CN207608652U - Electroplating equipment structure - Google Patents
Electroplating equipment structure Download PDFInfo
- Publication number
- CN207608652U CN207608652U CN201721583178.9U CN201721583178U CN207608652U CN 207608652 U CN207608652 U CN 207608652U CN 201721583178 U CN201721583178 U CN 201721583178U CN 207608652 U CN207608652 U CN 207608652U
- Authority
- CN
- China
- Prior art keywords
- electroplating
- water
- electroplating bath
- refrigerating plant
- partition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000009713 electroplating Methods 0.000 title claims abstract description 69
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 238000005192 partition Methods 0.000 claims description 24
- 239000003651 drinking water Substances 0.000 claims description 9
- 235000020188 drinking water Nutrition 0.000 claims description 9
- 238000005086 pumping Methods 0.000 claims description 9
- 230000000694 effects Effects 0.000 abstract description 18
- 239000007788 liquid Substances 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 9
- 238000007747 plating Methods 0.000 abstract description 7
- 239000010865 sewage Substances 0.000 abstract description 7
- 238000001816 cooling Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000001914 filtration Methods 0.000 description 6
- 230000005611 electricity Effects 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000004064 recycling Methods 0.000 description 3
- 238000004040 coloring Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 150000001768 cations Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000000866 electrolytic etching Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000003911 water pollution Methods 0.000 description 1
Landscapes
- Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
- Water Treatment By Electricity Or Magnetism (AREA)
Abstract
The utility model discloses an electroplating device structure, this electroplating device structure has a plating bath and disposes a refrigerating plant and a filter equipment, this refrigerating plant of accessible ensures that plating liquid is in the best operation temperature during messenger's electroplating operation, promote metal object's electroplating effect by a wide margin, and electroplate produced sewage behind the operation, then can filter the back recycle through the filter equipment, avoid sewage discharge and the water resource pollution that leads to, and utilize refrigerating plant's cooling after retrieving can directly carry out electroplating operation, not only promote electroplating operation's efficiency by a wide margin, more have environmental protection benefit concurrently.
Description
Technical field
The utility model relates to a kind of electroplating device, refers in particular to a kind of include filtering and the plating of refrigerating plant
Device structure.
Background technology
Plating is to utilize the principle of electrolysis by the method for electric conductor layer overlay metal, and the main application of plating includes preventing
Metal aoxidizes（Such as corrosion）And it is decorated.The outer layer of many coins also utilizes electroplating activity to complete, but the dirt generated is electroplated
Water（Such as lose the electrolyte of effectiveness）If unprocessed, it will be the important sources of water pollution, substantially endanger ambient enviroment.
Utility model content
The technical problem to be solved by the utility model is to be directed to above-mentioned missing of the existing technology, a kind of electricity is provided
Coating apparatus structure.
The utility model provides a kind of electroplating device structure, it includes：One electroplating bath, a refrigerating plant and a filtering dress
It sets, wherein there is a dipper room inside the electroplating bath, and the indoor anode plate of dipper, Yi Jiyi are stretched into equipped at least one
Across setting the cathode plate above electroplating bath, which there is a circulation pipe, the circulation pipe to be set in dipper room, the filtering
There is device a drinking-water pipe and an outlet pipe, one end of the drinking-water pipe to connect a filter core, and the other end of the drinking-water pipe is then arranged
Bottom in dipper room, one end and the electroplating bath group of the outlet pipe connect, the other end of the outlet pipe then with a Water-pumping motor
Water outlet connects, and the end of drawing water of the Water-pumping motor is then equipped with a connection tube and is connect with filter core, by above structure, to constitute one
Kind electroplating device structure.
Wherein, it is additionally provided with first partition and second partition inside the electroplating bath, the first partition is outer with the electroplating bath
Ring wall is arranged with bridge with height, is connected and fixed for the circulation pipe of refrigerating plant, and the second partition is then less than first
Partition board, and first and second partition board is equipped with a circulation groove mouth.
Wherein, which is additionally provided with two corresponding recess portions, and the inlay card to provide the cathode plate is fixed.
The effect of compareing prior art：The electroplating device structure of the utility model has an electroplating bath and configured with a refrigeration
Device and a filter device make to ensure that electro-plating liquid is in best operation temperature when electroplating activity by the refrigerating plant
Degree, is substantially improved the electroplating effect of metal, and generated sewage after electroplating activity, then can be after filter device filters again
Recycling uses, and avoids water resource pollution caused by sewage discharge, and after recycling using the cooling of refrigerating plant can directly into
Row electroplating activity not only significantly improves electroplating activity efficiency, more has both environmental benefit.
Description of the drawings
Fig. 1 is the stereogram of the utility model.
Fig. 2 is the exploded view of the utility model.
Fig. 3 is the electroplating activity schematic diagram of the utility model.
