CN104342723A - Electroforming device - Google Patents
Electroforming device Download PDFInfo
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- CN104342723A CN104342723A CN201310328979.0A CN201310328979A CN104342723A CN 104342723 A CN104342723 A CN 104342723A CN 201310328979 A CN201310328979 A CN 201310328979A CN 104342723 A CN104342723 A CN 104342723A
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- electroforming
- tank body
- main
- groove body
- auxiliary
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- 238000005323 electroforming Methods 0.000 title claims abstract description 209
- 239000007788 liquid Substances 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 26
- 238000004891 communication Methods 0.000 claims description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 34
- 238000001914 filtration Methods 0.000 claims description 8
- 238000005086 pumping Methods 0.000 claims description 7
- 238000012544 monitoring process Methods 0.000 claims description 3
- 239000000243 solution Substances 0.000 description 66
- 239000012535 impurity Substances 0.000 description 14
- 239000002245 particle Substances 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical group 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- LMHKOBXLQXJSOU-UHFFFAOYSA-N [Co].[Ni].[Pt] Chemical compound [Co].[Ni].[Pt] LMHKOBXLQXJSOU-UHFFFAOYSA-N 0.000 description 1
- 239000010405 anode material Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- JPNWDVUTVSTKMV-UHFFFAOYSA-N cobalt tungsten Chemical compound [Co].[W] JPNWDVUTVSTKMV-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- -1 fluoborate Chemical compound 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-M sulfamate Chemical compound NS([O-])(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-M 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention provides an electroforming device. The electroforming device comprises an electroforming groove, electroforming anodes and electroforming cathodes; the electroforming groove is divided into a main groove body and an auxiliary groove body; the electroforming anodes and the electroforming cathodes are arranged in the main groove body; at least one filter cover is configured for the electroforming cathodes; each filter cover is used for covering an electroforming female die connected with the corresponding electroforming cathode; the electroforming device further comprises a liquid circulating device capable of enabling electroforming solutions in the main groove body and electroforming solutions in the auxiliary groove body to circularly flow and at least one heating device; the electroforming female dies are surrounded by the filter covers, and therefore the electroforming quality is improved; the at least one heating device is arranged in the auxiliary groove body so as to heat the electroforming solutions in the auxiliary groove body; the electroforming solutions in the auxiliary groove body and the electroforming solutions in the main groove body are circulated through the liquid circulating device, and therefore the temperature of the electroforming solutions in the main groove body is constant; the temperature and the concentration of the electroforming solutions are more even, and therefore the electroforming efficiency is improved.
Description
Technical Field
The invention relates to the field of electroforming, in particular to electroforming equipment.
Background
Electroforming is a special machining method that uses the principle of electrolytic deposition of metals to accurately replicate certain complex or special shaped workpieces. The metals used for electroforming are usually copper, nickel and iron, and alloys such as gold, silver, platinum nickel-cobalt, cobalt-tungsten, etc. are sometimes used, but electroforming of nickel is most widely used. The thickness of the electroformed layer is generally 0.02 to 6 mm, and the thickness can also be up to 25 mm.
The electroforming equipment consists of an electroforming cell and a direct current power supply (generally 12 volts, hundreds to thousands of amperes). The anode of the DC power supply is connected with an electroforming anode, the cathode is connected with an electroforming cathode, and the electroforming solution adopts an aqueous solution containing sulfate, sulfamate, fluoborate, chloride and the like of electroforming metal ions. The electroforming process is to deposit various metals or alloys on the electroforming mother die of the electroforming cathode.
However, the electroforming efficiency is low due to non-uniform temperature and concentration of the electroforming solution in the electroforming tank of the existing electroforming equipment; and, some particulate impurities are inevitably present on the surface of the electroformed master during the production thereof, so that these particles are gradually enlarged by the influence of the electrolytic impurities in the electroforming solution during the electroforming process, thereby affecting the quality of electroforming.
Disclosure of Invention
In view of the above, the present invention provides an electroforming apparatus to improve electroforming efficiency and quality.
The present invention provides an electroforming apparatus, including: the electroforming device comprises an electroforming tank, an electroforming anode and an electroforming cathode, wherein a common wall is arranged in the electroforming tank and divides the electroforming tank into two tanks, namely a main tank body and an auxiliary tank body;
the electroforming anode is arranged in the main groove body and is connected with the positive pole of a power supply;
the electroforming cathode is arranged in the main tank body, and is provided with at least one filter mask for covering an electroforming female die connected with the electroforming cathode;
further comprising: the liquid circulation device and at least one heating device can make the electroforming solution in the main tank body and the auxiliary tank body flow circularly, and the heating end of the heating device is arranged in the auxiliary tank body.
In one embodiment, the bottom of the main groove body is provided with a water inlet;
the liquid pumping end of the liquid circulating device is arranged in the auxiliary groove body, and the water outlet end of the liquid circulating device is communicated with the water inlet of the main groove body from the outside and is used for circulating the electroforming solution in the auxiliary groove body into the main groove body;
and at least one communicating hole is formed in the common wall, so that the electroforming solution in the main tank body can enter the auxiliary tank body through the communicating hole.
In one embodiment, the liquid circulation device comprises: a water pump, a filter and a water delivery pipeline; wherein,
the liquid pumping end of the water pump is arranged in the auxiliary groove body;
the water outlet end of the water suction pump is communicated with the filtering inlet of the filter through the water conveying pipeline;
and the filtering outlet of the filter is communicated with the water inlet of the main groove body through the input pipeline.
In one embodiment, the at least one communication hole is provided in an upper portion of the common wall so that the electroforming solution higher than the communication hole in the main tank body enters the sub tank body.
In one embodiment, at least one communicating pipe is further arranged in the auxiliary tank body;
the at least one communication hole is provided at a lower portion of the common wall;
one end of the communicating pipe is connected with the communicating hole and is used for forming a communicating device between the main tank body and the auxiliary tank body so that the electroforming solution in the main tank body enters the auxiliary tank body through the communicating pipe.
In one embodiment, the heating end of the heating device is disposed within the communication tube.
In one embodiment, a liquid level sensor for monitoring the liquid level of the electroforming solution in the sub-tank is also arranged in the sub-tank.
In one embodiment, a separation baffle plate for dividing the main tank body into two parts is arranged in the main tank body, and at least one separation plate hole communicated with the two parts of the main tank body is formed in the separation baffle plate.
According to the technical scheme, the electroforming tank is divided into the main tank body and the auxiliary tank body, at least one heating device is arranged in the auxiliary tank body to heat the electroforming solution in the auxiliary tank body, and the electroforming solution in the auxiliary tank body and the electroforming solution in the main tank body are circulated through the liquid circulation device, so that the temperature of the electroforming solution in the main tank body is constant, the temperature and the concentration of the electroforming solution are more uniform, and the electroforming efficiency is improved; meanwhile, the embodiment of the invention also covers the periphery of the electroforming female die with the filter cover to filter impurities in the electroforming solution, reduce the influence of the impurities on the surface particles of the electroforming female die, weaken the influence of the surface particles of the electroforming female die on the quality of an electroforming workpiece, and further improve the electroforming quality.
Drawings
Fig. 1 is a schematic structural diagram of a first possible implementation of an electroforming apparatus provided in an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a second possible implementation of an electroforming apparatus provided in an embodiment of the invention;
FIG. 3 is a schematic structural view of a third possible implementation of an electroforming apparatus according to an embodiment of the invention;
FIG. 4 is a schematic structural diagram of a fourth possible implementation of an electroforming apparatus according to an embodiment of the invention;
FIG. 5 is a schematic structural view of a filter mask in an electroforming apparatus according to an embodiment of the present invention;
FIG. 6 is a schematic view showing an electroforming apparatus according to an embodiment of the present invention, in which all of the electroforming mother molds are housed in an integrated filter housing;
FIG. 7 is a schematic view showing a single electroforming mother mold housed in a single filter housing in an electroforming apparatus according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a fifth possible implementation of the electroforming apparatus according to the embodiment of the invention.
Detailed Description
As shown in fig. 1, 2, 3, and 4, a schematic structural view of an electroforming apparatus according to an embodiment of the present invention is provided. As shown in fig. 1, the electroforming apparatus according to the present embodiment includes: an electroforming cell, an electroforming anode (not shown), an electroforming cathode 180, a liquid circulation device, and at least one heating device 130. Wherein, a common wall 112 is arranged in the electroforming tank, and the common wall 112 divides the electroforming tank into two tanks, namely a main tank body 110 and an auxiliary tank body 120. The electroforming anode is arranged in the main groove body and is connected with a positive power supply (not shown in detail); the electroforming cathode 180 is disposed in the main tank, and the electroforming cathode 180 is provided with at least one filter mask 182 for covering an electroforming mother die 181 connected to the electroforming cathode 180. The liquid circulating device can be arranged outside or inside the electroforming tank, so that the electroforming solution in the main tank body 110 and the electroforming solution in the auxiliary tank body 120 can flow circularly. The heating end of the heating device 130 is arranged in the auxiliary tank body 110 and is used for heating the electroforming solution in the auxiliary tank body 110.
In the embodiment, the electroforming tank is divided into the main tank body and the auxiliary tank body, at least one heating device is arranged in the auxiliary tank body to heat the electroforming solution in the auxiliary tank body, and the electroforming solution in the auxiliary tank body and the electroforming solution in the main tank body are circulated by the liquid circulation device, so that the temperature of the electroforming solution in the main tank body is constant, the temperature and the concentration of the electroforming solution are more uniform, and the electroforming efficiency is improved; meanwhile, the embodiment also covers the periphery of the electroforming female die with the filter cover to filter impurities in the electroforming solution, reduce the influence of the impurities on the surface particles of the electroforming female die, weaken the influence of the surface particles of the electroforming female die on the quality of an electroforming workpiece, and further improve the electroforming quality.
Further, as shown in FIGS. 1, 2, 3 and 4, a concrete example of the liquid circulation apparatus for realizing the circulation flow of the electrocasting solution in the main tank and the sub tank is shown. Specifically, the bottom of the main tank body 110 is provided with a water inlet. The liquid pumping end of the liquid circulating device is arranged in the auxiliary groove body 120, and the water outlet end of the liquid circulating device is communicated with the water inlet of the main groove body 110 and is used for circulating the electroforming solution in the auxiliary groove body 120 into the main groove body 110. At least one communication hole 113 is formed on the common wall 112, so that the electroforming solution in the main tank body 110 enters the auxiliary tank body 120 through the communication hole 113. Specifically, the liquid circulation device has a function of pumping the electroforming solution in the sub tank body 120 into the main tank body 110, and the electroforming solution in the main tank body 110 can flow into the sub tank body 120 through the communication hole 113, so that the electroforming solution is circulated. Here, it should be noted that: the scheme for realizing the liquid circulation in the main tank body and the auxiliary tank body is not limited to the implementation scheme, and the technical scheme that the circulating flow of the electroforming solution in the main tank body and the auxiliary tank body can be realized is applicable to the invention.
Further, the liquid circulation device described in the above embodiment may be implemented by using the structure shown in fig. 1, including: suction pump 140, filter 150, and water conduit 160. Wherein, the liquid pumping end 141 of the water pump is arranged in the auxiliary groove body. The water outlet end of the water pump 140 is communicated with the filtering inlet of the filter 150 through the water pipe 160. The filtering outlet of the filter 150 is communicated with the water inlet of the main tank 110 through the input pipe 160. The suction pump 140 pumps the electrocasting solution from the sub tank 120, filters the electrocasting solution through the filter 150, and then enters the main tank 110 through the water pipe 160.
Further, as shown in fig. 1 and 2, at least one communication hole 113 in the above embodiment may be provided in an upper portion of the common wall 112, that is, a position away from the bottom of the main tank body 110, that is, a position near the tank top of the main tank body 110, so that the electroforming solution in the main tank body higher than the communication hole 113 enters the sub tank body. Thus, the distance between the communication hole 113 and the water inlet at the bottom of the main tank body 110 is relatively long, and the electroforming solution in the main tank body 110 can flow favorably when circulating in the main tank body 110 and the auxiliary tank body 120, so that the temperature and the concentration of the electroforming solution in the main tank body 110 are more uniform. Alternatively, as shown in fig. 3 and 4, the at least one communication hole 113 is disposed at a lower portion of the common wall 112, and at least one communication pipe 222 is further disposed in the sub-tank 120, where in this embodiment, the communication pipe 222 is in an "L" shape. One end of the communication pipe 222 is connected to the communication hole 113, and is used for forming a communication between the main tank body 110 and the auxiliary tank body 120, so that the electroforming solution in the main tank body 110 enters the auxiliary tank body 120 through the communication pipe 222. The liquid in the main tank 110 passes through the communication hole 113 and enters the sub tank 120 through the communication pipe 222. The cross section of the communication pipe 222 may be cylindrical, square, or any other shape.
As shown in fig. 1 and 2, the heating end of the heating device 130 may be directly disposed in the auxiliary tank body 120 to heat the electroforming solution in the auxiliary tank body 120, the heated electroforming solution is pumped to the main tank body 110 by the liquid circulation device, the liquid in the main tank body 110 enters the auxiliary tank body 120 through the communication hole 113, and the temperature and concentration of the electroforming solution in the main tank body are more uniform through such continuous circulation. Alternatively, if the sub-tank 120 and the main tank 110 form a communication pipe 222 as shown in fig. 3 or 4, the heating device 130 may be disposed in the communication pipe 222. To facilitate the arrangement of the heating means 130 in the communication pipe 222, the communication hole 113 is provided on the common wall 112 at a position near the bottom of the main tank 110. Among them, the number of the communication holes 113, the communication pipe 222, and the heating means 130 may be two or more. More communication holes 113, communication pipes 222, and heating means 130 can make the temperature of the electroforming solution in the main tank 110 more uniform.
In practical application, some impurities such as particles inevitably exist on the surface of the electroforming master die positioned at the electroplating cathode, and in the electroforming process, the particles are gradually enlarged under the influence of the electrolytic impurities in the electroforming solution, so that the quality of an electroforming workpiece is influenced. In order to solve the above problems, at least one filtering cover is disposed in the main tank body according to the first embodiment. As shown in fig. 1 and 3, a plurality of filter covers 182a are provided in the main tank 110, each of which covers the periphery of one electroforming mother die for electroforming a cathode terminal in the main tank 110. Alternatively, as shown in fig. 2 and 4, an integral filter mask 182 is arranged in the main tank body 110, and the integral filter mask 182 surrounds all the electroforming mother dies 181. The arrangement of the filter cover can reduce the accumulation of original particles on the surface of the electroforming female die and weaken the influence of the particles on the electroforming workpiece, thereby improving the quality of the electroforming workpiece. Specifically, as shown in fig. 6 and 7, an electroformed anode 170 and an electroformed cathode 180 are both disposed within the main tank. The electroformed anode 170 is connected to the positive pole of the dc power supply 20, and the electroformed anode 170 is provided as a titanium basket containing anode material. A filter cover 182 is arranged at the electroforming cathode 180; the electroforming cathode 180 is provided with a workpiece to be cast, i.e., an electroforming mother die 181, and the electroforming cathode 180 is connected to the negative electrode of the power source 20. Fig. 6 shows a case where all the electroforming mother molds 181 are enclosed in one filter housing. FIG. 7 shows a case where one filter cap is provided for each of the housings of the electroforming mother die 181. Both the integral filter cover and the independent filter cover are mesh covers and are used for filtering impurities in electroforming solution, reducing the influence of the impurities on particles on the surface of an electroforming female die and weakening the influence of the particles on the surface of the electroforming female die on the quality of an electroforming workpiece, thereby improving the electroforming quality.
Fig. 5 shows an example of a filter cage. In FIG. 5, the filter housing 182 is a rectangular parallelepiped, and the remaining 5 surfaces of the rectangular parallelepiped except the top are made of a mesh screen made of an insulating material, which can insulate the electric ions in the electroforming solution and prevent the mesh of the mesh screen from being blocked. Before electroforming, the electroforming female die is placed into the filter cover through the top; the mesh shape of the screen mesh can be rhombus, regular hexagon and other polygons, and the mesh size density is suitable for isolating impurities in the electroforming solution. Or the filter cover can also be in other structures, such as a structure formed by surrounding three screens by the side wall of the main trough body. The invention is described only in terms of the functions of the filter housing, and the filter housing structure designed by the idea and the principle of the invention is also within the protection scope of the invention.
Further, as shown in fig. 1, 2, 3 and 4, in order to monitor the liquid level of the electroforming solution in the sub tank body 120, a liquid level sensor 121 for monitoring the liquid level of the electroforming solution in the sub tank body 120 is further provided in the sub tank body 120.
Further, as shown in fig. 8, a baffle 211 is further provided in the main tank 110 to divide the main tank 110 into two parts. The baffle 211 is provided with a baffle hole 214 communicating the two parts of the main tank 110. The baffle 211 is primarily intended to simulate the operation of a pictographic anode.
The operation of the electroforming apparatus provided by the embodiment of the present invention will be further described with reference to fig. 1, 2, 3, 4, 6, and 7.
When the electroforming equipment carries out electroforming, electroforming solution is injected into the main groove body 110 and the auxiliary groove body 120, and the direct current power supply 20, the electroforming anode 170, the electroforming cathode 180 and the electroforming mother die 181 are connected to form a current loop through the electroforming solution. When the power switch of the dc power supply 20 is turned on for electroforming, the suction pump 140 and the filter 150 operate simultaneously. Thus, the electroforming solution in the auxiliary tank body 120 is pumped into the filter 150 by the water pump, and the electroforming solution is filtered by the filter 150 and then flows into the main tank body 110 through the water pipe 160; then, the electroforming solution in the main tank body 110 returns to the sub-tank body 120 through the communication hole 113, the electroforming solution is heated by the heating device 130 in the sub-tank body 120 and then pumped to the filter 150 by the water pump 140, and the liquid filtered by the filter flows into the main tank body 110. The liquid in the main tank body 110 flows into the auxiliary tank body 120 through the communication hole. Therefore, the electroforming solution in the main tank body 110 can be circulated continuously, the uniformity of the temperature and the concentration of the electroforming solution in the main tank body 110 is higher, the electroforming efficiency is further improved, and meanwhile, along with the flowing of the electroforming solution, impurities in the electroforming solution are isolated outside the filter cover 182, so that the influence of the impurities on an electroforming mother die is reduced, and the electroforming quality is improved.
The electroforming equipment surrounds the electroforming female die by using the filter mask, reduces the deposition of impurities in electroforming solution on the surface of the electroforming female die, weakens the accumulation of particles on the surface of the electroforming female die and improves the quality of an electroforming workpiece; meanwhile, the electroforming tank is divided into a main tank body and an auxiliary tank body which are communicated with each other, the electroforming solution is heated in the auxiliary tank body by a heating device, and then the electroforming solution in the main tank body and the electroforming solution in the auxiliary tank body are circulated by a liquid circulating device, so that the temperature of the electroforming solution in the main tank body is kept constant, and the temperature and the concentration of the electroforming solution are more uniform, thereby improving the electroforming efficiency.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. An electroforming apparatus, comprising: the electroforming device comprises an electroforming tank, an electroforming anode and an electroforming cathode, wherein a common wall is arranged in the electroforming tank and divides the electroforming tank into two tanks, namely a main tank body and an auxiliary tank body;
the electroforming anode is arranged in the main groove body and is connected with the positive pole of a power supply;
the electroforming cathode is arranged in the main tank body, and is provided with at least one filter mask for covering an electroforming female die connected with the electroforming cathode;
further comprising: the liquid circulation device and at least one heating device can make the electroforming solution in the main tank body and the auxiliary tank body flow circularly, and the heating end of the heating device is arranged in the auxiliary tank body.
2. The electroforming apparatus of claim 1,
the bottom of the main groove body is provided with a water inlet;
the liquid pumping end of the liquid circulating device is arranged in the auxiliary groove body, and the water outlet end of the liquid circulating device is communicated with the water inlet of the main groove body from the outside and is used for circulating the electroforming solution in the auxiliary groove body into the main groove body;
and at least one communicating hole is formed in the common wall, so that the electroforming solution in the main tank body can enter the auxiliary tank body through the communicating hole.
3. The electroforming apparatus according to claim 2, wherein the liquid circulation device comprises: a water pump, a filter and a water delivery pipeline; wherein,
the liquid pumping end of the water pump is arranged in the auxiliary groove body;
the water outlet end of the water suction pump is communicated with the filtering inlet of the filter through the water conveying pipeline;
and the filtering outlet of the filter is communicated with the water inlet of the main groove body through the input pipeline.
4. The electrocasting apparatus according to claim 2, wherein the at least one communication hole is provided at an upper portion of the common wall so that the electrocasting solution in the main tank higher than the communication hole enters the sub tank.
5. The electroforming apparatus according to claim 2, wherein at least one communication pipe is further provided in the sub tank;
the at least one communication hole is provided at a lower portion of the common wall;
one end of the communicating pipe is connected with the communicating hole and is used for forming a communicating device between the main tank body and the auxiliary tank body so that the electroforming solution in the main tank body enters the auxiliary tank body through the communicating pipe.
6. The electrocasting apparatus according to claim 5, wherein a heating end of the heating device is disposed within the communication tube.
7. The electrocasting apparatus according to any one of claims 1 to 6, wherein a liquid level sensor for monitoring a liquid level of the electrocasting solution in the sub tank is further provided in the sub tank.
8. The electroforming apparatus according to any one of claims 1 to 6, wherein a baffle plate dividing the main tank body into two parts is provided in the main tank body, and at least one baffle plate hole communicating the two parts of the main tank body is provided on the baffle plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310328979.0A CN104342723A (en) | 2013-07-31 | 2013-07-31 | Electroforming device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310328979.0A CN104342723A (en) | 2013-07-31 | 2013-07-31 | Electroforming device |
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| Publication Number | Publication Date |
|---|---|
| CN104342723A true CN104342723A (en) | 2015-02-11 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310328979.0A Pending CN104342723A (en) | 2013-07-31 | 2013-07-31 | Electroforming device |
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| CN202610378U (en) * | 2011-12-21 | 2012-12-19 | 北大方正集团有限公司 | System for filtering metallic coating of printed circuit board |
| CN202913077U (en) * | 2012-10-16 | 2013-05-01 | 厦门欣建雅工贸有限公司 | Rinsing bath used in electroplating |
| CN202936501U (en) * | 2012-11-28 | 2013-05-15 | 浙江三高自动化设备有限公司 | Cathode electrophoresis circulating device |
| CN203419996U (en) * | 2013-07-31 | 2014-02-05 | 南昌欧菲光科技有限公司 | Electroforming equipment |
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