CN102023649B - 磨片机砂浆流量自动调节装置及其方法 - Google Patents
磨片机砂浆流量自动调节装置及其方法 Download PDFInfo
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- CN102023649B CN102023649B CN 201010607210 CN201010607210A CN102023649B CN 102023649 B CN102023649 B CN 102023649B CN 201010607210 CN201010607210 CN 201010607210 CN 201010607210 A CN201010607210 A CN 201010607210A CN 102023649 B CN102023649 B CN 102023649B
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CN 201010607210 CN102023649B (zh) | 2010-12-27 | 2010-12-27 | 磨片机砂浆流量自动调节装置及其方法 |
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CN 201010607210 CN102023649B (zh) | 2010-12-27 | 2010-12-27 | 磨片机砂浆流量自动调节装置及其方法 |
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CN102023649A CN102023649A (zh) | 2011-04-20 |
CN102023649B true CN102023649B (zh) | 2012-03-28 |
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CN104765295B (zh) * | 2015-03-26 | 2017-07-07 | 湖南标立通用科技有限公司 | 一种微量添加仪控制装置及微量添加仪 |
CN115400845B (zh) * | 2022-09-16 | 2023-04-28 | 江苏道金智能装备股份有限公司 | 磷酸铁锂砂磨单机台生产工艺自动化方法及系统 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001300845A (ja) * | 2000-04-24 | 2001-10-30 | Nippon Telegr & Teleph Corp <Ntt> | 研磨装置および研磨方法 |
US6623333B1 (en) * | 1999-12-14 | 2003-09-23 | Texas Instruments Incorporated | System and method for controlling a wafer polishing process |
CN1523461A (zh) * | 2003-02-20 | 2004-08-25 | 台湾积体电路制造股份有限公司 | 研磨浆臂自动控制装置及方法 |
US6949007B1 (en) * | 2004-08-31 | 2005-09-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for multi-stage process control in film removal |
CN201333662Y (zh) * | 2009-01-18 | 2009-10-28 | 湖南宇晶机器实业有限公司 | 研磨机调速装置 |
CN201427274Y (zh) * | 2009-08-10 | 2010-03-24 | 景德镇市中天水晶科技有限公司 | 多级变速铣磨机 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6623333B1 (en) * | 1999-12-14 | 2003-09-23 | Texas Instruments Incorporated | System and method for controlling a wafer polishing process |
JP2001300845A (ja) * | 2000-04-24 | 2001-10-30 | Nippon Telegr & Teleph Corp <Ntt> | 研磨装置および研磨方法 |
CN1523461A (zh) * | 2003-02-20 | 2004-08-25 | 台湾积体电路制造股份有限公司 | 研磨浆臂自动控制装置及方法 |
US6949007B1 (en) * | 2004-08-31 | 2005-09-27 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for multi-stage process control in film removal |
CN201333662Y (zh) * | 2009-01-18 | 2009-10-28 | 湖南宇晶机器实业有限公司 | 研磨机调速装置 |
CN201427274Y (zh) * | 2009-08-10 | 2010-03-24 | 景德镇市中天水晶科技有限公司 | 多级变速铣磨机 |
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Effective date of registration: 20180703 Address after: 300384 Tianjin Binhai New Area high tech Zone Huayuan Industrial Area (outside the ring) Hai Tai Road 12 inside. Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 300384 Nankai District Huayuan Industrial Park, Tianjin, 12 Patentee before: TIANJIN HUANOU SEMICONDUCTOR MATERIAL TECHNOLOGY Co.,Ltd. |
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Effective date of registration: 20191211 Address after: 214200 Dongfen Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Co-patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Patentee after: Zhonghuan leading semiconductor materials Co.,Ltd. Address before: 300384 in Tianjin Binhai high tech Zone Huayuan Industrial Zone (outer ring road No. 12 in Haitai) Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |
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Address after: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee after: Zhonghuan Leading Semiconductor Technology Co.,Ltd. Country or region after: China Patentee after: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. Address before: 214200 Dongjia Avenue, Yixing Economic and Technological Development Zone, Wuxi City, Jiangsu Province Patentee before: Zhonghuan leading semiconductor materials Co.,Ltd. Country or region before: China Patentee before: TIANJIN ZHONGHUAN ADVANCED MATERIAL TECHNOLOGY Co.,Ltd. |