CN102005532A - High-efficiency reflective LED package structure and packaging method thereof - Google Patents
High-efficiency reflective LED package structure and packaging method thereof Download PDFInfo
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- CN102005532A CN102005532A CN2010105091225A CN201010509122A CN102005532A CN 102005532 A CN102005532 A CN 102005532A CN 2010105091225 A CN2010105091225 A CN 2010105091225A CN 201010509122 A CN201010509122 A CN 201010509122A CN 102005532 A CN102005532 A CN 102005532A
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- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000011521 glass Substances 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000013078 crystal Substances 0.000 claims abstract description 30
- 239000002904 solvent Substances 0.000 claims abstract description 14
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000012856 packing Methods 0.000 claims description 12
- 150000001298 alcohols Chemical class 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 5
- 125000001931 aliphatic group Chemical group 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 238000007645 offset printing Methods 0.000 claims description 5
- 230000008021 deposition Effects 0.000 claims description 4
- 239000002270 dispersing agent Substances 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 238000009156 water cure Methods 0.000 claims description 4
- 241000218202 Coptis Species 0.000 claims description 3
- 235000002991 Coptis groenlandica Nutrition 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000002002 slurry Substances 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 230000004907 flux Effects 0.000 abstract description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000005538 encapsulation Methods 0.000 description 6
- 238000000605 extraction Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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Abstract
The invention relates to the technical field of LED, in particular to a high-efficiency reflective LED package structure and a packaging method thereof. The high-efficiency reflective LED package structure comprises a substrate and a grain crystal, wherein the grain crystal is fixedly arranged in the substrate and connected with an electrode of the substrate through a conduction line; an inner surface of the substrate is coated with a nanometer glass layer; the nanometer glass is placed into an alcohol solvent to be stirred and mixed before the grain crystal is fixed in the substrate to prepare a nanometer glass solution; and the nanometer glass solution is injected into the substrate to be baked so that the alcohol solvent in the nanometer glass solution volatilizes, and the nanometer glass uniformly deposits on the inner surface of the substrate to form a nanometer glass layer; and the nanometer glass layer is a high-effective reflective layer so as to effectively reflect the light of the grain crystal, thereby increasing luminous flux, reducing light loss and having high light emergence efficiency.
Description
Technical field:
The present invention relates to the LED technical field, refer in particular to efficient reflection LED encapsulating structure and method for packing thereof.
Background technology:
LED is a kind of light emitting semiconductor device, is used as indicator light, display screen etc. widely.White light LEDs be described as replace fluorescent lamps and incandescent lamp the 4th generation lighting source.LED changed the incandescent lamp tungsten filament luminous with the luminous principle of fluorescent lamp tricolor powder, utilize electroluminescence, have that light efficiency height, radiationless, life-span are long, an advantage of low-power consumption and environmental protection.A kind of traditional approach that forms white light LEDs is that blue light or ultraviolet chip excite the fluorescent material that is covering on chip, and the light stimulus fluorescent material that chip sends under electricity drives produces the visible light of other wave band, and the each several part colour mixture forms white light.Along with the continuous expansion that LED uses, also more and more higher to the luminous efficiency requirement of LED encapsulation, and luminous efficiency is the most important parameter of decision LED encapsulation.
At present, LED comprises substrate and crystal grain, crystal grain is fixedly mounted in the substrate, crystal grain connects the electrode of substrate by lead, its general way is earlier crystal grain to be fixed in the substrate, then two of lead is welded on respectively on crystal grain and the electrode of substrate, then fluorescence glue is injected in the substrate, baking at last makes the fluorescent glue water cure make product.At present LED uses substrate to prevent light leak, no matter the catoptric arrangement design is perfect again, the problem that all exists light leak and surface light in various degree to absorb causes the luminous flux loss, and optical energy loss is very big.As seen, owing to be subjected to the restriction of LED encapsulation technology up till now, most of luminous energy that LED produces is depleted in the total reflection process.Therefore, thus the reflection efficiency that how to improve LED encapsulation improves the light extraction efficiency of LED encapsulation becomes industry key issue anxious to be solved.