Fig. 4 is the filtering process schematic diagram of the utility model.
Symbol description in attached drawing：
10 electroplating baths；11 dipper rooms；111 first partitions；112 second partitions；113 bridge；114 circulation grooves
Mouthful；115 recess portions；12 anode plates；13 cathode plates；20 refrigerating plants；21 circulation pipes；30 filter devices；31 drinking-water pipes；
32 outlet pipes；33 filter cores；34 Water-pumping motors；341 water outlets；342 draw water end；343 connection tubes；A electro-plating liquids；B
Metal.
Specific implementation mode
To enable to have a better understanding and awareness to the purpose of this utility model, feature and effect, coordinate below
Details are as follows for schema：
First, refering to fig. 1, shown in 2, a kind of electroplating device structure, it includes：One electroplating bath 10, a refrigerating plant 20 with
An and filter device 30, wherein 10 inside of electroplating bath has a dipper room 11, and sets that there are two stretch into dipper room 11
Anode plate 12 and one across setting the cathode plate 13 above electroplating bath 10, and be additionally provided with first partition inside the electroplating bath 10
111 and second partition 112, the external annulus of the first partition 111 and the electroplating bath 10 is arranged with bridge 113 with high,
And the second partition 112 is then less than first partition 111, and first and second partition board 111,112 is all equipped with a circulation groove mouth 114, it should
10 upper end of electroplating bath is additionally provided with two corresponding recess portions 115, and the inlay card to provide the cathode plate 13 is fixed, the refrigerating plant
20 there is a circulation pipe 21, the circulation pipe 21 to be connected in first partition 111 and the bridge 113 of external annulus, re-extend setting
In in dipper room 11, which has a drinking-water pipe 31 and an outlet pipe 32, and one end of the drinking-water pipe 31 is in electricity
Connecting a filter core 33 outside coating bath 10, the other end is then set to 11 bottom of dipper room in electroplating bath 10, and the one of the outlet pipe 32
End is mounted on the electroplating bath 10, and neighbouring first and second partition board 111,112, the other end then water outlet 341 with a Water-pumping motor 34
The end 342 of drawing water of connection, the Water-pumping motor 34 is then connect equipped with a connection tube 343 with filter core 33, by above structure, to complete
A kind of electroplating device structure.
In actual use, shown in Fig. 3,4, the electroplating bath 10 is in dipper room for the electroplating device structure of the utility model
It is installed with electro-plating liquid A in 11, and this two anode plates 12 stretched into dipper room 11 is made to be covered by electro-plating liquid A leachings, then
The metal B that colouring is electroplated will be needed to be hung on 13 conduction of cathode plate to connect, and immersed in electro-plating liquid A, passed to whereby straight
After the power supply of galvanic electricity, which can discharge electronics, and the cation of electro-plating liquid A is then restored in cathode terminal, in turn
The electrolytic etching of metal of anode plate 12 is attached to metal B surface, achievees the effect that plating colouring, and the electroplating bath 10 is also arranged in pairs or groups
One refrigerating plant 20, and the circulation pipe 21 is extended in dipper room 11, the cooling-down effect of electro-plating liquid A is provided, the electricity is made
Plating liquid A can be maintained at best processing temperature, and then steadily reach the electroplating effect of metal B, and be produced after being electroplated
Raw sewage is then gradually extracted out by Water-pumping motor 34 by 11 bottom of dipper room again, and via the filter core of filter device 30 33
The electrolyte for losing effectiveness is filtered into attachment, is finally imported in electroplating bath 10 via Water-pumping motor 34 and outlet pipe 32, and mistake
When electro-plating liquid A after filter imports dipper room 11, meeting is again sequentially by the circulation notch 114 of the first and second partition board 111,112
Collect, if still having impurity after filtering, i.e., can be sunk to the bottom because impurity proportion is more than electro-plating liquid A, and then impurity is retained in the
One, between two partition boards 111,112, to ensure the degree of purity of electro-plating liquid A.
Following benefits can be obtained in the structure of above-mentioned specific embodiment：The electroplating device structure of the utility model has an electricity
Coating bath 10 is simultaneously configured with a refrigerating plant 20 and a filter device 30, makes by the refrigerating plant 20 to ensure when electroplating activity
Electro-plating liquid A is in best processing temperature, the electroplating effect of metal B is substantially improved, and produced after electroplating activity
Sewage, then recycling can be used after the filtering of filter device 30, avoid water resource pollution caused by sewage discharge, and recycle
Electroplating activity can be directly carried out using the cooling of refrigerating plant 20 afterwards, electroplating activity efficiency has not only been significantly improved, has more had both
Environmental benefit.
The above, only a preferred embodiment of the utility model, it is real when the utility model cannot be limited with this
The range applied；That is equivalent changes and modifications made according to the patent scope of the utility model generally, should all still fall within this practicality
In the range of new patent is covered.
Claims (3)
1. a kind of electroplating device structure, which is characterized in that include：
One electroplating bath, the electroplating bath inside has a dipper room, and stretches into the indoor anode plate of dipper equipped at least one,
And one across setting the cathode plate above electroplating bath；
There is a circulation pipe, the circulation pipe to be set in dipper room for one refrigerating plant, the refrigerating plant；
One filter device, the filter device have a drinking-water pipe and an outlet pipe, one filter of one end connection of the drinking-water pipe
Core, the other end of the drinking-water pipe are then set to the bottom of dipper room, and one end and the electroplating bath group of the outlet pipe connect, described
The other end of outlet pipe is then connect with the water outlet of a Water-pumping motor, and the end of drawing water of the Water-pumping motor is then equipped with a connection tube simultaneously
It is connect with filter core.
2. electroplating device structure according to claim 1, which is characterized in that wherein, is additionally provided with inside the electroplating bath
One partition board and second partition, the first partition and the external annulus of the electroplating bath are same high, and are arranged with bridge, for
The circulation pipe of refrigerating plant connects and fixes, and the second partition is then less than first partition, and first and second partition board is equipped with
One circulation groove mouth.
3. electroplating device structure according to claim 1, which is characterized in that wherein, the electroplating bath upper end is additionally provided with
Two corresponding recess portions, the inlay card to provide the cathode plate are fixed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106202766U TWM543250U (en) | 2017-02-24 | 2017-02-24 | Electroplating equipment structure |
| TW106202766 | 2017-02-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207608652U true CN207608652U (en) | 2018-07-13 |
Family
ID=59688817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721583178.9U Expired - Fee Related CN207608652U (en) | 2017-02-24 | 2017-11-23 | Electroplating equipment structure |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN207608652U (en) |
| TW (1) | TWM543250U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111912691A (en) * | 2020-09-07 | 2020-11-10 | 盘锦忠旺铝业有限公司 | Automatic change aluminum alloy sample positive pole tectorial membrane device |
| WO2021190250A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Electrochemical deposition device |
-
2017
- 2017-02-24 TW TW106202766U patent/TWM543250U/en not_active IP Right Cessation
- 2017-11-23 CN CN201721583178.9U patent/CN207608652U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021190250A1 (en) * | 2020-03-27 | 2021-09-30 | 京东方科技集团股份有限公司 | Electrochemical deposition device |
| CN111912691A (en) * | 2020-09-07 | 2020-11-10 | 盘锦忠旺铝业有限公司 | Automatic change aluminum alloy sample positive pole tectorial membrane device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM543250U (en) | 2017-06-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207608652U (en) | Electroplating equipment structure | |
| CN107881535A (en) | A kind of device and process for preparing metal base ultra-hydrophobicity surface | |
| CN208087773U (en) | A kind of electrolytic cell collected with the earth of positive pole | |
| CN205222762U (en) | Water treatment device | |
| CN204385304U (en) | Dipolar four-contact electric conduction device between embedded electrodeposition electrolyzer | |
| CN109161958A (en) | A kind of method and device preparing copper surface super hydrophobic structure | |
| CN203904040U (en) | System for recycling manganese containing wastewater | |
| CN204779852U (en) | Electrolysis system and anode assembly thereof | |
| CN207973821U (en) | A kind of weak electrolyte circulation and stress device | |
| CN113699331A (en) | Quenching cooling device for advanced nonferrous metal part after heat treatment | |
| CN209210449U (en) | A kind of electrode assembly being electrolysed dephosphorization water treatment facilities | |
| CN203530456U (en) | Cable slot for electrolytic solution pool | |
| CN207347308U (en) | A kind of pcb board electroplating waste processing equipment | |
| CN202849585U (en) | Coppered wire stripped rack recycling groove | |
| CN207227579U (en) | A kind of electric deposition device | |
| CN202284227U (en) | Energy-saving series connection electrolysis device with electrolyte flowing into and out of separation groove in circulation mode | |
| CN204156327U (en) | A kind of power transformation box with electroformed layer | |
| CN201901714U (en) | Electrolytic cell | |
| CN105420768A (en) | Method for adjusting bivalent tin ion concentration | |
| CN215251288U (en) | Electroplating bath for surface of inner hole of terminal | |
| CN203307452U (en) | Electrocasting equipment | |
| CN204608191U (en) | Electrophoresis anolyte controls and voltage control system | |
| CN109809600A (en) | The quickly device of processing chemical nickel Ageing solution | |
| CN109097796A (en) | A kind of red copper embossment electroforming process | |
| CN203065591U (en) | Nickel-extracting treatment device for electroplating nickel wastewater |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20180713 Termination date: 20191123 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |