TWM543250U - Electroplating equipment structure - Google Patents

Description

Plating equipment structure

This creation relates to an electroplating apparatus, and more particularly to an electroplating apparatus structure including filtration and cooling effects.

Electroplating is a method of laying a layer of metal on the conductor by the principle of electrolysis. The main purposes of electroplating include preventing metal oxidation (such as rust) and decorating. The outer layers of many coins are also completed by electroplating, but the sewage generated by electroplating (such as the ineffective electrolyte) will be an important source of water pollution if it is not treated, which will greatly harm the surrounding environment.

In view of this, the creator has been engaged in the manufacturing development and design experience of related products for many years. After detailed design and careful evaluation, the author has finally achieved a practical and practical creation.

The technical problem to be solved by the present invention is to provide a plating apparatus structure in view of the above-mentioned shortcomings existing in the prior art.

An electroplating apparatus structure comprising: a plating tank, a refrigerating device, and a filtering device, wherein the electroplating tank has a liquid chemical tank chamber therein, and is provided with at least one anode plate extending into the liquid chemical tank chamber, and a A cathode plate is disposed across the plating tank, the refrigeration device has a circulation pipe, and the circulation pipe is disposed in the liquid medicine tank, the filtering device has a water pump pipe and a An outlet pipe, one end of the pumping pipe is connected to a filter core, and the other end is disposed at the bottom of the liquid medicine tank chamber, one end of the water outlet pipe is connected with the plating tank, and the other end is connected with the water outlet end of a pumping motor, and The pumping end of the pumping motor is further provided with a connecting tube connected to the filter element, and by the above structure, the crucible is configured to constitute a plating apparatus structure.

The first plating plate and the second partition plate are further disposed inside the plating tank, and the first partition plate is at the same height as the outer wall of the plating tank, and is symmetrically provided with a bridging portion for the circulation tube of the refrigeration device. The card is fixed, and the second partition is lower than the first partition, and the first and second partitions are provided with a flow slot.

Wherein, the upper end portion of the plating tank is further provided with two corresponding concave portions to provide the clamping and fixing of the cathode plate.

Compared with the efficacy of the prior art: the electroplating apparatus of the present invention has a plating tank and is provided with a refrigerating device and a filtering device, so that the electroplating operation can ensure that the electroplating liquid is at an optimal working temperature through the refrigerating device, and the metal articles are greatly improved. The electroplating effect, and the sewage generated after the electroplating operation, can be filtered and then recycled, so as to avoid the pollution of water resources caused by sewage discharge, and the electroplating can be directly performed by the cooling of the refrigerating device after recycling. It not only greatly enhances the efficiency of the work, but also has environmental benefits.

10‧‧‧ plating bath

11‧‧‧ drug solution chamber

111‧‧‧First partition

112‧‧‧Second partition

113‧‧‧ bridging department

114‧‧‧Circulation slot

115‧‧‧ recess

12‧‧‧Anode plate

13‧‧‧ cathode plate

20‧‧‧Refrigeration unit

21‧‧‧Circulation tube

30‧‧‧Filter device

31‧‧‧Water pipes

32‧‧‧Outlet

33‧‧‧ filter

34‧‧‧ pumping motor

341‧‧‧ water outlet

342‧‧‧ pumping end

343‧‧‧Connecting tube

Figure 1: This is a perspective view of the creation.

Figure 2: This is an exploded view of the creation.

Figure 3: This is a schematic diagram of the electroplating operation of this creation.

Figure 4: Schematic diagram of the filtering process for this creation.

In order to enable your review committee to have a better understanding and understanding of the purpose, characteristics and efficacy of this creation, please refer to the following [Simplified Description of the Drawings] for details:

First, referring to FIGS. 1 and 2, an electroplating apparatus structure includes: a plating tank 10, a refrigerating apparatus 20, and a filtering device 30, wherein the plating tank 10 has a liquid chemical tank chamber 11 therein. And an anode plate 12 extending into the liquid chamber 11 and a cathode plate 13 spanning the plating tank 10, and the first plating plate 111 and the second partition are further disposed inside the plating tank 10. The first partition plate 111 is at the same height as the outer ring wall of the plating tank 10, and is symmetrically provided with a bridging portion 113, and the second partition plate 112 is lower than the first partition plate 111, and the first partition plate The two partition plates 111 and 112 are respectively provided with a flow-through slot 114. The upper end portion of the plating tank 10 is further provided with two corresponding recesses 115 for providing the locking and fixing of the cathode plate 13. The refrigeration device 20 has a circulation tube 21 The circulation pipe 21 is coupled to the first partition plate 111 and the bridging portion 113 of the outer ring wall, and is further disposed in the liquid chemical tank chamber 11. The filter device 30 has a water suction pipe 31 and an water outlet pipe 32. One end of the water suction pipe 31 is connected to a filter core 33 outside the plating tank 10, and the other end is disposed at the bottom of the liquid medicine tank chamber 11 in the plating tank 10. One end of the outlet pipe 32 is disposed in the plating tank 10, adjacent to the first and second partition plates 111, 112, and the other end is connected to the water outlet end 341 of a pumping motor 34, and the pumping end of the pumping motor 34 342 is further provided with a connecting tube 343 connected to the filter element 33, and by the above structure, a plating apparatus structure is completed.

