CN105618887A - Welding method for gold plated lead wire SMD - Google Patents
Welding method for gold plated lead wire SMD Download PDFInfo
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- CN105618887A CN105618887A CN201410595674.0A CN201410595674A CN105618887A CN 105618887 A CN105618887 A CN 105618887A CN 201410595674 A CN201410595674 A CN 201410595674A CN 105618887 A CN105618887 A CN 105618887A
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Abstract
The invention relates to the technical field of semiconductor devices, in particular to a welding method for a gold plated lead wire SMD. The welding method for the gold plated lead wire SMD comprises the following steps that the device is selected; the welding method is determined; the device is subjected to tin plating treatment; and the device is welded. According to the welding method for the gold plated lead wire SMD, tin plating treatment is adopted, the effect of gold removing is optimal, and the welding strength is best; the welding method is simple in process, easy to operate and suitable for being used in the industrial field widely.
Description
Technical field
The present invention relates to technical field of semiconductor device, be specifically related to a kind of gold plated lead SMD welding method.
Background technology
Device wire plated thickness is more than 1.27um's, it is necessary to carry out " except gold ", and device wire plated thickness should at 1.3-5.7um. Owing to SMD device encapsulates integrated level height, especially QFP encapsulation, its lead spacing is only small and relatively soft, warding off the usual stannum pot of stannum to ward off the as easy as rolling off a log generation bridge of stannum even or make device because the slightly lead deformation by external force when through hole mounting related components, this all even makes device normally to mount by directly affecting the quality that reflow welding connects. And adopt and ward off stannum or manual welding technique by hand, its efficiency and quality are greatly reduced, and are not suitable with the needs of technical development.
Summary of the invention
It is contemplated that propose a kind of gold-plated pin device the best welding method.
Technical program of the present invention lies in:
A kind of gold plated lead SMD welding method, adopts following steps:
Step 1: selected device;
Step 2: determine welding method;
Step 3: device is warded off stannum and processes;
Step 4: device welds.
Preferably, described device welding method is:
A the chip soldering warding off stannum is connected in one piece of test printed board by (), bread board is numbered 1#;
(b) chip soldering not warding off stannum is connected on one piece test printed board on, then with inhale stannum rope exhaust as far as possible device surrounding lead-in wire on scolding tin, and with electric cautery add stannum to go between again weld, bread board is numbered 2#;
C the chip soldering not warding off stannum is connected in one piece of test printed board by (), four limit lead-in wires of device are identified A, B, C, D respectively, the lead-in wire flatiron on A and B both sides is carried out re melting process, and C and D maintains the original state;
D device solder joint is cleaned up after having assembled by () above-mentioned bread board with dehydrated alcohol.
Preferably, described gold plated lead SMD kind is more, substantially can be coated with other SMD of lead-in wire due to QFP device, therefore determines to study mainly for QFP packaging, selects pin count to be 208 feet, lead spacing be the gold plated lead device of 0.5mm.
Or preferably, the welding method in described step 2 can be also following several:
A () device first carries out warding off stannum and processes, then adopt reflow soldering;
B () device first directly adopts reflow soldering, then exhaust scolding tin as far as possible with suction stannum rope, finally again weld with flatiron;
C () device is first made directly reflow soldering, then add stannum remelting with electric cautery;
D () device is made directly reflow soldering, lead-in wire does not deal with.
Or preferably, described stannum processing method that device is warded off is: gold plated lead is warded off the special stannum pot temperature of stannum and is set to 280 DEG C, hand-held device, device wire is coated with appropriate scaling powder, then become 0 �㡫30 �� angles to immerse in stannum pot tin-lead solder with stannum pot face vertical direction, ward off stannum time 1��2s, it is ensured that ward off stannum height slightly above lead-in wire root; Connecting situation if there is bridge in warding off stannum process, available stannum rope of inhaling sucks unnecessary scolding tin, and slight deformation lead-in wire is corrected.
The method have technical effect that:
The present invention adopts and wards off stannum and process, and to going gold best results, weld strength is best, and process of the present invention is simple, it is easy to operation, is suitable for industrial using on a large scale.
Detailed description of the invention
A kind of gold plated lead SMD welding method, adopts following steps:
Step 1: selected device;
Step 2: determine welding method;
Step 3: device is warded off stannum and processes;
Step 4: device welds.
Wherein, the device welding method described in step 4 is:
A the chip soldering warding off stannum is connected in one piece of test printed board by (), bread board is numbered 1#;
(b) chip soldering not warding off stannum is connected on one piece test printed board on, then with inhale stannum rope exhaust as far as possible device surrounding lead-in wire on scolding tin, and with electric cautery add stannum to go between again weld, bread board is numbered 2#;
C the chip soldering not warding off stannum is connected in one piece of test printed board by (), four limit lead-in wires of device are identified A, B, C, D respectively, the lead-in wire flatiron on A and B both sides is carried out re melting process, and C and D maintains the original state;
D device solder joint is cleaned up after having assembled by () above-mentioned bread board with dehydrated alcohol.
Gold plated lead SMD kind is more, substantially can be coated with other SMD of lead-in wire due to QFP device, therefore determines to study mainly for QFP packaging, selects pin count to be 208 feet, lead spacing be the gold plated lead device of 0.5mm.
Welding method in described step 2 can be also following several:
A () device first carries out warding off stannum and processes, then adopt reflow soldering;
B () device first directly adopts reflow soldering, then exhaust scolding tin as far as possible with suction stannum rope, finally again weld with flatiron;
C () device is first made directly reflow soldering, then add stannum remelting with electric cautery;
D () device is made directly reflow soldering, lead-in wire does not deal with.
Device is warded off stannum processing method is: gold plated lead is warded off the special stannum pot temperature of stannum and is set to 280 DEG C, hand-held device, device wire is coated with appropriate scaling powder, then become 0 �㡫30 �� angles to immerse in stannum pot tin-lead solder with stannum pot face vertical direction, ward off stannum time 1��2s, it is ensured that ward off stannum height slightly above lead-in wire root; Connecting situation if there is bridge in warding off stannum process, available stannum rope of inhaling sucks unnecessary scolding tin, and slight deformation lead-in wire is corrected.
Claims (5)
1. a gold plated lead SMD welding method, it is characterised in that: adopt following steps:
Step 1: selected device;
Step 2: determine welding method;
Step 3: device is warded off stannum and processes;
Step 4: device welds.
2. such as claim 1 gold plated lead SMD welding method, it is characterised in that: described device welding method is:
A the chip soldering warding off stannum is connected in one piece of test printed board by (), bread board is numbered 1#;
(b) chip soldering not warding off stannum is connected on one piece test printed board on, then with inhale stannum rope exhaust as far as possible device surrounding lead-in wire on scolding tin, and with electric cautery add stannum to go between again weld, bread board is numbered 2#;
C the chip soldering not warding off stannum is connected in one piece of test printed board by (), four limit lead-in wires of device are identified A, B, C, D respectively, the lead-in wire flatiron on A and B both sides is carried out re melting process, and C and D maintains the original state;
D device solder joint is cleaned up after having assembled by () above-mentioned bread board with dehydrated alcohol.
3. such as claim 1 gold plated lead SMD welding method, it is characterized in that: described gold plated lead SMD kind is more, substantially other SMD of lead-in wire can be coated with due to QFP device, therefore determine to study mainly for QFP packaging, select pin count to be 208 feet, lead spacing be the gold plated lead device of 0.5mm.
4. such as claim 1 gold plated lead SMD welding method, it is characterised in that: the welding method in described step 2 can be also following several:
A () device first carries out warding off stannum and processes, then adopt reflow soldering;
B () device first directly adopts reflow soldering, then exhaust scolding tin as far as possible with suction stannum rope, finally again weld with flatiron;
C () device is first made directly reflow soldering, then add stannum remelting with electric cautery;
D () device is made directly reflow soldering, lead-in wire does not deal with.
5. such as claim 1 gold plated lead SMD welding method, it is characterized in that: described stannum processing method that device is warded off is: gold plated lead is warded off the special stannum pot temperature of stannum and is set to 280 DEG C, hand-held device, device wire is coated with appropriate scaling powder, then become 0 �㡫30 �� angles to immerse in stannum pot tin-lead solder with stannum pot face vertical direction, ward off stannum time 1��2s, it is ensured that ward off stannum height slightly above lead-in wire root; Connecting situation if there is bridge in warding off stannum process, available stannum rope of inhaling sucks unnecessary scolding tin, and slight deformation lead-in wire is corrected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410595674.0A CN105618887A (en) | 2014-10-30 | 2014-10-30 | Welding method for gold plated lead wire SMD |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410595674.0A CN105618887A (en) | 2014-10-30 | 2014-10-30 | Welding method for gold plated lead wire SMD |
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| Publication Number | Publication Date |
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| CN105618887A true CN105618887A (en) | 2016-06-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410595674.0A Pending CN105618887A (en) | 2014-10-30 | 2014-10-30 | Welding method for gold plated lead wire SMD |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312233A (en) * | 2016-09-21 | 2017-01-11 | 北京空间机电研究所 | Special fixture for gold removal and tin coating for QFN encapsulated components, and method for gold removal and tin coating |
| CN107350585A (en) * | 2017-06-26 | 2017-11-17 | 安徽华东光电技术研究所 | A kind of method of flat gold plated lead manual welding |
| CN109462974A (en) * | 2018-11-09 | 2019-03-12 | 中国科学院长春光学精密机械与物理研究所 | A kind of chip pin correcting tool and a kind of chip mounting method |
| CN110049634A (en) * | 2019-05-08 | 2019-07-23 | 中国电子科技集团公司第二十九研究所 | A kind of assembly technique based on thin space QFN device and pottery envelope QFP device |
| CN111681972A (en) * | 2020-06-19 | 2020-09-18 | 中国航空无线电电子研究所 | Tool for assisting gold removal of chip with pins and gold removing and tin coating method |
| CN112164949A (en) * | 2020-08-19 | 2021-01-01 | 山东航天电子技术研究所 | High-reliability assembling method for thin-wall through hole piece |
| CN112247300A (en) * | 2020-09-11 | 2021-01-22 | 中国电子科技集团公司第十三研究所 | Electronic component welding method and surface-mounted electronic component welding method |
-
2014
- 2014-10-30 CN CN201410595674.0A patent/CN105618887A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106312233A (en) * | 2016-09-21 | 2017-01-11 | 北京空间机电研究所 | Special fixture for gold removal and tin coating for QFN encapsulated components, and method for gold removal and tin coating |
| CN106312233B (en) * | 2016-09-21 | 2018-08-31 | 北京空间机电研究所 | A method of it goes gold to ward off the special fixture of tin for QFN encapsulation components and gold is gone to ward off tin |
| CN107350585A (en) * | 2017-06-26 | 2017-11-17 | 安徽华东光电技术研究所 | A kind of method of flat gold plated lead manual welding |
| CN109462974A (en) * | 2018-11-09 | 2019-03-12 | 中国科学院长春光学精密机械与物理研究所 | A kind of chip pin correcting tool and a kind of chip mounting method |
| CN110049634A (en) * | 2019-05-08 | 2019-07-23 | 中国电子科技集团公司第二十九研究所 | A kind of assembly technique based on thin space QFN device and pottery envelope QFP device |
| CN111681972A (en) * | 2020-06-19 | 2020-09-18 | 中国航空无线电电子研究所 | Tool for assisting gold removal of chip with pins and gold removing and tin coating method |
| CN111681972B (en) * | 2020-06-19 | 2024-03-15 | 中国航空无线电电子研究所 | Frock assisting gold removal of mounted chip with pins and Jin Tangxi removal method |
| CN112164949A (en) * | 2020-08-19 | 2021-01-01 | 山东航天电子技术研究所 | High-reliability assembling method for thin-wall through hole piece |
| CN112247300A (en) * | 2020-09-11 | 2021-01-22 | 中国电子科技集团公司第十三研究所 | Electronic component welding method and surface-mounted electronic component welding method |
| CN112247300B (en) * | 2020-09-11 | 2022-04-29 | 中国电子科技集团公司第十三研究所 | Electronic component welding method and surface-mounted electronic component welding method |
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Application publication date: 20160601 |