CN219059196U - Electroplating solution purifying device - Google Patents

Abstract

The utility model belongs to the technical field of electroplating, and provides an electroplating liquid purifying device, wherein the purifying device comprises a filtering component and a circulating mechanism; the filter assembly is suspended in the electroplating bath and comprises at least two filter boxes which are sequentially overlapped, the side wall of each filter box is provided with a plurality of filter holes, and the inner cavity of the filter box positioned at the innermost side forms a filter tank; the filtering holes on the filtering boxes are sequentially reduced; the anode is arranged in the filter tank; in the working state, the liquid level in the filter tank is higher than the liquid level of the electroplating tank; the circulating mechanism comprises a pipeline and a circulating pump, wherein the water outlet end of the pipeline is communicated with the filter tank, and the water inlet end of the pipeline is positioned at the bottom of the electroplating tank. The utility model can purify the electroplating solution and reduce the mixing of mechanical impurities precipitated from the anode into the electrolyte.

Description

Electroplating solution purifying device

Technical Field

The utility model belongs to the technical field of electroplating, and particularly relates to an electroplating liquid purifying device.

Background

Suspended mechanical impurities in the electroplating solution generally reach the cathode in a diffusion, convection, electrophoresis and other modes and are co-deposited or adhered with the plating layer, so that the thickness, uniformity, strength, finish and the like of the plating film are affected, the plating film of a workpiece is easy to be disqualified, reworking and reworking are required, and the workpiece is seriously scrapped even. For a workpiece with high requirements on the brightness of a coating, in the electroplating processing process, mechanical impurities cause the surface of the coated workpiece to form tiny pits or bulges or burrs and other defects, so that a product becomes a defective product and cannot be sold, only the crushing treatment can be carried out, a certain amount of related resource waste such as metal and the workpiece is caused, and the energy consumption, the production cost and the like are increased.

One source of mechanical impurities in the plating solution is an anode that supplements cations of the plating solution; because the purity of the anode and insoluble mechanical impurities are introduced in the manufacturing process, fine mechanical impurities are mixed into electrolyte in the anode dissolution process, and are settled and collected at a place where the flow of the electroplating solution is slow, and form a daub shape after long-time accumulation, namely anode slime. After the anode slime is impacted by a slightly strong water flow, the anode slime is suspended in electrolyte by a large-size flocculating substance, and is easier to adsorb and deposit when encountering the surface of an irregular plating piece. The suspension and flocculation quantity is increased along with the extension of the application time of the electroplating solution, so that the coating quality is further deteriorated.

Disclosure of Invention

In order to overcome the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a plating solution purifying apparatus that can purify a plating solution and reduce mixing of mechanical impurities precipitated from an anode into an electrolyte.

The technical scheme adopted for solving the technical problems is as follows:

an electroplating liquid purifying device comprises a filtering component and a circulating mechanism;

the filter assembly is suspended in the electroplating bath and comprises at least two filter boxes which are sequentially overlapped, the side wall of each filter box is provided with a plurality of filter holes, and the inner cavity of the filter box positioned at the innermost side forms a filter tank; along the direction of the electroplating solution flowing from the filter tank to the electroplating tank, the filter holes on the filter tanks are sequentially reduced; the anode is arranged in the filter tank; in the working state, the liquid level in the filter tank is higher than the liquid level of the electroplating tank;

the circulating mechanism comprises a pipeline and a circulating pump, the water outlet end of the pipeline is communicated with the filter tank, and the water inlet end of the pipeline is positioned at the bottom of the electroplating tank; and under the action of the circulating pump, the electroplating solution at the bottom of the electroplating tank is supplied into the filtering tank.

Preferably, the device also comprises a hanging frame; the hanging frame comprises two groups of connecting pieces which are U-shaped, the two groups of connecting pieces are mutually perpendicular, and a placing space for supporting the filter assembly is formed in the middle of the connecting pieces; a hanging hook is arranged on the outer side of the upper end of each connecting piece, and the hanging frame is hung on the electroplating bath by the aid of the hanging hooks;

the filter assembly is disposed in the placement space.

Preferably, the filter assembly comprises three filter boxes, and the three filter boxes are sequentially overlapped with each other.

Preferably, the diameters of the filtering holes of the three filtering boxes are sequentially 1mm, 0.5mm and 0.1mm along the direction from inside to outside.

Preferably, two hangers are arranged on the filter box at the outermost side, and the two hangers are arranged on two opposite side walls of the filter box at the outermost side.

Preferably, the anode is arranged in the filter tank in a hanging manner.

Preferably, the water outlet end of the pipeline is positioned at the depth of 1/5-1/4 of the filter tank.

Preferably, a control valve for controlling the flow rate is arranged on the pipeline.

Preferably, the filter component is made of silicon carbide.

Compared with the prior art, the utility model has the beneficial effects that:

in the electroplating liquid purifying device, metal ions dissolved by the anode pass through the filtering component and are then supplemented into the electroplating liquid in the electroplating process. Because the anode is impure and insoluble tiny mechanical impurities are precipitated and are directly filtered Kong Jieliu on a plurality of filter boxes, the impurities cannot be discharged into the electroplating tank, and electroplating liquid is purified from the source, compared with a purifying mode of suspending in the electroplating liquid and then intercepting the electroplating liquid, the electroplating liquid has obvious filtering and purifying effects. Further, in order to solve the influence of insoluble precipitate directly scattered in the electroplating solution and residual mechanical impurities in the electroplating solution on the electroplating quality, the utility model can also pump and discharge the electroplating solution (containing mechanical impurities) at the bottom of the electroplating tank into the filter tank from the tank bottom through the circulating pump, and at the moment, the electroplating solution is filtered through the filter holes on the inner wall of the filter tank and then is recirculated and returned to the electroplating tank by utilizing the natural liquid level pressure difference between the filter tank and the electroplating tank, so that the circulating filtration and purification treatment of the electroplating solution is realized, and the influence of the retention of the mechanical impurities on the electroplating process is further prevented.

The filtering component of the electroplating liquid purifying device comprises a plurality of filtering boxes, and forms the filtering tank with gradient filtering effect, thereby being beneficial to intercepting suspended mechanical impurities with different convolution diameters and avoiding the electroplating liquid to be filtered in the filtering tank from flowing out due to the rapid sealing of the wall surface of the filtering boxes. In addition, the filter holes can ensure enough porosity, ensure that cations can smoothly move through, and do not influence the normal operation of electroplating processing.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view showing a three-dimensional structure of a plating solution purification apparatus of the present utility model.

FIG. 2 is a perspective view of a filter assembly of the plating liquid purification apparatus of the present utility model.

FIG. 3 is a perspective view of a circulation mechanism of the plating liquid purification apparatus of the present utility model.

FIG. 4 is a perspective view of a hanger of the plating liquid purification apparatus of the present utility model.

Fig. 5 is a schematic view of an iron sheet after conventional plating processing in test example 1.

FIG. 6 is a schematic view of an iron sheet subjected to plating processing after the plating solution is purified and filtered by the plating solution purification apparatus of the utility model in test example 1.

Fig. 7 is a schematic view of an iron sheet after conventional plating processing in test example 2.

FIG. 8 is a schematic view of an iron sheet subjected to plating processing after the plating solution is purified and filtered by the plating solution purification apparatus of the utility model in test example 2.

Fig. 9 is a schematic view of an iron sheet after conventional plating processing in test example 3.

FIG. 10 is a schematic view of an iron sheet subjected to plating processing after the plating solution is purified and filtered by the plating solution purification apparatus of the utility model in test example 3.

Wherein:

1-filter component, 101-filter box, 102-filter hole, 103-hangers, 104-filter tank, 2-hanger, 201-connector, 202-hanger, 203-placing space, 3-circulation mechanism, 301-pipeline, 302-circulation pump, 303-control valve, 4-hanger bar, 5-anode.

Detailed Description

In order that the above-recited objects, features and advantages of the present utility model will be more clearly understood, a more particular description of the utility model will be rendered by reference to the appended drawings and appended detailed description. In addition, embodiments of the present application and features of the embodiments may be combined with each other without conflict. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, and the described embodiments are merely some, rather than all, embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, are intended to fall within the scope of the present utility model.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

Example 1

Referring to fig. 1 to 4, the present embodiment discloses a plating solution purifying apparatus, which includes a hanger 2, a filter assembly 1, and a circulation mechanism 3.

The filter assembly 1 is suspended in the electroplating bath through the suspension bracket 2, the filter assembly 1 comprises at least two filter boxes 101 which are sequentially overlapped, and each filter box 101 is made of silicon carbide and has high fire resistance, heat resistance, impact resistance, acid resistance and the like; the side walls of the filter boxes 101 are provided with a plurality of filter holes 102, and the inner cavity of the filter box 101 positioned at the innermost side forms a filter tank 104; the filtering holes 102 on each filtering box 101 are sequentially reduced along the direction of the electroplating solution flowing from the filtering tank 104 to the electroplating tank; anode 5 is disposed in said filter tank 104; in normal operation, the fluid level in the filter tank 104 is higher than the fluid level in the plating tank.

Specifically, the filter assembly 1 in the present embodiment includes three filter boxes 101, and the three filter boxes 101 are sequentially stacked on each other. The diameters of the filtering holes 102 of the three filtering boxes 101 are sequentially 1mm, 0.5mm and 0.1mm along the direction from inside to outside. Through setting up three rose box 101, form the filter tank 104 that has three-layer gradient filter effect, carry out gradient filtration to the mechanical impurity that positive pole 5 separated out, can hold back the suspended mechanical impurity of big, well, little different diameters of circling round, avoid mechanical impurity to get into in the plating bath, effectively promote the cleanliness factor of electroplating solution. Of course, the number of filter boxes 101 and the size of the filter holes 102 in this embodiment can be flexibly set.

Further, two hanging lugs 103 are arranged on the outermost filter box 101, and two hanging lugs 103 are arranged on two opposite side walls of the outermost filter box 101. Through the setting of hangers 103, on the one hand, make things convenient for workman to carry filter assembly 1, on the other hand also can directly hang filter assembly 1 in the plating bath.

The anode 5 of the present embodiment is provided in the filter tank 104 in a suspended manner. In particular, a hanger bar 4 may be provided on the top notch of the filter tank 104, and the anode 5 may be hung on the hanger bar 4 by a hanger 202, as shown in fig. 1. Suspending the anode 5 in the filter tank 104 allows the precipitated mechanical impurities to be suspended and remain in the filter tank 104 for a longer period of time, thereby further improving the filtration effect and reducing the risk of mechanical impurities exiting the filter tank 104 into the plating bath.

The circulation mechanism 3 of the embodiment comprises a pipeline 301 and a circulation pump 302, wherein the water outlet end of the pipeline 301 is communicated with the filter tank 104, and the water inlet end of the pipeline 301 is positioned at the bottom of the electroplating tank; the plating solution at the bottom of the plating tank is supplied to the filter tank 104 by the circulation pump 302. The water outlet end of the pipe 301 is located at a depth of 1/5-1/4 of the filter tank 104.

Preferably, the pipe 301 of the present embodiment is provided with a control valve 303 for controlling the flow rate. The arrangement of the control valve 303 on the pipe 301 of the circulation mechanism 3 in this embodiment facilitates control of the circulation flow rate of the plating solution, and avoids overflow in the filter tank 104 due to excessive flow rate or incapability of realizing circulation due to excessively low flow rate. The control valves 303 of the present embodiment are provided with two, i.e., a first control valve 303 and a second control valve 303, respectively, which are provided on the front and rear sides of the circulation pump 302, respectively

The hanging frame 2 comprises two groups of connecting pieces 201 which are U-shaped, the two groups of connecting pieces 201 are mutually perpendicular, and a placing space 203 for supporting the filter assembly 1 is formed in the middle; a hanger 202 is arranged on the outer side of the upper end of each connecting piece 201, and the hanging frame 2 is hung on the electroplating bath by using the hanger 202. The filter assembly 1 is arranged in the placement space 203. Through the setting of mounted frame 2, the fixed in position of filter tank 104 subassembly of being convenient for, the while is convenient hangs filter assembly 1 in the plating bath to can adjust the position in a flexible way according to the scene condition, easy operation is convenient, and the flexibility is good.

When the electroplating solution purifying device of the embodiment is installed, the pipeline of the circulating mechanism 3 is fixedly installed on the electroplating bath, so that the filtering component 1 and the hanging frame 2 can be pressed to a certain depth as electroplating solution, the water outlet end of the pipeline 301 of the circulating mechanism 3 is bypassed and then lifted slightly, the water outlet end of the pipeline 301 can be positioned in the filtering tank 104, and then the hanging frame 2 is correspondingly hung on a bracket of the electroplating bath, so that the installation can be completed.

In the electroplating process, if the liquid level in the filter tank 104 is continuously increased, specifically increased by 10-15cm, the filter tank 104 is predicted to trap excessive mechanical impurities or have a blocking condition, and at the moment, the filter assembly 1 can be taken out for backwashing, and the blocked mechanical impurities can be taken out for continuous use.

The following is a comparative test example of conventional plating processing and plating processing after using the plating liquid purification apparatus of this embodiment:

test example 1

Conventional electroplating processing: pouring the pure acid copper electroplating solution into a 5L electroplating tank, adding a proper amount of fine sand, and starting a heating rod while ventilating and stirring to maintain the temperature of the electroplating solution at 30 ℃. The copper sheet is taken as an anode 5 to be placed in electroplating solution, then the iron sheet taken as a cathode is placed in electrolyte, and a direct current power supply is immediately connected, so that the direct current is quickly regulated to 0.1A, and the power supply is turned off after electroplating for 30 s. The copper plating effect was observed by taking out the iron sheet, as shown in FIG. 5.

Electroplating after purification: the circulation pump 302 was turned on, the plating solution was sucked from the bottom of the plating tank, returned to the filter tank 104 immersed in the plating solution, filtered for 2 minutes, and the conventional plating process was repeated to observe the effect of plating copper on the patch, as shown in fig. 6.

Referring to fig. 5, after copper plating of the iron sheet in the electroplating solution containing fine sand, the copper plating layer on the surface of the iron sheet has uneven color, incomplete plating film and obvious sand attachment marks. Referring to fig. 6, the effect of plating copper on the iron sheet of the plating solution after sand filtration is better, and the surface is more bright and uniform.

Test example 2

Conventional electroplating processing: pouring the pure acid copper electroplating solution into a 5L electroplating tank, adding a proper amount of fine sand, and starting a heating rod while ventilating and stirring to maintain the temperature of the electroplating solution at 25 ℃. The copper sheet is taken as an anode 5 to be placed in electroplating solution, then the iron sheet taken as a cathode is placed in electrolyte, and a direct current power supply is immediately connected, so that the direct current is quickly regulated to 0.2A, and the power supply is turned off after electroplating for 60 seconds. The copper plating effect was observed by taking out the iron sheet, as shown in fig. 7.

Electroplating after purification: the filter pump was turned on, the plating solution was sucked from the bottom of the plating tank, returned to the filter tank 104 immersed in the plating solution, and filtered for 4 minutes, and the conventional plating process was repeated, and the effect of plating copper by the patch was observed, as shown in fig. 8.

Referring to fig. 7, after copper plating of the iron sheet in the plating solution containing fine sand, the copper plating layer on the surface of the iron sheet was uneven in surface color, the plating layer was rough, the copper film coverage of the polishing scratch on the surface of the iron sheet was poor, and there was a small amount of sand-attached surface mark. Referring to fig. 8, the effect of plating copper on the iron sheet of the plating solution after sand filtration and purification is better, and the surface is more bright and uniform.

Test example 2

Conventional electroplating processing: pouring the pure acid copper electroplating solution into a 5L electroplating tank, adding a proper amount of fine sand, and starting a heating rod while ventilating and stirring to maintain the temperature of the electroplating solution at 25 ℃. The copper sheet is taken as an anode 5 to be placed in electroplating solution, then the iron sheet taken as a cathode is placed in electrolyte, and a direct current power supply is immediately connected, so that the direct current is quickly regulated to 0.3A, and the power supply is turned off after electroplating for 30 s. The copper plating effect was observed by taking out the iron sheet, as shown in FIG. 9.

Electroplating after purification: the filtration pump was turned on, the plating solution was sucked from the bottom of the plating tank, returned to the filtration tank 104 immersed in the plating solution, and filtered for 4 minutes, and the conventional plating process was repeated, and the effect of plating copper on the iron plate after the filtration of the plating solution was observed, as shown in fig. 10.

Referring to fig. 9, after copper plating of the iron sheet in the plating solution containing fine sand, the copper plating layer surface of the iron sheet is entirely covered, and the plating layer becomes thick. But the surface of the patch has uneven color, rough plating and a small amount of sand attached trace on the surface. Referring to fig. 10, the effect of plating copper on the iron sheet of the plating solution after sand filtration is better, and the surface is brighter. Slightly less chromatic aberration.

The present utility model is not limited to the preferred embodiments, and any modifications, equivalent variations and modifications made to the above embodiments according to the technical principles of the present utility model are within the scope of the technical proposal of the present utility model.

Claims (9)

1. The electroplating liquid purifying device is characterized by comprising a filtering component and a circulating mechanism;

the filter assembly is suspended in the electroplating bath and comprises at least two filter boxes which are sequentially overlapped, the side wall of each filter box is provided with a plurality of filter holes, and the inner cavity of the filter box positioned at the innermost side forms a filter tank; along the direction of the electroplating solution flowing from the filter tank to the electroplating tank, the filter holes on the filter tanks are sequentially reduced; the anode is arranged in the filter tank; in the working state, the liquid level in the filter tank is higher than the liquid level of the electroplating tank;

the circulating mechanism comprises a pipeline and a circulating pump, the water outlet end of the pipeline is communicated with the filter tank, and the water inlet end of the pipeline is positioned at the bottom of the electroplating tank; and under the action of the circulating pump, the electroplating solution at the bottom of the electroplating tank is supplied into the filtering tank.

2. The plating liquid purification apparatus according to claim 1, further comprising a hanger; the hanging frame comprises two groups of connecting pieces which are U-shaped, the two groups of connecting pieces are mutually perpendicular, and a placing space for supporting the filter assembly is formed in the middle of the connecting pieces; a hanging hook is arranged on the outer side of the upper end of each connecting piece, and the hanging frame is hung on the electroplating bath by the aid of the hanging hooks;

the filter assembly is disposed in the placement space.

3. The plating liquid purification apparatus according to claim 1 or 2, wherein said filter assembly comprises three of said filter boxes, and said three filter boxes are sequentially stacked one on another.

4. A plating liquid purification apparatus according to claim 3, wherein the diameter of the filtering holes of the three filtering boxes is sequentially 1mm, 0.5mm, 0.1mm in the direction from inside to outside.

5. The plating liquid purification apparatus according to claim 1, wherein two lugs are provided on the outermost filter tank, and two of said lugs are provided on two of opposite side walls of the outermost filter tank.

6. The plating liquid purification apparatus according to claim 1, wherein said anode is provided in said filter tank in a suspended manner.

7. The plating liquid purification apparatus according to claim 1, wherein the water outlet end of said pipe is located at a depth of 1/5 to 1/4 of the depth of said filter tank.

8. The plating liquid purification apparatus according to claim 1, wherein a control valve for controlling a flow rate is provided on the pipe.

9. The plating solution purification apparatus according to claim 1, wherein said filter member is made of silicon carbide.

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