CN214694448U - Copper ion concentration control device - Google Patents
Copper ion concentration control device Download PDFInfo
- Publication number
- CN214694448U CN214694448U CN202120702367.3U CN202120702367U CN214694448U CN 214694448 U CN214694448 U CN 214694448U CN 202120702367 U CN202120702367 U CN 202120702367U CN 214694448 U CN214694448 U CN 214694448U
- Authority
- CN
- China
- Prior art keywords
- dissolving
- control device
- ion concentration
- copper ion
- concentration control
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Special Spraying Apparatus (AREA)
Abstract
The utility model provides a copper ion concentration control device, which comprises a shell, wherein at least two mutually communicated dissolving cavities are formed in the shell through partition board components along the material flow direction, each partition board component comprises an upper partition board and a lower partition board which are arranged in a staggered mode, and a communicating flow passage is formed between the upper partition board and the lower partition board; spraying assemblies are arranged in the dissolving cavity at intervals, and metal particles are filled in the dissolving cavity; the side wall of the shell is provided with at least one ultrasonic generator. The utility model divides the baffle plate into at least two dissolving cavities, and the solution bends and flows to ensure that the solution can fully dissolve the metal particles; in addition, spray the metal particle through the subassembly that sprays, improved the contact of metal particle with solution, increase the vortex at dissolving the intracavity, strengthen dissolving of metal particle, reduce metal particle's use, set up ultrasonic generator at the casing lateral wall and strengthen dissolving of metal particle, have simple structure, dissolve characteristics such as efficient and with low costs.
Description
Technical Field
The utility model belongs to the technical field of electroplate, especially, relate to a copper ion concentration control device.
Background
In a full-automatic vertical continuous thin plate electroplating production line, an electroplating plate is electroplated in a multi-stage copper electroplating cylinder, and in order to improve the uniformity and compactness of a plating layer on the electroplating plate, the concentration of copper ions in an electrolytic solution needs to be controlled emphatically. In the continuous operation process of the electroplating plate electroplating production line, because the electrolytic solution in the electroplating copper cylinder flows circularly and gradually consumes copper ions and reduces the concentration of the copper ions in the electroplating process, the copper ions in the electroplating copper cylinder need to be supplemented timely.
The traditional copper powder adding mode is that copper powder is added into a main tank of the copper electroplating cylinder and is introduced into the copper electroplating cylinder through a jet pipeline with a filter and a circulating pump for electroplating. This kind of mode of addition work efficiency is lower, throws the material inaccurate, is difficult to control the copper ion that fully accurately supplyes the consumption, and in addition, copper oxide powder is difficult to dissolve, needs to add sulphuric acid and carries out supplementary dissolving, increases waste water and liquid medicine consumption, and is high in price, and when dissolving inadequately simultaneously, the solid particle adheres to the circuit board face and can influence the electroplating effect.
CN211848201U discloses an electrolytic copper plating apparatus for controlling copper ion concentration, which includes a dissolution tank, a management tank, and an electroplating tank sequentially connected by a steel pipe, wherein the dissolution tank is connected with a copper oxide adding device, a concentration analyzing device and an addition amount control device are provided between the management tank and the copper oxide adding device, the concentration analyzing device analyzes dissolved copper oxide and then transmits data to an addition amount control device, and the copper oxide adding device performs powder addition according to the data of the addition amount control device. The utility model discloses an electrolytic copper plating equipment of management and control copper ion concentration connects the management and the control that reach real-time copper ion concentration with concentration analysis device and addition controlling means, has reduced copper ion's management scope to manage and control copper ion concentration through periodic analysis, can accurately control the addition of copper oxide powder, have very high practical value. However, the copper powder is not sufficiently dissolved, so that solid particles are adhered to the surface of the circuit board, which affects the electroplating effect.
CN206646183U discloses a copper powder adding and dissolving system, which comprises a frame and a dissolving tank, wherein a weighing platform is arranged on the frame, a feeding hopper is arranged on the weighing platform, the top of the feeding hopper is connected with a vacuum feeding machine, the inlet end of the vacuum feeding machine is connected with a copper powder storage tank positioned below the frame through a feeding pipe, the bottom of the feeding hopper is connected with the feeding port of the right end stirring area of the dissolving tank through a guide mechanism, a stirring driving device is arranged at the position, close to the feeding port, of the right end stirring area of the dissolving tank, the output end of the stirring driving device is in driving connection with a stirring impeller in the dissolving tank, a plurality of overflow baffles are distributed in the left end overflow area of the dissolving tank along the length direction, a liquid feeding port is arranged at the top of the right end stirring area of the dissolving tank, a liquid outlet is arranged at the bottom of the left end of the dissolving tank, the utility model has reasonable structural design and high automation degree, the copper powder is weighed the management accurate, and job stabilization nature is high, can the copper ion concentration in the accurate control electrolysis liquid medicine, but when dissolving inadequately, the solid particle can influence the electroplating effect attached to the circuit board face.
The existing copper ion concentration control devices all have the problems of complex structure, insufficient dissolution, low dissolution speed and the like, so that the problems that the metal dissolution efficiency is high, the cost is low and the like can be ensured under the condition that the copper ion concentration control device has a simple structure, and the existing copper ion concentration control devices are urgently required to solve at present.
SUMMERY OF THE UTILITY MODEL
Not enough to prior art exists, the utility model aims to provide a copper ion concentration control device sprays the subassembly through setting up and sprays the metal particle and dissolve to combine ultrasonic generrator, increase solution and metal ion's area of contact, only need a small amount of metal particle can maintain metal ion's in the solution concentration, have characteristics such as device simple structure, with low costs and dissolution efficiency height.
To achieve the purpose, the utility model adopts the following technical proposal:
the utility model provides a copper ion concentration control device, which comprises a shell, wherein at least two mutually communicated dissolving cavities are formed in the shell through partition board components along the material flow direction, each partition board component comprises an upper partition board and a lower partition board which are arranged in a staggered mode, and a communicating flow passage is formed between the upper partition board and the lower partition board; the dissolving cavity is internally provided with spraying assemblies at intervals, the dissolving cavity is filled with metal particles, and the side wall of the shell is provided with at least one ultrasonic generator.
The utility model divides the baffle plate into at least two dissolving cavities, and the solution flows in the dissolving cavities and the communicating flow passage in a bending way, thereby ensuring that the solution can fully dissolve metal particles; in addition, spray the metal particles through the subassembly that sprays, further improved the contact of metal particles with solution through spraying, increase the vortex dissolving the intracavity, strengthen dissolving of metal particles, reduce metal particles's use, further, through setting up ultrasonic generrator at the casing lateral wall, strengthen metal particles's dissolution effectively, make the utility model has the characteristics of simple structure, dissolve efficiently and with low costs etc.
As a preferred technical scheme of the utility model, spray assembly including spraying the person in charge, spray the shower that is connected with at least one vertical setting on being responsible for, be provided with at least one shower nozzle on the shower.
As a preferred technical scheme of the utility model, the shower is the matrix and arranges in dissolving the intracavity.
The sum of the cross-sectional areas of the showers is 10-30% of the area of the bottom of the dissolution chamber, for example, 10%, 12%, 14%, 16%, 18%, 20%, 22%, 24%, 26%, 28%, or 30%, but not limited to the values listed, and other values not listed in this range are equally applicable.
The utility model ensures the spraying area by controlling the sum of the sectional areas of the spraying pipes to account for 10-30% of the bottom area of the dissolving cavity and adjusting the proportion of the sectional areas of the spraying pipes, and if the proportion of the sectional areas of the spraying pipes is less than 10% of the bottom area of the dissolving cavity, the dissolving efficiency is affected due to the poor spraying effect of the spraying pipes; if the proportion of the cross section area of the spray pipe is higher than 30% of the area of the bottom of the dissolving cavity, the filled metal particles are less, so that more spray solution is sprayed, the dissolving rate is too high, and the concentration of metal ions in the solution is too high to exceed the use requirement.
The metal particles are spherical or cylindrical in shape.
As a preferred technical scheme of the utility model, copper ion concentration control device still cyclic connection have the reservoir.
The utility model discloses a cyclic connection reservoir, through solution at the device inner loop flow, guarantee metal ion's concentration.
The liquid storage tank is in circulating connection with the copper ion concentration control device through a first circulating pipeline and a second circulating pipeline, the bottom of the liquid storage tank is connected to an inlet of the copper ion concentration control device through the first circulating pipeline, and the outlet of the copper ion concentration control device is connected to the top of the liquid storage tank through the second circulating pipeline.
And the inlet of the copper ion concentration control device is positioned at the bottom of the shell.
As a preferred technical scheme of the utility model, the bottom in dissolution chamber is provided with the grid net.
The utility model discloses a set up the grid net, prevent that metal granules from spilling, further prevent that metal granules from getting into spray assembly, blocking up the shower nozzle.
As a preferred technical scheme of the utility model, the top of casing is provided with the top cap that can dismantle the connection.
It should be noted that the present invention does not have specific requirements and limitations on the detachable connection form, and those skilled in the art can reasonably select the detachable connection form according to the operation requirement, for example, the detachable connection form is a bolt connection.
And a sealing structure is arranged at the joint of the top cover and the shell.
It should be noted that the utility model discloses do not do specific requirements and special limitation to the form of seal structure, the skilled in the art can rationally select the form of seal structure according to the operation demand, for example, the seal structure is the sealing washer.
As a preferable technical proposal of the utility model, the first circulating pipeline is provided with a circulating pump.
As a preferred technical scheme of the utility model, the person in charge that sprays be connected with the pump that sprays, the pump that sprays draws the solution of grid net bottom portion.
The utility model discloses in utilize the circulating pump to spray solution to the metal particle circulation, reduce the quantity of solution, improve dissolving to the metal particle to the solution of extraction grid net bottom portion prevents that the metal particle from getting into and sprays the pump.
As a preferred technical scheme of the utility model, copper ion concentration control device still including set up in the concentration sensor in the reservoir, concentration sensor is used for detecting the metal ion concentration of the interior liquid of reservoir.
Preferably, copper ion concentration control device still include the controller, the controller respectively independent electric connection ultrasonic generator, concentration sensor, circulating pump and spray the pump, the controller is used for receiving the signal that concentration sensor sent to feedback control ultrasonic generator's power, circulating pump's flow and the flow of spray the pump.
Illustratively, the present invention provides a dissolving method for dissolving metal by using the above copper ion concentration control device, the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity, introducing a solution in a liquid storage tank into the dissolving cavity by a circulating pump, and introducing a part of the solution into the dissolving cavity through a grid net; the rest part enters the spraying assembly through the circulating pump, is sprayed out through the spray head to spray and dissolve the metal particles, and starts the ultrasonic generator to carry out ultrasonic dissolution on the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump and the spraying pump in a feedback mode, so that the flow of the circulating pump and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller controls the ultrasonic generator, the circulating pump and the spraying pump in a feedback mode, the power of the ultrasonic generator, the flow of the circulating pump and the flow of the spraying pump are reduced, and the use concentration is guaranteed.
The spraying pump comprises a liquid storage tank, a liquid storage tank and a spraying pump, wherein the liquid storage tank comprises oxidation state metal ions, metal particles comprise copper, the oxidation state metal ions comprise one or a combination of at least two of manganese ions, cerium ions, iron ions and vanadium ions, the flow regulating range of the spraying pump is 600-3000L/h, the concentration of the oxidation state metal ions is 1-50 g/L, the using concentration is the concentration of the copper ions, and the concentration of the copper ions is 10-60 g/L.
The numerical range of the present invention includes not only the point values listed above, but also any point values between the above numerical ranges not listed, which is limited to space and for the sake of brevity, the present invention does not exhaust the specific point values included in the range.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model divides the baffle plate into at least two dissolving cavities, and the solution flows in the dissolving cavities and the communicating flow passage in a bending way, thereby ensuring that the solution can fully dissolve metal particles; in addition, spray the metal particles through the subassembly that sprays, further improved the contact of metal particles with solution through spraying, increase the vortex dissolving the intracavity, strengthen dissolving of metal particles, reduce metal particles's use, further, through setting up ultrasonic generrator at the casing lateral wall, strengthen metal particles's dissolution effectively, make the utility model has the characteristics of simple structure, dissolve efficiently and with low costs etc.
Drawings
Fig. 1 is a schematic structural diagram of a copper ion concentration control device according to an embodiment of the present invention.
Wherein, 1-shell; 2-a dissolution cavity; 3-a spray assembly; 4-a lower baffle plate; 5-an upper partition plate; 6-a first circulation line; 7-a circulating pump; 8-a liquid storage tank; 9-a second circulation line; 10-a grid net; 11-an ultrasonic generator.
Detailed Description
It is to be understood that in the description of the present invention, the terms "central," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for the purpose of convenience and simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention. Furthermore, the terms "first", "second", etc. are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
It should be noted that, unless explicitly stated or limited otherwise, the terms "disposed," "connected" and "connected" in the description of the present invention are to be construed broadly, and may for example be fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art through specific situations.
The technical solution of the present invention will be further explained by the following embodiments.
In a specific embodiment, the utility model provides a copper ion concentration control device, as shown in fig. 1, the copper ion concentration control device comprises a shell 1, along the material flow direction, the shell 1 is internally divided into at least two mutually communicated dissolving cavities 2 through a partition board, the partition board comprises an upper partition board 5 and a lower partition board 4 which are arranged in a staggered manner, and a communication flow channel is formed between the upper partition board 5 and the lower partition board 4; the dissolving cavity 2 is internally provided with spraying components 3 at intervals, the dissolving cavity 2 is internally filled with metal particles, and the side wall of the shell is provided with at least one ultrasonic generator 11.
The utility model divides the baffle plate into at least two dissolving cavities 2, and the solution flows in the dissolving cavities 2 and the communicating flow passage in a bending way, thereby ensuring that the solution can fully dissolve metal particles; in addition, spray the metal particles through spray assembly 3, further improved the contact of metal particles with solution through spraying, increase the vortex in dissolving chamber 2, strengthen dissolving of metal particles, reduce metal particles's use, further, through setting up ultrasonic generrator 11 at the casing lateral wall, strengthen dissolving of metal particles effectively, make the utility model has the characteristics of simple structure, dissolve efficiently and with low costs.
Further, the spraying assembly 3 comprises a spraying main pipe, at least one vertically arranged spraying pipe is connected to the spraying main pipe, and at least one spray head is arranged on the spraying pipe. The spray pipes are arranged in a matrix in the dissolving cavity 2. Furthermore, the sum of the sectional areas of the spray pipes accounts for 10-30% of the bottom area of the dissolving cavity 2.
The utility model ensures the spraying area by controlling the sum of the sectional areas of the spraying pipes to account for 10-30% of the bottom area of the dissolving cavity 2 and adjusting the proportion of the sectional areas of the spraying pipes, and if the proportion of the sectional areas of the spraying pipes is less than 10% of the bottom area of the dissolving cavity 2, the dissolving efficiency is affected because the spraying effect of the spraying pipes is poor; if the proportion of the cross section area of the spray pipe is higher than 30% of the bottom area of the dissolving cavity 2, the filled metal particles are less, the spray solution is more, the dissolving speed is too high, the concentration of metal ions in the solution is too high, and the use requirement is exceeded.
Further, the metal particles are spherical or cylindrical in shape. Further, the copper ion concentration control device is also connected with a liquid storage tank 8 in a circulating mode, the liquid storage tank 8 is connected with the copper ion concentration control device in a circulating mode through a first circulating pipeline 6 and a second circulating pipeline 9, the first circulating pipeline 6 is connected to an inlet of the copper ion concentration control device from the bottom of the liquid storage tank 8, the second circulating pipeline 9 is connected to the top of the liquid storage tank 8 from an outlet of the copper ion concentration control device, and an inlet of the copper ion concentration control device is located at the bottom of the shell 1. The utility model discloses a circulation connection reservoir 8, through solution at the device inner loop flow, guarantees metal ion's concentration.
Further, the bottom of the dissolution chamber 2 is provided with a grid mesh 10. The utility model discloses a set up grid net 10, prevent that metal particle from spilling, further prevent that metal particle from getting into spray set 3, blocking nozzle.
Further, the top of the housing 1 is provided with a top cover which can be detachably connected, optionally, the detachable connection is in the form of bolt connection, and a sealing structure is arranged at the joint of the top cover and the housing 1, optionally, the sealing structure is a sealing ring.
Further, a circulation pump 7 is provided on the first circulation line 6. The main spray pipe is connected with a spray pump which extracts the solution at the bottom of the grid net 10. The utility model discloses in utilize circulating pump 7 to spray the metal particles circulation with solution, reduce the quantity of solution, improve dissolving to metal particles to the solution of extraction grid net 10 bottom prevents that metal particles from getting into the spray pump.
Further, the copper ion concentration control device further comprises a concentration sensor arranged in the liquid storage tank 8, and the concentration sensor is used for detecting the metal ion concentration of the liquid in the liquid storage tank 8. The copper ion concentration control device further comprises a controller, the controller is respectively and independently electrically connected with the concentration sensor, the circulating pump 7 and the spraying pump, and the controller is used for receiving signals sent by the concentration sensor and controlling the flow of the circulating pump 7 and the flow of the spraying pump in a feedback mode.
Illustratively, the present invention provides a dissolving method for dissolving metal by the above copper ion concentration control device, the dissolving method specifically includes the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7, is sprayed out by the nozzle to spray and dissolve the metal particles, and starts the ultrasonic generator 11 to carry out ultrasonic dissolution on the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller feeds back the ultrasonic generator 11, controls the circulating pump 7 and the spraying pump, reduces the power of the ultrasonic generator 11, the flow of the circulating pump 7 and the flow of the spraying pump, and ensures the use concentration.
The solution in the liquid storage tank 8 comprises oxidation state metal ions, the material of the metal particles comprises copper, the oxidation state metal ions comprise one or a combination of at least two of manganese ions, cerium ions, iron ions or vanadium ions, the flow regulating range of the spray pump is 600-3000L/h, the concentration of the oxidation state metal ions is 1-50 g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 10-60 g/L.
Example 1
The embodiment provides a copper ion concentration control device, based on embodiment 1 copper ion concentration control device, wherein, be two dissolving chamber 2 that communicate each other through the baffle component in the casing 1, the casing lateral wall is provided with two ultrasonic generators 11 relatively, and the sum of shower sectional area accounts for 20% of dissolving chamber 2 bottom surface area, metal particle's shape is globular.
The embodiment also provides a dissolving method for dissolving metal by adopting the copper ion concentration control device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7, is sprayed out by the nozzle to spray and dissolve the metal particles, and starts the ultrasonic generator 11 to carry out ultrasonic dissolution on the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller feeds back the ultrasonic generator 11, controls the circulating pump 7 and the spraying pump, reduces the power of the ultrasonic generator 11, the flow of the circulating pump 7 and the flow of the spraying pump, and ensures the use concentration.
