| JPH09137276A (en) * | 1995-11-10 | 1997-05-27 | Hitachi Chem Co Ltd | Method for removing iron component from electroless copper plating liquid |
-
2010
- 2010-08-31 CN CN 201010268942 patent/CN102029089B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4059976B2 (en) * | 1998-04-27 | 2008-03-12 | ニチハ株式会社 | Lightweight inorganic board |
| JP2004143478A (en) * | 2002-10-22 | 2004-05-20 | Ebara Udylite Kk | Acid copper plating method, and acid copper plating device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102029089A (en) | 2011-04-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102029089B (en) | System and method for circulating and filtering chemical copper deposition solution | |
| CN100518898C (en) | Injecting, bubbling ,dust settling, desulfurating and absorbing tower with vertical screen deck | |
| CN100482865C (en) | Foreign matter removing mechanism, fluid flow processing equipment, and foreign matter removing method | |
| CN102674552A (en) | Water treatment system of artificial wetland | |
| CN110917679A (en) | Micro-water-quantity back-flushing variable-speed upward-flow light filter material filter and method thereof | |
| KR100803713B1 (en) | Water purifying apparatus of provisional water supply system | |
| CN102389657B (en) | Continuous sand filtration apparatus | |
| CN105498995B (en) | A kind of shower apparatus | |
| WO2016136326A1 (en) | Painting equipment | |
| CN202342963U (en) | Continuous type sand filtration equipment | |
| CN101164663A (en) | Equipment for cleaning air | |
| CN102030430B (en) | Water treatment system | |
| CN203513377U (en) | Advanced wastewater treatment device | |
| CN101299360A (en) | Method and apparatus for cleanness continuously supplying paint to varnished wire painting groove | |
| KR200417138Y1 (en) | W-type under-drain block | |
| CN215822476U (en) | Filter equipment reaches integration sewage treatment device who contains it | |
| CN218403899U (en) | Dyeing wastewater physicochemical treatment filter tank | |
| CN114890570B (en) | Reverse series connection carbon sand filter tank and water filtering method | |
| CN204769331U (en) | A paint reflux unit for drenching lacquer machine | |
| CN220879742U (en) | Novel double-cylinder resin flushing column | |
| CN111620474B (en) | Biochemical tail water mechanical coagulation clarification equipment and method thereof | |
| CN217627896U (en) | A comprehensive processing apparatus of waste water for coating production | |
| JP2000153102A (en) | Oil-water separation pretreatment tank | |
| CN209967761U (en) | Equalizing basin with sediment sludge discharge function | |
| CN219585908U (en) | IC anaerobic reactor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220623 Address after: 3007, Hengqin international financial center building, No. 58, Huajin street, Hengqin new area, Zhuhai, Guangdong 519031 Patentee after: New founder holdings development Co.,Ltd. Patentee after: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. Address before: 100871, Beijing, Haidian District Cheng Fu Road 298, founder building, 5 floor Patentee before: PEKING UNIVERSITY FOUNDER GROUP Co.,Ltd. Patentee before: ZHUHAI FOUNDER TECH. HI-DENSITY ELECTRONIC Co.,Ltd. |
|
| TR01 | Transfer of patent right |