CN101996699A - 在降低的加工温度下由银纳米颗粒形成高导电部件的新方法 - Google Patents

在降低的加工温度下由银纳米颗粒形成高导电部件的新方法 Download PDF

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Publication number
CN101996699A
CN101996699A CN2010102560353A CN201010256035A CN101996699A CN 101996699 A CN101996699 A CN 101996699A CN 2010102560353 A CN2010102560353 A CN 2010102560353A CN 201010256035 A CN201010256035 A CN 201010256035A CN 101996699 A CN101996699 A CN 101996699A
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China
Prior art keywords
amine
composition
silver
containing nanoparticles
conductive component
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Pending
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CN2010102560353A
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English (en)
Chinese (zh)
Inventor
吴贻良
柳平
胡南星
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Xerox Corp
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Xerox Corp
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Publication of CN101996699A publication Critical patent/CN101996699A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0789—Aqueous acid solution, e.g. for cleaning or etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1131—Sintering, i.e. fusing of metal particles to achieve or improve electrical conductivity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Nanotechnology (AREA)
  • Dispersion Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Non-Insulated Conductors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
CN2010102560353A 2009-08-14 2010-08-13 在降低的加工温度下由银纳米颗粒形成高导电部件的新方法 Pending CN101996699A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/541,644 US9137902B2 (en) 2009-08-14 2009-08-14 Process to form highly conductive feature from silver nanoparticles with reduced processing temperature
US12/541,644 2009-08-14

Publications (1)

Publication Number Publication Date
CN101996699A true CN101996699A (zh) 2011-03-30

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CN2010102560353A Pending CN101996699A (zh) 2009-08-14 2010-08-13 在降低的加工温度下由银纳米颗粒形成高导电部件的新方法

Country Status (5)

Country Link
US (1) US9137902B2 (de)
EP (1) EP2285194B1 (de)
JP (1) JP5690098B2 (de)
CN (1) CN101996699A (de)
CA (1) CA2712306C (de)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103928617A (zh) * 2014-05-06 2014-07-16 电子科技大学 一种高电导率有机薄膜太阳能光伏电池的制备方法
CN103975030A (zh) * 2011-09-06 2014-08-06 汉高知识产权控股有限责任公司 导电金属和方法
CN105340370A (zh) * 2013-07-04 2016-02-17 爱克发-格法特公司 制备导电金属层或图案的方法
TWI564913B (zh) * 2013-04-26 2017-01-01 同和電子科技股份有限公司 Dispersion of metal nanoparticles, a method for producing a metal nanoparticle dispersion of the bonding method and

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JP5574761B2 (ja) * 2009-04-17 2014-08-20 国立大学法人山形大学 被覆銀超微粒子とその製造方法
US8765025B2 (en) * 2010-06-09 2014-07-01 Xerox Corporation Silver nanoparticle composition comprising solvents with specific hansen solubility parameters
WO2013036519A1 (en) 2011-09-06 2013-03-14 Henkel Corporation Conductive material and process
CN105579533B (zh) 2013-08-16 2020-04-14 汉高知识产权控股有限责任公司 亚微米银颗粒油墨组合物、方法和用途
EP3072613B1 (de) * 2013-11-20 2019-05-29 National University Corporation Yamagata University Silbernanopartikel, verfahren zur herstellung von silbernanopartikeln und silbernanopartikeltinte
EP3689984B8 (de) * 2014-06-19 2023-07-12 National Research Council of Canada Molekulare tinten
JP2018109232A (ja) * 2016-12-28 2018-07-12 Ｄｏｗａエレクトロニクス株式会社 接合材及びそれを用いた接合方法
US10821658B2 (en) * 2018-07-24 2020-11-03 Xerox Corporation Conductive three-dimensional articles
DE102019107633A1 (de) 2019-03-25 2020-10-29 Sphera Technology Gmbh Mehrkomponentensystem und Verfahren zur Herstellung eines Mehrkomponentensystems
DE102020124955A1 (de) 2020-09-24 2022-03-24 Sphera Technology Gmbh Elektronikeinheit mit einem integrierten Schaltkreis und Verfahren zu deren Herstellung

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CN1478285A (zh) * 2000-10-25 2004-02-25 ��ĥ������ʽ���� 导电金属膏
CN1608296A (zh) * 2001-12-27 2005-04-20 株式会社藤仓 导电性组合物、导电性覆膜和导电性覆模的形成方法
CN1687992A (zh) * 2005-05-13 2005-10-26 范琳 一种无铅银电极浆料及其制造方法
CN101157127A (zh) * 2006-10-05 2008-04-09 施乐公司 具有置换稳定剂的含银纳米颗粒
WO2009054453A1 (ja) * 2007-10-24 2009-04-30 Dowa Electronics Materials Co., Ltd. 微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト

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US6306204B1 (en) * 1999-11-24 2001-10-23 Xerox Corporation Ink jet ink compositions and printing processes
US20060001726A1 (en) * 2001-10-05 2006-01-05 Cabot Corporation Printable conductive features and processes for making same
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
US6740900B2 (en) * 2002-02-27 2004-05-25 Konica Corporation Organic thin-film transistor and manufacturing method for the same
US20050129843A1 (en) * 2003-12-11 2005-06-16 Xerox Corporation Nanoparticle deposition process
US7270694B2 (en) * 2004-10-05 2007-09-18 Xerox Corporation Stabilized silver nanoparticles and their use
JP5007020B2 (ja) 2004-12-20 2012-08-22 株式会社アルバック 金属薄膜の形成方法及び金属薄膜
US7491646B2 (en) 2006-07-20 2009-02-17 Xerox Corporation Electrically conductive feature fabrication process
DE102007037079A1 (de) * 2006-10-25 2008-04-30 Bayer Materialscience Ag Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen
JP5151150B2 (ja) 2006-12-28 2013-02-27 株式会社日立製作所 導電性焼結層形成用組成物、これを用いた導電性被膜形成法および接合法
US20090148600A1 (en) 2007-12-05 2009-06-11 Xerox Corporation Metal Nanoparticles Stabilized With a Carboxylic Acid-Organoamine Complex
US8048488B2 (en) 2008-01-14 2011-11-01 Xerox Corporation Methods for removing a stabilizer from a metal nanoparticle using a destabilizer
US8382878B2 (en) * 2008-08-07 2013-02-26 Xerox Corporation Silver nanoparticle process
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CN1478285A (zh) * 2000-10-25 2004-02-25 ��ĥ������ʽ���� 导电金属膏
CN1608296A (zh) * 2001-12-27 2005-04-20 株式会社藤仓 导电性组合物、导电性覆膜和导电性覆模的形成方法
CN1687992A (zh) * 2005-05-13 2005-10-26 范琳 一种无铅银电极浆料及其制造方法
CN101157127A (zh) * 2006-10-05 2008-04-09 施乐公司 具有置换稳定剂的含银纳米颗粒
WO2009054453A1 (ja) * 2007-10-24 2009-04-30 Dowa Electronics Materials Co., Ltd. 微小銀粒子含有組成物、その製造方法、微小銀粒子の製造方法および微小銀粒子を有するペースト

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103975030A (zh) * 2011-09-06 2014-08-06 汉高知识产权控股有限责任公司 导电金属和方法
TWI576396B (zh) * 2011-09-06 2017-04-01 漢高智慧財產控股公司 導電材料及方法
TWI564913B (zh) * 2013-04-26 2017-01-01 同和電子科技股份有限公司 Dispersion of metal nanoparticles, a method for producing a metal nanoparticle dispersion of the bonding method and
CN105340370A (zh) * 2013-07-04 2016-02-17 爱克发-格法特公司 制备导电金属层或图案的方法
CN103928617A (zh) * 2014-05-06 2014-07-16 电子科技大学 一种高电导率有机薄膜太阳能光伏电池的制备方法

Also Published As

Publication number Publication date
EP2285194B1 (de) 2017-10-11
JP5690098B2 (ja) 2015-03-25
JP2011044709A (ja) 2011-03-03
US20110039096A1 (en) 2011-02-17
US9137902B2 (en) 2015-09-15
EP2285194A1 (de) 2011-02-16
CA2712306A1 (en) 2011-02-14
CA2712306C (en) 2015-06-02

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Application publication date: 20110330