CN102023649A - 磨片机砂浆流量自动调节装置及其方法 - Google Patents
磨片机砂浆流量自动调节装置及其方法 Download PDFInfo
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- CN102023649A CN102023649A CN 201010607210 CN201010607210A CN102023649A CN 102023649 A CN102023649 A CN 102023649A CN 201010607210 CN201010607210 CN 201010607210 CN 201010607210 A CN201010607210 A CN 201010607210A CN 102023649 A CN102023649 A CN 102023649A
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- 239000004570 mortar (masonry) Substances 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 12
- 230000001105 regulatory effect Effects 0.000 title abstract 3
- 230000002572 peristaltic effect Effects 0.000 claims abstract description 44
- 230000009471 action Effects 0.000 claims abstract description 11
- 239000003082 abrasive agent Substances 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- 239000000523 sample Substances 0.000 claims description 4
- 230000008844 regulatory mechanism Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 9
- 230000001276 controlling effect Effects 0.000 abstract description 5
- 230000008901 benefit Effects 0.000 abstract description 2
- 239000004576 sand Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000012467 final product Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000009711 regulatory function Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
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CN 201010607210 CN102023649B (zh) | 2010-12-27 | 2010-12-27 | 磨片机砂浆流量自动调节装置及其方法 |
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CN 201010607210 CN102023649B (zh) | 2010-12-27 | 2010-12-27 | 磨片机砂浆流量自动调节装置及其方法 |
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CN102023649A true CN102023649A (zh) | 2011-04-20 |
CN102023649B CN102023649B (zh) | 2012-03-28 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104765295A (zh) * | 2015-03-26 | 2015-07-08 | 湖南标立通用科技有限公司 | 一种微量添加仪控制装置及微量添加仪 |
CN115400845A (zh) * | 2022-09-16 | 2022-11-29 | 江苏道金智能装备股份有限公司 | 磷酸铁锂砂磨单机台生产工艺自动化方法及系统 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001300845A (ja) * | 2000-04-24 | 2001-10-30 | Nippon Telegr & Teleph Corp <Ntt> | 研磨装置および研磨方法 |
US6623333B1 (en) * | 1999-12-14 | 2003-09-23 | Texas Instruments Incorporated | System and method for controlling a wafer polishing process |
CN1523461A (zh) * | 2003-02-20 | 2004-08-25 | 台湾积体电路制造股份有限公司 | 研磨浆臂自动控制装置及方法 |
US6949007B1 (en) * | 2004-08-31 | 2005-09-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for multi-stage process control in film removal |
CN201333662Y (zh) * | 2009-01-18 | 2009-10-28 | 湖南宇晶机器实业有限公司 | 研磨机调速装置 |
CN201427274Y (zh) * | 2009-08-10 | 2010-03-24 | 景德镇市中天水晶科技有限公司 | 多级变速铣磨机 |
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2010
- 2010-12-27 CN CN 201010607210 patent/CN102023649B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6623333B1 (en) * | 1999-12-14 | 2003-09-23 | Texas Instruments Incorporated | System and method for controlling a wafer polishing process |
JP2001300845A (ja) * | 2000-04-24 | 2001-10-30 | Nippon Telegr & Teleph Corp <Ntt> | 研磨装置および研磨方法 |
CN1523461A (zh) * | 2003-02-20 | 2004-08-25 | 台湾积体电路制造股份有限公司 | 研磨浆臂自动控制装置及方法 |
US6949007B1 (en) * | 2004-08-31 | 2005-09-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for multi-stage process control in film removal |
CN201333662Y (zh) * | 2009-01-18 | 2009-10-28 | 湖南宇晶机器实业有限公司 | 研磨机调速装置 |
CN201427274Y (zh) * | 2009-08-10 | 2010-03-24 | 景德镇市中天水晶科技有限公司 | 多级变速铣磨机 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104765295A (zh) * | 2015-03-26 | 2015-07-08 | 湖南标立通用科技有限公司 | 一种微量添加仪控制装置及微量添加仪 |
CN104765295B (zh) * | 2015-03-26 | 2017-07-07 | 湖南标立通用科技有限公司 | 一种微量添加仪控制装置及微量添加仪 |
CN115400845A (zh) * | 2022-09-16 | 2022-11-29 | 江苏道金智能装备股份有限公司 | 磷酸铁锂砂磨单机台生产工艺自动化方法及系统 |
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Effective date of registration: 20191211 Address after: 214200 Dongfen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Co-patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 300384 in Tianjin Binhai high tech Zone Huayuan Industrial Zone (outer ring road No. 12 in Haitai) Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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