The solution in the liquid storage tank 8 comprises oxidized metal ions, the metal particles comprise copper, the oxidized metal ions comprise manganese ions, the flow regulation range of the spray pump is 600-3000L/h, the concentration of the oxidized metal ions is 25g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 35 g/L.
Example 2
The embodiment provides a copper ion concentration control device, based on embodiment 1 copper ion concentration control device, wherein, be four dissolving chamber 2 that communicate each other through the baffle component in the casing 1, the casing lateral wall is provided with four ultrasonic generators 11 relatively, and the total of shower sectional area accounts for 10% of dissolving 2 basal areas in chamber, the shape of metal particle is globular.
The embodiment also provides a dissolving method for dissolving metal by adopting the copper ion concentration control device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7, is sprayed out by the nozzle to spray and dissolve the metal particles, and starts the ultrasonic generator 11 to carry out ultrasonic dissolution on the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller feeds back the ultrasonic generator 11, controls the circulating pump 7 and the spraying pump, reduces the power of the ultrasonic generator 11, the flow of the circulating pump 7 and the flow of the spraying pump, and ensures the use concentration.
The solution in the liquid storage tank 8 comprises oxidized metal ions, the metal particles comprise copper, the oxidized metal ions comprise cerium ions, the flow regulation range of the spray pump is 600-3000L/h, the concentration of the oxidized metal ions is 1g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 10 g/L.
Example 3
This embodiment provides a copper ion concentration control device, based on embodiment 1 copper ion concentration control device, wherein, be five dissolving chamber 2 that communicate each other through the baffle component in the casing 1, the casing lateral wall interval is provided with three ultrasonic generator 11, and the sum of shower sectional area accounts for 30% of dissolving 2 basal areas in chamber, metal particle's shape is cylindricly.
The embodiment also provides a dissolving method for dissolving metal by adopting the copper ion concentration control device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7, is sprayed out by the nozzle to spray and dissolve the metal particles, and starts the ultrasonic generator 11 to carry out ultrasonic dissolution on the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller feeds back the ultrasonic generator 11, controls the circulating pump 7 and the spraying pump, reduces the power of the ultrasonic generator 11, the flow of the circulating pump 7 and the flow of the spraying pump, and ensures the use concentration.
The solution in the liquid storage tank 8 comprises oxidized metal ions, the metal particles comprise copper, the oxidized metal ions comprise vanadium ions, the flow regulation range of the spray pump is 600-3000L/h, the concentration of the oxidized metal ions is 50g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 60 g/L.
Example 4
This embodiment provides a copper ion concentration control device, based on embodiment 1 copper ion concentration control device, wherein, be six dissolving chamber 2 that communicate each other through the baffle component in the casing 1, the casing lateral wall interval is provided with four ultrasonic generators 11, and the total of shower sectional area accounts for 15% of dissolving 2 basal areas in chamber, the shape of metal particle is globular.
The embodiment also provides a dissolving method for dissolving metal by adopting the copper ion concentration control device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7, is sprayed out by the nozzle to spray and dissolve the metal particles, and starts the ultrasonic generator 11 to carry out ultrasonic dissolution on the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller feeds back the ultrasonic generator 11, controls the circulating pump 7 and the spraying pump, reduces the power of the ultrasonic generator 11, the flow of the circulating pump 7 and the flow of the spraying pump, and ensures the use concentration.
The solution in the liquid storage tank 8 comprises oxidized metal ions, the material of the metal particles comprises copper, the oxidized metal ions comprise a combination of iron ions and vanadium ions, the molar ratio of the iron ions to the vanadium ions is 1:1, the flow regulation range of the spray pump is 600-3000L/h, the concentration of the oxidized metal ions is 8g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 25 g/L.
Example 5
The embodiment provides a copper ion concentration control device, based on embodiment 1 copper ion concentration control device, wherein, be eight dissolving chamber 2 that communicate each other through the baffle component in the casing 1, the casing lateral wall is provided with two ultrasonic generators 11 relatively, and the sum of shower sectional area accounts for 25% of dissolving chamber 2 bottom surface area, metal particle's shape is globular.
