CN207537590U - Electroplanting device - Google Patents
Electroplanting device Download PDFInfo
- Publication number
- CN207537590U CN207537590U CN201721571649.4U CN201721571649U CN207537590U CN 207537590 U CN207537590 U CN 207537590U CN 201721571649 U CN201721571649 U CN 201721571649U CN 207537590 U CN207537590 U CN 207537590U
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- CN
- China
- Prior art keywords
- electroplating bath
- plating
- storage tank
- fixing groove
- upper plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model discloses electroplanting devices, including upper plate and lower plate, support column is connected between the upper plate and lower plate, electroplating bath is provided on the upper plate, the electroplating bath is equipped with the rectangular-shape hollow structure of opening for top, and the side inner wall top horizontal of electroplating bath is provided with transverse slat, inner wall side of the transverse slat far from electroplating bath is provided with fixing groove, fixed link is movably set in the fixing groove, bottom end exposure of the fixed link far from fixing groove is connected with filter cartridge in fixing groove.In the utility model, user makes to generate precipitation during plating and the cleaning of impurity is more convenient, when electroplating bath cleaning when electroplate liquid more easily unloading and reflux, the tedious steps poured out and pour into electroplate liquid again are avoided, the process of cleaning electroplating bath is simplified, improves efficiency, the utility model is simple in structure, solve the problems, such as to pour out that pour into electroplate liquid, efficiency again low during previous electroplanting device cleaning impurity, it is highly practical, it is easy to spread.
Description
Technical field
The utility model is related to electroplating technology more particularly to electroplanting devices.
Background technology
It is exactly to plate the other gold of a thin layer on certain metal surfaces using electrolysis principle that (Electroplating), which is electroplated,
Belong to or alloy process, be using electrolysis make the surface of metal or other materials product attachment layer of metal film technique from
And playing prevents metal from aoxidizing (such as corrosion), improves wearability, electric conductivity, reflective, corrosion resistance (copper sulphate etc.) and promotes
The effects that beautiful.The outer layer of many coins is also plating.During plating, coated metal or other insoluble materials do anode, to be plated
Workpiece do cathode, the cation of coated metal is reduced to form coating in workpiece surface to be plated.To exclude other cations
Interference, and make coating uniformly, securely, electroplate liquid need to be done with the solution of the cation containing coated metal, with keep coated metal sun from
The concentration of son is constant.The purpose of plating is that the coat of metal is plated on base material, changes substrate surface property or size.Plating can increase
The corrosion resistance (coated metal uses corrosion resistant metal more) of strong metal increases hardness, prevents from wearing away, improves electric conductivity, light
Slip, heat resistance and surface aesthetic.In order to ensure the quality of coating, in addition to the techniques such as strict temperature control, current density, PH are joined
Number is outer, it is necessary to which influence of the factors such as impurity in electroplate liquid to plating quality, the impurity in electroplate liquid is to placing in order to prevent
The plating of part in electroplating bath has an impact, then at regular intervals, needs to purify the electroplate liquid in electroplating bath
Filtering is replaced.And former electroplate liquid is also required to add in a certain proportion of electroplate liquid, and electroplating bath needs to clean after filtering, it will
It is cumbersome that electroplate liquid is poured into after electroplate liquid extraction cleaning electroplating bath again, working efficiency can be influenced, we design plating thus
Device, to solve the above problems.
Utility model content
The purpose of this utility model is and the electroplanting device proposed in order to solve shortcoming in the prior art.
To achieve these goals, the utility model employs following technical solution：
Electroplanting device including upper plate and lower plate, is connected with support column between the upper plate and lower plate, it is described on
Electroplating bath is provided on bottom plate, the electroplating bath is equipped with the rectangular-shape hollow structure of opening, and the side of electroplating bath for top
Inner wall top horizontal is provided with transverse slat, and inner wall side of the transverse slat far from electroplating bath is provided with fixing groove, in the fixing groove
Fixed link is movably set with, bottom end exposure of the fixed link far from fixing groove is connected with filter cartridge, and mistake in fixing groove
The hollow reticular structure of rectangular-shape that box is equipped with opening for top is filtered, fixing bolt is provided through at the top of the transverse slat, and solid
The bottom for determining bolt extends to fixed link at the top of transverse slat, and the bottom of the electroplating bath is provided through washing outlet pipe, institute
Washing outlet pipe is stated through the bottom of electroplating bath and upper plate, and the first valve is provided on washing outlet pipe, the electroplating bath
Top be provided through plating outlet, it is described plating outlet through electroplating bath bottom and upper plate, the lower plate
On be provided with storage tank, the storage tank is rectangular-shape hollow structure, and piston is movably set in storage tank, the top of the piston
Push rod is vertically arranged with, and the top exposure of push rod is set in the top of storage tank, the bottom of the plating outlet, which is connected with, stretches
Contracting hose, and the one end of bellows far from plating outlet is connected with hose connection through the top of storage tank and piston, it is described
The junction of plating outlet and bellows is provided with the second valve.
Preferably, bearing is provided at the top of the transverse slat, and L-shaped bar and fixing device is connected on bearing.
Preferably, mounting hole is provided at the top of the fixed link, and the size of mounting hole and fixing bolt are adapted.
Preferably, the bottom end of the storage tank is connected with plating inlet pipe, and the described one end of plating inlet pipe far from storage tank connects
It is connected in electroplating bath, and is electroplated on inlet pipe and is provided with third valve.
Preferably, it is provided with agitating device in the electroplating bath.
Preferably, the top of the plating outlet is equipped with strainer.
Compared with prior art, the beneficial effects of the utility model are：In the utility model, user by fixing groove,
The design of fixed link, filter cartridge and fixing bolt makes to generate precipitation during plating and the cleaning of impurity is more convenient, soft using stretching
The design of pipe, push rod, piston, storage tank, plating inlet pipe, the second valve and third valve, making electroplating bath, electroplate liquid is more in cleaning
Add easily unloading and reflux, avoid the tedious steps poured out and pour into electroplate liquid again, simplify the process of cleaning electroplating bath, carry
High efficiency, makes the better of electroplanting device, the utility model is simple in structure, when solving previous electroplanting device cleaning impurity
It pours out and pours into electroplate liquid again, the problem of efficiency is low, it is highly practical, it is easy to spread.
Description of the drawings
Fig. 1 be the utility model proposes electroplanting device overall structure diagram；
Fig. 2 is the enlarged drawing of part A in Fig. 1.
In figure：1 upper plate, 2 lower plates, 3 support columns, 4 electroplating baths, 5 transverse slats, 6 fixing grooves, 7 fixed links, 8 filter cartridges, 9
Fixing bolt, 10 washing outlet pipes, 11 first valves, 12 plating outlets, 13 storage tanks, 14 pistons, 15 push rods, 16 bellows,
17 hose connections, 18 second valves, 19 plating inlet pipes, 20 third valves.
Specific embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
It clearly and completely describes, it is clear that the described embodiments are only a part of the embodiments of the utility model rather than whole
Embodiment.
With reference to Fig. 1-2, electroplanting device including upper plate 1 and lower plate 2, is connected with branch between upper plate 1 and lower plate 2
Dagger 3, electroplating bath 4 is provided on upper plate 1, and electroplating bath 4 is equipped with the rectangular-shape hollow structure of opening, and electroplating bath for top
4 side inner wall top horizontal is provided with transverse slat 5, and inner wall side of the transverse slat 5 far from electroplating bath 4 is provided with fixing groove 6, fixing groove
Fixed link 7 is movably set in 6, bottom end exposure of the fixed link 7 far from fixing groove 6 is connected with filter cartridge 8 in fixing groove 6,
And filter cartridge 8 is equipped with the hollow reticular structure of rectangular-shape of opening for top, the top of transverse slat 5 is provided through fixing bolt 9, and
The bottom of fixing bolt 9 extends to fixed link 7 through the top of transverse slat 5, and the bottom of electroplating bath 4 is provided through washing outlet pipe
10, washing outlet pipe 10 runs through the bottom of electroplating bath 4 and upper plate 1, and the first valve 11 is provided on washing outlet pipe 10, electricity
The top of coating bath 4 is provided through plating outlet 12, and plating outlet 12 is through the bottom of electroplating bath 4 and upper plate 1, bottom
Storage tank 13 is provided on plate 2, storage tank 13 is rectangular-shape hollow structure, and piston 14 is movably set in storage tank 13, piston
Top vertical is provided with push rod 15, and the top exposure of push rod 15 is set in the top of storage tank 13, and the bottom of outlet 12 is electroplated
Bellows 16 is connected with, and the one end of bellows 16 far from plating outlet 12 connects through the top of storage tank 13 and piston 14
Hose connection 17 is connected to, the junction that outlet 12 and bellows 16 is electroplated is provided with the second valve 18, and the top of transverse slat 5 is set
Bearing is equipped with, and L-shaped bar and fixing device are connected on bearing, the top of fixed link 7 is provided with mounting hole, and mounting hole is big
Small and fixing bolt 9 is adapted, and the bottom end of storage tank 13 is connected with plating inlet pipe 19, the one end of plating inlet pipe 19 far from storage tank 13
It is connected in electroplating bath 4, and is electroplated on inlet pipe 19 and is provided with third valve 20, be provided with agitating device in electroplating bath 4, be electroplated out
The top of mouth pipe 12 is equipped with strainer.
