CN102005519B - Method for packaging high-power white LED with high luminous efficiency - Google Patents
Method for packaging high-power white LED with high luminous efficiency Download PDFInfo
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- CN102005519B CN102005519B CN2010102812640A CN201010281264A CN102005519B CN 102005519 B CN102005519 B CN 102005519B CN 2010102812640 A CN2010102812640 A CN 2010102812640A CN 201010281264 A CN201010281264 A CN 201010281264A CN 102005519 B CN102005519 B CN 102005519B
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Abstract
The invention provides a method for packaging a high-power white light emitting diode (LED) with high luminous efficiency, which comprises the following steps of: (1) preparing bi-component silica gel according to the mass ratio of A to B of 1:1, and doping fluorescent powder to prepare fluorescent powder gel; (2) fixing an LED chip in a high-power cup, coating the prepared fluorescent powder gel into the high-power cup in a way that the coating amount of the gel is three quarters the depth of the high-power cup, and performing drying and curing; (3) preparing the bi-component silica gel according to the mass ratio of the A to the B of 4:3, completely coating the bi-component silica gel into the high-power cup, drying the cup at 125 DEG C and covering a lens on the cup; and (4) preparing the bi-component silica gel in the mass ratio of the A to the B of 3:1, and potting and drying the lens. In the method, three silica gel layers with refractive indexes sequentially progressively decreased from the chip to the lens are formed by utilizing the characteristic of different refractive indexes of the components A and B of the bi-component silica gel so as to effectively obtain relatively more light output and effectively avoid layering phenomena in the baking of the silica gel.
Description
Technical field
The present invention relates to a kind of method for packing of large power white light LED of high light-emitting efficiency, belong to the optoelectronic applications technical field.
Background technology
Great power LED is as a kind of new forms of energy, and development is very rapid, and light efficiency develops into present lumens up to a hundred from initial several lumens.But its covering technology is very stable; Conventional encapsulation general using silica gel mass ratio A: B=1: 1 carries out phosphor gel mixes; After the baking, still with silica gel mass ratio A: B=1: 1 ratio is carried out embedding, and the casting glue hardness ratio of this kind technology is bigger; Be easy to generate lamination after the baking, cause light extraction efficiency low.
Summary of the invention
The present invention is directed to the deficiency that existing high-power LED encapsulation technology exists, a kind of high-power white light LED packaging method that can effectively avoid the high light-emitting efficiency of silica gel baking " layering " phenomenon is provided.
The high-power white light LED packaging method of high light-emitting efficiency of the present invention may further comprise the steps:
(1) with two component silica gel in mass ratio A: B=1: 1 ratio is mixed, and A is an epoxy resin, and B is a curing agent, mixes fluorescent material by the 20%-40% that mixes the back gross mass then and processes phosphor gel;
(2) led chip is fixed in the high-power bowl cup, the phosphor gel that step (1) is processed is coated to the high-power bowl cup of putting into led chip, and the phosphor gel coated weight is 3/4ths, 125 ℃ of baking and curing of the high-power bowl cup degree of depth;
(3) again with two component silica gel in mass ratio A: B=4: 3 ratio is mixed, and is coated in the high-power bowl cup, is coated with full bowl cup, and 125 ℃ of oven dry are buckled lens on the bowl cup then;
(4) with two component silica gel in mass ratio A: B=3: 1 ratio is mixed, the embedding lens;
(5) behind the embedding lens, dry for 125 ℃.
The present invention utilizes two component silica gel A components and B component refractive index different features, forms three layers of silica gel layer of from the chip to the index of refraction in lens, successively decreasing successively, obtains higher light output effectively, can effectively avoid " layering " phenomenon of silica gel baking.
Description of drawings
Fig. 1 is that step of the present invention (2) is fixed on led chip in the sketch map that in the high-power bowl cup and in high-power bowl cup, applies phosphor gel.
Fig. 2 is step of the present invention (3) is coated with full phosphor gel in high-power bowl cup a sketch map.
Fig. 3 is the sketch map of step of the present invention (4) embedding lens.
Wherein: 1, mass ratio A: B=3: two component silica gel of 1 mixed; 2, phosphor gel; 3, mass ratio A: B=4: 3 two component silica gel of mixing, 4, led chip, 5, high-power bowl glass, 6, lens.
Embodiment
The high-power white light LED packaging method of high light-emitting efficiency of the present invention specifically may further comprise the steps:
(1) preparation phosphor gel 2: the silica gel that will have A epoxy resin and two kinds of components of B curing agent is in mass ratio A: B=1: 1 ratio is mixed, and mixes fluorescent material and processes phosphor gel by mixing afterwards the 20%-40% of gross mass then;
(2) led chip 4 is fixed in the high-power bowl cup 5, the phosphor gel that step (1) is processed is coated to the high-power bowl cup 5 of putting into led chip, and the coated weight of phosphor gel 2 is 3/4ths places that are coated to high-power bowl cup 4 degree of depth, 125 ℃ of baking and curing; As shown in Figure 1.
(3) again will be in mass ratio A: B=4: 3 ratio be carried out mixed pair of component silica gel 3 and is coated in the high-power bowl cup 5, and until being coated with completely high-power bowl cup 5, lens 6 are buckled in 125 ℃ of oven dry then, baking back that finishes on the bowl cup; As shown in Figure 2.
(4) at last will be in mass ratio A: B=3: 1 ratio is carried out mixed pair of component silica gel 1 embedding to 6 li on lens, and be as shown in Figure 3.Lens 6 are provided with aperture, through syringe needle two component silica gel are expelled in the lens 6 by aperture.
(5) behind the embedding lens 6, dry for 125 ℃.
Claims (1)
1. the high-power white light LED packaging method of a high light-emitting efficiency may further comprise the steps:
(1) with two component glue in mass ratio A: B=1: 1 ratio is mixed, and A is an epoxy resin, and B is a curing agent, mixes fluorescent material by the 20%-40% that mixes the back gross mass then and processes phosphor gel;
(2) led chip is fixed in the high-power bowl cup, the phosphor gel that step (1) is processed is coated to the high-power bowl cup of putting into led chip, and the phosphor gel coated weight is 3/4ths, 125 ℃ of baking and curing of the high-power bowl cup degree of depth;
(3) again with two component glue in mass ratio A: B=4: 3 ratio is mixed, and is coated in the high-power bowl cup, is coated with full bowl cup, and 125 ℃ of oven dry are buckled lens on the bowl cup then;
(4) with two component glue in mass ratio A: B=3: 1 ratio is mixed, the embedding lens;
(5) behind the embedding lens, dry for 125 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102812640A CN102005519B (en) | 2010-09-15 | 2010-09-15 | Method for packaging high-power white LED with high luminous efficiency |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010102812640A CN102005519B (en) | 2010-09-15 | 2010-09-15 | Method for packaging high-power white LED with high luminous efficiency |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102005519A CN102005519A (en) | 2011-04-06 |
| CN102005519B true CN102005519B (en) | 2012-02-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010102812640A Expired - Fee Related CN102005519B (en) | 2010-09-15 | 2010-09-15 | Method for packaging high-power white LED with high luminous efficiency |
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| Country | Link |
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| CN (1) | CN102005519B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485409A (en) * | 2014-12-02 | 2015-04-01 | 苏州沃斯麦机电科技有限公司 | Dispensing method during packaging of plug-in LED (light emitting diode) lamp |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102777786B (en) * | 2011-05-05 | 2017-01-18 | 硅谷光擎 | TIR system used for small high power transmitter |
| CN107256920A (en) * | 2017-08-15 | 2017-10-17 | 苏州轻光材料科技有限公司 | A kind of high luminous intensity burst of ultraviolel white light LEDs and preparation method thereof |
| CN111341898A (en) * | 2018-12-19 | 2020-06-26 | 深圳市聚飞光电股份有限公司 | LED packaging structure, manufacturing method thereof and LED flash lamp |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101369623A (en) * | 2008-10-08 | 2009-02-18 | 山东华光光电子有限公司 | Technique for coating fluorescent powder on LED chip |
| CN101694857A (en) * | 2009-10-16 | 2010-04-14 | 中外合资江苏稳润光电有限公司 | Manufacture method of low-attenuation white light LED |
| CN101704988A (en) * | 2009-11-23 | 2010-05-12 | 东莞市永兴电子科技有限公司 | Method for preparing fluorescent powder colloid |
| CN101764192A (en) * | 2010-01-18 | 2010-06-30 | 山东华光光电子有限公司 | Encapsulating process of large-power LED |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200744227A (en) * | 2006-05-19 | 2007-12-01 | Chen Shiang Mian | White LED light source and manufacturing method of fluorescent powder thereof |
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2010
- 2010-09-15 CN CN2010102812640A patent/CN102005519B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101369623A (en) * | 2008-10-08 | 2009-02-18 | 山东华光光电子有限公司 | Technique for coating fluorescent powder on LED chip |
| CN101694857A (en) * | 2009-10-16 | 2010-04-14 | 中外合资江苏稳润光电有限公司 | Manufacture method of low-attenuation white light LED |
| CN101704988A (en) * | 2009-11-23 | 2010-05-12 | 东莞市永兴电子科技有限公司 | Method for preparing fluorescent powder colloid |
| CN101764192A (en) * | 2010-01-18 | 2010-06-30 | 山东华光光电子有限公司 | Encapsulating process of large-power LED |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485409A (en) * | 2014-12-02 | 2015-04-01 | 苏州沃斯麦机电科技有限公司 | Dispensing method during packaging of plug-in LED (light emitting diode) lamp |
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| CN102005519A (en) | 2011-04-06 |
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Granted publication date: 20120208 Termination date: 20130915 |