The embodiment also provides a dissolving method for dissolving metal by adopting the copper ion concentration control device, and the dissolving method specifically comprises the following steps:
filling metal particles into a dissolving cavity 2, introducing a solution in a liquid storage tank 8 into the dissolving cavity 2 by a circulating pump 7, and introducing a part of the solution into the dissolving cavity 2 through a grid net 10; the rest part enters the spraying component 3 through the circulating pump 7, is sprayed out by the nozzle to spray and dissolve the metal particles, and starts the ultrasonic generator 11 to carry out ultrasonic dissolution on the metal particles;
(II) the concentration sensor detects the concentration of metal ions in the solution in the liquid storage tank 8, and when the concentration of the metal ions is lower than the use concentration, the controller controls the circulating pump 7 and the spraying pump in a feedback mode, so that the flow of the circulating pump 7 and the flow of the spraying pump are improved; when the concentration of the metal ions reaches the use concentration, the controller feeds back the ultrasonic generator 11, controls the circulating pump 7 and the spraying pump, reduces the power of the ultrasonic generator 11, the flow of the circulating pump 7 and the flow of the spraying pump, and ensures the use concentration.
The solution in the liquid storage tank 8 comprises oxidation state metal ions, the material of the metal particles comprises copper, the oxidation state metal ions comprise a combination of manganese ions, cerium ions and vanadium ions, the molar ratio of the manganese ions to the cerium ions to the vanadium ions is 1:1:1, the flow regulating range of the spray pump is 600-3000L/h, the concentration of the oxidation state metal ions is 35g/L, the use concentration is the concentration of the copper ions, and the concentration of the copper ions is 40 g/L.
Through the embodiment, the utility model divides the partition board into at least two dissolving cavities 2, and the solution flows in the dissolving cavities 2 and the communicating flow passage in a bending way, thereby ensuring that the solution can fully dissolve the metal particles; in addition, spray the metal particles through spray assembly 3, further improved the contact of metal particles with solution through spraying, increase the vortex in dissolving chamber 2, strengthen dissolving of metal particles, reduce metal particles's use, further, through setting up ultrasonic generrator 11 at the casing lateral wall, strengthen dissolving of metal particles effectively, make the utility model has the characteristics of simple structure, dissolve efficiently and with low costs.
The applicant states that the above description is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and those skilled in the art should understand that any changes or substitutions easily conceivable by those skilled in the art within the technical scope of the present invention are within the protection scope and the disclosure scope of the present invention.
Claims (10)
1. The copper ion concentration control device is characterized by comprising a shell, wherein the shell is divided into at least two mutually communicated dissolving cavities along the material flow direction through partition plate components, each partition plate component comprises an upper partition plate and a lower partition plate which are arranged in a staggered mode, and a communication flow channel is formed between the upper partition plate and the lower partition plate;
spraying assemblies are arranged in the dissolving cavity at intervals, and metal particles are filled in the dissolving cavity;
the side wall of the shell is provided with at least one ultrasonic generator.
2. The copper ion concentration control device according to claim 1, wherein the spray assembly comprises a main spray pipe, at least one vertically arranged spray pipe is connected to the main spray pipe, and at least one spray head is arranged on the spray pipe.
3. The copper ion concentration control device according to claim 2, wherein the shower pipes are arranged in a matrix in the dissolution chamber;
the sum of the sectional areas of the spray pipes accounts for 10-30% of the area of the bottom of the dissolving cavity;
the metal particles are spherical or cylindrical in shape.
4. The copper ion concentration control device according to claim 1, wherein the copper ion concentration control device is further connected with a liquid storage tank in a circulating manner;
the liquid storage tank is in circulating connection with the copper ion concentration control device through a first circulating pipeline and a second circulating pipeline, the bottom of the liquid storage tank of the first circulating pipeline is connected to the inlet of the copper ion concentration control device, and the outlet of the copper ion concentration control device of the second circulating pipeline is connected to the top of the liquid storage tank;
and the inlet of the copper ion concentration control device is positioned at the bottom of the shell.
5. The copper ion concentration control device according to claim 1, wherein a grid mesh is provided at the bottom of the dissolution chamber.
6. The copper ion concentration control device according to claim 1, wherein a top cover detachably connected is provided on the top of the housing;
and a sealing structure is arranged at the joint of the top cover and the shell.
7. The apparatus according to claim 4, wherein a circulation pump is provided on the first circulation line.
8. The copper ion concentration control device according to claim 5, wherein a spray pump is connected to the spray main pipe, and the spray pump pumps the solution at the bottom of the grid mesh.
9. The copper ion concentration control device according to claim 4, further comprising a concentration sensor disposed in the reservoir, wherein the concentration sensor is configured to detect a metal ion concentration of the liquid in the reservoir.
10. The apparatus according to claim 9, further comprising a controller, wherein the controller is electrically connected to the ultrasonic generator, the concentration sensor, the circulating pump and the spray pump, and the controller is configured to receive the signal from the concentration sensor and feedback-control the power of the ultrasonic generator, the flow rate of the circulating pump and the flow rate of the spray pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120702367.3U CN214694448U (en) | 2021-04-07 | 2021-04-07 | Copper ion concentration control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120702367.3U CN214694448U (en) | 2021-04-07 | 2021-04-07 | Copper ion concentration control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214694448U true CN214694448U (en) | 2021-11-12 |
Family
ID=78529684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120702367.3U Active CN214694448U (en) | 2021-04-07 | 2021-04-07 | Copper ion concentration control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214694448U (en) |
-
2021
- 2021-04-07 CN CN202120702367.3U patent/CN214694448U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103663802B (en) | Microelectrolysis-fenton oxidizing reaction device | |
| CN214694448U (en) | Copper ion concentration control device | |
| EP2300135B1 (en) | Apparatus and method for mixing concentrated water treatment solutions | |
| CN208151518U (en) | A kind of electroplate liquid automatic control system | |
| CN110436576A (en) | Except the method and device of cyanogen granule electrode and preparation method and processing high cyanide containing wastewater | |
| CN212894972U (en) | Chemical tinning device for printed circuit board | |
| CN208532950U (en) | A kind of electrolytic cell | |
| CN207109132U (en) | A kind of copper plating device for coordinating cupric oxide powder supplement copper ion using insoluble anode | |
| CN210104117U (en) | Copper ion supplementing device for electroplating | |
| CN213835567U (en) | Self-circulation electrolytic electrodeposition tank | |
| CN217378065U (en) | Jet flow anode device for horizontal electroplating equipment | |
| CN211268287U (en) | Automatic spout medicine device | |
| CN108326292A (en) | A kind of metallic cover type composite granule electroplating technology | |
| CN211226711U (en) | Commercial water dispenser with automatic waste water discharge function | |
| CN211445923U (en) | Stannous octoate electrochemistry continuous cycle synthesizer | |
| CN113101818A (en) | Metal dissolving device and dissolving method thereof | |
| CN110468393B (en) | Chemical nickel plating system | |
| CN208948924U (en) | A kind of PH adjusting mixing arrangement | |
| CN207743341U (en) | A kind of novel chemical conversion pond | |
| CN109081480A (en) | A kind of acidic etching liquid waste water end-o f-pipe -control system | |
| CN211813523U (en) | Chlorine supplementing equipment | |
| CN208120796U (en) | A kind of three-dimensional electrocatalysis oxidation reaction device | |
| CN220952148U (en) | Ferric iron copper dissolving circulation device | |
| CN220246300U (en) | Electroplating solution circulation system and electroplating system | |
| CN207537196U (en) | A kind of circulating iron carbon reduction reaction device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |