CN109936928A - A kind of pcb board welding method - Google Patents
A kind of pcb board welding method Download PDFInfo
- Publication number
- CN109936928A CN109936928A CN201711364822.8A CN201711364822A CN109936928A CN 109936928 A CN109936928 A CN 109936928A CN 201711364822 A CN201711364822 A CN 201711364822A CN 109936928 A CN109936928 A CN 109936928A
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- pcb board
- lead
- welding
- fixed plate
- pad
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Abstract
The present invention relates to pcb board welding technology field more particularly to a kind of pcb board welding method, comprise the following steps that fixed plate surface is opened up several pcb board slots for being used to place pcb board by S1, the fixed plate table is provided with lead fixing pipe；Pcb board is fixed in the pcb board slot in fixed plate by S2；S3 is by the tin cream dosage of the pad of pre-welding lead on pcb board；S4 is by lead placement in lead fixing pipe in fixed plate, the pad of pre-welding lead on the welding end in contact pcb board of lead；S5 is by fixed plate by Reflow Soldering, so that lead is welded on pcb board, welding temperature is 150-250 degree；S6 takes out the pcb board welded from fixed plate table.Pcb board welding method of the present invention makes the operating time shorten half, is improved production efficiency, in the case where the operation beat of holding production line is constant, reduces operator, has saved labour cost.
Description
Technical field
The present invention relates to pcb board welding technology field more particularly to a kind of pcb board welding methods.
Background technique
Now, it is manufactured in production line in pcb board, usually in welding lead process, needs worker from conveyer belt
Pcb board is taken out to station, every time when welding, worker needs hand that constant temperature electric iron is taken to draw respectively to the positive and negative anodes of pcb board workpiece
Wire bonding piece position heating tin cream is welded, and a tin point is once welded, and welding lead at two on pcb board in two times could be complete
At entire welding lead process operations, entire welding lead process needs to spend 6 seconds.In order to make welding lead process keep up with production
The operation beat of line needs to arrange two worker operations on this station, and the human cost of cost is larger.Therefore, how to change
Into the operating process and equipment of the process, keep production line operation beat it is constant in the case where, reduce labor cost at
For the development new direction of welding lead process modification.
Summary of the invention
The purpose of the present invention is to solve the shortcomings of the prior art providing a kind of pcb board welding method, grasped using this method
Make to have the characteristics that improve production efficiency when welding lead, save labour cost.
To achieve the above object, a kind of pcb board welding method of the invention, comprises the following steps that S1 will fix plate surface
It opens up several and is provided with lead fixing pipe for placing the pcb board slot of pcb board, the fixed plate table；Pcb board is fixed on by S2
In pcb board slot in fixed plate；S3 is by the tin cream dosage of the pad of pre-welding lead on pcb board；S4 is by lead placement in fixation
In lead fixing pipe on plate, the pad of pre-welding lead on the welding end in contact pcb board of lead；Fixed plate is passed through reflux by S5
Weldering, so that lead is welded on pcb board, welding temperature is 150-250 degree；S6 takes the pcb board welded from fixed plate table
Out.
Preferably, the pcb board slot of the step S1 is through-hole groove, the step S2 is: putting in the lower surface of fixed plate
One piece of vaccum-suction attachement pad is set, vaccum-suction attachement pad is against in pcb board slot in the position of each pcb board slot of correspondence setting convex block, passes through
It vacuumizes and pcb board is fixed in pcb board slot；The pcb board slot of the step S1 is through-hole, the step S2: in pcb board slot
Wall setting circlip fixes pcb board.
Preferably, platform is arranged in the pcb board slot of the step S1, the step S2 is: pcb board is placed on platform
Upper fixation.
Preferably, the step S3 is: being covered on fixed plate surface with one piece of steel mesh, draw on steel mesh in corresponding pre-welding
Through-hole is offered at the pcb board pad locations of line, paste solder printing operation is then carried out on steel mesh, is the tin cream dosage of pad.
Preferably, the lead fixing pipe of the step 1 is to rise as high as the banks, the step S4 is: lead is leaned on to the portion of proximal head
Divide bending to arch upward, is overlapped on lead welding end naturally on pcb board pad, to overcome the shadow due to lead external insulation layer thickness
It rings and makes on lead welding end and pcb board existing spacing between pad.
Preferably, the lead fixing pipe of the step S1 is skewed slot, end and PCB are welded according to lead in the inclination angle of skewed slot
Existing spacing size setting between pad on plate, the method for the step S4 is: by lead placement in the skewed slot, lead
Welding end is overlapped on naturally on pcb board pad.
Beneficial effects of the present invention: a kind of pcb board welding method of the invention comprises the following steps that S1 by fixed plate table
Face opens up several and is provided with lead fixing pipe for placing the pcb board slot of pcb board, the fixed plate table；S2 fixes pcb board
In pcb board slot in fixed plate；S3 is by the tin cream dosage of the pad of pre-welding lead on pcb board；S4 is by lead placement solid
In lead fixing pipe on fixed board, the pad of pre-welding lead on the welding end in contact pcb board of lead；S5 passes through back fixed plate
Fluid welding, so that lead is welded on pcb board, welding temperature is 150-250 degree；S6 is by the pcb board welded from fixed plate table
It takes out.Pcb board welding method of the present invention is that pcb board workpiece is placed in fixed plate, and pcb board workpiece fixing clamp is steady, then will
Tin cream is individually placed to wire locations at two on pcb board workpiece, and lead is welded on pcb board simultaneously by Reflow Soldering by fixed plate
On, the operating time shortens half, is improved production efficiency, in the case where the operation beat of holding production line is constant, subtracts
Few operator, has saved labour cost.
Specific embodiment
The present invention is described in detail below.
A kind of pcb board welding method of the invention comprises the following steps that fixed plate surface is opened up several and is used to put by S1
The pcb board slot of pcb board is set, the fixed plate table is provided with lead fixing pipe；Pcb board is fixed on the pcb board in fixed plate by S2
In slot；S3 is by the tin cream dosage of the pad of pre-welding lead on pcb board；Lead fixing pipe of the S4 by lead placement in fixed plate
In, the pad of pre-welding lead on the welding end in contact pcb board of lead；Fixed plate is passed through Reflow Soldering by S5, so that lead be welded
It connects on pcb board, welding temperature is 150-250 degree；S6 takes out the pcb board welded from fixed plate table.Pcb board weldering of the present invention
Method is connect, is that pcb board workpiece is placed in fixed plate, pcb board workpiece fixing clamp is steady, and lead fixing pipe fixes lead,
Lead is welded on pcb board by fixed plate simultaneously by Reflow Soldering, and the operating time shortens half, is improved production efficiency,
In the case where the operation beat of holding production line is constant, operator is reduced, labour cost has been saved.
The pcb board slot of the step S1 of the present embodiment is through-hole groove, and the step S2 is: placing one in the lower surface of fixed plate
Block vaccum-suction attachement pad, vaccum-suction attachement pad is against in pcb board slot in the position of each pcb board slot of correspondence setting convex block, true by taking out
Pcb board is fixed in pcb board slot by sky；The pcb board slot of the step S1 is through-hole, the step S2: is set in pcb board slot inner wall
Circlip is set to fix pcb board.
Platform is set in the pcb board slot of the step S1 of the present embodiment, and the step S2 is: pcb board is placed on platform
It is fixed.
The step S3 of the present embodiment is: being covered on fixed plate surface with one piece of steel mesh, is corresponding to pre-welding lead on steel mesh
Pcb board pad locations at offer through-hole, then on steel mesh carry out paste solder printing operation, be pad tin cream dosage.
The lead fixing pipe of the step 1 of the present embodiment is to rise as high as the banks, and the step S4 is: lead is curved by the part of proximal head
Arched, it is overlapped on lead welding end naturally on pcb board pad, to overcome the influence due to lead external insulation layer thickness
Make on lead welding end and pcb board existing spacing between pad.
The lead fixing pipe of the step S1 of the present embodiment is skewed slot, and end and pcb board are welded according to lead in the inclination angle of skewed slot
Existing spacing size setting between upper pad, the method for the step S4 is: by lead placement in the skewed slot, lead weldering
End is connect to be overlapped on naturally on pcb board pad.
The above is only a preferred embodiment of the present invention, for those of ordinary skill in the art, according to the present invention
Thought, there will be changes in the specific implementation manner and application range, and the content of the present specification should not be construed as to the present invention
Limitation.
Claims (6)
1. a kind of pcb board welding method, it is characterised in that: comprise the following steps that fixed plate surface is opened up several and is used for by S1
The pcb board slot of pcb board is placed, the fixed plate table is provided with lead fixing pipe；Pcb board is fixed on the PCB in fixed plate by S2
In board slot；S3 is by the tin cream dosage of the pad of pre-welding lead on pcb board；S4 fixes lead of the lead placement in fixed plate
Guan Zhong, the pad of pre-welding lead on the welding end in contact pcb board of lead；Fixed plate is passed through Reflow Soldering by S5, thus by lead
It is welded on pcb board, welding temperature is 150-250 degree；S6 takes out the pcb board welded from fixed plate table.
2. a kind of pcb board welding method according to claim 1, which is characterized in that the pcb board slot of the step S1 is logical
Hole slot, the step S2 is: placing one piece of vaccum-suction attachement pad in the lower surface of fixed plate, vaccum-suction attachement pad is in each PCB of correspondence
The position setting convex block of board slot is against in pcb board slot, and pcb board is fixed in pcb board slot by vacuumizing；The step S1's
Pcb board slot is through-hole, the step S2: fixes pcb board in pcb board slot inner wall setting circlip.
3. a kind of pcb board welding method according to claim 1, which is characterized in that set in the pcb board slot of the step S1
Horizontalization platform, the step S2 is: pcb board being placed on platform fixed.
4. a kind of pcb board welding method according to claim 1, which is characterized in that the step S3 is: with one piece of steel mesh
It is covered on fixed plate surface, through-hole is offered at the pcb board pad locations of corresponding pre-welding lead on steel mesh, then in steel mesh
Upper progress paste solder printing operation is the tin cream dosage of pad.
5. a kind of pcb board welding method according to claim 1, which is characterized in that the lead fixing pipe of the step 1 is
Rise as high as the banks, the step S4 is: by lead, by the part of proximal head, bending is arched upward, and lead welding end is made to be overlapped on pcb board naturally
On pad, make to exist between pad on lead welding end and pcb board to overcome the influence due to lead external insulation layer thickness
Spacing.
6. a kind of pcb board welding method according to claim 1, which is characterized in that the lead fixing pipe of the step S1
For skewed slot, the inclination angle of skewed slot is according to existing spacing size is arranged between pad on lead welding end and pcb board, the step
The method of S4 is: by lead placement in the skewed slot, lead welding end is overlapped on naturally on pcb board pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711364822.8A CN109936928A (en) | 2017-12-18 | 2017-12-18 | A kind of pcb board welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711364822.8A CN109936928A (en) | 2017-12-18 | 2017-12-18 | A kind of pcb board welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109936928A true CN109936928A (en) | 2019-06-25 |
Family
ID=66982573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711364822.8A Pending CN109936928A (en) | 2017-12-18 | 2017-12-18 | A kind of pcb board welding method |
Country Status (1)
| Country | Link |
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| CN (1) | CN109936928A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102029089A (en) * | 2010-08-31 | 2011-04-27 | 北大方正集团有限公司 | System and method for circulating and filtering chemical copper deposition solution |
| US8153905B2 (en) * | 2009-02-27 | 2012-04-10 | Ibiden Co., Ltd. | Method for manufacturing printed wiring board and printed wiring board |
| CN103317200A (en) * | 2013-06-20 | 2013-09-25 | 上海三思电子工程有限公司 | Welding method and jig for adhering lead on circuit board |
-
2017
- 2017-12-18 CN CN201711364822.8A patent/CN109936928A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8153905B2 (en) * | 2009-02-27 | 2012-04-10 | Ibiden Co., Ltd. | Method for manufacturing printed wiring board and printed wiring board |
| CN102029089A (en) * | 2010-08-31 | 2011-04-27 | 北大方正集团有限公司 | System and method for circulating and filtering chemical copper deposition solution |
| CN103317200A (en) * | 2013-06-20 | 2013-09-25 | 上海三思电子工程有限公司 | Welding method and jig for adhering lead on circuit board |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190625 |
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| RJ01 | Rejection of invention patent application after publication |