In the utility model, user is stretched into fixing groove 6 using the fixed link 7 on filter cartridge 8 and is stretched into again with fixing bolt 9
Filter cartridge 8 is fixed in mounting hole in fixed link 7, is filtered, is easy for installation and removal using filter cartridge 8 when usually using, when
Impurity excessively needs to open the second valve 18 during cleaning in electroplating bath 4, using push rod 15 that the electroplate liquid in electroplating bath 4 is electroplated
The strainer at 12 top of outlet is pumped into storage tank 13, closes the second valve 18, is opened the first valve 11 and is cleaned electricity with distilled water again
Coating bath 4, the cleaned outlet 10 of water after cleaning are discharged, and third valve 20 is opened after having cleaned, and piston is pushed using push rod 15
14 can be pressed into the electroplate liquid electroplated inlet pipe 19 in storage tank 13 in electroplating bath 4, and adding a certain amount of electroplate liquid can be after
Continuous to use, the utility model of simple structure and strong practicability is easy to spread.
The preferable specific embodiment of the above, only the utility model, but the scope of protection of the utility model is not
This is confined to, in the technical scope that any one skilled in the art discloses in the utility model, according to this practicality
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (6)
1. electroplanting device, including upper plate (1) and lower plate (2), which is characterized in that the upper plate (1) and lower plate (2) it
Between be connected with support column (3), be provided with electroplating bath (4) on the upper plate (1), the electroplating bath (4) is equipped with opening for top
Rectangular-shape hollow structure, and the side inner wall top horizontal of electroplating bath (4) is provided with transverse slat (5), and the transverse slat (5) is separate
The inner wall side of electroplating bath (4) is provided with fixing groove (6), and fixed link (7) is movably set in the fixing groove (6), described solid
Bottom end exposure of the fixed pole (7) far from fixing groove (6) is connected with filter cartridge (8) in fixing groove (6), and filter cartridge (8) is top
Portion is equipped with the hollow reticular structure of rectangular-shape of opening, fixing bolt (9) is provided through at the top of the transverse slat (5), and fixed
The bottom of bolt (9) extends to fixed link (7) at the top of transverse slat (5), and the bottom of the electroplating bath (4) is provided through cleaning
Outlet (10), the washing outlet pipe (10) is through the bottom of electroplating bath (4) and upper plate (1), and washing outlet pipe (10)
On be provided with the first valve (11), be provided through at the top of the electroplating bath (4) plating outlet (12), it is described plating outlet
Pipe (12) is provided with storage tank (13), the storage tank on the bottom of electroplating bath (4) and upper plate (1), the lower plate (2)
(13) it is rectangular-shape hollow structure, and piston (14) is movably set in storage tank (13), the top vertical setting of the piston
There is push rod (15), and the top exposure of push rod (15) is set in the top of storage tank (13), the bottom of the plating outlet (12)
Be connected with bellows (16), and the one end of bellows (16) far from plating outlet (12) through the top of storage tank (13) and
Piston (14) is connected with hose connection (17), and the junction of the plating outlet (12) and bellows (16) is provided with second
Valve (18).
2. electroplanting device according to claim 1, which is characterized in that be provided with bearing, and axis at the top of the transverse slat (5)
It holds and is connected with L-shaped bar and fixing device.
3. electroplanting device according to claim 1, which is characterized in that mounting hole is provided at the top of the fixed link (7),
And the size and fixing bolt (9) of mounting hole are adapted.
4. electroplanting device according to claim 1, which is characterized in that the bottom end of the storage tank (13) is connected with plating
Inlet pipe (19), the described one end of plating inlet pipe (19) far from storage tank (13) are connected in electroplating bath (4), and be electroplated on inlet pipe (19)
It is provided with third valve (20).
5. electroplanting device according to claim 1, which is characterized in that be provided with agitating device in the electroplating bath (4).
6. electroplanting device according to claim 1, which is characterized in that the top of the plating outlet (12) is equipped with filter
Net.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721571649.4U CN207537590U (en) | 2017-11-22 | 2017-11-22 | Electroplanting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721571649.4U CN207537590U (en) | 2017-11-22 | 2017-11-22 | Electroplanting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207537590U true CN207537590U (en) | 2018-06-26 |
Family
ID=62614550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721571649.4U Expired - Fee Related CN207537590U (en) | 2017-11-22 | 2017-11-22 | Electroplanting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207537590U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111663171A (en) * | 2020-06-13 | 2020-09-15 | 鹰潭市科速达电子塑胶有限公司 | Electroplating device for hardware stamping surface |
| CN112708922A (en) * | 2020-12-31 | 2021-04-27 | 郑州琦升精密制造有限公司 | Electroplating stirring and filtering device |
-
2017
- 2017-11-22 CN CN201721571649.4U patent/CN207537590U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111663171A (en) * | 2020-06-13 | 2020-09-15 | 鹰潭市科速达电子塑胶有限公司 | Electroplating device for hardware stamping surface |
| CN112708922A (en) * | 2020-12-31 | 2021-04-27 | 郑州琦升精密制造有限公司 | Electroplating stirring and filtering device |
| CN112708922B (en) * | 2020-12-31 | 2024-02-02 | 郑州琦升精密制造有限公司 | Electroplating stirring filter device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180626 Termination date: 20201122 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |