CN110468393B

CN110468393B - Chemical nickel plating system

Info

Publication number: CN110468393B
Application number: CN201910787992.XA
Authority: CN
Inventors: 谢彪
Original assignee: Huizhou Ontap Surface Treatment Technology Co ltd
Current assignee: Huizhou Ontap Surface Treatment Technology Co ltd
Priority date: 2019-08-26
Filing date: 2019-08-26
Publication date: 2021-09-14
Anticipated expiration: 2039-08-26
Also published as: CN110468393A

Abstract

The invention relates to the field of nickel plating equipment, and discloses a chemical nickel plating system which comprises a nickel plating assembly, a medicine feeding assembly and a circulating assembly, wherein the medicine feeding assembly comprises a medicine feeding pipe and a zigzag medicine spraying pipe, the zigzag medicine spraying pipe comprises a lifting pipe, a parallel pipe, a descending pipe and a longitudinal spraying pipe, the first end of the medicine feeding pipe is communicated with a medicine preparation cavity, the second end of the medicine feeding pipe is communicated with the lifting pipe, the parallel pipe, the descending pipe and the longitudinal spraying pipe are sequentially communicated, the longitudinal spraying pipe is arranged in a reaction cavity, and the longitudinal spraying pipe is provided with a plurality of first medicine spraying holes which are arranged at intervals; the circulating component comprises a medicine outlet pipe, a filter and a circulating pipe, wherein the first end of the medicine outlet pipe is communicated with the reaction cavity, and the second end of the medicine outlet pipe is communicated with the first end of the filter. The invention enhances the water pressure of the qualified nickel plating solution, enables the qualified nickel plating solution to be sprayed out, enhances the flow of the qualified nickel plating solution in the reaction cavity, and better achieves the effect of uniform circulation of the qualified nickel plating solution on the upper layer and the lower layer, thereby improving the uniformity of the plating layer of the finished nickel plating product.

Description

Chemical nickel plating system

Technical Field

The invention relates to the field of nickel plating equipment, in particular to a chemical nickel plating system.

Background

Electroless nickel plating, also known as electroless plating, may also be referred to as autocatalytic plating, and specifically refers to a process in which metal ions in an aqueous solution are reduced by a reducing agent under certain conditions and are precipitated onto the surface of a solid substrate. Unlike displacement plating, the plating layer can be thickened continuously, and the plated metal has catalytic capability. The chemical nickel plating liquid generally uses nickel sulfate, nickel acetate, etc. as main salts, hypophosphites, sodium borohydride, borane, hydrazine, etc. as reducing agents, and various auxiliary agents are added. The operation is carried out in a high-temperature acidic solution. The coating shows superiority in uniformity, corrosion resistance, hardness, weldability, magnetism and decorativeness.

The existing chemical nickel plating equipment is mainly a chemical nickel plating tank, a large amount of nickel plating liquid medicine is contained in the chemical nickel plating tank, and due to the fact that the volume of the chemical nickel plating tank is large and is about 2000L generally, the nickel plating liquid medicine in the chemical nickel plating tank is difficult to mix uniformly, so that the temperature and concentration difference of the nickel plating liquid medicine at different positions is caused, and the coating of a product to be plated is uneven. Furthermore, the used nickel plating solution contains some visible impurities, and the used nickel plating solution is discharged into a sewage channel in order not to affect the quality of a plating layer and not to be recycled, so that the consumption of the nickel plating solution is high, the nickel plating cost is high, and the discharge amount of the nickel plating waste solution is large.

Disclosure of Invention

The invention aims to overcome the defects in the prior art and provide the chemical nickel plating system which can improve the uniformity of a plating layer, reduce the nickel plating cost and reduce the discharge amount of nickel plating waste liquid.

The purpose of the invention is realized by the following technical scheme:

an electroless nickel plating system comprising:

the chemical nickel plating device comprises a nickel plating assembly, a chemical nickel plating tank and an overflow baffle plate, wherein a containing cavity is arranged in the chemical nickel plating tank, and the overflow baffle plate is connected with the inner wall of the chemical nickel plating tank and encloses a reaction cavity and a medicine preparation cavity which are mutually isolated with the containing cavity respectively;

the device comprises a medicine feeding assembly, a medicine feeding assembly and a zigzag medicine spraying pipe, wherein the zigzag medicine spraying pipe comprises a lifting pipe, a parallel pipe, a descending pipe and a longitudinal spraying pipe, the first end of the medicine feeding pipe is communicated with a medicine preparing cavity, the second end of the medicine feeding pipe is communicated with the lifting pipe, the parallel pipe, the descending pipe and the longitudinal spraying pipe are sequentially communicated, the longitudinal spraying pipe is arranged in the reaction cavity, and the longitudinal spraying pipe is provided with a plurality of first medicine spraying holes which are arranged at intervals; and

the circulating assembly comprises a medicine outlet pipe, a filter and a circulating pipe, wherein the first end of the medicine outlet pipe is communicated with the reaction cavity, and the second end of the medicine outlet pipe is communicated with the first end of the filter; the second end of the filter is communicated with the first end of the circulating pipe, and the second end of the circulating pipe is communicated with the medicine preparation cavity.