Summary of the invention:
Purpose of the present invention be exactly the deficiency that exists at prior art and provide a kind of and light efficiently can be reflected away, efficient reflection LED encapsulating structure that light extraction efficiency is high, this efficient reflection LED method for packing also is provided, has been intended to solve the low problem of existing LED encapsulation light extraction efficiency.
To achieve these goals, the technical solution used in the present invention is:
Efficient reflection LED encapsulating structure, it includes substrate and crystal grain, and crystal grain is fixedly mounted in the substrate, and crystal grain is by the electrode of lead connection substrate, and the inner surface of substrate is coated with the nano-glass layer.
The thickness of described nano-glass layer is 1～3 μ m.
Described lead is a gold thread.
The invention also discloses efficient reflection LED method for packing, may further comprise the steps:
A, nano-glass inserted in the alcohols solvent mix, make nano-glass solution;
B, red offset printing is brushed to the electrode of substrate;
C, baking make red adhesive curing;
D, substrate is carried out the surface treatment of electricity slurry;
E, nano-glass solution is injected in the substrate;
F, baking make the alcohols solvent volatilization in the nano-glass solution, and the nano-glass uniform deposition forms the nano-glass layer in the inner surface of substrate;
G, remove red glue;
H, crystal grain is fixed in the substrate;
I, two of lead is welded on respectively on crystal grain and the electrode of substrate;
J, fluorescence glue is injected in the substrate;
K, baking make the fluorescent glue water cure.
Wherein, before carrying out steps A, carry out following steps earlier:
A1, oven dry nano-glass dewater;
A2, nano-glass is destaticed;
A3, with the alcohols solvent purifying and dewater.
Wherein, make nano-glass solution in the steps A after, nano-glass solution is destaticed.
Wherein, by corrosion resistant plate red offset printing is brushed to the electrode of substrate among the step B.
Wherein, substrate toasted under 100～150 ℃ temperature 5～15 minutes in the step F.
Wherein, the solution of nano-glass described in the steps A comprises following components in weight percentage:
Alcohol 99～99.9%
Nano-glass 0.1～1%
Dispersant 0～0.01%.
Wherein, described alcohol is volatile solvents such as methyl alcohol or ethanol, and dispersant is a nanoscale aliphatic acid.
Beneficial effect of the present invention is: the present invention includes substrate and crystal grain, crystal grain is fixedly mounted in the substrate, crystal grain connects the electrode of substrate by lead, the inner surface of substrate is coated with the nano-glass layer, before crystal grain is fixed on substrate, earlier nano-glass is inserted in the alcohols solvent and mix, make nano-glass solution, then nano-glass solution is injected in the substrate, baking makes the alcohols solvent volatilization in the nano-glass solution, the nano-glass uniform deposition forms the nano-glass layer in the inner surface of substrate, the nano-glass layer is efficient reflector, the light of crystal grain efficiently can be reflected away, and promotes luminous flux, reduce light loss, the light extraction efficiency height.
Description of drawings:
Fig. 1 is a structural representation of the present invention.
Embodiment:
The present invention is further illustrated below in conjunction with accompanying drawing, sees shown in Figure 1:
Efficient reflection LED encapsulating structure includes substrate 1 and crystal grain 2, and crystal grain 2 is fixedly mounted in the substrate 1, and crystal grain 2 is by the electrode of lead 3 connection substrates 1, and lead 3 is a gold thread, and resistance is low, reduces caloric value.
The inner surface of substrate 1 is coated with nano-glass layer 4, and the thickness of nano-glass layer 4 is 1～3 μ m, and thickness has preferable combination property when being 1～3 μ m, as being 1 μ m, 1.5 μ m, 2 μ m, 3 μ m etc., is preferably 2 μ m.