When the structure is actually used, please refer to FIGS. 3 and 4 again. The plating tank 10 is provided with a plating liquid A in the chemical liquid chamber 11, and the second electrode is inserted into the anode of the liquid chamber 11 The plate 12 is immersed in the plating liquid A, and the metal object B to be electroplated is suspended from the cathode plate 13 to be electrically connected, and immersed in the plating liquid A, thereby passing the DC power supply, the two anode plates 12 The electrons are released, and the positive ions of the plating liquid A are reduced at the cathode end, and the metal of the anode plate 12 is further The electroplating is adhered to the surface of the metal article B to achieve the effect of electroplating, and the plating tank 10 is further matched with a refrigerating device 20, and the circulation pipe 21 is extended into the liquid chemical tank chamber 11 to provide a cooling effect of the plating liquid A. The plating liquid A can be maintained at an optimum working temperature, thereby stably achieving the plating effect of the metal article B, and the sewage generated after the plating is gradually extracted from the bottom of the liquid medicine chamber 11 through the pumping motor 34. And the filter electrolyte 33 of the filter device 30 is used to filter and remove the electrolyte that has lost its effect. Finally, it is introduced into the plating tank 10 via the pump motor 34 and the water outlet pipe 32, and the filtered plating liquid A is introduced into the drug solution chamber 11, and then sequentially The first and second separators 112 are collected by the flow notches 114. If there is any impurities after the filtration, the impurities are more than the plating liquid A, and the impurities are deposited in the first and second separators. 111, 112 to ensure the purity of the plating liquid A.

With the structure of the above specific embodiment, the following advantages can be obtained: the electroplating apparatus of the present invention has a plating tank 10 and is provided with a refrigerating device 20 and a filtering device 30, so that the electroplating can ensure the electroplating through the refrigerating device 20 during the plating operation. The liquid A is in the optimal working temperature, and the electroplating effect of the metal article B is greatly improved, and the sewage generated after the electroplating operation can be filtered and then recycled by the filtering device 30 to prevent the sewage from being discharged and causing water resources. Contamination, and after the recovery, the electroplating operation can be directly performed by the cooling of the refrigerating device 20, which not only greatly improves the work efficiency, but also has environmental benefits.

In summary, this creation has indeed achieved a breakthrough structural design, with improved creative content, while at the same time achieving industrial use and progress, and this creation has not been seen in any publication, but also novel, when In accordance with the provisions of the relevant laws and regulations of the Patent Law, the application for the creation of a patent shall be filed according to law, and the examination of the member of the Bureau shall be granted a legal patent right.

Only the above-mentioned ones are only preferred embodiments of the present invention, and the scope of the creation of the present invention cannot be limited thereto; that is, the equal changes and modifications made by the general applicants according to the scope of the patent application for the creation, All should remain within the scope of this creation patent.

10‧‧‧ plating bath

11‧‧‧ drug solution chamber

111‧‧‧First partition

112‧‧‧Second partition

113‧‧‧ bridging department

114‧‧‧Circulation slot

115‧‧‧ recess

12‧‧‧Anode plate

13‧‧‧ cathode plate

20‧‧‧Refrigeration unit

21‧‧‧Circulation tube

30‧‧‧Filter device

31‧‧‧Water pipes

32‧‧‧Outlet

33‧‧‧ filter

34‧‧‧ pumping motor

341‧‧‧ water outlet

342‧‧‧ pumping end

343‧‧‧Connecting tube

Claims (3)

An electroplating apparatus structure comprising: a plating tank having a liquid chemical tank chamber therein; and at least one anode plate extending into the liquid chemical tank chamber; and a cathode plate spanning the plating tank; a refrigerating device, the refrigerating device has a circulation pipe, and the circulation pipe is disposed in the liquid chemical tank chamber; a filtering device having a water pumping pipe and an outlet pipe, one end of the water pipe is connected to a filter core, and the other One end is disposed at the bottom of the liquid medicine tank chamber, one end of the water outlet pipe is connected with the plating tank, the other end is connected with the water outlet end of a pumping motor, and the pumping end of the pumping motor is further provided with a connecting tube and a filter element. connection. The electroplating apparatus structure according to the first aspect of the invention, wherein the electroplating tank is further provided with a first partition and a second partition, the first partition being at the same height as the outer wall of the plating tank, and The bridging portion is symmetrically disposed for the circulation tube of the refrigerating device to be snap-fitted, and the second partition is lower than the first partition, and the first and second partitions are provided with a flow slot. The electroplating apparatus structure according to the first aspect of the invention, wherein the upper end portion of the plating tank is further provided with two corresponding recesses for providing the clamping and fixing of the cathode plate.