In one embodiment, the chemical nickel plating bath has a bottom with a chemical inlet and a chemical outlet, the chemical inlet is respectively communicated with the chemical preparation cavity and the chemical inlet pipe, and the chemical outlet is respectively communicated with the reaction cavity and the chemical outlet pipe.

In one of the implementation modes, a plurality of limiting grooves are formed in the overflow partition plate and are sequentially connected, the bottom end of each limiting groove is a lower liquid level, and the top end of each limiting groove is an upper liquid level.

In one of them embodiment, the filter includes parallel connection pipe, filters casing, filter core and L shape connecting pipe, go out the pencil parallel connection pipe filter the casing the filter core reaches L shape connecting pipe communicates in proper order, the filter core set up in filter the casing, the filter core includes diatom mud shell and filters the inner core, filter the inner core pack in the diatom mud shell, filter the inner core and include from last to stacking gradually activated carbon layer, tourmaline layer and the cotton layer of pp that sets up down.

In one embodiment, the nickel plating assembly further comprises a heating device, the heating device comprises a heater and a temperature controller, the heater is arranged at the bottom of the reaction cavity, and the temperature controller is electrically connected with the heater and is located outside the chemical nickel plating bath.

In one of the embodiments, the medicine feeding assembly further comprises a first solenoid valve and a booster pump, the first solenoid valve and the booster pump are respectively arranged on the medicine feeding pipe, and the booster pump is located between the first solenoid valve and the lifting pipe.

In one embodiment, the circulation assembly 130 further includes a second solenoid valve, and the second solenoid valve is disposed on the medicine outlet pipe.

In one embodiment, the central axis of the first spray opening forms an angle of 45 ° with the central axis of the longitudinal lance.

In one embodiment, the nickel plating assembly further comprises a stirring device, the stirring device comprises a stirrer and an isolation shell, the isolation shell is arranged at the bottom of the reaction cavity, the isolation shell is provided with a flow hole, and the stirrer is arranged in the isolation shell.

In one of them embodiment, the nickel plating subassembly still includes the drain device, the drain device includes flexible drain board, connecting piece, magnetism firmware and iron sheet, the first end of connecting piece with the first side wall connection of chemical nickel plating groove, the second end of connecting piece with the first end of flexible drain board is connected, the second end of flexible drain board with the magnetism firmware is connected, the iron sheet is fixed in on the second side outer wall of chemical nickel plating groove, the magnetism firmware be used for with iron sheet magnetism is inhaled fixedly, a plurality of waterlogging caused by excessive rainfall holes have been seted up to flexible drain board, the waterlogging caused by excessive rainfall hole site in the reaction cavity reaches the top of preparing medicine cavity.

Compared with the prior art, the invention has at least the following advantages:

according to the invention, the qualified nickel plating solution sequentially passes through the medicine inlet pipe, the lifting pipe, the parallel pipe, the descending pipe and the longitudinal spray pipe, the operation of ascending and descending is carried out firstly, so that the water pressure of the qualified nickel plating solution is enhanced, and then the qualified nickel plating solution enters the relatively narrow first medicine spraying hole through the relatively wide longitudinal spray pipe, so that the water pressure of the qualified nickel plating solution is further enhanced, and the qualified nickel plating solution is sprayed out, so that the flowing of the qualified nickel plating solution in the reaction cavity is enhanced, the effect of uniform circulation of the qualified nickel plating solution on the upper layer and the lower layer is better achieved, and the uniformity of a plating layer of a finished nickel plating product is improved; the qualified nickel plating solution is introduced into the filter through the medicine outlet pipe, impurity particles contained in the qualified nickel plating solution are filtered and removed, the nickel plating circulating solution is discharged back into the medicine preparation cavity through the circulating pipe, and detection and parameter adjustment operations are carried out again to obtain the qualified nickel plating solution, so that the qualified nickel plating solution is recycled, the consumption of the qualified nickel plating solution is reduced, the nickel plating cost is reduced, and the discharge of nickel plating waste liquid is reduced.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a flow chart of the steps of an electroless nickel plating method according to one embodiment of the present invention.

Fig. 2 is a schematic structural diagram of an electroless nickel plating system according to an embodiment of the present invention.

Fig. 3 is a schematic partial structure view of an electroless nickel plating system according to an embodiment of the present invention.

Fig. 4 is a schematic partial structure view of an electroless nickel plating system according to an embodiment of the present invention.

Fig. 5 is a schematic view of a partial structure of an electroless nickel plating system according to an embodiment of the present invention.

Fig. 6 is a schematic view of a partial structure of an electroless nickel plating system according to an embodiment of the present invention.

Fig. 7 is a schematic structural view of a nickel plating assembly of an electroless nickel plating system in accordance with an embodiment of the present invention.

Fig. 8 is a schematic structural view of a filter of a circulation module of an electroless nickel plating system according to an embodiment of the present invention.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

In one embodiment, referring to fig. 1, an electroless nickel plating method includes the following steps: s110, enabling the nickel plating standby solution to flow into a standby medicine cavity of a chemical nickel plating bath, and carrying out detection operation on the nickel plating standby solution to obtain a current parameter table; s120, comparing the current parameter table with a standard parameter table, and performing parameter adjustment operation on the nickel plating standby liquid to obtain a nickel plating qualified liquid; s130, enabling the qualified nickel plating solution to sequentially flow through a medicine inlet pipe, a lifting pipe, a parallel pipe, a descending pipe and a parallel spray pipe, and arranging a plurality of first medicine spraying holes at intervals on the parallel spray pipe so that the qualified nickel plating solution is sprayed out of the first medicine spraying holes into a reaction cavity of the chemical nickel plating tank; s140, putting a product to be plated into the reaction cavity, and carrying out chemical nickel plating operation to obtain a nickel plated finished product; s150, enabling the qualified nickel plating solution to flow out of the medicine outlet pipe into a filter, carrying out filtering operation to obtain a nickel plating circulating solution, and enabling the nickel plating circulating solution to flow out of the circulating pipe into the medicine preparation cavity.

Referring to fig. 2 and 3, an electroless nickel plating system 10 includes a nickel plating assembly 110, a chemical feed assembly 120, and a circulation assembly 130. The nickel plating assembly 110 comprises a chemical nickel plating tank 111 and an overflow baffle plate 112, wherein a containing cavity is arranged in the chemical nickel plating tank 111, and the overflow baffle plate 112 is connected with the inner wall of the chemical nickel plating tank 111 and surrounds a reaction cavity 1111 and a medicine preparation cavity 1112 which are isolated from each other respectively with the containing cavity. The pesticide feeding assembly 120 comprises a pesticide feeding pipe 121 and a zigzag pesticide spraying pipe 122, the zigzag pesticide spraying pipe 122 comprises a lifting pipe 1221, a parallel pipe 1222, a descending pipe 1223 and a longitudinal spraying pipe 1224, a first end of the pesticide feeding pipe 121 is communicated with the pesticide preparation cavity 1112, a second end of the pesticide feeding pipe 121 is communicated with the lifting pipe 1221, the parallel pipe 1222, the descending pipe 1223 and the longitudinal spraying pipe 1224 are sequentially communicated, the longitudinal spraying pipe 1224 is arranged in the reaction cavity 1111, and the longitudinal spraying pipe 1224 is provided with a plurality of first pesticide spraying holes 1224a arranged at intervals. The circulation assembly 130 comprises a drug outlet pipe 131, a filter 132 and a circulation pipe 133, wherein a first end of the drug outlet pipe 131 is communicated with the reaction cavity 1111, and a second end of the drug outlet pipe 131 is communicated with a first end of the filter 132; the second end of the filter 132 is connected to the first end of the circulation tube 133, and the second end of the circulation tube 133 is connected to the medicine preparation chamber 1112.

In order to ensure the quality of nickel plating, the parameters of the nickel plating solution are adjusted before the electroless nickel plating operation, so as to improve the uniformity of the plating quality of the nickel plating finished products of different batches. The containing cavity is divided into a reaction cavity 1111 and a medicine preparing cavity 1112 by the overflow clapboard 112, so that the containing function of the chemical nickel plating bath 111 is enhanced, and the chemical nickel plating bath can be used as a configuration container of a nickel plating standby solution and a reaction container of a nickel plating qualified solution and a product to be plated; the qualified nickel plating solution sequentially passes through the medicine inlet pipe 121, the lifting pipe 1221, the parallel pipe 1222, the descending pipe 1223 and the longitudinal spray pipe 1224, the operation of ascending and descending is performed firstly, the water pressure of the qualified nickel plating solution is enhanced, and then the qualified nickel plating solution enters the relatively narrow first spray hole 1224a through the relatively wide longitudinal spray pipe 1224, the water pressure of the qualified nickel plating solution is further enhanced, so that the qualified nickel plating solution is sprayed out, the flowing of the qualified nickel plating solution in the reaction cavity 1111 is enhanced, the effect of uniform circulation of the qualified nickel plating solution on the upper layer and the lower layer is better achieved, and the uniformity of a plating layer of a finished nickel plating product is improved. After the chemical nickel plating operation is completed, the nickel content of the qualified nickel plating solution is greatly reduced, and impurity particles such as gravel and precipitates may be contained, the qualified nickel plating solution is introduced into the filter 132 through the medicine outlet pipe 131, the impurity particles contained in the qualified nickel plating solution are filtered and removed, the nickel plating circulating solution is discharged back into the medicine preparation cavity 1112 through the circulating pipe 133, the nickel plating circulating solution in the medicine preparation cavity 1112 is the nickel plating standby solution, the detection and parameter adjustment operations are carried out again to obtain the qualified nickel plating solution, so that the qualified nickel plating solution is recycled, the consumption of the qualified nickel plating solution is reduced, the nickel plating cost is reduced, and the discharge of the nickel plating waste solution is reduced.

In one embodiment, the chemical nickel plating bath 111 has a chemical inlet and a chemical outlet at the bottom, the chemical inlet is respectively communicated with the chemical preparation cavity 1112 and the chemical inlet pipe 121, and the chemical outlet is respectively communicated with the reaction cavity 1111 and the chemical outlet pipe 131. It should be noted that the medicine preparation cavity 1112 is communicated with the medicine inlet tube 121 through the medicine inlet, and the reaction cavity 1111 is communicated with the medicine outlet tube 131 through the medicine outlet.

In one embodiment, the operation of performing the detection operation on the nickel plating solution comprises: and carrying out nickel content detection operation, pH detection operation and capacity detection operation on the nickel plating standby solution, wherein the current parameter table comprises a current nickel content parameter, a current pH parameter and a current capacity parameter.

In one embodiment, the standard parameter table includes a nickel content standard parameter, a pH standard parameter, and a capacity standard parameter, and the operation of performing the parameter adjustment operation on the nickel plating solution includes a nickel content adjustment operation, a pH adjustment operation, and a capacity adjustment operation on the nickel plating solution.

It should be noted that the key parameters affecting the nickel plating effect are the current nickel content parameter, the current pH parameter and the current capacity parameter, and the current nickel content parameter, the current pH parameter and the current capacity parameter of the nickel plating solution respectively reach the standard nickel content parameter, the standard pH parameter and the standard capacity parameter through parameter adjustment operation, so as to improve the uniformity of the plating quality of the nickel plated products of different batches.

In an embodiment, referring to fig. 4, the overflow partition 112 is provided with a plurality of limiting grooves 1121, the limiting grooves 1121 are sequentially connected, a bottom end of each limiting groove 1121 is a lower liquid level 1121a, and a top end of each adjacent two limiting grooves 1121 is an upper liquid level 1121 b.

It should be noted that, by forming the limiting groove 1121 on the overflow partition 112, an upper liquid level 1121b and a lower liquid level 1121a are formed on the overflow partition 112, so that people can visually determine the relative level of the qualified nickel plating liquid in the chemical nickel plating bath 111, if the level of the reserve nickel plating liquid in the reserve medicine cavity 1112 is lower than the lower liquid level 1121a, it is determined that the current capacity parameter of the reserve nickel plating liquid is smaller than the standard capacity parameter, and after water is added, if the level of the reserve nickel plating liquid in the reserve medicine cavity 1112 is equal to the lower liquid level 1121a, it is determined that the current capacity parameter of the reserve nickel plating liquid is equal to the standard capacity parameter, such a capacity detection operation is very simple and fast.

In one embodiment, the operation of performing the filtering operation comprises: and enabling the qualified nickel plating solution to sequentially flow through a parallel connecting pipe, a diatom ooze shell, an activated carbon layer, an tourmaline layer, a pp cotton layer and an L-shaped connecting pipe to obtain the nickel plating circulating solution.

In one embodiment, referring to fig. 8, the filter 132 includes a parallel connection pipe 1321, a filter housing 1322, a filter element 1323, and an L-shaped connection pipe 1324, the drug outlet pipe 131, the parallel connection pipe 1321, the filter housing 1322, the filter element 1323, and the L-shaped connection pipe 1324 are sequentially communicated, the filter element 1323 is disposed in the filter housing 1322, the filter element 1323 includes a diatom ooze housing 1323a and a filter inner core, the filter inner core is filled in the diatom ooze housing 1323a, and the filter inner core includes an activated carbon layer 1323b, a tourmaline layer 1323c, and a pp cotton layer 1323d, which are sequentially stacked from top to bottom.

After the electroless nickel plating operation, the qualified nickel plating solution flows into the parallel connection pipe 1321, the filter housing 1322, the filter element 1323 and the L-shaped connection pipe 1324 in sequence, and is subjected to multiple filtration by the diatom ooze shell 1323a, the activated carbon layer 1323b, the tourmaline layer 1323c and the pp cotton layer 1323d, so that an excellent filtration effect can be achieved, and impurities in the qualified nickel plating solution can be removed efficiently.

In one embodiment, the filter housing 1322 defines a first filter opening communicating with the parallel connection pipe 1321 and a second filter opening communicating with the L-shaped connection pipe 1324, and a central axis of the first opening of the filter housing 1322 and a central axis of the second opening of the filter housing 1322 are perpendicular to each other.

It should be noted that the first opening and the second opening of the filter housing 1322, which are perpendicular to each other, make the filtering path of the qualified nickel plating solution more tortuous, so as to increase the retention time of the qualified nickel plating solution in the filter 132, thereby further enhancing the filtering effect of the qualified nickel plating solution.

In one embodiment, the filter 132 further comprises a filter screen, which is disposed in the parallel connection pipe 1321.

It should be noted that the filter screen traps large particles of impurities of the qualified nickel plating solution outside the filter casing 1322 to reduce the filtering pressure of the filter element 1323, thereby prolonging the service life of the filter element 1323.

In one embodiment, before the operation of placing the product to be plated into the reaction chamber, a heating device is further installed at the bottom of the reaction chamber, and the qualified nickel plating solution is contacted with the heating device to perform a heating operation, so that the temperature of the qualified nickel plating solution reaches a standard temperature.

In one embodiment, referring to fig. 1, the nickel plating assembly 110 further includes a heating device, the heating device includes a heater and a temperature controller, the heater is disposed at the bottom of the reaction chamber 1111, and the temperature controller is electrically connected to the heater and located outside the electroless nickel plating bath 111. The heater is an electric heating rod which is arranged in the bottom wall of the chemical nickel plating bath 111.

It should be noted that the qualified nickel plating solution in the reaction chamber 1111 is heated by the heater, and the temperature of the heater is controlled by the temperature controller, so that the temperature of the qualified nickel plating solution is maintained within the standard temperature range, and the uniformity of the plating quality of the nickel plating finished products of different batches is improved.

In one embodiment, when the qualified nickel-plating solution flows through the medicine inlet pipe, a booster pump is further installed on the medicine inlet pipe, and the qualified nickel-plating solution flows into the booster pump to perform a boosting operation, so as to increase the water pressure of the qualified nickel-plating solution.

In an embodiment, referring to fig. 2, the medicine feeding assembly further includes a first solenoid valve 123 and a booster pump 124, the first solenoid valve 123 and the booster pump 124 are respectively disposed on the medicine feeding pipe 121, and the booster pump 124 is located between the first solenoid valve 123 and the lifting pipe 1221.

It should be noted that the first electromagnetic valve 123 automatically closes or opens the chemical inlet pipe 121, so as to control the volume of the qualified nickel plating solution entering the reaction cavity 1111, and the booster pump 124 pressurizes the qualified nickel plating solution to increase the flow rate, so as to increase the spraying force of the qualified nickel plating solution in the longitudinal spray pipe 1224, so that the qualified nickel plating solution in the reaction cavity 1111 flows more vigorously, and the qualified nickel plating solution is mixed more uniformly.

In one embodiment, referring to fig. 2, the circulation assembly 130 further includes a second solenoid valve 134, and the second solenoid valve 134 is disposed on the medicine outlet pipe 131. The second solenoid valve 134 automatically closes or opens the discharge pipe 131 to control the amount of the qualified nickel plating solution to be filtered.

In one embodiment, referring to fig. 3, the first spraying holes 1224a are disposed toward the inner wall of the electroless nickel plating bath 111, and the central axis of the first spraying holes 1224a forms an angle of 45 ° with the central axis of the longitudinal spraying pipe 1224.

It should be noted that, through the first spraying hole 1224a inclined at an angle of 45 degrees, the qualified nickel-plating solution at the bottom of the reaction chamber 1111 is sprayed towards the inner wall of the chemical nickel-plating bath 111 and the qualified nickel-plating solution thereon at an upward inclined angle of 45 degrees, so that on one hand, the qualified nickel-plating solution can be prevented from being sprayed out, and on the other hand, the action area of the qualified nickel-plating solution at the bottom on the qualified nickel-plating solution at the top can be increased.

In one embodiment, after the operation of spraying the qualified nickel plating solution from each of the first spraying holes into the reaction cavity of the electroless nickel plating bath, the qualified nickel plating solution is further flowed out of the parallel spray pipes into a plurality of transverse spray pipes, and a plurality of second spraying holes arranged at intervals are respectively formed in each of the transverse spray pipes, so that the qualified nickel plating solution is sprayed from each of the second spraying holes into the reaction cavity.

In one embodiment, referring to fig. 5, the zigzag spray pipe 122 further includes a plurality of transverse spray pipes 1225, each of the transverse spray pipes 1225 is vertically communicated with the longitudinal spray pipe 1224, the transverse spray pipe 1225 is provided with a plurality of second spray holes 1225a arranged at intervals, the second spray holes 1225a are arranged towards the inner wall of the electroless nickel plating bath 111, and the central axes of the second spray holes 1225a form an included angle of 45 ° with the central axis of the transverse spray pipe 1225.

It should be noted that the spraying force application area is greatly increased by additionally arranging the plurality of transverse nozzles 1225, so that the qualified nickel plating solution in the reaction cavity 1111 flows more vigorously, and the qualified nickel plating solution is mixed more uniformly.

In one embodiment, the distance between the central axis of the longitudinal spray pipe 1224 and the inner wall of the electroless nickel plating bath 111 is 200mm to 300mm, the inner diameter of the longitudinal spray pipe 1224 is preferably 60mm, and the inner diameter of the first spray hole 1224a is preferably 6 mm.

In one embodiment, after the operation of spraying the qualified nickel plating solution from each of the first spraying holes into the reaction cavity of the electroless nickel plating bath, the qualified nickel plating solution flows out from the parallel spray pipes into a plurality of curved fluctuating pipes, and a plurality of upper spraying holes and lower spraying holes are formed in each of the curved fluctuating pipes at intervals, so that the qualified nickel plating solution is sprayed from each of the upper spraying holes and each of the lower spraying holes into the reaction cavity.

In an embodiment, referring to fig. 6, the zigzag pesticide spraying pipe 122 further includes a plurality of curved fluctuating pipes 1226, each curved fluctuating pipe 1226 is respectively communicated with the longitudinal spraying pipe 1224, each curved fluctuating pipe 1226 includes a plurality of upper arc pipes 1226a and a plurality of lower arc pipes 1226b, the plurality of upper arc pipes 1226a and the plurality of lower arc pipes 1226b are respectively connected in a one-to-one correspondence manner, so that each curved fluctuating pipe 1226 is an integrated structure, the upper arc pipes 1226a are provided with a plurality of upper pesticide spraying holes 1226c arranged at intervals, the plurality of upper pesticide spraying holes 1226c are arranged in a plum blossom shape, the lower arc pipes 1226b are provided with a plurality of lower pesticide spraying holes 1226d arranged at intervals, the plurality of lower pesticide spraying holes 1226d are arranged in a plum blossom shape, and the aperture of the upper pesticide spraying holes 1226c is larger than the aperture of the lower pesticide spraying holes 1226 d.

It should be noted that, the spraying force application area is greatly increased by additionally arranging a plurality of curved fluctuating pipes 1226, wherein the spraying positions of the upper spraying holes 1226c and the lower spraying holes 1226d for the qualified nickel plating solution are changed by the fluctuation of the height of the curved fluctuating pipes 1226, the aperture of the upper spraying holes 1226c is larger than that of the lower spraying holes 1226d, so that the spraying force of the upper spraying holes 1226c is smaller than that of the lower spraying holes 1226d, the flowing of the qualified nickel plating solution is increased by mixing through a plurality of different spraying modes, and the qualified nickel plating solution is more uniformly mixed.

In one embodiment, before the product to be plated is placed into the reaction cavity, an anode film is attached to the peripheral side wall of the reaction cavity, and four cathode rods are respectively inserted into four corners of the reaction cavity, so that nickel ions in the qualified nickel plating solution move towards the cathode rods under the action of an electric field.

In one embodiment, referring to fig. 5, the nickel plating assembly 110 further includes an anti-crystallization device 114, where the anti-crystallization device 114 includes an anode film 1141 and four cathode bars 1142, the anode film 1141 is respectively attached to the peripheral side walls of the reaction cavity 1111, and the four cathode bars 1142 are respectively inserted into the four corners of the reaction cavity 1111.

The anode film is made of a positive electrode material, and the cathode film is made of a negative electrode material. The nickel ions in the qualified nickel plating solution move towards the cathode rod 1142 under the action of the electric field, and the surface area of the cathode rod 1142 is far smaller than that of the inner tank wall of the chemical nickel plating tank, so that the nickel ions can be effectively prevented from being crystallized and attached to the inner tank wall, and the consumption of the qualified nickel plating solution is reduced.

In one embodiment, during the operation of the electroless nickel plating operation, an isolation housing is further installed at the bottom of the reaction chamber, a stirrer is installed in the isolation housing, the qualified nickel plating solution flows into the isolation housing, the qualified nickel plating solution is contacted with the stirrer, and the stirring operation is performed, so that the qualified nickel plating solution is uniformly mixed.

In an embodiment, referring to fig. 5, the nickel plating assembly 110 further includes a stirring device 113, the stirring device 113 includes a stirrer and an isolation housing, the isolation housing is disposed at the bottom of the reaction chamber, the isolation housing is provided with a flow hole, and the stirrer is disposed in the isolation housing. The stirrer comprises a motor, a stirring shaft and stirring blades, the motor is suspended above the chemical nickel plating bath, an output shaft of the motor is connected with the stirring shaft, and the stirring blades are arranged on the stirring shaft. Preferably, the stirrer is located between two adjacent transverse nozzles 1225 or between two adjacent curved undulating pipes 1226, so that the stirring effect is better.

It should be noted that the qualified nickel plating solution enters the isolation housing through the inflow hole, the fluidity of the qualified nickel plating solution in the reaction cavity 1111 is further enhanced by the stirrer, and then the qualified nickel plating solution flows out of the outflow hole and is isolated from the product to be plated through the isolation housing, so that the surface damage of the product to be plated due to the fact that the product to be plated is contacted with the stirrer during stirring is avoided.

In one embodiment, after the operation of obtaining the nickel-plated finished product, a flexible draining plate is further installed above the chemical nickel plating bath, and the nickel-plated finished product is placed on the flexible draining plate to perform a draining operation.

In an embodiment, referring to fig. 7, the nickel plating assembly 110 further includes a draining device 115, the draining device 115 is connected above the chemical nickel plating bath 111, the draining device 115 includes a flexible draining plate 1151, a connecting member 1152, a magnetic fixture 1153 and an iron sheet 1154, a first end of the connecting member 1152 is connected to a first side outer wall of the chemical nickel plating bath 111, a second end of the connecting member 1152 is connected to a first end of the flexible draining plate 1151, a second end of the flexible draining plate 1151 is connected to the magnetic fixture, the iron sheet 1154 is fixed to a second side outer wall of the chemical nickel plating bath 111, the magnetic fixture is configured to be magnetically fixed to the iron sheet 1154, the flexible draining plate 1151 is configured with a plurality of draining holes, and the draining holes are located above the reaction cavity 1111 and the medicine preparation cavity 1112.

The retractable draining board 1151 is normally folded, so that the area is reduced, and the normal use of the electroless nickel plating bath 111 is not affected. During the use, stretch flexible waterlogging caused by excessive rainfall board 1151 toward the second side direction of chemical nickel plating groove 111, so that magnetic firmware and iron sheet 1154 contact, iron sheet 1154 is fixed by magnetic firmware magnetism, increase flexible waterlogging caused by excessive rainfall board 1151's area and firmly fix flexible waterlogging caused by excessive rainfall board 1151 on chemical nickel plating groove 111, then put the nickel plating finished product after the chemical nickel plating on flexible waterlogging caused by excessive rainfall board 1151, remaining qualified nickel plating liquid on the nickel plating finished product gets back to reaction cavity 1111 along the waterlogging caused by excessive rainfall hole in, accomplish the recovery to qualified nickel plating liquid, it can lead to ground corrosion to avoid the qualified nickel plating liquid drop remaining on the nickel plating finished product to drop on ground.

according to the invention, the qualified nickel plating solution sequentially passes through the medicine inlet pipe 121, the lifting pipe 1221, the parallel pipe 1222, the descending pipe 1223 and the longitudinal spray pipe 1224, the operation of ascending and descending is performed firstly, so that the water pressure of the qualified nickel plating solution is enhanced, and then the qualified nickel plating solution enters the relatively narrow first medicine spraying hole 1224a through the relatively wide longitudinal spray pipe 1224, so that the water pressure of the qualified nickel plating solution is further enhanced, and the qualified nickel plating solution is sprayed out, so that the flowing of the qualified nickel plating solution in the reaction cavity 1111 is enhanced, the effect of uniform circulation of the qualified nickel plating solution on the upper layer and the lower layer is better achieved, and the uniformity of a plating layer of a finished nickel plating product is improved; the qualified nickel plating solution is introduced into the filter 132 through the discharge pipe 131, impurity particles contained in the qualified nickel plating solution are filtered and removed, the nickel plating circulating solution is discharged back into the preparation chamber 1112 through the circulating pipe 133, and the detection and parameter adjustment operations are carried out again to obtain the qualified nickel plating solution, so that the qualified nickel plating solution is recycled, the consumption of the qualified nickel plating solution is reduced, the nickel plating cost is reduced, and the discharge of the nickel plating waste solution is reduced.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. An electroless nickel plating system, comprising:

the device comprises a medicine feeding assembly, a medicine feeding assembly and a zigzag medicine spraying pipe, wherein the zigzag medicine spraying pipe comprises a lifting pipe, a parallel pipe, a descending pipe and a longitudinal spraying pipe, the first end of the medicine feeding pipe is communicated with a medicine preparing cavity, the second end of the medicine feeding pipe is communicated with the lifting pipe, the parallel pipe, the descending pipe and the longitudinal spraying pipe are sequentially communicated, the longitudinal spraying pipe is arranged in the reaction cavity, and the longitudinal spraying pipe is provided with a plurality of first medicine spraying holes which are arranged at intervals; the zigzag pesticide spraying pipe also comprises a plurality of bent fluctuating pipes, each bent fluctuating pipe is respectively communicated with the longitudinal spraying pipe, each bent fluctuating pipe comprises a plurality of upper arc-shaped pipes and a plurality of lower arc-shaped pipes, the upper arc-shaped pipes and the lower arc-shaped pipes are respectively connected in a one-to-one correspondence manner, so that each bent fluctuating pipe is of an integrated structure, the upper arc-shaped pipes are provided with a plurality of upper pesticide spraying holes which are arranged at intervals, the upper pesticide spraying holes are arranged in a plum blossom shape, the lower arc-shaped pipes are provided with a plurality of lower pesticide spraying holes which are arranged at intervals, the lower pesticide spraying holes are arranged in a plum blossom shape, and the aperture of the upper pesticide spraying holes is larger than that of the lower pesticide spraying holes; and

2. An electroless nickel plating system according to claim 1, wherein the bottom of the electroless nickel plating tank is provided with a chemical inlet and a chemical outlet respectively, the chemical inlet is communicated with the chemical preparation cavity and the chemical inlet pipe respectively, and the chemical outlet is communicated with the reaction cavity and the chemical outlet pipe respectively.

3. The electroless nickel plating system of claim 1, wherein the overflow baffle is provided with a plurality of limiting grooves, the limiting grooves are sequentially connected, the bottom end of each limiting groove is a lower liquid level, and the top end of the connection of two adjacent limiting grooves is an upper liquid level.

4. The electroless nickel plating system of claim 1, wherein the filter comprises a parallel connection pipe, a filter housing, a filter element and an L-shaped connection pipe, the drug outlet pipe, the parallel connection pipe, the filter housing, the filter element and the L-shaped connection pipe are sequentially communicated, the filter element is disposed in the filter housing, the filter element comprises a diatom ooze outer shell and a filter inner core, the filter inner core is filled in the diatom ooze outer shell, and the filter inner core comprises an activated carbon layer, a tourmaline layer and a pp cotton layer which are sequentially stacked from top to bottom.

5. An electroless nickel plating system according to claim 1, wherein said nickel plating assembly further comprises a heating device, said heating device comprises a heater and a temperature controller, said heater is disposed at the bottom of said reaction chamber, said temperature controller is electrically connected with said heater and is located outside said electroless nickel plating bath.

6. The electroless nickel plating system of claim 1, wherein said chemical feed assembly further comprises a first solenoid valve and a booster pump, said first solenoid valve and said booster pump being disposed on said chemical feed tube, respectively, said booster pump being located between said first solenoid valve and said riser tube.

7. An electroless nickel plating system according to claim 1, wherein said circulation assembly 130 further comprises a second solenoid valve disposed on said outlet tube.

8. An electroless nickel plating system according to claim 1, wherein the central axis of said first spray orifice forms a 45 ° angle with the central axis of said longitudinal lance.

9. An electroless nickel plating system according to claim 1, wherein said nickel plating assembly further comprises a stirring device, said stirring device comprises a stirrer and an isolating shell, said isolating shell is disposed at the bottom of said reaction chamber, said isolating shell is provided with a flow hole, and said stirrer is disposed in said isolating shell.

10. The electroless nickel plating system of claim 1, wherein the nickel plating assembly further comprises a draining device, the draining device comprises a flexible draining plate, a connecting piece, a magnetic fixing piece and an iron sheet, a first end of the connecting piece is connected with the outer wall of the first side of the electroless nickel plating bath, a second end of the connecting piece is connected with the first end of the flexible draining plate, a second end of the flexible draining plate is connected with the magnetic fixing piece, the iron sheet is fixed on the outer wall of the second side of the electroless nickel plating bath, the magnetic fixing piece is used for being fixed with the iron sheet in a magnetic attraction mode, the flexible draining plate is provided with a plurality of draining holes, and the draining holes are located above the reaction cavity and the preparation cavity.