Adopt the efficient reflection LED method for packing of above-mentioned encapsulating structure, may further comprise the steps:
1, the oven dry nano-glass dewaters;
2, nano-glass is destaticed;
3, with the alcohols solvent purifying and dewater;
4, nano-glass is inserted in the alcohols solvent mix, make nano-glass solution;
5, nano-glass solution is destaticed;
6, by corrosion resistant plate red offset printing is brushed to the electrode of substrate 1;
7, baking makes red adhesive curing;
8, substrate 1 is carried out the surface treatment of electricity slurry;
9, with point gum machine nano-glass solution is clicked and entered in the substrate 1;
10, substrate 1 toasted under 100～150 ℃ temperature 5～15 minutes, made the alcohols solvent volatilization in the nano-glass solution, and the nano-glass uniform deposition forms nano-glass layer 4 in the inner surface of substrate 1;
11, remove red glue;
12, crystal grain 2 is fixed in the substrate 1;
13, two of lead 3 is welded on crystal grain 2 and substrate 1 electrode respectively;
14, fluorescence glue is injected in the substrate 1;
15, baking makes the fluorescent glue water cure;
16, optic test.
Wherein, nano-glass solution comprises the component of weight fraction: methyl alcohol 98.99, nano-glass 1, nanoscale aliphatic acid 0.01.
The present invention has set up nano-glass layer 4 as efficient reflector, the light of crystal grain 2 efficiently can be reflected away, and promotes luminous flux, reduces light loss, the light extraction efficiency height.
As different from Example 1, nano-glass solution comprises the component of weight fraction: ethanol 99, nano-glass 0.99, nanoscale aliphatic acid 0.01.
As different from Example 1, nano-glass solution comprises the component of weight fraction: methyl alcohol 99.9, nano-glass 0.1.
As different from Example 1, nano-glass solution comprises the component of weight fraction: ethanol 99.89, nano-glass 0.1, nanoscale aliphatic acid 0.01.
Certainly, the above only is a better embodiment of the present invention, so all equivalences of doing according to the described structure of patent claim of the present invention, feature and principle change or modify, is included in the patent claim of the present invention.
Claims (10)
1. efficiently reflect the LED encapsulating structure, it includes substrate and crystal grain, and crystal grain is fixedly mounted in the substrate, and crystal grain is by the electrode of lead connection substrate, and it is characterized in that: the inner surface of described substrate is coated with the nano-glass layer.
2. efficient reflection LED encapsulating structure according to claim 1, it is characterized in that: the thickness of described nano-glass layer is 1～3 μ m.
3. efficient reflection LED encapsulating structure according to claim 1, it is characterized in that: described lead is a gold thread.
4. efficiently reflect the LED method for packing, it is characterized in that, may further comprise the steps:
A, nano-glass inserted in the alcohols solvent mix, make nano-glass solution;
B, red offset printing is brushed to the electrode of substrate;
C, baking make red adhesive curing;
D, substrate is carried out the surface treatment of electricity slurry;
E, nano-glass solution is injected in the substrate;
F, baking make the alcohols solvent volatilization in the nano-glass solution, and the nano-glass uniform deposition forms the nano-glass layer in the inner surface of substrate;
G, remove red glue;
H, crystal grain is fixed in the substrate;
I, two of lead is welded on respectively on crystal grain and the electrode of substrate;
J, fluorescence glue is injected in the substrate;
K, baking make the fluorescent glue water cure.
5. efficient reflection LED method for packing according to claim 4 is characterized in that: carried out following steps earlier before carrying out steps A:
A1, oven dry nano-glass dewater;
A2, nano-glass is destaticed;
A3, with the alcohols solvent purifying and dewater.
6. efficient reflection LED method for packing according to claim 4 is characterized in that: after making nano-glass solution in the steps A, nano-glass solution is destaticed.
7. efficient reflection LED method for packing according to claim 4 is characterized in that: by corrosion resistant plate red offset printing is brushed to the electrode of substrate among the step B.
8. efficient reflection LED method for packing according to claim 4, it is characterized in that: substrate toasted under 100～150 ℃ temperature 5～15 minutes in the step F.
9. according to any described efficient reflection LED method for packing of claim 4-8, it is characterized in that: the solution of nano-glass described in the steps A comprises following components in weight percentage:
Alcohol 99～99.9%
Nano-glass 0.1～1%
Dispersant 0～0.01%.
10. efficient reflection LED method for packing according to claim 9, it is characterized in that: described dispersant is a nanoscale aliphatic acid.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105091225A CN102005532A (en) | 2010-10-15 | 2010-10-15 | High-efficiency reflective LED package structure and packaging method thereof |
| CN2011103097448A CN102324459A (en) | 2010-10-15 | 2011-09-30 | Light-emitting diode (LED) lamp package structure and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105091225A CN102005532A (en) | 2010-10-15 | 2010-10-15 | High-efficiency reflective LED package structure and packaging method thereof |
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| CN102005532A true CN102005532A (en) | 2011-04-06 |
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| CN2010105091225A Pending CN102005532A (en) | 2010-10-15 | 2010-10-15 | High-efficiency reflective LED package structure and packaging method thereof |
| CN2011103097448A Pending CN102324459A (en) | 2010-10-15 | 2011-09-30 | Light-emitting diode (LED) lamp package structure and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361056A (en) * | 2010-10-15 | 2012-02-22 | 广东昭信灯具有限公司 | High brightness large power light emitting diode and manufacture method thereof |
| CN112166039A (en) * | 2018-04-06 | 2021-01-01 | 聚合-医药有限公司 | Methods and compositions for photopolymerizable additive manufacturing |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106591777B (en) * | 2017-01-05 | 2019-11-08 | 利亚德光电股份有限公司 | The film coating jig and film plating process of LED display |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201699054U (en) * | 2010-06-04 | 2011-01-05 | 浙江联众光电科技股份有限公司 | SMD light-emitting diode |
| CN102034919A (en) * | 2010-10-15 | 2011-04-27 | 陈林 | High-brightness high-power light-emitting diode (LED) and manufacturing method thereof |
-
2010
- 2010-10-15 CN CN2010105091225A patent/CN102005532A/en active Pending
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- 2011-09-30 CN CN2011103097448A patent/CN102324459A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102361056A (en) * | 2010-10-15 | 2012-02-22 | 广东昭信灯具有限公司 | High brightness large power light emitting diode and manufacture method thereof |
| CN112166039A (en) * | 2018-04-06 | 2021-01-01 | 聚合-医药有限公司 | Methods and compositions for photopolymerizable additive manufacturing |
| CN112166039B (en) * | 2018-04-06 | 2023-09-05 | 聚合-医药有限公司 | Methods and compositions for photopolymerized additive manufacturing |
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| CN102324459A (en) | 2012-01-18 |
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| ASS | Succession or assignment of patent right |
Owner name: GUANGDONG REAL FAITH LIGHTING CO., LTD. Free format text: FORMER OWNER: CHEN LIN Effective date: 20111012 |
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Free format text: CORRECT: ADDRESS; FROM: 523000 DONGGUAN, GUANGDONG PROVINCE TO: 528251 FOSHAN, GUANGDONG PROVINCE |
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Effective date of registration: 20111012 Address after: 528251 Guangdong Province, Foshan City Nanhai Pingzhou Shawei Industrial District South Street No. 21 Applicant after: Guangdong Real Faith Lighting Co., Ltd. Address before: 523000 Guangdong Province, Dongguan City Wancheng District BBK District 8 Building No. 88 Applicant before: Chen Lin |
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Open date: 20110406 |